AlN/Si3N4纳米多层膜的外延生长与力学性能

采用射频磁控溅射方法制备单层AlN, Si₃N₄薄膜和不同调制周期的AlN/Si₃N₄纳米多层膜.采用X射线衍射仪、高分辨透射电子显微镜和纳米压痕仪对薄膜进行表征.结果发现,多层膜中Si₃N₄层的晶体结构和多层膜的硬度依赖于Si₃N₄层的厚度.当AlN层厚度为4.0nm、 Si₃N₄层厚度 关键词： 3N₄纳米多层膜')" href="#">AlN/Si₃N₄纳米多层膜 外延生长 应力场 超硬效应     

Si3N4在h-AlN上的晶体化与AlN/Si3N4纳米多层膜的超硬效应

采用反应磁控溅射法制备了一系列具有不同Si₃N₄层厚度的AlN/Si₃N₄纳米多层膜,利用X射线衍射仪、高分辨透射电子显微镜和微力学探针表征了多层膜的微结构和力学性能.研究了Si₃N₄层在AlN/Si₃N₄纳米多层膜中的晶化现象及其对多层膜生长结构与力学性能的影响.结果表明,在六方纤锌矿结构的晶体AlN调制层的模板作用下,通常溅射条件下以非晶态存在的Si₃N₄层在其厚度小于约1nm时被强制晶化为结构与AlN相同的赝形晶体,AlN/Si₃N₄纳米多层膜形成共格外延生长的结构,相应地,多层膜产生硬度升高的超硬效应.Si₃N₄随层厚的进一步增加又转变为非晶态,多层膜的共格生长结构因而受到破坏,其硬度也随之降低.分析认为,AlN/Si₃N₄纳米多层膜超硬效应的产生与多层膜共格外延生长所形成的拉压交变应力场导致的两调制层模量差的增大有关. 关键词： 3N₄纳米多层膜')" href="#">AlN/Si₃N₄纳米多层膜 外延生长 赝晶体 超硬效应     

氮化硅薄膜的微结构

利用TEM,STM和PDS显微光度计研究了ECR-PECVD技术制备的Si₃N₄薄膜的微结构.结果表明：在较低沉积温度下，ECR-PECVD制备的Si₃N₄薄膜是一种纳米α-Si₃N₄薄膜，其晶粒粒度在14—29nm间，而且这种薄膜具有较好的表面平整度.初步分析了ECR-PECVD制备的Si₃N₄在较低沉积温度下形成晶态薄膜的机理. 关键词：     

纳米非晶氮化硅键态结构的X射线径向分布函数研究

本文用X射线径向分布函数法研究了室温到1000℃不同退火条件下的纳米非晶氮化硅样品的微结构和键合特征。观察到占庞大体积百分数界面不是“gas-like”结构,而是与非晶纳米粒子不同的新的短程序结构。Si—N键长和最近邻原子配位数(CN)均比传统Si₃N₄小,并存在大量的Si悬键和不饱和键。纳米氮化硅与传统Si₃N₄饱和共价键不同,是含有大量非饱和键和悬键的非典型共价键结构。由于键配位的不饱和特征,纳米非晶氮化硅的分子式应写作Si_3-xN_4-y。纳米非晶氮化硅出现强极性与非饱和键和悬键有密切的关系。 关键词：     

Si3N4/Si表面Si生长过程的扫描隧道显微镜研究

利用原位扫描隧道显微镜和低能电子衍射分析了Si的纳米颗粒在Si₃N₄/Si(111)和Si₃N₄/Si(100)表面生长过程的结构演变.在生长早期T为350—1075K范围内,Si在两种衬底表面上都形成高密度的三维纳米团簇,这些团簇的大小均在几个纳米范围内,并且在高温退火时保持相当稳定的形状而不相互融合.当生长继续时,Si的晶体小面开始显现.在晶态的Si₃N₄(0001)/S 关键词： 氮化硅 扫描隧道显微镜 纳米颗粒     

TiN和Ti1-xSixNy薄膜的微观结构分析

使用x射线衍射(XRD)、x射线光电子谱(XPS)、高分辨透射电子显微镜(HRTEM)和原子力显微镜（AFM）多种观测手段分析了TiN薄膜和Ti_1-xSi_xN_y纳米复合薄膜的微观结构.实验分析证明Ti_1-xSi_xN_y薄膜是由直径为3—5nm的纳米晶TiN和非晶Si₃N₄相构成，并且Ti_1-xSi_{x关键词： 纳米复合薄膜 自由能 表面粗糙度 TiN 1-x}Si_xN_y')" href="#">Ti_1-xSi_xN_y     

C3N4/TiN交替复合膜的微结构研究

采用双阴极封闭型非平衡磁场dc反应磁控溅射离子镀制备C₃N₄/TiN复合交替膜,用X射线光电子能谱法分析了薄膜的组成,测量了薄膜的X射线衍射谱和氮化碳的透射电子衍射图像.氮化碳经氮化钛的强迫晶化作用,生成了β-C₃N₄和c-C₃N₄. 关键词：     

TiN/Al2O3纳米多层膜的共格外延生长及超硬效应

采用多靶磁控溅射法制备了一系列具有不同Al₂O₃调制层厚度的TiN/Al₂O₃纳米多层膜. 利用X射线能量色散谱、X射线衍射、扫描电子显微镜、高分辨透射电子显微镜和微力学探针表征了多层膜的成分、微结构和力学性能. 研究结果表明，在TiN/Al₂O₃纳米多层膜中，单层膜时以非晶态存在的Al₂O₃层在厚度小于1.5 nm时因TiN晶体层的模板效应而晶化，并与TiN层形成共格外延生长，相应地，多层膜产生硬度明显升高的超硬效应，最高硬度可达37.9 GPa. 进一步增加多层膜中Al₂O₃调制层的层厚度，Al₂O₃层逐渐形成非晶结构并破坏了多层膜的共格外延生长，使得多层膜的硬度逐步降低. 关键词： 2O₃纳米多层膜')" href="#">TiN/Al₂O₃纳米多层膜 外延生长 非晶晶化 超硬效应     

改善Si3N4俘获层过擦现象的第一性原理研究

采用第一性原理方法对如何改善电荷俘获存储器的过擦现象进行了研究. 过擦是由于氮空位中Si原子对电荷的局域能力弱导致, 因此, 在Si₃N₄超胞中分别建立了以C, N, O替换氮空位中的Si原子的缺陷结构作为本文的研究模型. 分别计算了擦写之后体系的巴德电荷分布、相互作用能、态密度, 借以分析替位原子对过擦的影响. 巴德电荷分布的计算结果表明, Si₃N₄在O替位128号Si后的过擦现象被明显改善; C替位128号Si也可以改善过擦, 但由于C替位对电荷的局域作用变弱, 不利于电荷的存储实现; N替位128号Si则不能改善过擦; 而在162和196号Si位置, 三种原子的替换均无法改善过擦现象. 相互作用能的研究表明, 在128号Si位置, 三种原子都能够和氮空位形成团簇, 在体系中稳定存在. 特别地, O替位Si后, 体系中两缺陷的相互吸引作用最弱, 从而写入的电荷能够短暂的打破O团簇的稳定性, 实现电荷重构, 将电荷局域在O团簇周围. 此外, 态密度的分析结果表明O在128号Si位置能够在Si₃N₄禁带中引入深能级缺陷, 深能级局域电荷的能力强. 以上分析证明, O替位可以很好的改善Si₃N₄中的过擦现象. 本文的研究结果为电荷俘获存储器改善过擦提供了一种方法, 对提高器件的电荷保持特性和优化存储窗口具有指导意义.     

TaN/TiN和NbN/TiN纳米结构多层膜超硬效应及超硬机理研究

采用射频磁控溅射方法制备单层TaN,NbN和TiN薄膜和不同调制周期的TaN/TiN和NbN/TiN纳米多层膜.薄膜采用X射线衍射仪、高分辨率透射电子显微镜和显微硬度仪进行表征.结果表明TaN/TiN和NbN/TiN纳米多层膜在一定的调制周期范围内均呈共格界面,相应地均出现了超硬效应,且最大硬度值接近.分析了TaN/TiN与NbN/TiN纳米多层膜的超硬机理,TaN/TiN的晶格错配度与NbN/TiN的接近,但TaN/TiN的弹性模量差与NbN/TiN的有一定的差别,表明由于晶格错配使共格外延生长在界面处 关键词： TaN/TiN纳米多层膜 NbN/TiN纳米多层膜 外延生长 超硬效应     

Deposition of nanocomposite TiN-Si3N4 thin films by hybrid cathodic arc and chemical vapor process

A hybrid technique is described for the synthesis of nanocomposite TiNSi₃N₄ thin films based on the reactive deposition of Ti produced from a cathodic arc source and Si from a liquid tetramethylsilane (TMS), precursor. The technique combines both the physical vapour of Ti and chemical vapour of silicon in a nitrogen background pressure in a single system. The influence of the TMS flow rate on the structure and mechanical properties has been investigated. The film structure was found to comprise of TiN crystallites and amorphous Si₃N₄. The X-ray diffraction data showed that with increasing TMS flow, there is a decrease in the TiN crystalline size from 33 nm to 4 nm. The hardness of the films was found to be strongly dependent on the Si content and reached a maximum value of 41 GPa at 5% Si content at a total pressure of nitrogen and TMS of 0.8 Pa. Hardness enhancement was found to arise from the nanostructural change induced due to the addition of an amorphous Si₃N₄ phase into the film. Transmission electron microscopy (TEM) analysis confirmed the structure of the ncTiN/aSi₃N₄ composites. Films with 4 at.% or more silicon were found to maintain the hardness after annealing at 500 °C in vacuum. PACS 68.55.Jk; 81.15.-z; 81.15.Ef     

Influence of silicon on the microstructure and mechanical properties of Zr-Si-N composite films

A series of Zr-Si-N composite films with different Si contents were synthesized in an Ar and N₂ mixture atmosphere by the bi-target reactive magnetron sputtering method. These films’ composition, microstructure and mechanical properties were characterized by energy dispersive spectroscopy, X-ray diffraction, scanning electron microscopy, atomic force microscopy and nanoindentation. Experimental results revealed that after the addition of silicon, Si₃N₄ interfacial phase formed on the surface of ZrN grains and prevented them from growing up. Zr-Si-N composite films were strengthened at low Si content with the hardness and elastic modulus reaching their maximum values of 29.8 and 352 GPa at 6.2 at% Si, respectively. With a further increase of Si content, the crystalline Zr-Si-N films gradually transformed into amorphous, accompanied with a remarkable fall of films’ mechanical properties. This limited enhancement of mechanical properties in the Zr-Si-N films may be due to the low wettability of Si₃N₄ on the surface of ZrN grains.     

Synthesis and characterization of superhard Ti-Si-N films obtained in an inductively coupled plasma enhanced chemical vapor deposition (ICP-CVD) with magnetic confinement

Using a novel inductively coupled plasma enhanced chemical vapor deposition (ICP-CVD) with magnetic confinement system, Ti-Si-N films were prepared on single-crystal silicon wafer substrates by sputtering Ti and Si (5 at.%:1 at.%) alloyed target in argon/nitrogen plasma. High-resolution transmission electron microscopy (HRTEM), X-ray photoelectron spectroscopy (XPS), X-ray diffractometer (XRD), field emission scanning electron microscope (FESEM), atomic force microscopy (AFM) and Nano Indenter XP tester were employed to characterize nanostructure and performances of the films. These films were essentially composed of TiN nanocrystallites embedded in an amorphous Si₃N₄ matrix with maximum hardness value of 44 GPa. Experimental results showed that the film hardness was mainly dependent on the TiN crystallite size and preferred orientation, which could be tailored by the adjustment of the N₂/Ar ratio. When the N₂/Ar ratio was 3, the film possessed the minimum TiN size of 10.5 nm and the maximum hardness of 44 GPa.     

Structure and mechanical properties of reactive sputtering CrSiN films

CrSiN films with various Si contents were deposited by reactive magnetron sputtering using the co-deposition of Cr and Si targets in the presence of the reactive gas mixture. Comparative studies on microstructure and mechanical properties between CrN and CrSiN films with various Si contents were carried out. The structure of the CrSiN films was found to change from crystalline to amorphous structure as the Si contents increase. Amorphous phase of Si₃N₄ compound was suggested to exist in the CrSiN film. The growth of films has been observed from continuous columnar structure, granular structure to glassy-like appearance morphology with the increase of silicon content. The film fracture changed from continuous columnar structure, granular structure to glassy-like appearance morphology with the increase of silicon content. Two hardness peaks of the films as function of Si contents have been discussed.     

Role of ion energy flux on the structural and morphological properties of silicon oxy-nitride composite films deposited by plasma focus device

ABSTRACT

Crystalline silicon oxy-nitride (SiON) composite films are deposited on Si substrate for multiple (5, 15, 25 and 50) focus shots (FS) by plasma focus device. The X-rays diffraction patterns reveal the development of various diffraction peaks related to Si, Si₃N₄, and SiO₂ phases which confirms the formation of SiON composite film. The intensity of Si₃N₄ (1 0 2) plane is linearly increased with the increase of FS. The Si₃N₄ (1 0 2) phase does not nucleate for 5 FS. Raman analysis confirms the formation of β–Si–N phase. Raman and Fourier transform infrared spectroscopy analysis reveals that the strength of chemical bonds like Si–N, Si–O formed during the deposition process of SiON composite films is associated with the bonds intensity which in turn depends on the number of FS. The field emission scanning electron microscopic analysis reveals that the surface morphology like size, shape and distribution of micro/nano-dimensional particles, film compactness and the formation of micro-rods, micro-teethes and micro-tubes of SiON composite films is entirely associated with the rise in substrate surface transient temperature which in turn depends on the increasing number of FS. The EDX spectrum confirms the presence of Si (22.5?±?4.7 at. %), N (13.4?±?4.5 at. %) and O (54.7?±?11.3 at. %) in the SiON composite film. The thickness of SiON composite film deposited for 50 FS is found to ～15.47?µm.     

Superhard Nb-Si-N composite films synthesized by reactive magnetron sputtering

By means of the reactive magnetron sputtering method, a series of Nb-Si-N composite films with different Si contents were deposited in an Ar, N₂ and SiH₄ mixture atmosphere. These films’ chemical composition, phase formation, microstructure and mechanical properties were characterized by the energy dispersive spectroscopy, X-ray diffraction, transmission electron microcopy, atomic force microscopy and nanoindentation. The experimental results showed that the silicon content in the Nb-Si-N composite films can be conveniently controlled by adjusting the SiH₄ partial pressure in mixed gas. The hardness and elastic modulus of the Nb-Si-N films were remarkably increased with a small amount of silicon addition and reached their maximum values of 53 and 521 GPa, respectively, at 3.4 at.% Si. Such an obvious enhancement of mechanical properties is related to the increment of crystal defects in the Nb-Si-N films. With silicon content increasing in the films further, the mechanical properties decreased gradually to somewhat a bit lower than those of the NbN film.     

Si3N4的晶体化和ZrN/Si3N4纳米多层膜的超硬效应

研究了Si₃N₄层在ZrN/Si₃N₄纳米多层膜中的晶化现象及其对多层膜微结构与力学性能的影响. 一系列不同Si₃N₄层厚度的ZrN/Si₃N₄纳米多层膜通过反应磁控溅射法制备. 利用X射线衍射仪、高分辨透射电子显微镜和微力学探针表征了多层膜的微结构和力学性能. 结果表明，由于受到ZrN调制层晶体结构的模板作用，溅射条件下以非晶态存在的Si₃N₄层在其厚度小于0.9 nm时被强制晶化为NaCl结构的赝晶体，ZrN/Si₃N₄纳米多层膜形成共格外延生长的柱状晶，并相应地产生硬度升高的超硬效应. Si₃N₄随层厚的进一步增加又转变为非晶态，多层膜的共格生长结构因而受到破坏，其硬度也随之降低.     

The effects of Si3N4 interlayer on the thermal stability and hardness of Ti/TiNx (x = 0.5-1) nanolayered coatings

The polycrystalline Ti/TiN_x multilayer films were deposited by magnetron sputtering, and the as-deposited multilayer coatings were annealed at 500-800 °C for 2-4 h in vacuum. We investigated the effects of annealing temperature and annealing time on the microstructural, interfacial, and mechanical properties of the polycrystalline Ti/TiN_x multilayer films. It was found that the hardness increased with annealing temperature. This hardness enhancement was probably caused by the preferred crystalline orientation TiN(1 1 1). The X-ray reflectivity measurements showed that the layer structure of the coatings could be maintained after annealing at 500 °C and the addition of the Si₃N₄ interlayer to Ti/TiN_x multilayer could improve the thermal stability to 800 °C.     

Tribological Properties of MACs-APS Films

Multiply-alkylated cyclopentanes (MACs) with different molecular structure were deposited on single crystal silicon wafers coated with a thin aminopropyltrimethoxylsilane (APS) film as an adhesive layer to form MACs-APS films. The thickness, wetting behavior and nano-scale morphologies of the films were characterized by means of ellipsometry, contact angle measurement, and atomic force microscopy (AFM). The friction and wear behaviors of the thin films sliding against a Si₃N₄ ball were examined on a UMT-2MT tribometer in a ball-on-disk contact mode. The worn surfaces of the MACs-APS films and the counterpart Si₃N₄ balls were investigated with a scanning electron microscope (SEM). It was found that the water contact angles on the MACs-APS film increased with the MACs alkyl chain-length. The MACs-APS film exhibited higher load-carrying capacity and better friction reduction and anti-wear behavior as compared with the APS film. This is suggested to occur because the APS acts as a strongly bonded lubricant phase and MACs as a mobile lubricant phase in the MACs-APS film. The increase of the chain-length of the alkyl substituent in the MACs compounds resulted in improved tribological properties of MACs-APS film. It is suggested that the longer alkyl chains are much more flexible and can dissipate the mechanical energy during the shearing process more easily than the short chain compounds. MACs with the longer chains have stronger chain-chain interactions and the larger MAC molecules have stronger intermolecular interactions, resulting in the good tribological properties of MACs-APS film.     

Effect of annealing temperature on microstructure, hardness and adhesion properties of TiSixNy superhard coatings

A series of TiSi_xN_y superhard coatings with different Si contents were prepared on M42 steel substrates using two Ti and two Si targets by reactive magnetron sputtering at 500 °C. These samples were subsequently vacuum-annealed at 500, 600, 700, 800 and 900 °C, respectively. X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), microindenter, Rockwell hardness tester and scratch tester were applied to investigate the microstructure, phase configuration, hardness and adhesion properties of as-deposited and annealed samples. The results indicated that there were two bonds, TiN and Si₃N₄, in all presently deposited TiSi_xN_y thin films, that structure was nanocomposite of nanocrystalline (nc-) TiN embedded into amorphous Si₃N₄ matrices. Annealing treatment below 900 °C played a little role in microstructure and hardness of the coatings although it greatly affected those of steel substrates. The film-substrate adhesion strength was slightly increased, followed by an abrupt decrease with increasing annealing temperature. Its value got to the maximum at 600 °C. Annealing had little effect on the friction coefficient with its value varying in the range of 0.39-0.40.