基于神经网络遗传算法的激光熔钎焊参数优化

针对激光钎焊熔深难以控制的问题,选取激光焊接功率、焊接速度等激光焊接过程中所涉及的控制参数建立基于BP人工神经网络的激光钎焊模型。根据激光钎焊模拟实验的历史数据对焊接熔深进行预测,采用遗传算法对控制参数进行优化,得到目标焊接熔深。运用MATLAB软件建立了针对铝合金/镀锌钢的激光熔钎焊过程的参数的BP人工神经网络模型,并利用遗传算法的并行和群体搜索策略,对其控制参数进行了优化,使得焊接熔深能通过过程参数精确控制,提高了接头性能。     

溅射Al对AlN的“润湿”与钎焊

由于润湿性不佳, 难以实现金属钎料对陶瓷的无过渡层直接钎焊, 本文在研究了溅射Al薄膜对AlN的“润湿”作用的基础上, 通过磁控溅射的方法在AlN表面沉积Al基薄膜作为钎料, 在真空条件下对AlN陶瓷进行了直接钎焊. 采用高景深光学显微镜、扫描电子显微镜和X射线能量分散谱表征了钎焊接头和剪切断口的组织及形貌. 结果表明, 高能量溅射Al粒子对AlN的撞击可以形成只有850 ℃以上高温才可获得的Al-N化学键, 实现Al对AlN的“润湿”, 使Al基薄膜钎料能够在较低的温度(≥ 510 ℃)对AlN直接钎焊. 此方法获得的Al/AlN接头的剪切强度达到104 MPa, 含3.8 at.% Cu的Al合金钎料接头强度可进一步提高到165 MPa, 它们的剪切断裂都产生于钎缝金属之中; 增加钎料中的Cu含量至9.1 at.%后, Cu在钎缝与陶瓷界面的偏聚使接头的剪切强度降低为95 MPa. Al-20 at.% Ge合金可以将钎焊温度降低至510 ℃, 但Ge在钎缝与陶瓷界面的偏聚使接头在48 MPa发生断裂.     

银铜钛膏状钎料钎焊石墨和铜合金接头的微观组织及性能

利用银铜钛(Ag-Cu-Ti)膏状钎料采用真空钎焊的方法对两种不同石墨和铜合金进行钎焊连接实验，研究了钎焊温度、中间缓冲层、母材尺寸等工艺参数对接头性能的影响。采用自行设计模具对接头的剪切强度进行了测试，利用扫描电镜和配带的X射线能谱分析仪分析了接头界面组织形貌及元素物相成分。研究结果表明：当钎焊温度为910℃，保温时间10min时，Ag-Cu-Ti膏状钎料能够与石墨和无氧铜两侧母材形成良好的结合界面；与GA石墨相比，阿泰克石墨与无氧铜接头强度更高；采用1mm无氧铜做中间缓冲层钎焊石墨和铬锆铜时，能有效缓解钎焊热应力，接头强度有明显提高。     

双尺度织构的激光光刻工艺

搭建了双光束激光干涉光刻系统和激光快速扫描系统。利用干涉光刻系统,实现了不同周期、不同深度、大面积的表面规则光栅织构的构筑。利用激光快速扫描器的二维扫描功能,通过控制激光功率和扫描速度,对曝光量和填充线条间距进行了优化。提出了两种双尺度复合织构的制备方法:一种是在激光快速扫描系统中对抗蚀剂表面分别进行x, y方向的扫描光刻,然后在干涉光刻系统中进行双光束干涉光刻;另一种是在激光干涉光刻系统中进行两次曝光,每次曝光的入射角不同。实验结果表明:这两种方法在制备双尺度复合织构方面具有快速、廉价、操作简易等优点。     

钨/低活化钢钎焊用铁基非晶钎料与接头微结构

为了连接W和CLF-1 RAFM钢,设计出由低活化元素组成的Fe-B-Si、Fe-B-Si-Sn、Fe-B-Si-Cr-(Sn)、Fe-B-Si-P-(Cr,Sn)、Fe-B-Si-Mn-(Ga,Sn)和Fe-B-Si-(Cr,Mn,Ga,Ta,Sn)系列Fe基非晶钎料,结合熔体快淬技术制备出非晶合金箔带,并对W/CLF-1 RAFM钢接头微结构进行了对比研究。采用X-射线衍射仪对箔带样品与焊缝进行了相鉴定;通过差热分析测量了非晶箔带的熔化温度和液相线温度;利用光学金相和电子探针分析了焊缝组织形貌和元素分布。结果表明,利用Fe-B-Si、Fe-B-Si-Cr和Fe-B-Si-Mn-Sn非晶钎料可获得结构完整的W/CLF-1钢接头;前两种钎料得到的焊缝组织基体相为α-Fe固溶体,而含Mn钎料形成的焊缝基体为马氏体组织;在高温钎焊过程中,这些Fe基非晶钎料中的高B含量促使FeWB、FeW2B2和Fe3B型金属间化合物在焊缝中形成,并有效地阻止了W元素向低活化钢基体长程扩散。所设计的低活化Fe基非晶钎料可用于W和低活化钢的连接和接头性能研究。     

HL-2M偏滤器CFC/CuCrZr靶板的非晶钎焊工艺研究

在采用商用的STEMET-1101非晶钎料、温度为710~750°C的真空钎焊下,对CFC/OFC(氯氟烃/无氧铜)复合块与CuCrZr(铬锆铜)的钎焊进行了研究。首先,通过X-射线衍射(XRD)和差式扫描量热分析对钎料的结构和熔化行为进行了表征;然后,通过光学显微镜、电子探针微分析和拉伸试验等方法对焊缝的组织形貌、元素成分分布、相结构和力学性能进行了分析;最后,通过高热负荷装置对CFC/OFC/CuCrZr钎焊模块的热疲劳性能进行测试。结果表明,在710~750°C钎焊温度内焊缝由Cu固溶体、(Cu, Ni)3P和Ni(Cu ,Cr)2P金属间化合物组成,焊缝平整无裂纹;特别是在750°C/15min情况下,抑制了焊缝金属间化合物的连续分布,OFC/CuCrZr的焊接强度大于OFC的抗拉强度,CuCrZr/CuCrZr的结合强度为210MPa,并呈现部分韧性断裂。在750°C/15min情况下制备的CFC/Cu/CuCrZr模块可以承受1000次7MW·m^-2的循环热负荷。     

用于激光驱动飞片诊断的线成像速度干涉仪

设计并建立了一套完整的线成像激光干涉测速系统,用于激光驱动技术中小尺寸飞片或样品一条线上所有点的速度测量。它将激光压缩为线状照射到靶面,用成像物镜收集靶面的漫反射光并传递到广角迈克尔逊干涉腔中形成干涉,产生的梳妆干涉条纹作为信号载体,用变像管扫描相机记录条纹随时间的变化,用不同位置的条纹移动量反推出不同位置的速度分布,实现空间分辨。系统具有50 ps响应时间和20μm空间分辨能力。用该系统测量了激光驱动飞片的速度场,清晰的扫描干涉图像直观显示了飞片的运动过程和各点的速度差异。用傅里叶变换方法对干涉图像进行处理,得到了靶面一条线的速度和位移分布。     

斜齿轮激光熔覆Fe基合金组织与性能研究

采用激光熔覆技术在斜齿轮钢表面制备Fe基熔覆层。通过光学显微镜、显微硬度计对熔覆层进行金相组织与显微硬度分析,采用磨损机对熔覆层和基材进行摩擦实验。结果表明:当激光功率为750W,送粉速率为20g/min,扫描速度10mm/s,离焦量为16.4mm时,铁基熔覆层与基体结合界面有明显的白亮带,激光熔覆效果较好,熔覆层的显微硬度值分布在845.3HV至955.6HV之间,约为基体硬度(419.7HV)2倍;熔覆层摩擦磨损性能得到了提高;熔覆层显微组织为均匀而细小的铁素体和珠光体,力学性能优于基体材质。     

基于激光毛化技术的5052铝合金粘接试验研究

为了提高5052铝合金的粘接性能,利用脉冲光纤激光的短脉冲和高峰值功率的特性,对铝合金试件进行了激光毛化试验研究。通过正交实验法,研究了平均功率、扫描速度、脉冲频率和脉冲宽度等工艺参数对激光毛化质量的影响,以及各工艺参数的影响权重,并求得最佳工艺参数,最佳工艺参数为平均功率90 W、扫描速度10 mm/s、脉冲频率1000 kHz、脉冲宽度200 ns。根据优化后的工艺参数,加工获得了粗糙度2.35 μm,然后对激光毛化后的铝合金试件进行单搭接拉伸试验,研究发现粘接强度随着粗糙度的增大而增大,当粗糙度到达一定程度时,粘接强度反而会随着粗糙度的增大而减小。另外,粘接强度还跟铝合金表面的微织构的类型及疏密程度都有很大关系。     

基于4 kW YAG激光器的激光拼焊焊接工艺

分析了激光拼焊工艺特征,重点研究了在大功率固体激光器条件下,激光拼焊焊接工艺中激光功率、焊接速度和离焦量等因素变化对焊接质量的影响,得出了变化规律曲线。并系统全面地研究了目前汽车常用板材全厚度系列激光拼焊工艺,采用叠代寻优的方法获得到了适用于全自动激光拼焊生产线的优化工艺规范。     

Preparation of solder pads by selective laser scanning

We propose a new laser preparation technique to solder Sn-Ag3.5-Cu0.7 on a copper clad laminate （CCL）. The experiment is conducted by selective laser heating and melting the thin solder layer and then preprinting it on CCL in order to form the matrix with solder pads. Through the analysis of macro morphology of the matrix with solder pads and microstructure of single pads, this technique is proved to be suitable for preparing solder pads and that the solder pads are of good mechanical properties. The results also reveal that high frequency laser pulse is beneficial to the formation of better solder pad, and that the 12-W fiber laser with a beam diameter of 0.030 mm can solder Sn-Ag3.5-Cu0.7 successfully on CCL at 500-kHz pulse frequency. The optimized parameters of laser soldering on CCL are as follows： the laser power is 12 W, the scanning speed is 1.0 mm/s, the beam diameter is 0.030 ram, the lead-free solder is Sn-Ag3.5-Cu0.7, and the laser pulse frequency is 500 kHz.     

Characteristics of Multi-Beam Module Using Waveguides for Laser Scanning Optical Systems

A multi-beam module using optical waveguides has been studied for a laser scanning optical system. Laser diodes with a wavelength of 780 nm are assembled on a silicon substrate. The beams emitted from the laser diodes are directly coupled into waveguides. This multi-beam module is assembled on a metal substrate with a photodiode. The photodiode controls the power of each laser diode on the silicon substrate. The multi-beam module is able to increase the output speed of high-density image printings, and the speed for high-speed color printings. We have developed the four-beam module with beam divergence angles of 11 degrees and spatial beam interval of 24 μm. Additional heat sink and optimizing tip-bonding between the laser diode and solder pad on the silicon substrate is useful to stabilize laser power against rising temperature.     

Effects of soft beam energy on the microstructure of Pb37Sn, Au20Sn, and Sn3.5Ag0.5Cu solder joints in lensed-SM-fiber to laser-diode-affixing application

This paper reports on the effectiveness of soft beam energy as a heat source to form an optimum solder joint to fix a lensed fiber permanently on a Ni/Au-plated substrate. Solders, i.e., Pb37Sn, Au20Sn, and Sn3.5Ag0.5Cu (SAC) [wt%] were evaluated for this fluxless application. The microstructures of the solder joints have been examined using scanning electron microscopy (SEM), in order to understand the response of these solder materials to the focussed white light. Obviously, the exposure time has a greater effect on the soldering temperature before reaching the peak temperature, which is determined by the power. A power setting of 40 W can reach approximately 340 °C, 30 W can reach about 310 °C while 25 W can easily reach 260 °C. In general, a higher soldering temperature than the melting temperature is required to form good wetting solder joints for fluxless applications. However, too high an input thermal energy may result in premature aging for the cases of Pb37Sn and SAC, and lateral cracks for the case of Au20Sn. The thermal cracks and voids observed in Au20Sn solder joint were attributed to the fact that the soft beam heating profile does not suit the AuSn preform. Out of these three solder types, SAC demonstrated just the right response to the soft beam, i.e., good wetting, fine and homogeneous structure, and no cracks or other visible failures.     

New optical measuring system for solder joint inspection

Due to specularity and complex 3D geometry, the visual inspection of solder joints has been regarded as one of the most difficult tasks and thus has not guaranteed accurate inspection results. This paper deals with an optical sensing system designed to inspect solder joints automatically. Taking into account a specular characteristic, a new optical solder joint inspection system is proposed to obtain the external profile of solder joints accurately. A laser scanning unit scans the area of solder joint and observes the angle of the reflected beam. To realize this measuring principle, the system is so composed that a galvanometer steers the direction of laser beam to a point to be measured, a mirror unit (a parabolic and a conic mirror) gathers the specular components of the reflected beam toward its center and a beam-receiving unit positioned along the mirror unit's center line detects the reflected beam. To classify the defects of solder joint, a statistical pattern recognition method is utilized. To verify the validity of the developed system, a series of experiments was performed for SOPs and QFPs in insufficient, normal and excess soldering condition. Based upon observation of the experimental results, the proposed system is found to show good performance for inspection of solder joint defects.     

Characterization of a laser-soldered avionic component using lead-free paste

Electrical cable-connector sets used in airplanes have been laser soldered using a lead-free paste. These connections are usually crimped using a hand tool, which necessarily leads to variable mechanical and electrical properties in the connection. Calorimetric studies have shown that paste melting occurs within tenths of a second at laser intensities of 400 or 500 W cm⁻². However, when such laser intensities strike the connector surface, some boiling occurs. In order to avoid paste losses, a stepped heating curve is applied, which allows good weldability. It was verified that a reaction layer of 2 μm length exists between the wires and the solidified solder paste, and also that there is some diffusion of copper from the wires to the paste. The soldered joints are 38% more electrically conductible and have 113% more tensile strength resistance than crimped joints.     

Ultrasonic soldering in electronics

Ultrasonic (US) soldering of electronic components, as an alternative to flux soldering, is environmentally friendly, improves the quality of soldered connections at the mounting elements after long-term storage, and allows the use of lead-free solders. Methods of US solder melt activation, lead-free solders in US soldering and glass-ceramic capacitor metallization processes have been investigated.     

Au80Sn20合金焊料制备工艺

针对高功率二极管激光器的封装要求,通过磁控溅射的方法制备了Au80Sn20合金焊料,使用扫描电子显微镜（SEM）观察其微结构和表面形貌;利用能谱仪（EDX）和X射线荧光测试仪分析其成分;采用差热分析法（DTA）测试其熔化温度,并用制备的Au80Sn20合金焊料进行了可焊性实验。结果表明:磁控溅射法可以制备Au80Sn20合金焊料,其制备的Au80Sn20合金焊料表面无明显缺陷,结构致密;成分与理论值接近;熔点与理论熔点接近;焊接浸润性好,空洞率小,强度大。     

Optical fiber cleaved at an angle by CO2 laser ablation: Application to micromachining

Laser ablation can be achieved by delivering short power pulse with durations much smaller than the heat diffusion time. In this investigation, we are collimating and magnifying a beam from a CO₂ laser with a Keplerian telescopic system. Then we study the quality of the cut performed by scanning the beam at a fast speed over an optical fiber just after focusing a well collimated CO₂ beam at λ=10.6 μm. It is found that the best results for cutting optical fibers depend upon both the time required in raising matter temperature to the vaporization point and the scanning speed of the CO₂ laser beam. Some aspects of the laser beam collimation before focusing is reviewed briefly and results for optical fibers being cleaved at low and fast speed under various conditions are also shown and discussed.     

4 mm腔长高功率单管半导体激光器封装应力的研究

为了减小长腔长高功率单管半导体激光器在封装过程中引入的热应力,根据应力改变禁带宽度的原理,理论上推导了应力与波长漂移的关系,提出了一种通过测量激光器脉冲条件下的光谱来定量计算激光器应力的方法。利用这种方法得到的研究结果表明,焊接质量直接决定着应力的大小,由焊接质量的不同引起的应力差值超过了300 MPa,提出了优化焊接回流曲线的方法,使激光器的应力由原来129.7 MPa降低到53.4 MPa,该方法还有效的解决了封装应力随储存时间变化的问题。实验表明,激光器光谱图的测量分析是研究高功率单管半导体激光器封装应力的有效方法,也是检测分析烧结工艺的有效手段。     

封装热应力致半导体激光器“Smile”效应的抑制方法

封装热应力所致smile效应是阵列封装大功率半导体激光器中普遍存在的问题。为解决这一问题,本文在研究smile效应产生机理的基础上,提出采用错温封装技术和热沉预应力封装技术降低smile效应的措施。以某808nm水平阵列封装半导体激光器为例,采用仿真分析的办法研究了上述技术的可行性和有效性。仿真分析表明,采用传统封装技术,在恢复至室温22℃后,芯片smile值约为39.36μm,采用封装前升高芯片温度至429℃的错温封装技术,可以将smile值降至1.9μm;若采用热沉预应力技术,对热沉的两个端面沿长边方向分别施加190 N的拉力,可以将smile值降至0.35μm。结果表明,这两种封装措施是有效的。错温封装技术和热沉预应力封装技术具有易于实现的优点,其中热沉预应力技术对于各种smile效应类型和不同的smile值都可以调整和修正。