铜电极表面硅烷膜的自组装及其性能研究

应用自组装技术在铜电极表面上制备3巯基丙基三甲氧基硅烷自组装膜.红外光谱研究该自组装膜结构,电化学方法考察3-巯基丙基三甲氧基硅烷膜在5%NaCl溶液中对铜电极的缓蚀性能.结果表明,于不同浓度的3-巯基丙基三甲氧基硅烷乙醇溶液中自组装的硅烷膜表现出较好的抗腐蚀性.     

铁表面自组装缓蚀功能膜的电化学阻抗谱研究

在铁表面自组装十四烷基胺膜.研究该膜在0.5 mol/LH2SO4溶液中对铁的缓蚀性能.电化学阻抗谱测试表明,随着组装时间的延长,缓蚀性能也随之增强,最大缓蚀效率为68.7%.而以十二烷基硫醇和十四烷基胺修饰的混合膜则更为致密、稳定,对铁的缓蚀能力也明显优于仅以十二烷基硫醇或十四烷基胺修饰的单一膜,其缓蚀效率可提高至78.2%.     

5-苯基-1H-四氮唑对铜片缓蚀性能的研究

通过金相显微镜和接触角测试研究了5-苯基-1H-四氮唑在硫-乙醇体系中对铜的缓蚀性能。结果显示,缓蚀剂可以在铜片表面形成疏水性保护膜,有效抑制了铜片的腐蚀。电化学测试表明,当缓蚀剂浓度为70 mg/L时缓蚀效率达到87%,对铜电极有明显的缓蚀作用。通过量子化学密度泛函理论研究了缓蚀剂分子结构与缓蚀性能的关系,分析了缓蚀剂分子的活性位点。通过分子动力学模拟研究了缓蚀剂分子在Cu的(111)表面的吸附行为。     

金属缓蚀剂Gemini型咪唑啉双季铵盐的合成及其性能的研究

合成了系列新型咪唑啉双季铵盐阳离子缓蚀剂（S-HSJ）,研究并讨论了其在5%盐酸介质中对铜、铝等金属的缓蚀性能及缓蚀剂结构中亲油基部分碳链长度、缓蚀时间、缓蚀剂浓度等对缓蚀效果的影响。研究表明：S-HSJ系列咪唑啉双季铵盐对红铜、黄铜、铝及马口铁四种金属均表现出较传统单季铵盐与苯并三氮唑缓蚀剂好的缓蚀性能,S-HSJ-16双季铵盐添加量0.1%时缓蚀效率可达94~99%,S-HSJ与阴离子表面活性剂复配对铜腐蚀表现出明显协同效应。     

Gemini型咪唑啉双季铵盐金属缓蚀剂的合成及其性能

合成了系列新型咪唑啉双季铵盐阳离子缓蚀剂(S-HSJ),研究并讨论了其在5%HCl介质中对铜、铁、铝等金属的缓蚀性能及缓蚀剂结构中亲油基部分碳链长度、缓蚀时间、缓蚀剂浓度等对缓蚀效果的影响. 研究表明,S-HSJ系列咪唑啉双季铵盐对红铜、黄铜、铝及马口铁四种金属均表现出较传统单季铵盐与苯并三氮唑缓蚀剂好的缓蚀性能,S-HSJ-16双季铵盐添加量0.1%时缓蚀效率可达94%~99%,S-HSJ与阴离子表面活性剂复配对铜腐蚀表现出明显协同效应.     

卤离子溶液中邻香兰素邻苯二胺对铜的缓蚀作用

应用恒电位稳态极化和交流阻抗技术研究了希夫碱—邻香兰素邻苯二胺 (V_oPh_V)在中性NaCl或NaBr溶液中对金属铜阳极溶解和腐蚀的缓蚀作用 .通过比较铜在空白溶液与含有V_o_Ph_V溶液中的电化学行为解释了V_o_Ph_V的缓蚀机制 .此外还研究了V_o_Ph_V自组装膜在Na Cl溶液中对铜腐蚀的缓蚀效应 .     

光电化学方法在铜缓蚀剂作用机理研究中的应用

本文综述了笔者实验室采用光电化学方法在铜缓蚀剂作用机理研究中的应用情况，采用此方法不仅可对铜缓蚀剂的缓蚀性能进行评定，而且还可对缓蚀剂的作用机理级缓蚀协同效应与作用机理进行研究，可以得到其它一些常规电化学方法及表面分析所不能得到的一些信息，此方法不失为一种研究缓蚀剂作用机进的好方法。     

吡咯烷二硫代氨基甲酸铵自组装膜对铜的缓蚀作用

吡咯烷二硫代氨基甲酸铵(APDTC)是一种环境友好型金属缓蚀剂, 以其在铜表面制备了自组装单分子膜(SAMs), 用电化学方法研究在0.5 mol·L-1 HCl介质中APDTC SAMs对铜的缓蚀作用及其吸附行为. 结果表明, APDTC分子易在铜表面形成稳定的APDTC SAMs, 改变了电极表面的双电层结构, SAMs同时抑制了铜的阳极氧化过程和阴极还原过程, 铜电极的电荷转移电阻明显提高, 双电层电容明显降低. 电化学阻抗和极化曲线测试结果显示, 在0.5 mol·L-1 HCl介质中, 铜表面APDTC SAMs表现出良好的缓蚀效果. 研究结果还表明, APDTC的吸附行为符合Langmuir吸附等温式, 吸附机理是介于化学吸附和物理吸附之间的一种吸附.     

硫、氮杂环类衍生物对铜缓蚀性能的研究

采用电化学测试技术和分子动力学模拟相结合的方法研究了5-巯基-1-甲基四唑(MMT)和1-(2-二甲基氨基乙基)-1H-5巯基四氮唑(MTZ)2种四氮唑化合物在1mol/L HCl溶液中对铜的缓蚀性能。电化学结果表明,缓蚀剂的加入可以有效降低铜电极的腐蚀电流密度,提高铜的耐腐蚀性能,且2种缓蚀剂的缓蚀效率为MTZMMT。量化计算和分子动力学模拟结果表明,两种缓蚀剂均以平行于铜表面的方式吸附在金属表面,并且MTZ比MMT具有更强的反应活性和更稳定的吸附性能。两种缓蚀剂的缓蚀效率的理论评价与实验结果相一致。     

SDBS与HA缓蚀剂复配的实验与理论研究

通过静态失重法研究了十二烷基苯磺酸钠(SDBS)与六亚甲基四胺(HA)在盐酸溶液中对Q235钢的协同缓蚀效应, 并采用分子动力学模拟从缓蚀剂膜抑制腐蚀粒子扩散的角度对其缓蚀机理进行分析. 结果显示: SDBS和HA单独使用时, 最高缓蚀效率分别为82.82%和79.46%, 复配后最高缓蚀效率可达到92.78%; 与两种缓蚀剂单独使用时相比, SDBS与HA复配后缓蚀剂膜体系中的自由空间明显下降, 削弱了膜内缓蚀剂分子的自扩散能力, 腐蚀粒子在缓蚀剂膜携带下的被动迁移也随之减弱; SDBS与HA复配能更有效抑制腐蚀粒子在缓蚀剂膜中的扩散, 也就是说复配后的缓蚀剂具有更好的缓蚀性能.     

MMI作为铜的盐酸酸洗缓蚀剂作用机理的研究

用失重法研究了N-甲基-2-巯基咪唑（MMI）在5％盐酸中对铜的酸洗缓蚀性能.探讨了温度和MMI浓度对缓蚀效果的影响，从中得出了MMI在铜表面的吸附等温式，计算了吸附热及MMI的加入对铜在盐酸中腐蚀反应活化能的影响，进而探讨了MMI对铜缓蚀作用的机理.结果表明， 30 ℃下，在5％盐酸中，当MMI的浓度在3 mmol•L－1和8 mmol•L－1之间时,缓蚀率随MMI浓度的增加而迅速增加，当浓度达到8 mmol•L－1时，缓蚀率趋于定值，而当浓度小于3 mmol•L－1时， MMI的加入会加速铜的腐蚀；吸附在铜表面的MMI分子间的作用力整体表现为引力； MMI在铜表面的吸附是吸热反应； MMI的加入降低了铜的腐蚀反应活化能.     

The Effect of Magnetic Field on Corrosion Inhibitor of Copper in 0.5 M HCl Solution

Corrosion of metals within magnetic field (MF) had been actively studied for better understanding of the corrosion mechanism when the magnetic sources are presented. However, findings regarding the effect of MF on metals are inconclusive, and there is a lack of studies of MF interaction with various corrosion control techniques, such as corrosion inhibitor. In this paper, the effect of MF on the corrosion of copper in 0.5 M hydrochloric acid (HCl) solution, with or without corrosion inhibitor were studied. Benzotriazole (BTA), a common copper inhibitor, was chosen as the inhibitor for this study. To determine the effect of MF, a MF of 13 mT, generated using a pair of permanent neodymium magnet, was applied during weight loss and electrochemical tests. The results showed that corrosion inhibition efficiency of BTA decreased when it is under an applied MF. A decrease from 47% to 60% in inhibition efficiency had been observed for all samples in an applied MF. By using Tafel extrapolation technique on the polarization curves, it revealed that MF had increased the corrosion current of copper in HCl, causing a decrease in the inhibition efficiency.     

2-氨基嘧啶对铜的缓蚀机理

利用动电位极化曲线、线性极化、X射线光电子能谱(XPS)、X射线俄歇能谱(X-AES)和表面增强拉曼散射(SERS)研究2-氨基嘧啶(2-AP)对金属铜的缓蚀作用。结果表明: 在含Cl~-离子的酸性介质中, 2-AP是铜的有效缓蚀剂; 随着介质pH值的增加, 2-AP的缓蚀能力降低。2-AP缓蚀能力随pH值明显变化的原因在于只有在酸性介质中, 质子化了的2-AP分子、Cl~-离子和铜表面原子(或离子)才可能形成保护作用强的多聚配合物膜。     

Corrosion of copper in aerated synthetic sea water solutions and its inhibition by 3-amino-1,2,4-triazole

Corrosion of copper in aerated synthetic sea water (3.5% NaCl) solutions and its inhibition by 3-amino-1,2,4-triazole (ATA) have been studied using electrochemical, gravimetric, and pH measurements, along with Raman spectroscopy. Electrochemical measurements indicated that the presence of ATA and the increase of its concentration suppress the corrosion process on the copper surface. This effect decreases cathodic, anodic, and corrosion (jcorr) currents and corrosion rates (Kcorr), while increasing polarization resistance (Rp), surface coverage (theta), and inhibition efficiency (IE%). Weight loss measurements indicated that the dissolution of copper and the accompanying change of pH decreased to a minimum even after 24 days immersion due to the presence of ATA and the increase of its concentration. Raman investigations revealed that the inhibition of copper corrosion is achieved by strong adsorption of ATA molecules onto the copper surface, preventing it from being corroded easily.     

Corrosion inhibition by benzotriazole derivatives and sodium dodecyl sulphate as corrosion inhibitors for copper in ground water at different temperatures

1‐(2‐Pyrrole carbonyl) benzotriazole (PBTA) and 1‐(2‐thienyl carbonyl)‐benzotriazole (TBTA) were synthesized. Different concentrations of PBTA, TBTA, sodium dodecyl sulphate (SDS), and molybdate (Mo) were evaluated as corrosion inhibitors for copper in ground water medium at different temperatures. The obtained results were compared with the effect of benzotriazole (BTA) on the inhibition of copper corrosion at the same condition. The study was performed using potentiodynamic polarization, electrochemical impedance spectroscopy, cyclic voltammetry, and scanning electron microscopy investigations. A good inhibition is ensured at elevated temperatures. All measurements indicated that PBTA, TBTA, and BTA act as good corrosion inhibitors and their inhibition efficiency (IE%) increased with combining them with optimum concentration of SDS and Mo. Furthermore, the best performance was recorded for the compound PBTA + SDS + Mo, which was found to offer increased IE% in a synergistic manner, thereby acting as a good corrosion inhibitor for copper in ground water medium. Copyright © 2015 John Wiley & Sons, Ltd.     

Review of corrosive environments for copper and its corrosion inhibitors

This review paper deals with corrosion of copper and its alloys in corrosive environments and their corrosion inhibitors. The main corrosion inhibitor groups for copper are introduced and a review of adsorption models is provided. The main part of this work is to investigate different corrosive environments for copper and its alloys and their corrosion inhibitors used in such environments to protect copper. According to the literature, the corrosion inhibition behavior of organic corrosion inhibitors and their derivatives in comparison with inorganic ones are further evaluated. Knowing maximum corrosion inhibition efficiency of a specific corrosion inhibitor in a specific corrosive environment is helpful to choose the most appropriate corrosion inhibitor compound.     

Effects of 3-amino-1,2,4-triazole on the inhibition of copper corrosion in acidic chloride solutions

Effects of 3-amino-1,2,4-triazole (ATA) on the inhibition of copper corrosion in 0.5 M HCl solutions have been studied using gravimetric, electrochemical, and Raman spectroscopy investigations. Weight-loss measurements after varied immersion periods revealed that the dissolution rate of copper decreased to a minimum, while the inhibition efficiency (zeta%) and consequently the degree of surface coverage (theta) increased with the presence of ATA and the increase of its concentration. Potentiodynamic polarization, chronoamperometric, and electrochemical impedance spectroscopy (EIS) measurements after 0, 24, and 48 h immersion of the copper electrode in the test solutions showed that the presence of ATA molecules significantly decreased cathodic, anodic, and corrosion (jcorr) currents and corrosion rates (Rcorr) and greatly increased polarization resistance (Rp), zeta%, and theta; this effect was increased on increasing the ATA content in the solution. Raman spectroscopy confirmed that ATA molecules strongly adsorbed onto the copper surface, blocking its active sites and preventing it from being corroded easily.     

Protection of Copper Surface Against Corrosion by Cationic Surfactant in Seawater

The protection power of the cationic surfactant decylammonium acetate (DAA) in seawater has been studied to define the perfect conditions have to be found for using it as a corrosion inhibitor for copper surface. The adsorption isotherm of this surfactant on copper surface has been determined at different interval times at 30°C. The given isotherms have, in general, similar shapes exhibiting a Languimirian L-shape. The corrosion measurement has been determined according to weight loss method. The study declines that cationic DAA, in seawater, protects well the copper surface against corrosion when added with low concentrations, while high concentrations show bad inhibition efficiency. ICP spectroscopic analysis assures this result where high Cu% has been obtained in the presence of high DAA concentration.