Electroless silver plating on tetraethoxy silane-bridged fiber glass

Tetraethoxy silane was used to functionalize the surface of fiber glass (FG) for adsorption with the electroless plated silver shell. The performance of electroless silver plated FG with tetraethoxy silane modification was compared to that of unmodified FG in terms of mechanical and electrical properties. The silane bridge provided more stability for binding with different concentrations of electroless plating silver ions. The characterization was investigated by using field emission scanning electron microscope (FESEM), X-ray diffraction patterns (XRD), energy-dispersion X-ray (EDX), metal microscope (MM) and electric resistance. The Ag coating on TEOS modified FG was more durable than that of unmodified FG in the ball milling test, as confirmed by the data of electric resistance and residue weight. The optimized conditions for producing the Ag coating FG were also investigated. The Ag-Si-FG-3-c product in this study has the lowest electrical resistance of 1.56 × 10³ Ω/cm² and good mechanical stability as exhibited in ball milling tests.     

Electroless preparation and characterization of magnetic Ni-P plating on polyurethane foam

Magnetic Ni-P plating was coated on surface of polyurethane (PU) foam by electroless plating technique. Morphology, composition, structure, thermal decomposing behavior and magnetic property of PU foam before and after plating were characterized by scanning electron microscopy (SEM), energy diffraction spectrum (EDS), X-ray photoelectron spectroscopy (XPS), infrared spectrometer (IR), X-ray diffraction (XRD), thermogrametric analysis (TG) and vibrating sample magnetometer (VSM), respectively. The results showed that the Ni-P plating was composed by particles whose diameters were in the range of 1-2 μm. Because of the Ni-P plating coated on surface of PU foam, peak intensity of the plated PU foam in IR and XRD were lower than those before plating. TG curves of PU foam before and after plating were composed of two decomposing stages. Because part of Ni in Ni-P plating was oxidized, TG curve of the plated PU foam was uptilt during 650-1000 °C. The plated PU foams are magnetic and can be used in some special application.     

Electroless plating of copper on surface-modified glass substrate

This work focuses on developing a novel convenient method for electroless copper deposition on glass material. This method is relied on the formation of amino (NH₂)-terminated film on the surface of glass substrate, by coating polyethylenimine (PEI) on glass matrix and using epichlorohydrin (ECH) as cross-linking agent. The introduced amino groups can effectively adsorb the palladium, the catalysts which could initiate the subsequent Cu electroless plating, onto the glass substrate surface. Finally, a copper film is formed on the palladium-activated glass substrate through copper electroless plating and the surface-coppered glass material is therefore acquired. X-ray diffraction (XRD), atomic force microscope (AFM), scanning electron microscopy (SEM) images combined with energy diffraction X-ray (EDX) analysis demonstrate the successful copper deposition on the surface of glass substrate.     

Investigation of the structure and the physical properties of nickel-phosphorus ultra-black surfaces

Ultra-black materials with low reflectivity can be applied in many fields of science and technology. We deposited nickel-phosphorus alloys (Ni-P) on copper substrate with the electroless plating method and etched the electroless plating with nitric acid in order to build ultra-black surface. On the one hand, the components of the Ni-P ultra-black surface layer were investigated by XRF and XPS. SEM represented that there are innumerable conical holes with the different diameters on the surface. XRD showed that the whole surface has become amorphous. On the other hand, compared to electroless blackening film by oxidation and black chromium plating materials, the Ni-P ultra-black surface showed lower wavelength dependence and lower reflectance in the range of 380–780 nm. In addition, the temperature of the sample with the Ni-P ultra-black surface increased more highly and quickly compared to the black chromium plating film after exposure in an IR laser for about half an hour. PACS 68.55.-a; 82.80.Kq; 78.68.+m     

石英光纤的金属镍锡涂敷工艺研究

为了实现石英光纤传感器的无胶金属化封装,需要在光纤表面涂敷金属层。先利用化学镀方法在石英光纤表面镀镍层,再利用电镀工艺电镀锡层,从而获得表面光亮、均匀、附着牢固、可焊性好的金属涂敷层。实验中研究了敏化、活化工艺对镀层的影响并提出一种效果较好的敏化活化方法。给出了石英光纤表面化学镀镍的最佳工艺条件。     

M型钡铁氧体陶瓷微珠核壳腔结构吸波材料

利用自反应淬熄法制备了一种M型钡铁氧体空心陶瓷微珠材料,在此基础上,对其表面进行超声波化学镀Ni-Co复合层,从而形成了具有核/壳/腔结构的材料;通过扫描电子显微镜、能谱仪和X射线衍射仪分析表明,该材料具有中空结构,主要物相BaFe12O19为M型钡铁氧体,经过化学镀后,在其表面形成了一层Ni-Co复合层;经过吸波性能测试,化学镀Ni-Co复合层后,在2~18GHz范围内,当厚度为2.10mm时,最低反射率达到了-28.62dB,反射率小于-10dB的带宽为3.33GHz。     

化学镀铜天然高分子材料表面特征的近红外光谱分析

通过对天然高分子材料木材进行化学镀的方法制成的木质电磁屏蔽材料既可以保留木材的一些优良特性,又能有效改善木材导电、 导热和电磁屏蔽性,不仅为木材的增值利用开辟了新道路,还为电磁屏蔽材料的加工利用拓宽了领域。本研究利用近红外光谱结合主成分分析法对化学镀铜处理前后样品进行了分析研究,旨在探讨利用近红外光谱技术研究该材料表面特性的可行性。结果表明：(1)化学镀铜前后样品表面的近红外光谱在形状和吸收强度上存在显著差异,而不同镀铜时间的样品之间也存在差异,尤其是反应未充分的样品。(2)经过主成分分析后,镀铜前后样品沿PC1轴、 PC2轴大致分成了6类,其中未处理样品、 活化处理样品性质较接近,镀铜时间25和40 min样品因反应充分,性质也比较类似,说明近红外光谱中包含反映材料处理前后的重要特征信息。(3)比较近红外区域和可见光区域光谱的主成分分析效果,发现近红外光谱区比可见光光谱区对镀铜处理前后样品的分类效果好,可见光光谱在突出样品的表面颜色特征信息方面表现更好,这说明两者结合运用更有利于样品表面特征信息的表征。     

ICF玻璃靶丸化学镀磁性Ni-Co-Fe-P四元合金涂层

采用化学镀技术在ICF玻璃靶丸表面均匀包覆一层磁性Ni-Co-Fe-P四元合金涂层,通过扫描电子显微镜、原子力显微镜、能量衍射谱仪和振动样品磁强计对ICF玻璃靶丸表面化学镀Ni-Co-Fe-P四元合金涂层的形貌、组成和磁性能进行了表征。结果表明:化学镀Ni-Co-Fe-P四元合金涂层的ICF玻璃靶丸,表面由平均直径为50 nm的细小颗粒组成,表面粗糙度小,磁性能高,可望用于磁悬浮实验研究。     

A plating method for metal coating of fiber Bragg grating

We present a method for metal coating optical fiber and in-fiber Bragg grating. The technology process which is based on electroless plating and electroplating method is described in detail. The fiber is firstly coated with a thin copper or nickel plate with electroless plating method. Then, a thicker nickel plate is coated on the surface of the conductive layer. Under the optimum conditions, the surfaces of chemical plating and electroplating coatings are all smooth and compact. There is no visible defect found in the cross-section. Using this two-step metallization method, the in-fiber Bragg grating can be well protected and its thermal sensitivity can be enhanced. After the metallization process, the fiber sensor is successfully embedded in the 42CrMo steel by brazing method. Thus a smart metal structure is achieved. The embedding results show that the plating method for metallization protection of in-fiber Bragg grating is effective.     

An investigation of smooth nano-sized copper seed layers on TiN and TaSiN by new non-toxic electroless plating

The purpose of this research is to explore the properties of a copper seed layer grown by electroless plating on TiN. We have developed a displacement layer made of amorphous silicon (a-Si) and copper contact displacement process to improve the island structure of copper activated layer which can then be grown directly on the surface of TiN. Furthermore, this research proposes glyoxylic acid as replacements to formaldehyde, which is commonly used at present as a reductant but regarded as a carcinogen, and is of high volatility. The copper seed layer has been grown by electroless plating on an activated surface of TiN, at the set temperature of 60 °C with the plating bath consisting of the copper source, complexing agent, stabilizer and surfactant. The existence of a copper seed layer provides not only the conduction layer, but also the copper nucleation layer, to help the growth of electroplated copper on the surface of TiN. Moreover, based on the results of the studies can lead us to grow a smooth nano-sized Cu seed layer on the top of a TaSiN layer.     

Laser-assisted activation and metallization of polyimides

Experimental results are presented on the maskless metallization of the surface of polyimides. In a certain range of laser parameters (Ar⁺ and copper-vapor lasers) the surface of polyimides irradiated in the air becomes catalytically active with respect to copper deposition from the solution for electroless copper plating. Copper lines 50–100 m wide are deposited on the Kapton films with good adherence.     

石英基掺Tm3+包层抽运光纤激光器

在MCVD车床上利用“湿法”掺杂方法研制出纤芯高掺Ge的石英基掺Tm³⁺光纤预制棒,采用侧面研磨和抛光工艺制成横截面为正六边形的光纤预制棒.经拉丝,内层涂覆低折射率材料后制成包层抽运光纤.测试其吸收谱,并对光纤参数进行优化.通过在光纤两端紫外写入光纤Bragg光栅,制成线形光学谐振腔,在工作波长793nm的激光抽运下,获得工作波长1947.1031nm、功率2.05W的激光输出.由此证明这种光纤具有优异的光学特性. 关键词： 3+光纤')" href="#">石英基掺Tm³⁺光纤 光纤Bragg光栅 包层抽运 光纤激光器     

Surface wettability of atmospheric dielectric barrier discharge processed Armos fibers

Wettability of Armos fibers has been investigated after exposed to dielectric barrier discharge (DBD) plasma, which was performed at atmospheric pressure in air while varying the sample treatment time between 9 and 27 s. Contact angles and surface free energy of the original and plasma-treated fibers were measured with dynamic contact angle analysis (DCAA) to reveal the correlation between the fiber wettability and the surface treatment, including surface composition and topography modifications, which were evaluated by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM), respectively. It was found by XPS analysis that the O/C atomic ratio on Armos fiber surface can be increased from 0.134 to 0.248 after the 18 s exposure to the plasma and many polar functional groups were proved to be incorporated into the surface, which aided good wetting. In addition, AFM observations revealed the changes of fiber surface microstructure, showing significant enhancement of the surface roughness after the treatment, which could also bring the fiber better wettability. What's more, the impacts of fiber surface treatment on its tensile properties were characterized by single fiber tensile strength (SFTS) testing. Results showed that Armos fibers exhibited only slight reductions in their tensile strengths with the great enhancement in fiber surface free energy.     

Electroless plating of copper on polyimide films modified by surface-initiated atom-transfer radical polymerization of 4-vinylpyridine

Surface modification of polyimide (PI) films were first carried out by chloromethylation under mild conditions, followed by surface-initiated atom-transfer radical polymerization (ATRP) of 4-vinylpyridine (4VP) from the chloromethylated PI surfaces. The composition and topography of the PI surfaces modified by poly(4-vinylpyridine) (P4VP) were characterized by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM), respectively. The P4VP brushes with well-preserved pyridine groups on the PI surface was used not only as the chemisorption sites for the palladium complexes without prior sensitization by SnCl₂ solution during the electroless plating of copper, but also as an adhesion promotion layer to enhance the adhesion of the electrolessly deposited copper to the PI surfaces. The T-peel adhesion strength of the electrolessly deposited copper on the modified PI surface could reach about 6.6 N/cm. Effects of the polymerization time and the activation time in the PdCl₂ solution on the T-peel adhesion strength of the electrolessly deposited copper in the Sn-free process to the modified PI surface were also studied.     

Effect of chemical etching on the Cu/Ni metallization of poly (ether ether ketone)/carbon fiber composites

Poly(ether ether ketone)/carbon fiber composites (PEEK/Cf) were chemical etched by Cr₂O₃/H₂SO₄ solution, electroless plated with copper and then electroplated with nickel. The effects of chemical etching time and temperature on the adhesive strength between PEEK/Cf and Cu/Ni layers were studied by thermal shock method. The electrical resistance of some samples was measured. X-ray photoelectron spectroscopy (XPS) was used to analyze the surface composition and functional groups. Scanning electron microscopy (SEM) was performed to observe the surface morphology of the composite, the chemical etched sample, the plated sample and the peeled metal layer. The results indicated that CO bond increased after chemical etching. With the increasing of etching temperature and time, more and more cracks and partially exposed carbon fibers appeared at the surface of PEEK/Cf composites, and the adhesive strength increased consequently. When the composites were etched at 60 °C for 25 min and at 70-80 °C for more than 15 min, the Cu/Ni metallization layer could withstand four thermal shock cycles without bubbling, and the electrical resistivity of the metal layer of these samples increased with the increasing of etching temperature and time.     

Growth behavior of electroless Ni-Co-P deposits on Fe

The electroless Ni-Co-P films were deposited on Fe film in plating baths using sodium hypophosphite as reducing agent and nickel and cobalt sulphates as ion source at pH value of 9 and plating temperature from 60 to 85 °C. The effect of the mol ratio of CoSO₄/CoSO₄ + NiSO₄ in plating bath on the growth behavior of electroless Ni-Co-P films was studied. The electroless Ni-Co-P films were characterized by transmission electron microscopy for the microstructure and thickness, and energy dispersive spectrometer for the composition. The results showed that the electroless Ni-Co-P films can be deposited on Fe films without the step of sensitization and activization; the surface of electroless Ni-Co-P film on Fe is quite even; the more the Co²⁺ ion in plating bath, the larger the activation energy and the smaller the plating rate of electroless Ni-Co-P films; and the mol ratio of Co/Co + Ni in film is larger than that in plating bath (with the exception of the film deposited in the bath with 0.9 mol ratio of CoSO₄/CoSO₄ + NiSO₄)     

Model of electroless Ni deposition on SiCp/Al composites and study of the interfacial interaction of coatings with substrate surface

Metallization techniques based on electroless plating are used to coat SiC_p/Al composite materials. The directly palladium chloride (PdCl₂) solutions in HCl is used to render the surface of such non-conductive substrates catalytically active towards metal deposition in the electroless plating solution. The microstructures of Ni-coated composites provided by scanning electron microscope (SEM) bring light into the palladium activation and electroless coating process. Also, X-ray photoelectron spectroscopy (XPS) and Line-scan have allowed to monitor the chemical and compositional surface modifications of activated and coated SiC_p/Al composites, as well as to understand the mechanisms of the catalyst (palladium species) chemisorption on the composites surface and the interaction mechanisms of Ni layer with the SiC_p/Al composites. The experimental results show that a nickel-substrate bonding action takes place during plating. Ni atom existing on the surface of the composites can partially obtain electrons from metals Al of the SiC_p/Al composites when the substrate is embedded in the Ni layers, that is, the orbital interaction through the mutual overlap of the electronic orbits does exist in the interfacial regions between the coated Ni atoms and composites substrate instead of the mechanical-interlocked form. On the basis of the evidence, a model of electroless Ni deposition on SiC_p/Al composites is submitted including Pd activation and Ni deposition processes to describe the formation of catalytic centers and the growth of deposited layer. The deposition model reveals that metal-substrate bond plays an important role in the high adhesion strength between the Ni coatings and the composites.     

ICF玻璃靶丸化学镀磁性Ni-P涂层的研究

 采用化学镀方法对ICF空心玻璃微球靶丸进行处理，使其表面均匀包覆一层磁性Ni-P合金镀层，从而使得ICF玻璃靶丸具有一定的磁性，可望用于进行磁悬浮ICF定位打靶实验研究。用X射线衍射仪、扫描电子显微镜和振动样品磁强计对涂层的组成、结构、形貌及磁性能进行了表征。结果表明：对 ICF玻璃靶丸进行化学镀处理，其球形度、同心度和壁厚均匀性都与化学镀前未发生明显改变，其饱和磁化强度和矫顽力分别为3.883×10^-3 A/g和1.046×^-3 T。     

Structural transformations on Cu(110) under molecular iodine action

Interaction of molecular iodine with the Cu(110) surface is investigated by the methods of ultrahigh vacuum scanning tunneling microscopy (STM) and low energy electron diffraction (LEED). It is found that at the coverage θ =0.5 monolayer (ML) iodine forms a simple commensurate c(2×2) lattice. Further exposure of iodine leads to uniaxial compression of the c(2×2) lattice along the 〈110〉 direction of the substrate. The STM data indicate that compression of the iodine layer proceeds through formation of striped domain walls. As the coverage is saturated at θ = 0.63 ML, iodine forms a uniformly compressed quasi-hexagonal structure. Further exposure of iodine on the Cu(110) surface results in growth of a copper iodide film. STM images of thin (7 to 20 Å) CuI films reveal, in addition to atomic modulation, a superstructure with a period of 90 to 100 Å consisting of double stripes. A structure model of the copper iodide surface allowing for CuI lattice contraction and formation of double stripe domain walls is proposed.     

Composite electroplating of Cu-SiO2 nano particles on carbon fiber reinforced epoxy composites

The main purpose of this work is to co-deposit nano-SiO₂ particles into the copper coatings on carbon fiber reinforced epoxy (C/EP) composite surface by electrodeposition method in order to improve the micro hardness of coatings. C/EP composites are copper plated with sulfuric acid based solution, and the effects of nano-SiO₂ and C₆H₁₂O₆ in the electrolyte contents on the copper coatings are investigated. It is found that crystalline grains of coatings are markedly refined by nano-SiO₂ in the acidic sulfate copper plating bath and the ceramic particles cause an increase in hardness of coatings though nano-SiO₂ results in a decline of deposition rate and a decrease in electrical conductivity of electroplating layers. Otherwise, C₆H₁₂O₆ in the plating bath is indispensable to the layer formation even though nano-SiO₂ added. These results demonstrate that the hardness of coatings will be increased with appropriate contents of co-deposited SiO₂ and C₆H₁₂O₆ in the plating bath.