退火温度和退火气氛对Ni/Au与p-GaN之间欧姆接触性能的影响

研究了不同退火温度和气氛对Ni/Au与p-GaN之间欧姆接触性能的影响. 采用圆形传输线模型方法得到不同退火温度和不同退火气氛下的比接触电阻率. 结果表明, 较适宜的退火温度为500 ℃左右, 退火温度太高或太低都会导致比接触电阻率的增大; 较适宜的退火气氛为适量含氧的氮气气氛, 且氧气含量对比接触电阻率大小的影响并不显著. 经过对退火条件的优化, 得到的比接触电阻率可达7.65×10^-4 Ω·cm². 关键词： p-GaN 欧姆接触 圆形传输线模型 快速热退火     

TiAl3 和Ti/TiAl3 非合金化电极n型GaN欧姆接触的实现

在不进行合金化的情况下,首次直接采用TiAl3合金材料作为金属接触电极.在蓝宝石衬底上生长的n型载流子浓度为2×1018 cm-3的GaN上,成功地得到低接触电阻的欧姆接触,并由环形传输线模型方法测得比接触电阻率为3×10-5 Ω*cm2.与通常n型欧姆接触采用的Ti/Al双层结构比较,TiAl3合金结构更容易形成非合金化的n型欧姆接触.在此实验基础上,进一步分析了N空位和界面层处的TiAl3在形成非合金化或低温退火欧姆接触中发挥的作用,由此设计的Ti/TiAl3/Ni/Au接触结构,在TiAl3合金结构基础上明显地降低了接触电阻率.     

传输线模型测量Au/Ti/p型金刚石薄膜的欧姆接触电阻率

采用传输线模型测量了重B掺杂p型金刚石薄膜(约10²⁰cm^-3)上Ti/A u欧姆接触电阻率ρ_c,测试了500℃退火前后及大电流情况下的I-V特性,研究 了退火对ρ_c的影响.结果表明,重掺杂和退火工艺是改善欧姆接触的有效手段. ρ_c随测试温度的变化表明金属/半导体接触界面载流子输运机制为隧道穿透.而 光照对ρ_c影响的分析表明金刚石可作为理想窗口材料.测试得到的最低ρ _c值约为10^-4Ωcm². 关键词： 金刚石薄膜 欧姆接触 接触电阻率     

热退火处理对AuGeNi/n-AlGaInP欧姆接触性能的影响

本文在n-(Al0.27Ga0.73)0.5In0.5P表面通过电子束蒸发Ni/Au/Ge/Ni/Au叠层金属并优化退火工艺成功制备了具有较低接触电阻的欧姆接触,其比接触电阻率在445℃退火600 s时达到1.4×10–4 W·cm2.二次离子质谱仪测试表明,叠层金属Ni/Au/Ge/Ni/Au与n-AlGaInP界面发生固相反应,Ga,In原子由于热分解发生外扩散并在晶格中留下Ⅲ族空位.本文把欧姆接触形成的原因归结为Ge原子内扩散占据Ga空位和In空位作为施主提高N型掺杂浓度.优化退火工艺对低掺杂浓度n-(Al0.27Ga0.73)0.5In0.5P的欧姆接触性能有显著改善效果,但随着n-(Al0.27Ga0.73)0.5In0.5P掺杂浓度提高,比接触电阻率与退火工艺没有明显关系.本文为n面出光的AlGaInP薄膜发光二极管芯片的n电极制备提供了一种新的方法,有望大幅简化制备工艺,降低制造成本.     

金属与半导体Ge欧姆接触制备、性质及其机理分析

金属与Ge材料接触时界面处存在着强烈的费米钉扎效应, 尤其与n型Ge形成的欧姆接触的比接触电阻率高, 是制约Si基Ge器件性能的关键因素之一. 本文对比了分别采用金属Al和Ni 与Si衬底上外延生长的p型Ge和n型Ge材料的接触特性. 发现在相同的较高掺杂条件下, NiGe与n型Ge可形成良好的欧姆接触, 其比接触电阻率 较 Al接触降低了一个数量级, 掺P浓度为2×10¹⁹ cm^-3时达到1.43×10^-5 Ω·cm². NiGe与p型Ge接触和Al接触的比接触电阻率相当, 掺B浓度为4.2×10¹⁸ cm^-3时达到1.68×10^-5 Ω·cm². NiGe与n型Ge接触和Al电极相比较, 在形成NiGe过程中, P杂质在界面处的偏析是其接触电阻率降低的主要原因. 采用NiGe作为Ge的接触电极在目前是合适的选择. 关键词： 金属与Ge接触性质 NiGe 比接触电阻率     

多层Ti/Al电极结构对Ga N/AlGaN HEMT欧姆接触特性的影响

研究了多层Ti/Al结构电极对GaN/AlGaN HEMT欧姆接触特性及表面形态的影响。采用传输线模型对各结构电极的比接触电阻率进行了测量,采用扫描电子显微镜对电极表面形态进行扫描。实验结果显示,在同样的退火条件下,随着Ti/Al层数的增加,比接触电阻率逐渐减小,表面形态趋于光滑;降低Ti/Al层的厚度会加剧Au向内扩散而增加比接触电阻率,但能稍微改善表面形态;Ti比例过高会影响Ti N的形成导致比接触电阻率增加,但能明显改善表面形态。     

硅衬底GaN基LED N极性n型欧姆接触研究

在Si衬底GaN基垂直结构LED的N极性n型面上,利用电子束蒸发的方法制作了Ti/Al电极,通过了I-V曲线研究了有无AlN缓冲层对这种芯片欧姆接触的影响.结果显示,去除AlN缓冲层后的N极性n型面与Ti/Al电极在500到600 ℃范围内退火才能形成欧姆接触.而保留AlN缓冲层的N极性n型面与Ti/Al电极未退火时就表现为较好的欧姆接触,比接触电阻率为2×10^-5 Ω·cm²,即使退火温度升高至600 ℃,也始终保持着欧姆接触特性.因此,AlN缓冲层的存在是Si衬底GaN基垂直结构LED获得高热稳定性n型欧姆接触的关键. 关键词： 硅衬底 N极性 AlN缓冲层 欧姆接触     

MSM结构ZnO/Cu薄膜的接触特性

利用脉冲激光沉积(PLD)法在Si(111)衬底上分别生长了ZnO薄膜和Cu薄膜, 用Cu薄膜作电极,研究了ZnO薄膜与Cu薄膜的接触特性。分别用X射线衍射仪、扫描电子显微镜和I-V测试的方法对样品的晶体质量、结构和电学性质进行了测试。结果表明:样品中ZnO薄膜和Cu薄膜均具有高度的择优取向;当Cu和 ZnO直接接触时,样品的I-V特性是非线性的;当Cu和 ZnO之间通过ZnO:Cu层间接接触时形成良好的欧姆接触,而且退火后欧姆接触性能明显提高,电阻率降低约2/3。本研究为价格低廉的Cu电极成为ZnO基器件的欧姆电极提供了一定的依据。     

980 nm 垂直腔面发射激光器低欧姆接触电阻制备

研究了980 nm的垂直腔面发射激光器(VCSEL)欧姆接触技术.降低VCSEL的欧姆接触电阻,可有效地提高VCSEL的输出功率和延长其可靠性.P面采用高掺杂的P-GaAs/Ti/Pt/Au系统,N面采用N-GaAs/Ge/Au/Ni/Au系统,通过优化合金温度,得到了最佳优化合金温度为440 ℃,最低欧姆接触电阻值为0.04 Ω,同时对比了440 ℃和450 ℃器件的输出功率和转换效率之间的对比关系.测试结果表明,440 ℃器件的欧姆接触电阻0.04 Ω,峰值波长980.1 nm,光谱的半高宽0.8 nm,平行发散角θ_‖ 15.2°,垂直发散角θ_⊥ 13.5°,输出功率1.4 W,转换效率最大值为14.4%,而450℃的器件欧姆接触电阻为0.049 Ω,输出功率为1.3 W,转换效率为12.8%.通过优化合金温度能有效地降低980 nm的VCSEL欧姆接触电阻.     

电磁轨道发射器连续发射的滑动电接触

从滑动电接触电阻大小的角度,详细分析了在时序放电条件下,两颗重约为5 g的电枢,以速度为1 000 m/s,166 Hz连续发射试验。通过近似计算电流所流经轨道电阻及电枢体电阻所产生的温升,对滑动电接触电阻的影响。结果表明:连续发射运行模式下,受轨道表面温度上升的影响,第二发电枢的滑动接触电阻略高于第一发电枢的滑动接触电阻,表面滑动电接触性能受到温升的影响,在两连发的发射情况下,其影响虽不是很大,但多发高频连续发射就必须考虑热管理问题。      

接触电阻对碳纳米管场发射的影响

基于改进的悬浮球模型,计算了碳纳米管和衬底间的接触电阻存在时碳纳米管顶端的局域电场, 并结合Fowler-Nordheim (F-N)场发射规律研究了接触电阻对碳纳米管场发射的影响.研究表明,接触电阻的存在,在高电场区域接触电阻抑制了碳纳米管的电子场发射,导致在高电场区域出现电流饱和及FN直线偏折现象.其原因可归结为接触电阻使得在碳纳米管顶端的局域电场相对于没有接触电阻时相对地减少. 关键词： 碳纳米管 场发射 接触电阻 电流饱和     

Contact barriers in a single ZnO nanowire device

The contact potential between a single ZnO nanowire and Ti/Au contacts was estimated to be ∼30 meV by considering the Arrhenious plot of the two-probe resistance, the thermionic emission conduction, and the Fowler–Nordheim tunneling model. The net voltages applied to the contacts were calculated by subtracting the four-probe voltages from the two-probe voltages at the same currents. The activation energy of the four-probe resistance was about 2.4 mV which was 1/11th of that of the two-probe resistance. The Fowler–Nordheim plot clearly showed the crossover of the conduction mechanism from thermionic emission to tunneling regime as lowering the temperatures below T<100 K.     

一种平行栅碳纳米管阵列阴极的场发射特性研究

建立一种平行栅碳纳米管阵列阴极,利用悬浮球模型和镜像电荷法进行计算,给出碳纳米管顶端表面电场与电场增强因子的解析式. 在此基础上,进一步分析器件各类参数以及接触电阻对阴极电子发射性能的影响. 分析表明,碳纳米管间距大约为2倍碳纳米管高度时阵列阴极的分布密度最佳,靠边缘部位的碳纳米管发射电子能力比其中心部位的大;除碳纳米管的长径比之外,栅极宽度和栅极间距也对电场增强因子有一定作用;接触电阻的存在大幅度降低碳纳米管顶端表面电场与发射电流,而接触电阻高于800 kΩ时,器件对阳极驱动电压的要求更高. 关键词： 平行栅碳纳米管阵列 悬浮球 场增强因子 接触电阻     

Mechanism of current flow in alloyed ohmic In/GaAs contacts

A mechanism of current flow in an alloyed ohmic In contact to low-doped gallium arsenide (n = 4 × 10¹⁵ cm^?3) is studied. From the temperature dependence of the contact resistance per unit surface area, it is found that the basic mechanism of current flow is thermionic emission through a potential barrier 0.03 eV in height.     

三维热场致发射模型的数值模拟与研究

研究了场致发射与热电子发射的基本理论, 得出热场致发射的适用公式, 探讨了其粒子的初始分布和初始动量, 并在FDTD-PIC原理的基础上编写了软件, 分别实现了场致发射模型, 热电子发射模型和热场致发射模型, 通过分别对一个长楔形阴极器件的数值模拟, 从发射电流特性, 电子初始能量分布等方面验证了其正确性.     

Stability of Field Emission from a Single Carbon Nanotube

It has been found experimentally that the field emission current passing through a single multiwall carbon nanotube heats it up and generates a thermionic component. The nanotube is heated by the Joule heat that releases on its series resistance, through which the current passes. From the solution to the heat conduction equation, the overheating temperature of the emitting end has been estimated. Conditions for field emission stability and for the onset of thermal field emission have been found.     

Dependence of negative resistance characteristics of avalanching MIM diodes on current injection mechanisms

Current-controlled negative resistance characteristics are computed for avalanche injection metal/insulator/metal diodes. Current injection is taken to occur by either Schottky thermionic emission or the Fowler-Nordheim tunneling mechanism. The results presented show that the diode negative resistance characteristics depend critically on both the magnitude and field dependance of injected currents.     

Ohmic contacts to GaAs epitaxial layers

Formation of ohmic contacts onto GaAs epitaxial layers was reviewed. Because the Fermi energy of GaAs is pinned at the surface near the middle of the bandgap, it is impossible to choose a metal with the proper work function to make an ohmic contact. Instead, it is necessary to create a heavily doped surface layer and using field emission or thermionic field emission to achieve an ohmic contact. The oldest known contact metallization for GaAs is sequentially deposited thin films of Au, Ge, and Ni. It was shown that the ‘dopant diffusion model’, widely accepted to date to explain the formation of an n⁺ layer on GaAs to form the ohmic contact, is incorrect. Instead, the “solid phase regrowth model” was discussed in detail and shown to describe formation of ohmic contacts in this system. Based on this result, general rules for forming ohmic contacts to compound semiconductors with pinned Fermi levels or large values of electron affinities plus bandgap were expressed.     

Parameter analysis for gate metal-oxide-semiconductor structures of ion-implanted 4H silicon carbide metal-semiconductor field-effect transistors

From the theoretical analysis of the thermionic emission model of current-voltage characteristics, this paper extracts the parameters for the gate Schottky contact of two ion-implanted 4H-SiC metal-semiconductor field-effect transistors (sample A and sample B for three and four times multiple ion-implantation channel region respectively) fabricated in the experiment, including the ideality factor, the series resistance, the zero-field barrier height, the interface oxide capacitance, the interface state density distribution, the neutral level of interface states and the fixed space charge density. The methods to improve the interface of the ion-implanted Schottky contact are given at last.