基于聚(4-乙烯基苯酚)衬底修饰层喷墨打印的小分子有机半导体薄膜制备和表征

采用旋涂法预先在SiO₂衬底表面形成一层聚（4-乙烯基苯酚）（PVP）作为表面修饰层,以喷墨打印的6,13-双（三异丙基甲硅烷基乙炔基）并五苯（TIPS并五苯）作为有源层制作有机薄膜晶体管,有效改善了有机半导体薄膜的形貌。采用真空热蒸镀工艺制备源漏电极,形成底栅顶接触结构的有机薄膜晶体管（OTFT）器件。作为对比,在未经过表面修饰的SiO₂衬底上采用相同条件打印TIPS并五苯薄膜晶体管,发现在经过PVP修饰的SiO₂衬底上打印的单点厚度更均匀,咖啡环效应被抑制或被消除;而通过多点交叠打印形成的矩形薄膜的晶粒尺寸更大,相应的OTFT器件具有更高的场效应迁移率。在有PVP修饰层的衬底上制作的OTFT,器件在饱和区的平均场效应迁移率达到了0.065 cm²·V^-1·s^-1;而直接在SiO₂衬底上制作的器件,相应的平均场效应迁移率仅为0.02 cm²·V^-1·s^-1。     

沟道层厚度对室温制备的In2O3薄膜晶体管器件性能的影响

在室温下采用直流磁控溅射以SiO₂/Si为衬底制备了不同沟道层厚度的底栅式In₂O₃薄膜晶体管,讨论了沟道层厚度对底栅In₂O₃薄膜晶体管的电学性能的影响。实验结果表明:器件的特性与沟道层厚度有关,最优沟道层厚度的In₂O₃薄膜晶体管为增强型,其阈值电压为2.5 V,开关电流比约为10⁶,场效应迁移率为6.2 cm²·V^-1·s^-1。     

氧化锌锡薄膜晶体管的研究

在ITO玻璃基底上用射频磁控溅射技术生长氧化锌锡(ZnSnO)沟道有源层、用PECVD生长SiO₂薄膜作为薄膜晶体管的栅绝缘层研制了薄膜晶体管(TFT), 器件的场效应迁移率最高达到μ_n=9.1 cm²/(V ·s),阈值电压-2 V,电流开关比为10⁴. 关键词： 氧化锌锡 薄膜晶体管 场效应迁移率     

Au/SiO2纳米多层薄膜的制备及其性质表征

利用多靶磁控溅射技术制备了Au/SiO₂纳米颗粒分散氧化物多层复合薄膜.研究了在保持Au单层颗粒膜沉积时间一定时薄膜厚度一定、变化SiO₂的沉积时间及SiO₂的沉积时间一定而改变薄膜厚度时，多层薄膜在薄膜厚度方向的微观结构对吸收光谱的影响.研究结果表明：具有纳米层状结构的Au/SiO₂多层薄膜在560 nm波长附近有明显的表面等离子共振吸收峰，吸收峰的强度随Au颗粒的浓度增加而增强，在Au颗粒浓度相同的情况下，复合薄膜 关键词： 2纳米复合薄膜')" href="#">Au/SiO₂纳米复合薄膜 多靶磁控溅射 吸收光谱 有效介质理论     

低栅极电压控制下带有phenyltrimethoxysilane单分子自组装层的有机薄膜晶体管场效应特性研究

制作了底栅极顶接触有机薄膜晶体管器件,60 nm的pentacene被用作有源层,120 nm热生长的SiO₂作为栅极绝缘层.通过采用不同自组装修饰材料对器件的有源层与栅极绝缘层之间的界面进行修饰,如octadecyltrichlorosilane （OTS）,phenyltrimethoxysilane （PhTMS）,来比较界面修饰层对器件性能的影响.同时对带有PhTMS修饰层的OTFTs器件低栅极电压调制下的场效应行为及其载流子的传输机理进行研究.结果得到,当|V 关键词： 有机薄膜晶体管 自组装单分子层 场效应迁移率 低栅极调制电压     

MgB2 超薄膜的制备和性质研究

利用混合物理化学气相沉积法在6H-SiC(001)衬底上制备干净的MgB₂超导超薄膜.在本底气体压强、载气氢气流量等条件一定的情况下,改变B₂H₆流量及沉积时间,制备得到不同厚度的系列MgB₂超薄膜样品,并研究了超导转变温度T_c、剩余电阻率ρ_(42K)、上临界磁场H_c2等与膜厚的关系.该系列超薄膜沿c轴外延生长,随膜厚度的变小,T_c(0)降低,ρ_(42K)升高.膜在衬底上的生长遵循Volmer-Weber岛状生长模式.对于厚度为7.5 nm的MgB₂超薄膜,T_c(0) =32.8 K,ρ_(42K) =118 μΩcm,是迄今为止所观测到的厚度为7.5 nm的MgB₂超薄膜最高的T_c值;对于厚度为10 nm的MgB₂膜,T_c(0)=35.5 K,ρ_(42K)=17.7 μΩcm,上临界磁场μ₀H_c2估算为12 T左右,零磁场、4 K时的临界电流密度J_c=1.0×10⁷ A/cm²,是迄今为止10 nm厚MgB₂超薄膜的最高J_c值,且其表面连接性良好,均方根粗糙度为0.731 nm.这预示MgB₂超薄膜在超导纳米器件上具有广阔的应用前景. 关键词： 2超薄膜')" href="#">MgB₂超薄膜 薄膜生长 氢气流量 混合物理化学气相沉积     

化学溶液法制备的Pb(Mg1/3Nb2/3)O3-PbTiO3薄膜的光学性能

用化学溶液方法在宝石衬底及有LaNiO₃缓冲层的Pt/TiO₂/SiO₂/Si衬底上制备了92%Pb(Mg_1/3Nb_2/3)O₃-8%PbTiO₃(PMNT)薄膜，X射线衍射测试结果表明：在有LaNiO₃缓冲层的Pt/TiO₂/SiO₂/Si衬底上制备的PMNT薄膜几乎是纯钙钛矿相，且薄膜 关键词： PMNT薄膜 光学性能 化学溶液法     

离子辅助沉积法制备SiO2介质薄膜的应力研究

在高功率垂直腔面发射激光器制作工艺中,生长出低应力、高质量、高稳定性的SiO₂介质层非常关键。我们使用高效率LaB₆离子源辅助,在低放电电流条件下,在GaAs衬底上沉积了SiO₂,并对退火的应力影响进行了测试。在有离子辅助沉积时,对不同生长速率、不同厚度的应力影响进行了研究,对沉积过程进行了分析。结果表明:离子辅助沉积的SiO₂薄膜的应力远小于常规工艺条件下沉积的薄膜的应力,且退火后应力变化小。     

不同衬底上Pb(Zr0.52Ti0.48)O3择优取向铁电薄膜的制备和研究

通过MOD法在Si(100)和Pt(111)/Ti/SiO₂/Si基片上制备出LaNiO₃ ( LNO)薄膜.再通过修 正的Sol-gel法，在Pt(111)/Ti/SiO₂/Si,LNO/Si(100)和LNO/Pt/Ti/SiO_{2< /sub>/Si三种衬底上 制备出具有择优取向的Pb(Zr0.52Ti0.48)O3铁电薄膜. 经XRD分析表明，L NO薄膜具有(100)择优取向的类钙钛矿结构；PZT薄膜均具有钙钛矿结构，且在Pt(111)/Ti/S iO2/Si衬底上的薄膜以(110)择优取向，在LNO/Pt/Ti/SiO2/Si和LN O/Si(100)衬底上的 薄膜以(100)择优取向.经场发射SEM分析和介电、铁电性能测试表明，在LNO/Si和LNO/Pt/Ti /SiO2/Si衬底上的PZT薄膜的平均粒径、介电常数以及剩余极化强度均比以Pt/T i/SiO2/Si为衬底的薄膜大. 关键词： 3}薄膜')" href="#">LaNiO₃薄膜 PZT铁电薄膜 择优取向 剩余极化强度     

内嵌CuO薄膜对并五苯薄膜晶体管性能的改善

制备了基于内嵌氧化物铜(CuO)薄膜的并五苯薄膜晶体管器件. 将3 nm CuO薄膜内嵌入到并五苯(pentacene)中, 作为空穴注入层, 降低电极与并五苯之间的空穴注入势垒. 相对于纯并五苯薄膜晶体管器件, 研制的晶体管的迁移率、阈值电压(V_TH)、电流开关比(I_on/I_off) 等参数都有明显改善. X射线光电子能谱数据表明, 这种空穴注入势垒的降低源自并五苯向CuO的电子转移.     

Performance improvement in pentacene organic thin film transistors by inserting a C60 ultrathin layer

The contact effect on the performances of organic thin film transistors is studied here. A C₆₀ ultrathin layer is inserted between Al source--drain electrode and pentacene to reduce the contact resistance. By a 3 nm C₆₀ modification, the injection barrier is lowered and the contact resistance is reduced. Thus, the field-effect mobility increases from 0.12 to 0.52 cm²/(V·s). It means that inserting a C₆₀ ultra thin layer is a good method to improve the organic thin film transistor (OTFT) performance. The output curve is simulated by using a charge drift model. Considering the contact effect, the field effect mobility is improved to 1.15 cm²/(V·s). It indicates that further reducing the contact resistance of OTFTs should be carried out.     

Electrical characteristics of top contact pentacene organic thin film transistors with SiO<Subscript>2</Subscript> and poly(methyl methacrylate) as gate dielectrics

Organic thin film transistors (OTFTs) were fabricated using pentacene as the active layer with two different gate dielectrics, namely SiO₂ and poly(methyl methacrylate) (PMMA), in top contact geometry for comparative studies. OTFTs with SiO₂ as dielectric and gold deposited on the rough side of highly doped silicon (n⁺-Si) as gate electrode exhibited reasonable field effect mobilities. To deal with poor stability and large leakage currents between source/drain and gate electrodes in these devices, isolated OTFTs with reduced source/drain contact area were fabricated by selective deposition of pentacene on SiO₂/PMMA through shadow mask. This led to almost negligible leakage currents and no degradation in electrical performance even after 14 days of storage under ambient conditions. But, the field effect mobilities obtained were lower than 10⁻³ cm² V⁻¹ s⁻¹, whereas by using PMMA as gate dielectric with chromium deposited on the polished side of n⁺-Si as gate electrode, improved field effect mobilities (>0.02 cm² V⁻¹ s⁻¹) were obtained. PMMA-based OTFTs also exhibited lower leakage currents and reproducible output characteristics even after 30 days of storage under ambient conditions.      

Enhanced electrical properties of pentacene-based organic thin-film transistors by modifying the gate insulator surface

A reliable surface treatment for the pentacene/gate dielectric interface was developed to enhance the electrical transport properties of organic thin-film transistors (OTFTs). Plasma-polymerized fluorocarbon (CFx) film was deposited onto the SiO₂ gate dielectric prior to pentacene deposition, resulting in a dramatic increase of the field-effect mobility from 0.015 cm²/(V s) to 0.22 cm²/(V s), and a threshold voltage reduction from −14.0 V to −9.9 V. The observed carrier mobility increase by a factor of 10 in the resulting OTFTs is associated with various growth behaviors of polycrystalline pentacene thin films on different substrates, where a pronounced morphological change occurs in the first few molecular layers but the similar morphologies in the upper layers. The accompanying threshold voltage variation suggests that hole accumulation in the conduction channel-induced weak charge transfer between pentacene and CFx.     

Study on solid structure of pentacene thin films using Raman imaging

We present a 532‐nm excited Raman imaging study of pentacene thin films (thickness, 2, 5, 10, 20, 50, 100, and 150 nm) prepared on an SiO₂ surface. The structure of the pentacene films has been investigated by images and histograms of the ratio (R) of intensity of the 1596‐cm⁻¹ band (b_3g) to that of the 1533‐cm⁻¹ band (a_g), which can be used as a marker of solid‐state phases: 1.54‐nm and 1.44‐nm phases. The Raman images showed that island‐like 1.44‐nm phase domains are grown on the 1.54‐nm phase layer from 50 nm, and all the surface of the 1.54‐nm phase layer is covered with the 1.44‐nm phase layer from 100 nm. The structural disorders have been discussed on the basis of the full width at half maximum of a band in the histogram of the R values for each film. Copyright © 2012 John Wiley & Sons, Ltd.     

In2O3 透明薄膜晶体管的制备及其电学性能的研究

采用磁控溅射方法在玻璃衬底上生长了In₂O₃晶体薄膜.该薄膜具有(111)晶面择优取向,晶粒尺寸达到33 nm.利用光刻工艺制作了以In₂O₃晶体薄膜为沟道层的底栅式薄膜晶体管.In₂O₃薄膜晶体管具有良好的栅压调制特性,场效应迁移率达到6.3 cm²/(V·s),开关电流比为3×10³,阈值电压为-0.9 V.结果表明,In相似文献   

有机薄膜晶体管中接触效应的研究

研究了接触效应对有机薄膜晶体管性能的影响.首先在n型重掺杂Si片上制备了以M_OO₃修饰的Al电极为源漏电极的Pentacene基OTFTs(organic thin film transistors),器件场效应迁移率μ_ef达到0.42 cm²/V ·s,阈值电压V_T为-9.16 V,开关比4.7×10³.通过中间探针法,对器件电势分布做了定性判断 关键词： 有机薄膜晶体管 场效应迁移率 接触效应 电荷漂移     

Effect of modifying a methyl siloxane-based dielectric by a polymer thin film for pentacene thin-film transistors

We report on the fabrication of pentacene thin-film transistors (TFTs) utilizing a spun methyl siloxane-based spin-on-glass (SOG) dielectric and show that these devices can give a similar electrical performance as achieved by using pentacene TFTs with a silicon dioxide (SiO₂) dielectric. To improve the electrical performance of pentacene TFTs with the SOG dielectric, we employed a hybrid dielectric of an SOG/cross-linked poly-4-vinylphenol (PVP) polymer. The PVP film was deposited onto the spun SOG dielectric prior to pentacene evaporation, resulting in an improvement of the saturation field effect mobility (μ_sat) from 0.01 cm²/(V s) to 0.76 cm²/(V s). The good surface morphology and the matching surface energy of the SOG dielectric that was modified with the polymer thin film allow the optimized growth of crystalline pentacene domains whose nuclei are embedded in an amorphous phase.     

Enhancement of long-term stability of pentacene thin-film transistors encapsulated with transparent SnO2

The long-term stability of pentacene thin-film transistors (TFTs) encapsulated with a transparent SnO₂ thin-film prepared by ion beam-assisted deposition (IBAD) was investigated. After encapsulation process, our organic thin-film transistors (OTFTs) showed somewhat degraded field-effect mobility of 0.5 cm²/(V s) that was initially 0.62 cm²/(V s), when a buffer layer of thermally evaporated 100 nm SnO₂ film had been deposited prior to IBAD process. However, the mobility was surprisingly sustained up to 1 month and then gradually degraded down to 0.35 cm²/(V s) which was still three times higher than that of the OTFT without any encapsulation layer after 100 days in air ambient. The encapsulated OTFTs also exhibited superior on/off current ratio of over 10⁵ to that of the unprotected devices (∼10⁴) which was reduced from ∼10⁶ before aging. Therefore, the enhanced long-term stability of our encapsulated OTFTs should be attributed to well protection of permeation of H₂O and O₂ into the devices by the IBAD SnO₂ thin-film which could be used as an effective inorganic gas barrier for transparent organic electronic devices.     

Ablation of silicon suboxide thin layers

We investigate the ablation of SiO _x thin films on fused silica substrates using single-pulse exposures at 193 nm and 248 nm. Two ablation modes are considered: front side (the surface of a film is irradiated from above) and rear side (a film is irradiated through its supporting substrate). Fluence is varied from below 200 mJ/cm² to above 3 J/cm². SiO _x films of thickness 200 nm, 400 nm, and 600 nm are ablated. In the case of rear-side illumination, at moderate fluences (around 0.5 mJ/cm²) the ablation depth corresponds roughly to the film thickness, above 1 J/cm² part of the substrate is ablated as well. In the case of front-side ablation the single-pulse ablation depth is limited for all film thicknesses to less than 200 nm even at fluences up to 4 J/cm². Experimental results are discussed in relation to film thickness, fluence, and ablation mode. Simple numerical calculations are performed to clarify the influence of heat transport on the ablation process.