半导体量子器件物理讲座第三讲 异质结双极晶体管（HBT）

文章首先给出了同质结双极晶体管和异质结双极晶体管（HBT）在材料结构参数上的差异,这种差异表明,在器件的材料结构设计上已从掺杂设计步到了能带工程设计,和同质结双极晶体管相比,HBT具有更优越的性能,接着介绍了HBT的工作原理,典型的材料结构及器件的制作。     

基于间接跃迁模型的p+-GaAsSb费米能级研究

重p型掺杂GaAsSb广泛应用于InP HBT基区材料,重掺杂影响GaAsSb材料的带隙和费米能级等重要参数,这些参数对设计高性能HBT起着关键作用。本文通过间接跃迁模型研究了p⁺-GaAsSb材料的荧光性质,以及费米能级与Sb组分的关系。由于费米能级与空穴有效质量m_h和空穴态密度n_h存在函数关系,我们通过荧光测量并计算了空穴有效质量m_h和空穴态密度n_h,研究结果表明m_h和n_h共同主导了费米能级的变化。     

GaSb/InSb/InP异质结构的漏电流机制

为提高InSb红外探测器室温下的工作性能,设计了GaSb/InSb/InP异质结构,并对结构中俄歇复合与肖克莱-瑞德复合两种复合机制对漏电流的影响进行研究。利用TCAD仿真工具对InSb探测器件进行建模,分析得到能带结构与载流子分布。以能带参数为基础,根据连续性方程,结合漂移扩散模型,分析了俄歇复合在反偏压下的衰减效应,并综合肖克莱-瑞德复合的影响,计算出不同缺陷浓度下器件的漏电流。利用低压金属有机化学气相沉积(LP-MOCVD)技术制备GaSb/InSb/InP异质外延样品,对其漏电流进行测试,并与仿真结果进行对比分析。实验结果表明,计算结果与实验结果一致,器件工作性能的主要限制为肖克莱-瑞德复合机制,器件的漏电流为0.26 A·cm~(-2),品质因子R_0A为0.1Ω·cm~2。相比于同质InSb结构,器件的R_0A提高了一个数量级,已接近实用化水平。     

InAlAs/GaSbAs/InP DHBT与InP/GaSbAs/InP DHBT性能比较分析

双异质结双极晶体管(DHBT)的性能与发射区-基区(E-B) 异质结和基区-集电区(B-C)异质结的能带突变类型关系密切, 本文基于热场发射-扩散模型, 对两类不同能带结构类型的新型DHBT的性能做了比较分析. 结论表明: 与作为当今研究热点的E-B和B-C异质结构均为全交错II型能带结构的InP/GaSbAs/InP DHBT的性能相比, E-B异质结采用传统I型、B-C异质结采用交错II型的一类新型能带结构的InAlAs/GaSbAs/InP DHBT虽然在开启电压上更高, 但具有更好的电流驱动能力、直流增益和高频性能.     

异质结界面电荷对突变InP/InGaAs异质结双极晶体管热场发射影响研究

异质结界面电荷的存在改变了异质结的内建势, 这引起了界面势垒尖峰高度和形状的扰动, 从而使异质结界面载流子的输运产生相应的变化, 最终导致异质结双极晶体管 (HBT) 性能的改变. 基于热场发射-扩散模型, 对异质结界面电荷对InP/InGaAs HBT性能的改变做了研究, 得到结论是正极性的界面电荷有利于InP/InGaAs HBT的直流和高频特性的改善, 而负极性的界面电荷则使器件的直流和高频特性变差. 关键词： InP/InGaAs异质结双极晶体管 界面电荷 内建势 热场发射     

能带工程对射频功率SiGe异质结双极晶体管热性能的改善

众所周知,基区"能带工程"可以改善Si_1-xGe _{x 基区异质结双极晶体管(HBT)的直流、频率和噪声等特性,但"能带工程"对HBT热学特性的影响的研究还很少。本文基于三维热电反馈模型,分析了"能带工程"对射频功率SiGe HBT热性能的影响。考虑到电流增益随温度的变化以及发射结电压负温度系数,给出了器件热稳定所需最小镇流电阻(REmin)的表达式,在此基础上给出了非均匀镇流电阻的设计,进一步提高了SiGe HBT的热稳定性 关键词： SiGe HBT Ge组分 热电反馈 镇流电阻}     

有机／聚合物电致发光器件中层间的能带匹配对器件发光性质的影响

对几种有机／聚合物电致发光材料的能带结构进行了表征，设计了几种结构的器件，并对它们进行了性质比较，结果表明，通过各种材料间合理的能带匹配，可以获得综合性能较好的电致发光器件。     

GaAs1-xSbx/GaAs单量子阱的光学特性研究

用选择激发光荧光研究了分子束外延生长的GaAsSb/GaAs单量子阱的光学性质，第一次同时观察到空间直接(Ⅰ类)和间接(Ⅱ类)跃迁.它们表现出不同的特性：Ⅰ类跃迁具有局域化特性，其发光能量不随激发光能量而变；Ⅱ类发光的能量位置随激发功率的增大而蓝移，也随激发光能量的增加而蓝移，复合发光发生在位于异质结GaAs一侧的电子和GaAsSb中的空穴之间，实验结果可以很好地用电荷分离造成的能带弯曲模型来解释，这也是空间间接跃迁的典型特性.还用光荧光的激发强度关系和时间分辨光谱进一步论证了GaAsSb/GaAs能带排 关键词： GaAsSb/GaAs 选择激发 Ⅱ类跃迁     

单载流子光电探测器的高速及高饱和功率的研究

利用载流子漂移-扩散模型, 模拟并分析了InGaAs/InP单载流子光电探测器(Uni-traveling-carrier/UTC-PD) 在不同条件下的物理特性及其带宽和饱和特性, 结合器件实验结果分析了影响器件高速和高饱和性能的物理机理. 结论表明在吸收区采用浓度渐变掺杂和增加InP崖层(cliff layer), 可以显著提升器件饱和特性, 高入射功率下吸收区电场崩塌是器件饱和的直接因素, 直径大于20 μm的UTC探测器中RC常数仍是影响带宽的主要因素. 论文指出了优化器件结构、 提升器件性能的有效方法.     

SiGe HBT大信号等效电路模型

基于SiGe HBT(异质结双极晶体管)的物理模型，建立了描述SiGe HBT的大信号等效电路模型.该等效电路模型考虑了准饱和效应和自热效应等，模型分为本征和非本征两部分，物理意义清晰，拓扑结构相对简单.该模型嵌入了PSPICE软件的DEVEO(器件方程开发包)中.在PSPICE软件资源的支持下，利用该模型对SiGe HBT器件进行了交直流特性模拟分析，模拟结果与理论分析结果相一致，并且与文献报道的结果符合较好. 关键词： SiGe HBT 等效电路模型 PSPICE     

A review of radiation effects in heterojunction bipolar transistors

We present a review of radiation effects studies on heterojunction bipolar transistors (HBTs) in order to develop a framework for qualifying devices for application in the harsh radiation environment of space. Radiation effects in different HBT material systems are considered here, including Si/SiGe, GaAs/AlGaAs, and InP/InGaAs. We discuss the different effects of ionizing and nonionizing radiation on device performance and review the strong role that device geometry plays in determining the overall radiation tolerance. We present a new comparison of radiation tolerance in conventional transistors, HBTs, and high electron mobility transistors. Finally, we conclude that with proper design, HBTs are excellent candidates for application in space.     

Study of the multiple-negative-differential-resistance (MNDR) switching behaviors based on heterojunction bipolar transistor (HBT) structures

In this paper, we demonstrate multiple-negative-differential-resistance (MNDR) switching behaviors based on the InGaP/GaAs heterostructure-emitter bipolar transistor (HEBT) and InGaAlAs/InP heterojunction bipolar transistor (HBT) structures. The devices act like conventional HBTs under forward operation mode. The proposed HEBTs show lower offset voltage due to the correct design of the emitter thickness. On the other hand, MNDR phenomena resulting from avalanche multiplication, confinement effects and the potential redistribution process are observed under inverted operation mode for both devices. In addition, three-terminal NDR characteristics are investigated under the applied base currentI_B . Moreover, for the InGaAlAs/InP HBT, anomalous multiple-route and multiple-step current–voltage (I–V) characteristics at 77 K are observed due to the insertion of a InGaAs quantum well (QW) between the base and collector layers.     

Passivation of InP-based HBTs

The surface effects, the (NH₄)₂S and low-temperature-deposited SiN_x passivations of InP-based heterostructure bipolar transistors (HBTs) have been investigated. The surface recombination current of InP-based HBTs is related to the base structures. The (NH₄)₂S treatment for InGaAs and InP removes the natural oxide layer and results in sulfur-bonded surfaces. This can create surface-recombination-free InP-based HBTs. Degradation is found when the HBTs were exposed to air for 10 days. The low-temperature-deposited SiN_x passivation of InGaAs/InP HBTs causes a drastic decrease in the base current and a significant increase in the current gain. The improvement in the HBT performance is attributed to the low deposition temperature and the effect of N₂ plasma treatment in the initial deposition process. The SiN_x passivation is found to be stable. S/SiN_x passivation of InGaAs/InP HBTs results in a decrease in the base current and an increase in the current gain. The annealing process can cause the base current to decrease further and the current gain increase.     

基区Ge组分分布对SiGe HBTs热学特性的影响

基区Ge组分的加入可以改善SiGe HBT的直流特性、 频率特性和噪声特性, 但Ge组分及其分布对HBT热学特性的影响报道还很少. 本文利用SILVACO半导体器件仿真工具, 建立了多指SiGe HBT模型, 对基区具有不同Ge组分梯度结构的SiGe HBTs的热学特性和电学特性的热稳定性进行了研究. 研究发现, 在Ge组分总量一定的条件下, 随着Ge组分梯度的增大, 器件的特征频率明显提高, 增益β和特征频率f_T随温度变化变弱, 器件温度分布的均匀性变好, 但增益变小; 而基区均匀Ge组分(Ge组分梯度为零) 的HBT的增益较大, 但随温度的变化较大, 器件温度分布的均匀性也较差. 在此基础上, 将基区Ge组分均匀分布和Ge组分缓变分布相结合, 提出了兼顾器件热学特性、 增益特性和频率特性的新型基区Ge组分分布- 分段分布结构. 结果表明, 相比于基区Ge组分均匀分布的器件, 新器件温度明显降低; β和f_T保持了较高的值, 且随温度的变化也较小, 显示了新结构器件的优越性. 这些结果对HBT的热学设计具有重要的参考意义, 是对SiGe HBT性能研究的一个补充.     

InGaAsP/InGaAs tandem cells for a solar cell configuration with more than three junctions

Currently, triple‐junction solar cells realized from III–V semiconductor compounds hold the solar energy conversion efficiency world record. To improve the efficiency significantly, it is necessary to increase the number of junctions and to involve a sub‐cell with an absorber layer in the band gap range of 1 eV. For the realization of a stacked four‐junction device with optimised band gaps, we have grown InGaAsP/InGaAs tandem cells lattice matched to InP substrates, and investigated properties of the absorber bulk material. Time‐resolved photoluminescence of the low band gap In_0.53Ga_0.47As absorber embedded between InP barriers was measured. The InGaAs/GaAsSb tunnel diode structure used in the tandem has been processed into a separate device and I –V curves were measured. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Comprehensive studies of InGaP/GaAs heterojunction bipolar transistors with different thickness of setback layers

The performances of InGaP/GaAs heterostructure bipolar transistors (HBTs) with different thickness of setback layers are theoretically studied. The appropriate thickness of the setback layer is an important factor in high-speed HBTs. In this work, it is found that the HBT device with a 60–90 Å setback layer has better DC and RF characteristics due to the absence of potential spike and reduced transit time. In addition, the studied devices with appropriate setback layer thickness have lower offset voltage, reverse saturation voltage, and base and collector current ideality factor.