Structure and luminescence of a-plane GaN on r-plane sapphire substrate modified by Si implantation

We show the structural and optical properties of non-polar a-plane GaN epitaxial films modified by Si ion implantation. Upon gradually raising Si fluences from 5×10¹³ cm^-2 to 5×10¹⁵ cm^-2, the n-type dopant concentration gradually increases from 4.6×10¹⁸ cm^-2 to 4.5×10²⁰ cm^-2, while the generated vacancy density accordingly raises from 3.7×10¹³ cm^-2 to 3.8×10¹⁵ cm^-2. Moreover, despite that the implantation enhances structural disorder, the epitaxial structure of the implanted region is still well preserved which is confirmed by Rutherford backscattering channeling spectrometry measurements. The monotonical uniaxial lattice expansion along the a direction (out-of-plane direction) is observed as a function of fluences till 1×10¹⁵ cm^-2, which ceases at the overdose of 5×10¹⁵ cm^-2 due to the partial amorphization in the surface region. Upon raising irradiation dose, a yellow emission in the as-grown sample is gradually quenched, probably due to the irradiation-induced generation of non-radiative recombination centers.     

电离辐射对部分耗尽绝缘体上硅器件低频噪声特性的影响

本文针对辐射前后部分耗尽结构绝缘体上硅(SOI)器件的电学特性与低频噪声特性开展试验研究. 受辐射诱生埋氧化层固定电荷与界面态的影响, 当辐射总剂量达到1 M rad(Si) (1 rad = 10^-2 Gy)条件下, SOI器件背栅阈值电压从44.72 V 减小至12.88 V、表面电子有效迁移率从473.7 cm²/V·s降低至419.8 cm²/V· s、亚阈斜率从2.47 V/dec增加至3.93 V/dec; 基于辐射前后亚阈斜率及阈值电压的变化, 可提取得到辐射诱生界面态与氧化层固定电荷密度分别为5.33×10¹¹ cm^{- 2}与2.36×10¹² cm^-2. 受辐射在埋氧化层-硅界面处诱生边界陷阱、氧化层固定电荷与界面态的影响, 辐射后埋氧化层-硅界面处电子被陷阱俘获/释放的行为加剧, 造成SOI 器件背栅平带电压噪声功率谱密度由7×10^{- 10} V²·Hz^-1增加至1.8×10^-9 V² ·Hz^-1; 基于载流子数随机涨落模型可提取得到辐射前后SOI器件埋氧化层界面附近缺陷态密度之和约为1.42×10¹⁷ cm^-3·eV^-1和3.66×10¹⁷ cm^-3·eV^-1. 考虑隧穿削弱因子、隧穿距离与时间常数之间关系, 本文计算得到辐射前后埋氧化层内陷阱电荷密度随空间分布的变化.     

退火对AlGaInP/GaInP多量子阱 LED外延片性能的影响

采用LP-MOCVD技术在n-GaAs衬底上生长了AlGaInP/GaInP多量子阱红光LED外延片.研究表明退火对外延片性能有重要影响.与未退火样品相比,460℃退火15min,外延片p型GaP层的空穴浓度由5.6×10¹⁸cm^-3增大到6.5×10¹⁸cm^-3,p型AlGaInP层的空穴浓度由6.0×10¹⁷cm^-3增大到1.1×10¹⁸cm^-3.但退火温度为780℃时,p型GaP层和p型AlGaInP层的空穴浓度分别下降至8×10¹⁷cm^-3和1.7×10¹⁷cm^-3,且Mg原子在AlGaInP系材料中的扩散加剧,导致未掺杂AlGaInP/GaInP多量子阱呈现p型电导.在460～700℃退火范围内,并没有使AlGaInP/GaInP多量子阱的发光性能发生明显变化.但退火温度为780℃时,AlGaInP/GaInP多量子阱的发光强度是退火前的2倍.     

A simulation study on p-doping level of polymer host material in P3HT:PCBM bulk heterojunction solar cells

In this study,we investigate the influence of doping on the charge transfer and device characteristics parameters in the bulk heterojunction solar cells based on poly(3-hexylthiophene)(P3HT) and a methanofuUerene derivative(PCBM).Organic semiconductors are also known to be not pure and they have defects and impurities,some of them are being charged and act as p-type or n-type dopants.Calculations of the solar cell characteristics parameters versus the p-doping level have been done at three different n-dopings(N_d) that consist of 5 × 10~(17) cm~(-3),10~(18) cm~(-3),and 5 × 10~(18) cm~(-3).We perform the analysis of the doping concentration through the drift-diffusion model,and calculate the current and voltage doping dependency.We find that at three different n-dopant levels,optimum p-type doping is about N_p = 6 × 10~(18) cm~(-3).Simulation results have shown that by increasing doping level,V_(oc) monotonically increases by doping.Cell efficiency reaches its maximum at somewhat higher doping as FF has its peak at N_p = 3 × 10~(18) cm~(-3).Moreover,this paper demonstrates that the optimum value for the p-doping is about N_p = 6 × 10~(18) cm~(-3) and optimum value for n-dopant is N_d = 10~(18) cm~(-3),respectively.The simulated results confirm that doping considerably affects the performance of organic solar cells.     

高能电子辐射下聚四氟乙烯深层充电特性

介质深层充放电现象是诱发航天器异常故障的重要因素之一.分析了高能电子辐射下介质内部电荷沉积、能量沉积特性和电导特性,考虑了真空与介质界面电荷对电场分布的影响,建立了介质二维深层充电的物理模型,并基于有限元方法实现了数值计算.计算了高能电子辐射下聚四氟乙烯的深层充电特性.结果表明:真空环境下,介质的表面存在较弱的反向电场,随着介质深度增大,电场减小至零,随后逐渐增大,最大值出现在靠近接地附近,但在接地点,电场存在小幅降低.分析了不同辐射时间下(1 h,1 d,10 d和30 d),介质内部最大电位和最大电场的时空演变特性.随着辐射时间的增加,最大电位由-128V增加至-7.9×104V,最大电场由2.83×105V·m-1增加至1.76×108V·m-1.讨论了入射电子束流密度对最大电场的影响,典型空间电子环境(1×10-10A·m-2)下,电子辐照10 d时,介质内部最大电场为2.95×106V·m-1.而恶劣空间电子环境(2×10-8A·m-2)下,电子辐射42 h,介质内部最大电场即达到108V·m-1,超过材料击穿阈值(约为108V·m-1),极易发生放电现象.该物理模型和数值方法可以作为航天器复杂部件多维电场仿真的研究基础.     

Evolution of optical properties and molecular structure of PCBM films under proton irradiation

Low-energy proton irradiation effects on the optical properties and the molecular structure of phenyl-C₆₁-butyric acid methyl ester (PCBM) are studied in this work. The PCBM films are irradiated by 100-keV proton beams with fluences of 5×10¹² p/cm², 5×10¹³ p/cm², and 5×10¹⁴ p/cm², respectively. The photoluminescence (PL) peaks of the post-irradiated PCBM films show a progressive decrease in the peak intensity as the proton fluences increase, which can be attributed to the deep defect levels induced by proton irradiation. Additionally, a slight blue-shift in the PL spectrum is also observed at a proton fluence of 5×10¹⁴ p/cm². The underlying mechanism can be traced back to the lift of the lowest unoccupied molecular orbital (LUMO) level, which is caused by the attachment of methoxy radicals on ortho position of the phenyl ring in the post-irradiated PCBM structure. This work is of significance in understanding the radiation hardness and the damage mechanism of the PCBM film in radiation environments, which is essential before it is put into practical application in space.     

Fe+注入植物种子射程实验的Monte-Carlo仿真

研究表明,TRIM程序运算结果与实验测量离子注入种子的射程分布数据相差甚远.本文根据种子微结构的特点,综合考虑多种因素,设计种子微结构模型和运算程序,用Monte-Carlo仿真不同能量（110 keV,20 keV,200 keV）、不同注量（2×10¹⁶ ions·cm^-2,5×10¹⁶ ions·cm^-2,10¹⁷ ions·cm^-2,2×10¹⁷ ions·cm^-2）的Fe⁺注入花生、彩棉、小麦种子的射程分布,结果显示本设计程序仿真的结果与实验测量数据较为吻合.所获得的注入离子与种子微结构相互作用的随机抽样模拟运算方法,为离子注入与生命体相互作用的理论研究提供新的思路.     

Surface chemical disorder and lattice strain of GaN implanted by 3-MeV Fe10+ ions

Chemical disorder on the surface and lattice strain in GaN implanted by Fe¹⁰⁺ ions are investigated. In this study, 3-MeV Fe¹⁰⁺ ions fluence ranges from 1×10¹³ ions/cm² to 5×10¹⁵ ions/cm² at room temperature. X-ray photoelectron spectroscopy, high-resolution x-ray diffraction, and high-resolution transmission electron microscopy were used to characterize lattice disorder. The transition of Ga-N bonds to oxynitride bonding is caused by ion sputtering. The change of tensile strain out-of-plane with fluence was measured. Lattice disorder due to the formation of stacking faults prefers to occur on the basal plane.     

一种精密的边限振荡器型NQR谱仪及其应用

本文介绍一种精密的场效应管边限振荡器型核四极矩共振(NQR)谱仪。工作频率范围14MHz~35MHz,分段连续可调。这种谱仪的灵敏度高、波形失真小。在室温下,多晶粉未状氯酸钾样品中³⁵Cl的NQR频率测量精度大约3×10^-6。重结晶样品中³⁵Cl的NQR谱一次微分信号信噪比S/N ≥ 150。用该谱仪对KClO3、NaClO3、NaCl样品进行测试,得到氯的同位素³⁵Cl和37Cl的四极耦合常数比(eQq₃5Cl/(eQq₃7Cl的实测值分别为1.2687363、1.2687306、1.2687361。在77K到393K温度区间测量了氯酸钾多晶粉未状样品中³⁵Cl的NQR共振频率和温度的关系,在冰水混合温度附近,温度每变化0.1K,NQR频率的变化是478Hz。     

High-sensitive phototransistor based on vertical HfSe2/MoS2 heterostructure with broad-spectral response

Van der Waals heterostructures based on the two-dimensional (2D) semiconductor materials have attracted increasing attention due to their attractive properties. In this work, we demonstrate a high-sensitive back-gated phototransistor based on the vertical HfSe₂/MoS₂ heterostructure with a broad-spectral response from near-ultraviolet to near-infrared and an efficient gate tunability for photoresponse. Under bias, the phototransistor exhibits high responsivity of up to 1.42×10³ A/W, and ultrahigh specific detectivity of up to 1.39×10¹⁵ cm·Hz^1/2·W^-1. Moreover, it can also operate under zero bias with remarkable responsivity of 10.2 A/W, relatively high specific detectivity of 1.43×10¹⁴ cm·Hz^1/2·W^-1, ultralow dark current of 1.22 fA, and high on/off ratio of above 10⁵. These results should be attributed to the fact that the vertical HfSe₂/MoS₂ heterostructure not only improves the broadband photoresponse of the phototransistor but also greatly enhances its sensitivity. Therefore, the heterostructure provides a promising candidate for next generation high performance phototransistors.     

Photo-stimulated CVD of SiNx for GaAs IC applications

The characteristics of silicon nitride deposited by a photo-enhanced CVD process have been investigated. The nitride films are used as inter metal insulator in GaAs ICs. For this application the step coverage is the most crucial aspect. The photo-CVD of SiN_x proves to be a surface determined deposition process, even in the case of undercutted structures. The insulation between first and second metallization was measured on a contact test structure with 1800 cross-overs. The insulating resistance in this structure is in the GΩ range even if the nitride is only 300 nm thick. A thickness uniformity of 4% for a batch of six 3 inch wafers and a reproducibility of 5% were obtained for 300 nm thick films, the intrinsic tensile stress being as small as 10⁷ to 10⁸ dyn/cm². The threshold voltage shift due to deposition was only -25 mV for MESFETs in GaAs ICs.     

金属有机物化学气相沉积生长GaN薄膜的室温热电特性研究

采用金属有机物化学气相沉积技术生长了不同掺杂浓度的GaN薄膜, 并且通过霍尔效应测试和塞贝克效应测试, 表征了室温下GaN薄膜的载流子浓度、迁移率和塞贝克系数. 在实验测试的基础上, 计算了GaN薄膜的热电功率因子, 并且结合理论热导率确定了室温条件下GaN薄膜的热电优值(ZT). 研究结果表明: GaN薄膜的迁移率随着载流子浓度的增加而减小, 电导率随着载流子浓度的增加而增加; GaN 薄膜材料的塞贝克系数随载流子浓度的增加而降低, 其数量级在100–500 μV/K范围内; GaN薄膜材料在载流子浓度为1.60×10¹⁸ cm^-3时, 热电功率因子出现极大值4.72×10^-4 W/mK²; 由于Si杂质浓度的增加, 增强了GaN薄膜中的声子散射, 使得GaN薄膜的热导率随着载流子浓度的增加而降低. GaN薄膜的载流子浓度为1.60×10¹⁸ cm^-3时, 室温ZT达到极大值0.0025.     

β-SiC单晶块体拉伸变形行为分子动力学研究

用分子动力学方法研究面心立方SiC(β-SiC)、C元素置换掺杂β-SiC单晶块体体系[001]向拉伸变形行为,对体系的拉伸断裂微观机理和5×10⁸/s,1×10⁹/s,1×10¹⁰/s三种应变速率下的力学行为进行分析.发现当拉伸应变量达到某个临界值后,Si-C sp³,C-C sp³键会分别向Si-C sp²和C-C sp²弱键转化.形成一定量sp²键后,β-SiC内部出现孔洞并发生断裂.由于C-C sp³键比Si-C sp³键更易向sp²弱键转化,导致C元素掺杂会降低SiC的强度、弹性模量和拉伸断裂应变.此外还发现此三种应变速率不影响β-SiC的杨氏模量,但影响其拉伸强度.     

基于窄带隙聚合物的高性能可见-近红外光伏探测器

聚合物光伏探测器是一种极具应用前景的新型光电探测器件.研究了基于窄带隙聚合物的高性能可见-近红外光伏探测器,结果表明,所制备的光伏探测器在可见至近红外光谱范围内具有宽的光谱响应(380—960 nm)、出色的响应度(840 nm时达到380 mA/W)和归一化探测度;同时,器件在暗态反偏条件下的能级示意图揭示了器件内平均电场较低是较厚光敏层器件具有低噪声电流的主要原因.电容-电压与时间周期性响应曲线研究表明聚合物光伏探测器具有快速的响应能力和良好的周期重复性.     

表面绝缘混合平面丝阵Z箍缩激光阴影图像诊断

基于脉冲半高全宽约为9 ns、波长为532 nm的Nd:YAG激光器,采用条纹相机和商用数码相机两种记录设备,建立了时间分辨和时间积分两种模式的激光阴影图像诊断系统,在"强光一号"装置上对表面绝缘混合平面丝阵Z箍缩等离子体开展了实验研究.实验结果表明:在融蚀过程中表面绝缘金属丝冕等离子体发展较普通金属丝慢,在t=44ns到t=56ns之间,其平均膨胀速度分别为1.1×104m·s-1和1.7×104m·s-1;在等离子体滞止前10 ns的快速聚爆过程中,表面绝缘金属丝和普通金属丝两侧的平均聚爆速度分别为5.5×105m·s-1和9.3×105m·s-1,表面绝缘一侧等离子体滞止时间小于普通金属丝一侧,分别为5.9 ns和9.5 ns;等离子体碰撞分界线偏向于表面绝缘一侧,滞止时形成的磁流体不稳定性结构类似.     

数字显微全息中记录参数对颗粒测量影响的数值模拟

数字显微全息技术由于具有三维、非接触和实时测量微小空间内流场的能力, 已引起了国内外学者的广泛关注. 利用数字显微全息方法测量微通道流场时, 记录距离、颗粒尺寸、颗粒浓度、入射光波长、CCD分辨率等参数会对颗粒重建结果产生重要影响. 为了评估颗粒浓度和样本空间深度对重建结果的影响, 本文开展了数值模拟研究. 采用基于洛伦兹-米散射理论的程序产生不同浓度的颗粒全息图, 用小波变换重建算法对其进行重建. 结果表明: 在样本空间深度为24 μm 时, 颗粒浓度n_s在3.44×10⁵ mm^-3–13.77×10⁵ mm^-3 范围内时, 颗粒重建率E_p随着颗粒浓度n_s 的增大而迅速减小, 在13.77×10⁵ mm^-3–55.08×10⁵ mm^-3范围内时, 颗粒重建率E_p 随颗粒浓度n_s增大而缓慢减少. 在颗粒浓度n_s (13.77×10⁵ mm^-3) 保持不变时, 颗粒重建率E_p与样本空间深度满足单调递减的线性关系. 当阴影密度不变时, 重建率的变化呈现一定的规律性:当深度L较小时, 样本空间深度对颗粒重建的影响要比颗粒浓度的影响大; 当深度L较大时, 颗粒浓度对颗粒重建的影响较大. 关键词： 数字显微全息 颗粒浓度 粒径误差 位置误差     

Optical properties of He+-implanted and diamond blade-diced terbium gallium garnet crystal planar and ridge waveguides

Terbium gallium garnet (Tb₃Ga₅O₁₂, TGG) crystal can be used to fabricate various magneto-optical devices due to its optimal Faraday effect. In this work, 400-keV He⁺ ions with a fluence of 6.0×10¹⁶ ions/cm² are irradiated into the TGG crystal for the planar waveguide formation. The precise diamond blade dicing with a rotation speed of 2×10⁴ rpm and a cutting velocity of 0.1 mm/s is performed on the He⁺-implanted TGG planar waveguide for the ridge structure. The dark-mode spectrum of the He⁺-implanted TGG planar waveguide is measured by the prism-coupling method, thereby obtaining the relationship between the reflected light intensity and the effective refractive index. The refractive index profile of the planar waveguide is reconstructed by the reflectivity calculation method. The near-field light intensity distribution of the planar waveguide and the ridge waveguide are recorded by the end-face coupling method. The He⁺-implanted and diamond blade-diced TGG crystal planar and ridge waveguides are promising candidates for integrated magneto-optical devices.     

Near-interface oxide traps in 4H–SiC MOS structures fabricated with and without annealing in NO

Near-interface oxide traps(NIOTs)in 4H–Si C metal–oxide–semiconductor(MOS)structures fabricated with and without annealing in NO are systematically investigated in this paper.The properties of NIOTs in Si C MOS structures prepared with and without annealing in NO are studied and compared in detail.Two main categories of the NIOTs,the"slow"and"fast"NIOTs,are revealed and extracted.The densities of the"fast"NIOTs are determined to be 0.76×10~(11)cm~(-2)and0.47×10~(11)cm~(-2)for the N_2 post oxidation annealing(POA)sample and NO POA sample,respectively.The densities of"slow"NIOTs are 0.79×10~(11)cm~(-2)and 9.44×10~(11)cm~(-2)for the NO POA sample and N_2POA sample,respectively.It is found that the NO POA process only can significantly reduce"slow"NIOTs.However,it has a little effect on"fast"NIOTs.The negative and positive constant voltage stresses(CVS)reveal that electrons captured by those"slow"NIOTs and bulk oxide traps(BOTs)are hardly emitted by the constant voltage stress.     

金属与半导体Ge欧姆接触制备、性质及其机理分析

金属与Ge材料接触时界面处存在着强烈的费米钉扎效应, 尤其与n型Ge形成的欧姆接触的比接触电阻率高, 是制约Si基Ge器件性能的关键因素之一. 本文对比了分别采用金属Al和Ni 与Si衬底上外延生长的p型Ge和n型Ge材料的接触特性. 发现在相同的较高掺杂条件下, NiGe与n型Ge可形成良好的欧姆接触, 其比接触电阻率 较 Al接触降低了一个数量级, 掺P浓度为2×10¹⁹ cm^-3时达到1.43×10^-5 Ω·cm². NiGe与p型Ge接触和Al接触的比接触电阻率相当, 掺B浓度为4.2×10¹⁸ cm^-3时达到1.68×10^-5 Ω·cm². NiGe与n型Ge接触和Al电极相比较, 在形成NiGe过程中, P杂质在界面处的偏析是其接触电阻率降低的主要原因. 采用NiGe作为Ge的接触电极在目前是合适的选择. 关键词： 金属与Ge接触性质 NiGe 比接触电阻率     

In-plane oriented CH_3NH_3PbI_3 nanowire suppression of the interface electron transfer to PCBM

One-dimensional nanowire is an important candidate for lead-halide perovskite-based photonic detectors and solar cells. Its surface population, diameter, and growth direction, etc., are critical for device performance. In this research,we carried out a detailed study on electron transfer process at the interface of nanowire CH_3 NH_3 PbI_3(N-MAPbI_3)/Phenyl C61 butyric acid methyl-ester synonym(PCBM), as well as the interface of compact CH_3 NH_3 PbI_3(C-MAPbI_3)/PCBM by transient absorption spectroscopy. By comparing the carrier recombination dynamics of N-MAPbI_3, N-MAPbI_3/PCBM,C-MAPbI_3, and C-MAPbI_3/PCBM from picosecond(ps) to hundred nanosecond(ns) time scale, it is demonstrated that electron transfer at N-MAPbI_3/PCBM interface is less efficient than that at C-MAPbI_3/PCBM interface. In addition, electron transfer efficiency at C-MAPbI_3/PCBM interface was found to be excitation density-dependent, and it reduces with photo-generation carrier concentration increasing in a range from 1.0 × 1018 cm~(-3)–4.0 × 1018 cm~(-3). Hot electron transfer,which leads to acceleration of electron transfer between the interfaces, was also visualized as carrier concentration increases from 1.0 × 10~(18) cm~(-3)–2.2 × 10~(18) cm~(-3).