基于4H-SiC肖特基势垒二极管的γ射线探测器

针对极端环境下耐高温和耐辐照半导体核探测器的研制需求,采用外延层厚度为100μm的4H碳化硅(4H-SiC)制备成肖特基二极管探测器,研究了该探测器对~(241)Am源γ射线的能谱响应.采用磁控溅射金属Ni制备了肖特基二极管的欧姆接触和肖特基接触,利用室温电流-电压和电容-电压测试研究了二极管的电学特性.欧姆特性测试表明,1050°C退火时,欧姆接触特性最好.从正向电流-电压曲线得出二极管肖特基势垒高度为1.617 eV,理想因子为1.127,表明探测器具备良好的热电子发射特性.从电容-电压曲线获得二极管外延层净掺杂浓度为2.903×10~(14)cm~(-3),并研究了自由载流子浓度在外延层中的纵向分布.在反向偏压为500 V时,二极管的漏电流只有2.11 nA,具有较高的击穿电压.测得在-300 V条件下,SiC二极管探测器对能量为59.5 keV的γ射线的能量分辨率为9.49%(5.65 keV).     

Ni/4H-SiC肖特基势垒二极管的γ射线辐照效应

对制备的Ni/4H-SiC肖特基势垒二极管（SBD）进行了γ射线辐照试验,并在辐照过程中对器件分别加0和-30?V偏压.经过1?Mrad（Si）总剂量的γ射线辐照后,不同辐照偏压下的Ni/4H-SiC肖特基接触的势垒高度和理想因子没有退化,SiC外延层中的少子寿命也没有退化.辐照后器件的反向电流下降,这是由于器件表面的负界面电荷增加引起的.研究表明,辐照偏压对Ni/4H-SiC SBD的辐照退化效应没有明显的影响. 关键词： 碳化硅 肖特基 辐照效应 偏压     

4H-SiC肖特基二极管γ射线探测器的模型与分析

 在研究反偏压4H-SiC肖特基二极管作为g射线探测器工作机理的基础上建立了数值模型,模拟了不同偏压和辐照剂量率下探测器的暗电流、工作电流和灵敏度。模拟结果表明:探测器的灵敏度随反向偏压的增加而上升;对于Au/SiC肖特基二极管,有源区掺杂数密度为2.2×10¹⁵ cm^-3时,0 V偏压下探测器的灵敏度为13.9×10^-9 C/Gy,100 V偏压下为24.5×10^-9 C/Gy。计算结果与实验数据符合得较好。     

4H-SiC探测器的γ辐照影响研究

为研究4H-SiC探测器的抗γ辐照性能,使用40万Ci级的60Co源对4H-SiC探测器进行了数次辐照,累积辐照剂量最大为1 MGy(Si),并在辐照后对4H-SiC的性能进行了测试。随着累积辐照剂量增加,4H-SiC探测器的正向电流增大,而反向电流恰好相反;根据4H-SiC探测器的正向I-V曲线可提取理想因子和肖特基势垒,理想因子从1.87增加到2.18,肖特基势垒从1.93 V减小至1.69 V;4H-SiC探测器对241Am源产生的α粒子进行探测时,探测器的电荷收集率从95.65%退化到93.55%,测得能谱的能量分辨率由1.81%退化到2.32%。4H-SiC探测器在受到1 MGy(Si)的γ辐照后,与未受到辐照时相比,在探测能量为5.486 MeV的α粒子时能量分辨率和电荷收集率仅退化了28.18%和2.2%,仍具备优良的探测性能。     

n-GaN肖特基势垒光敏器件的电子辐照效应

本文主要研究了n型GaN肖特基紫外光敏器件(包括GaN肖特基势垒紫外探测器,GaN肖特基二极管)的电子辐照效应和失效机理,以及辐照后二极管对不同波长光的光敏特性的变化。从实验中观测到,随着辐照注量的不断增加,GaN光敏器件的击穿电压明显减小,反向漏电流逐渐增大。证实了辐照后Au/GaN间产生的界面态是引起GaN肖特基势垒光敏器件辐照失效的原因。另外,在研究辐照效应对GaN肖特基二管光敏特性的影响时观测到,经过一定剂量的辐照后,GaN肖特基二管能探测到380nm的紫外光和可见光,而在辐照以前,它是探测不到的。这说明辐照效应将导致肖特基势垒光敏器件对较长波长的吸收,使得UV探测器中可见光成分的背景噪声增加。     

金刚石膜α粒子探测器的电学性能研究

从外加偏压、预辐照处理等方面对三明治结构金刚石膜探测器在α粒子辐照下的电学性能进行了研究.电流-电压特性和脉冲高度分布测试和分析表明，金刚石膜探测器在能量为5.5MeV的²⁴¹Am α粒子辐照一定时间后，其暗电流有所增加.探测器顶电极施加负偏压时，在α粒子辐照下得到的净电流和信噪比均较大.Raman光谱测试表明，造成上述现象的原因很可能是金刚石膜厚度方向的不均匀性分布.负偏压下探测器对α粒子的能量分辨率为25.0%，优于正偏压下的能量分辨率(38.4%).随着α粒子辐照时间的延长，探测器的净电流和电荷收集效率均有明显增加. 关键词： 金刚石薄膜 辐射探测器 电学性能 脉冲高度分布     

In_(0.53)Ga_(0.47)As/InP雪崩光电二极管响应及电学特性

通过分子束外延生长和开管式Zn扩散方法,制备了低暗电流、宽响应范围的In_(0.53)Ga_(0.47)As/InP雪崩光电二极管.在0.95倍雪崩击穿电压下,器件暗电流小于10nA;-5V偏压下电容密度低至1.43×10~(-8) F/cm~2.在1 310nm红外光照及30V反向偏置电压下,雪崩光电二极管器件的响应范围为50nW~20mW,响应度达到1.13A/W.得到了电荷层掺杂浓度、倍增区厚度结构参数与击穿电压和贯穿电压的关系:随着电荷层电荷密度的增加,器件贯穿电压线性增加,而击穿电压线性降低;电荷层电荷面密度为4.8×10~(12)cm~(-2)时,随着倍增层厚度的增加,贯穿电压线性增加,击穿电压增加.通过对器件结构优化,雪崩光电二极管探测器实现25V的贯穿电压和57V的击穿电压,且具有低暗电流和宽响应范围等特性.     

基于silvaco-TCAD的In0.53Ga0.47As/InP红外探测器的仿真

采用silvaco-TCAD研究In0.53Ga0.47As/InP SAGCM-APD光电探测器,对探测器的结构参数对器件的电场分布、击穿电压和贯穿电压的影响进行仿真分析。研究表明电荷层对器件内部电场起到更好的调节作用,但过高的电荷层面密度会导致APD探测器的击穿电压与贯穿电压之差减小。倍增层厚度的增加使击穿电压先减小后增高,贯穿电压线性增加,同时耗尽层宽度变大,使器件电容减小。当倍增区厚度1 μm、偏压为-5 V时,器件电容密度达到了4.5×10-17 F/μm。反向偏置电压为30 V时,APD探测器在1.31 μm和1.55 μm波长下的响应度分别达到1 A/W和1.1 A/W     

化学气相沉积金刚石薄膜探测器对α粒子的电荷收集效率

 实验测量了自行研制的三明治电极结构化学气相沉积(CVD)金刚石薄膜探测器在室温下对241Am, 243Am 与244Cm α粒子的能谱响应,得到了其α粒子响应电荷收集效率随偏压的变化关系;获得了不同偏压下其相对平均电荷收集效率及响应谱下降沿10%处的相对电荷收集效率。结果表明：所研制的CVD金刚石薄膜探测器性能稳定,对α粒子响应的电荷收集效率随偏压的增加而趋于饱和,对α粒子平均电荷收集效率达33.5%,谱下降沿10%处的电荷收集效率达57%。     

SiC-pn结二极管α粒子辐射效应

为了研究6HSiC材料制作的pn结二极管探测器的辐照特性,采用蒙卡程序模拟研究了4.3和1.8MeV能量的α粒子在辐照探测器中的物理过程。介绍了二极管探测器的工艺制作和物理参数,根据其结构建立了仿真模型,利用蒙卡程序进行了α粒子照射的仿真研究。研究结果直观地反映了α粒子在探测器中的输运情况。α粒子在探测器中的辐射效应主要是电离作用,电离产生的电子空穴对形成一定的分布。给出了α粒子在探测器中的电离能量损失分布及二极管探测器的电荷收集效率表达式。     

The barrier-height inhomogeneity in identically prepared Ni/n-type 6H-SiC Schottky diodes

The effective barrier heights and ideality factors of identically fabricated Ni/n-type 6 H-SiC Schottky diodes (23 dots) have been calculated from their experimental forward bias current–voltage (I–V) and reverse bias capacitance–voltage (C–V) characteristics. A statistical study related to the experimental barrier heights (BHs) and ideality factors of the diodes has been made. The effective Schottky barrier heights (SBHs) and ideality factors obtained from the I–V and C–V characteristics have differed from diode to diode. The BHs obtained from the I–V characteristics varied from 0.85 to 1.03 eV, the ideality factors varied from 1.13 to 1.40 and the BHs from C^-2–V characteristics varied from 1.10 to 1.70 eV. The experimental BH and ideality factor distributions obtained from the I–V characteristics are fitted by a Gaussian function, and their mean values are found to be 0.92±0.04 eV and 1.29±0.08 eV, respectively. The lateral homogeneous SBH value of 1.16 eV for the Ni/n-type 6H-SiC diodes has been calculated from a linear extrapolation of the effective barrier heights to n_if=1.03. PACS 79.40.+z; 73.40.Sx; 73.30.+y; 71.20.Nr     

Ti/4H-SiC肖特基势垒二极管抗辐射特性的研究

本文采用γ射线、高能电子和中子对Ti/4H-SiC肖特基势垒二极管(SBD)的抗辐射特性进行了研究.研究发现对于γ射线和1 MeV电子辐照,-30 V辐照偏压对器件的辐照效应没有明显的影响.经过1 Mrad(Si)的γ射线或者1×l0¹³ n/cm²的中子辐照后,Ti/4H-SiC肖特基接触都没有明显退化;经过3.43×10¹⁴ e/cm²的1 MeV电子辐照后Ti/4H-SiC的势垒高度比辐照前轻微下降,这是由于高能 关键词： 碳化硅 肖特基 辐照 偏压     

Edge termination study and fabrication of a 4Hben SiC junction barrier Schottky diode

The 4H-SiC junction barrier Schottky (JBS) diodes terminated by field guard rings and offset field plate are designed, fabricated and characterized. It is shown experimentally that a 3-μm P-type implantation window spacing gives an optimum trade-off between forward drop voltage and leakage current density for these diodes, yielding a specific on-resistance of 8.3 mΩ·cm². A JBS diode with a turn-on voltage of 0.65 V and a reverse current density less than 1 A/cm² under 500 V is fabricated, and the reverse recovery time is tested to be 80 ns, and the peak reverse current is 28.1 mA. Temperature-dependent characteristics are also studied in a temperature range of 75 ℃-200 ℃. The diode shows a stable Schottky barrier height of up to 200 ℃ and a stable operation under a continuous forward current of 100 A/cm².     

Study of 4H-SiC junction barrier Schottky diode using field guard ring termination

This paper reports that the 4H-SiC Schottky barrier diode, PiN diode and junction barrier Schottky diode terminated by field guard rings are designed, fabricated and characterised. The measurements for forward and reverse characteristics have been done, and by comparison with each other, it shows that junction barrier Schottky diode has a lower reverse current density than that of the Schottky barrier diode and a higher forward drop than that of the PiN diode. High-temperature annealing is presented in this paper as well to figure out an optimised processing. The barrier height of 0.79 eV is formed with Ti in this work, the forward drop for the Schottky diode is 2.1 V, with an ideality factor of 3.2, and junction barrier Schottky diode with blocking voltage higher than 400 V was achieved by using field guard ring termination.     

Influence of deep defects on electrical properties of Ni/4H-SiC Schottky diode

In this paper, we investigate the influence of deep level defects on the electrical properties of Ni/4H-SiC Schottky diodes by analyzing device current-voltage(I-V) characteristics and deep-level transient spectra(DLTS). Two Schottky barrier heights(SBHs) with different temperature dependences are found in Ni/4 H-SiC Schottky diode above room temperature. DLTS measurements further reveal that two kinds of defects Z_(1/2) and Ti(c)~a are located near the interface between Ni and SiC with the energy levels of E_C-0.67 eV and E_C-0.16 eV respectively. The latter one as the ionized titanium acceptor residing at cubic Si lattice site is thought to be responsible for the low SBH in the localized region of the diode, and therefore inducing the high reverse leakage current of the diode. The experimental results indicate that the Ti(c)~a defect has a strong influence on the electrical and thermal properties of the 4 H-SiC Schottky diode.     

套刻偏差对4H-SiC 浮动结结势垒肖特基二极管的影响研究

4H-SiC浮动结结势垒肖特基二极管与常规结势垒肖特基二极管相比在 相同的导通电阻条件下具有更高的击穿电压. 由p⁺埋层形成的浮动结与主结p⁺区 之间的套刻对准是实现该结构的一项关键技术. 二维模拟软件ISE的模拟结果表明, 套刻偏差的存在会明显影响器件的击穿特性, 随着偏差的增大击穿电压减小. 尽管主结和埋层的交错结构与对准结构具有相似的击穿特性, 但是当正向电压大于2 V后, 交错结构的串联电阻更大.     

Influence of contact shape on AlGaN/GaN Schottky diode prepared on Si with thick buffer layer

A report on the fabrication and characterization of high performance conventional and ring-shaped AlGaN/GaN Schottky barrier diode on Si is presented. The resulting device exhibited low leakage current, which led to a detectivity performance of 3.48×10¹³ and 1.76×10¹³ cm?Hz^1/2 W^?1, respectively, for both conventional and ring-shaped Schottky diode. The differential resistances of both devices were obtained at approximately 1.37×10¹² and 1.41×10¹³ Ω, respectively. The zero bias peak responsivities of conventional and ring-shaped Schottky diodes were estimated to be 3.18 and 2.08 A?cm^?2/W, respectively. The typical UV to visible rejection ratio was observed over three orders of magnitude at zero bias. The C–V measurements was used to calculate and analyze the polarization sheet charge density of the AlGaN barrier layer by using self-consistently solving Schrodinger’s and Poisson’s equations. It is demonstrated that the ring shape of the Schottky barrier has higher polarization sheet charge density, which has the consequence that the Schottky shape has influence on the strain of the AlGaN barrier layer.     

基于4H-SiC的高能量分辨率α粒子探测器

为突破传统半导体核探测器耐高温与抗辐照性能不足的瓶颈,采用4H-SiC宽禁带半导体材料研制了4H-SiC探测器,并研究其构成的探测系统对α粒子的能量分辨率和能量线性度。所研制4H-SiC探测器漏电流低,当外加反向偏压为200V时,其漏电流仅14.92nA/cm2。采用具有5种主要能量α粒子的226 Ra源研究其构成的探测系统对α粒子的能量分辨率,获得4H-SiC探测系统对4.8~7.7 MeV能量范围内α粒子的能量分辨率为0.61%~0.90%,与国际上报道的高分辨4H-SiC探测系统能量分辨率一致。同时,实验结果表明:4H-SiC探测系统对该能量范围内α粒子的能量线性度十分优异,线性相关系数为0.999 99。