毛细管区带电泳电化学检测法测定药物及果汁中芦丁和L-抗坏血酸

用毛细管区带电泳-电化学检测法同时测定复方芦丁片及果汁中芦丁和L-抗坏血酸的含量.研究了电极电位、电解液浓度和酸度、电泳电压及进样时间等对电泳的影响,得到了较为优化的测定条件.以直径为300μm的碳圆盘电极为检测电极,电极电位为1.0V(vs.SCE),在25mmol/L硼砂-50mmol/LNaH₂PO₄(pH8.0)运行缓冲液中,上述两组分在12min内完全分离.芦丁和L-抗坏血酸浓度分别在1.0×10^-6～2.5×10^-4和5.0×10^-6～2.5×10^-3mol/L范围内与电泳峰电流呈现良好线性关系,检测下限分别为8.0×10^-7和3.3×10^-6mol/L.9次测定含5.0×10^-5mol/L芦丁和2.5×10^-4mol/LL-抗坏血酸的试样溶液,峰高的相对标准偏差分别为2.85%和1.65%,5次测得的平均回收率分别为97.73%和99.68%.     

溶胶-凝胶法制备硅系有机-无机杂化分离膜

以α-Al₂O₃多孔陶瓷片为载体,用溶胶-凝胶法制备有机-无机杂化分离膜.通过考察前驱物的组成及杂化溶胶的合成条件对制膜工艺过程的影响,得到了制备有机-无机杂化分离膜的各种适宜性参数.红外光谱(FTIR)分析结果表明,杂化溶胶的性能不仅决定分离膜的性能,而且对膜热处理过程中的龟裂有很大影响.膜层的厚度为1～2μm;在膜两侧压差为0.10MPa、n(PTMOS)/n(TEOS)=1.16时,膜对O₂/N₂,CO₂/N₂和CO₂/O₂的分离因子分别为2.30,4.31和1.17,渗透系数为75.81×10^-17,75.28×10^-17和72.78×10^-17m₃(STP)·m/(m₂·s·Pa).     

1-丁基-3-甲基咪唑醋酸盐和水组成的混合电解液中三价铬电沉积铬的研究

本文在[BMIM]OAc-H₂O电解液中研究了Cr³⁺的电沉积反应. 经循环伏安研究表明,Cr³⁺的还原属于受扩散控制的分步还原过程, 即Cr³⁺ + e →Cr²⁺和Cr²⁺ + 2e → Cr⁰. 在40℃下通过Rendle-Sevcik方程计算得到Cr³⁺的扩散系数为1.2×10^-8 cm²/s. 采用计时电流法探讨了Cr的三维瞬时成核机理. 对沉积的铬镀层进行了XRD、SEM表征, 结果表明经600℃氩气保护下煅烧后的镀层由Cr和Cr₂O₃纳米球状颗粒聚集而成, 其平均粒径为0.48μm. 对40℃,-3.0V条件下所得镀层进行EDX检测,发现Cr与O的能级峰十分明显,其中Cr的质量分数为83.8%. 通过在[BMIM]OAc、[BMIM]BF₄和[BMIM]PF₆三种离子液体体系中电镀得到的Cr镀层质量的比较, 表明OAc-的确有利于Cr的电沉积.     

稀土气相扩渗BaTiO3基PTC陶瓷的NTCR效应

采用稀土气相扩渗法制备了La改性的BaTiO3基PTC陶瓷,并对其室温电阻率的变化及温-阻效应进行了研究.结果表明,BaTiO3基PTC陶瓷经La气相扩渗后,室温电阻率从2.7×109Ω.m下降到220Ω.m,在25-500℃范围内,电阻率随温度升高单调递减,从220Ω.m降至5.8Ω.m,产生了明显的NTCR效应.结合XRD,SEM,EDAX以及介电性能测试结果分析了La气相扩渗BaTiO3基PTC陶瓷NTCR效应的形成机理,建立了NTCR效应的物理结构模型.     

孔雀石绿分子印迹膜的制备和渗透性

以0.45 μm混合纤维素酯微孔膜为支载膜,丙烯酰胺为功能单体,N, N'-亚甲基双丙烯酰胺为交联剂,通过原位聚合法制备得到孔雀石绿分子印迹膜,并研究了其对模板分子和类似物的渗透性能。以分子印迹膜作为渗透膜,单一渗透实验中,13 h后MG的渗透量达到0.118×10^-3 g/cm²,而相同时间内甲基紫、甲酚红和溴百里酚蓝的渗透量分别为0.064×10^-3、0.057×10^-3和0.044×10^-3 g/cm²,且在竞争渗透中孔雀石绿的渗透速率没有发生明显变化,而甲基紫的渗透速率却显著下降。实验表明,分子印迹膜对模板分子孔雀石绿表现出良好的渗透选择性,且在与类似物甲基紫的竞争渗透中具有优先渗透能力。     

血红蛋白在裸银电极上的直接电化学及其分析应用

报道了血红蛋白(Hb)在裸银电极上的电化学氧化还原行为。在+0.4～-0.2V(vs.SCE)电位范围内于pH=4.5的0.1mol/LNaAc-HAc底液中,血红蛋白产生一对灵敏的氧化还原峰。峰电位之差△E为0.25V(扫描速度20mV/s).动力学研究表明:电极反应的电子转移数n为0.94,表现电子传递速率常数Ks为0.032.连续电位扫描30min,峰电流变化分别为0.2μA(还原峰)和0.15μA(氧化峰).两峰与血红蛋白浓度在2×10^-7～2×10^-6mol/L和2×10^-6～1.5×10^-5mol/L范围内均呈良好线性关系,已应用于血红蛋白的分析测定。     

烷基在针状焦形成中的作用

采用煤焦油沥青的甲苯可溶物和废聚苯乙烯共碳化制备针状焦,考察了中间相沥青中烷基含量对针状焦性能的影响。结果表明,通过添加废聚苯乙烯共碳化,中间相沥青中烷基的质量分数从12.0%增加到33.3%,可以制备出热膨胀系数更低、光学各向异性排列更好的针状焦。代表光学各向异性指数的两个量,在光学结构单元中,平行于热膨胀系数方向的轴向分矢量平均长度和光学结构单元的矢量平均长度,分别从20.8μm 和23.4μm增加到28.4μm和28.8μm,热膨胀系数从0.8×10^-6 /K降低到0.1×10^-6 /K。针状焦形成过程中中间相沥青的烷基含量增加使体系黏度降低,有利于光学各向异性相的融并和定向排列。烷基的增多在固化阶段产生足量的气体,在向外逸出过程中使融并中间相的芳香平面大分子沿轴向排列的更为规整。     

300 MW燃煤电站砷、汞排放特征研究

对某300 MW燃煤电站煤、底灰和静电除尘器(ESP)飞灰进行采样并测定了其中的砷、汞含量,同时应用Ontario Hydro Method (OHM) 标准方法和设备对ESP前后烟气中的砷、汞分布进行了直接采样和测试.对砷的检测结果表明,ESP飞灰中砷含量约6.68×10^-6,是原煤中砷含量的2.5倍左右,而底灰中砷含量仅为1.70×10^-6,ESP前烟气中砷含量约153.27 μg/m³,ESP后砷含量急剧降低为41.13 μg/m³;对汞的检测结果表明,原煤中汞含量约2.5×10^-7,飞灰、底灰中的汞含量分别约1.9×10^-7、1.5×10^-7;ESP前后烟气中总汞含量分别为5.49、5.21 μg/m³.砷在飞灰中明显富集,而汞在飞灰和底渣中均不具有富集效果.ESP单元具有明显的协同脱砷效果,平均脱除率约在71%左右,而对汞的协同脱除效果不明显.     

旋涂水溶液前驱体制备氧化锌薄膜及其性质

通过旋涂法, 采用Zn(OAc)2·2H2O和聚环氧乙烷(PEO)的水溶液为前驱体在不同的热处理温度下制备了ZnO薄膜. PEO的加入增加了溶液的成膜性, 其较低的热分解温度有利于制得纯净的ZnO薄膜. 文中考察了在不同热处理温度下制备的ZnO薄膜的形貌、结晶性、带隙(Eg)以及电导性. 原子力显微镜(AFM)测试表明在热处理温度为400、450和500 ℃制备的ZnO薄膜的粗糙度均方根值分别为3.3、2.7和3.6 nm. 采用透射电子显微镜(TEM)测试发现ZnO薄膜中含有大量纳晶粒子. 通过测试ZnO薄膜的UV-Vis吸收光谱, 根据薄膜位于373 nm处的吸收带边计算得到ZnO的带隙为3.3 eV. 通过对薄膜的电流-电压(I-V)曲线的测试计算得到在热处理温度为400、450和500 ℃制备的ZnO薄膜的电阻率分别为3.3×109、2.7×109和6.6×109 Ω·cm. 450 ℃时制备的ZnO薄膜的电阻率最小, 主要是由于较高的热处理温度有利于提高薄膜的纯度、密度和吸附氧. 而纯度较高、密度较大的薄膜电阻率比较小; 吸附氧含量增加, 晶界势垒增大, 电阻率增大. 因此在纯度和吸附氧的双重作用下450 ℃时制备的ZnO薄膜的电阻率最小, 而500 ℃时制备的ZnO薄膜的电阻率最大.     

反相离子对液相色谱分离-柱后衍生化学发光检测痕量金属离子

报道了反相离子对液相色谱-柱后衍生化学发光检测方法分离测定痕量的钴(Ⅱ)、铁(Ⅱ)、铜(Ⅱ)、铁(Ⅲ)及铬(Ⅲ).利用弱络合性的乳酸作为淋洗剂,加入适量的十二烷基磷酸钠作对离子试剂,研究了分离条件、发光条件及二者的匹配方式等因素对分离检测的影响.测定线性范围分别为(g/mL):Cr(Ⅲ)5.0×10^-9～1.0×10^-5;Fe(Ⅱ)2.0×10^-9～1.0×10^-5;Fe(Ⅲ〕8.0×10^-9～1.0×10^-5;Cu(Ⅱ)8.0×10^-11～1.0×10^-5及Co(Ⅲ)1.0×10^-11～1.0×10^-5.检出限分别为:10pgCr(Ⅲ),0.4pgFe(Ⅱ),20pgFe(Ⅲ),1.0pgCu(Ⅱ)及0.01pgCo(Ⅱ).     

Fabrication of a gold microelectrode for amperometric detection on a polycarbonate electrophoresis chip by photodirected electroless plating

A novel method of photoresist-free micropatterning coupled with electroless gold plating is described for the fabrication of an integrated gold electrode for electrochemical detection (ED) on a polycarbonate (PC) electrophoresis microchip. The microelectrode layout was photochemically patterned onto the surface of a PC plate by selective exposure of the surface coated without photoresist to 254 nm UV light through a chromium/quartz photomask. Thus, the PC plate was selectively sensitized by formation of reactive chemical moieties in the exposed areas. After a series of wet chemistry reactions, the UV-exposed area was activated with a layer of gold nanoparticles that served as a seed to catalyze the electroless plating. The gold microelectrode was then selectively plated onto the activated area by using an electroless gold plating bath. Nonselective gold deposition on the unwanted areas was eliminated by sonication of the activated PC plate in a KSCN solution before electroless plating, and the adhesion of the plated electrodes to the PC surface was strengthened with thermal annealing. Compared with the previously reported electroless plating technique for fabrication of microelectrodes on a microchip, the present method avoided the use of a membrane stencil with an electrode pattern to restrict the area to be wet-chemically sensitized. The CE with integrated ED (CE-ED) microchip was assembled by thermal bonding an electrode-plated PC cover plate to a microchannel-embossed PC substrate. The novel method allows one to fabricate low-cost, electrode-integrated, complete PC CE-ED chips with no need of a clean room. The fabricated CE-ED microchip was demonstrated for separation and detection of model analytes, including dopamine (DA) and catechol (CA). Detection limits of 0.65 and 1.03 microM were achieved for DA and CA, respectively, and theoretical plate number of 1.4 x 10(4) was obtained for DA. The plated gold electrode can be used for about 4 h, bearing usually more than 100 runs before complete failure.     

Facile fabrication of silver nanofin array via electroless plating

The fabrication of metallic nanostructures is one of the main issues in nanotechnology. This article describes the fabrication of a silver nanofin array by combining microlithography, electroless plating, and an etching technique. Fabricated Ag nanofins have a high aspect ratio (height/width = 10, width = 60 nm, height = 600 nm), and their widths and heights can be controlled by the period of electroless plating and the height of the original line pattern. An isolated Ag nanofin was proven to show metallic electrical conductivity. The current process provides a rapid and shape-designable fabrication method of metallic nanostructures.     

化学镀钴和超级化学镀填充的研究进展

随着半导体集成度的不断提高,铜互连线的电阻率迅速提高。当互连线宽度接近7 nm时,铜互连线的电阻率与钴接近。IBM和美国半导体公司（ASE）已经使用金属钴取代铜作为下一代互连线材料。然而,钴种子层的形成和超级电镀钴填充7 nm微孔的技术工艺仍是一个很大的挑战。化学镀是在绝缘体表面形成金属种子层的一种非常简单的方法, 通过超级化学镀填充方式, 直径为几纳米的盲孔可以无空洞和无缝隙的方式完全填充。本文综述了化学镀钴的研究进展,并分析了还原剂种类对化学镀钴沉积速率和镀膜质量的影响。同时, 在长期从事超级化学填充研究的基础上, 作者提出了通过超级化学镀钴技术填充7 nm以及一下微盲孔的钴互连线工艺。     

Electroless silver plating of the surface of organic semiconductors

The integration of nanoscale processes and devices demands fabrication routes involving rapid, cost-effective steps, preferably carried out under ambient conditions. The realization of the metal/organic semiconductor interface is one of the most demanding steps of device fabrication, since it requires mechanical and/or thermal treatments which increment costs and are often harmful in respect to the active layer. Here, we provide a microscopic analysis of a room temperature, electroless process aimed at the deposition of a nanostructured metallic silver layer with controlled coverage atop the surface of single crystals and thin films of organic semiconductors. This process relies on the reaction of aqueous AgF solutions with the nonwettable crystalline surface of donor-type organic semiconductors. It is observed that the formation of a uniform layer of silver nanoparticles can be accomplished within 20 min contact time. The electrical characterization of two-terminal devices performed before and after the aforementioned treatment shows that the metal deposition process is associated with a redox reaction causing the p-doping of the semiconductor.     

Application of microcontact printing to electroless plating for the fabrication of microscale silver patterns on glass

Microcontact printing (microCP) and electroless plating are combined to produce microscale patterns of silver on glass substrates. Silver patterns with feature sizes of 0.6-10 microm stripes are fabricated using two methods. (1) The printing seeding layer (PSL) method is to apply microCP to directly print the catalyst Sn pattern for further electroless plating. (2) The printing masking layer (PML) method is to use microCP to print the octadecyltrichlorosilane (OTS) self-assembled monolayer as a masking layer on glass substrates, which then become Sn-activated in the unstamped regions by immersing the substrates in stannous chloride solution. After the electroless silver plating, the PML method has a better selectivity of silver deposition than the PSL method. In addition, variation of the deposited silver thickness as a function of the plating time and temperature is discussed.     

Site-selective catalytic surface activation via aerosol nanoparticles for use in metal micropatterning

There is great interest in the fabrication of micro- and nanopatterned metallic structures on substrates for a wide range of electronic, photonic, and magnetic devices. One of the most widely used techniques is the electroless deposition (ELD) of metal, which requires the surface activation of the substrates with a metal catalyst. This paper introduces a method of catalytic surface activation by producing platinum aerosol nanoparticles via spark generation and then thermophoretically depositing the particles onto a flexible polyimide (PI) substrate through the pattern hole of a mask. After annealing, the catalytically activated substrate is placed into a solution for electroless silver deposition. The silver is then formed only on the activated regions of the substrate. Silver line patterns having a width of 18 microm and a height of 1 microm are created with the ability to be effectively reproduced. The average value of the resistivities is approximately 6.8 mu Omega.cm, which is almost comparable to the theoretical resistivity of bulk silver (1.6 mu Omega.cm). Other silver micropatterns containing square dot array, line, line array, Y-branched line, and tapered line using different pattern masks are also demonstrated.     

巯基改性棉纤维化学镀银导电布的研究

应用正交试验法研究巯基改性棉纤维表面化学镀银的特性,测定各因素对表面方阻和增重率的影响,得出制备化学镀银棉织物的最佳工艺：巯基硅烷浓度1%、改性时间120 min、改性液浴比1:60、硝酸银用量3.5 g、葡萄糖用量45 g、化学镀温度50 ℃、化学镀时间60 min.SEM和XRD分析表明巯基改性棉织物镀层均匀致密,具有良好的电磁屏蔽性.采用透明胶带法测试证实,该镀层结合牢固.     

化学镀镍磷镀层及其耐蚀性研究

针对工业实际对提高防护层防腐、耐磨性能的要求,对化学镀镍磷镀层的方法,镀敷液配方等进行了分析,对其腐蚀率进行了测定,并对镀层性能进行了表征;讨论了影响腐蚀率的若干重要因素;对有关工艺进行了优化,从而在多种基质上获得了抗腐蚀性较好的镍磷镀层,初步研究证明,其性能优于电镀方法所获得的镀层.     

3D amino-induced electroless plating: a powerful toolset for localized metallization on polymer substrates

The "3D amino-induced electroless plating" (3D-AIEP) process is an easy and cost-effective way to produce metallic patterns onto flexible polymer substrates with a micrometric resolution and based on the direct printing of the mask with a commercial printer. Its effectiveness is based on the covalent grafting onto substrates of a 3D polymer layer which presents the ability to entrap Pd species. Therefore, this activated Pd-loaded and 3D polymer layer acts both as a seed layer for electroless metal growth and as an interdigital layer for enhanced mechanical properties of the metallic patterns. Consequently, flexible and transparent poly(ethylene terephtalate) (PET) sheets were selectively metalized with nickel or copper patterns. The electrical properties of the obtained metallic patterns were also studied.     

Silver particles-modified polysulfonic acid-doped polyaniline layers: electroless deposition of silver in slightly acidic and neutral solutions

Polyaniline layers are produced by electrochemical polymerisation of aniline in the presence of small amounts of poly(2-acryalamido-2-methyl-propane-sulfonic acid) in an inorganic acid solution. Electroactivity and in situ conductance of the obtained polysulfonic acid-doped layers are studied in slightly acidic and neutral solutions. Electroless deposition of silver particles is carried out in silver-EDTA complex ion solutions at pH????.2 and pH????.6 by using the polyaniline layers as reductant. The amount of electroless-deposited silver is studied depending on: polymerisation charge used to synthesize the polymer layer, pH of the plating solution, metal ion concentration and dipping time. SEM shows in all cases a highly non-homogeneous distribution of the metallic phase over the surface, the most protruding fibrillar polymer structures favouring the electroless silver deposition. A linear dependence between amount of the polyaniline material and amount of deposited silver is found for the silver plating solutions with the highest investigated concentration (10?mmol?l^??). At lower concentrations (2.0 and 0.4?mmol?l^??), the same amount of silver becomes deposited on polymer layers with markedly different charges. The electroless deposition of silver in the solutions with lower acidity results in lower amounts of deposited silver at otherwise identical conditions. Effects such as charge transfer within the polymer phase and mass transport in the solution are addressed to explain the observed dependencies of the amount of deposited silver on concentration and pH in the different plating solutions.