Suppression of bias stress-induced degradation of pentacene-TFT using MoOx interlayer

The bias stress effect in pentacene thin-film transistors (TFTs) with and without MoO_x interlayer was characterized. The device without MoO_x interlayer showed a large threshold voltage shift of 5.1 V after stressing with a constant gate-source voltage of −40 V for 10000 s, while at the same condition, the device with MoO_x interlayer showed a low threshold voltage shift of 1.9 V. The results can be attributed to the stable interface between MoO_x/pentacene and small contact resistance change for the device with MoO_x/Cu electrode. Pentacene-TFTs with MoO_x interlayer showed a high field-effect mobility of 0.61 cm²/V s and excellent bias stability, which could be a significant step toward the commercialization of OTFT technology.     

Improving the electrical performance of HfInZnO-TFTs by introducing a thin ITO interlayer

We have fabricated hafnium–indium–zinc-oxide (HfInZnO) thin film transistors (TFT) with indium–tin-oxide (ITO) interlayer. Compared with conventional HfInZnO-TFT, the electrical performance and bias stability of HfInZnO-TFTs with ITO interlayer are improved. HfInZnO-TFT with 4-nm-thick ITO interlayer shows a high mobility of 7.2 cm²/V s, a low threshold voltage of 0.13 V and a better bias stability. The performance enhancement is attributed to a decrease in interface trap state and an increase in carrier concentration. It suggests that introducing ITO interlayer at the ALD Al₂O₃/HfInZnO interface is an effective way to improve the electrical performance and bias stability.     

Low-voltage-drive and high output current ZnO thin-film transistors with sputtering SiO2 as gate insulator

Low-voltage-drive ZnO thin-film transistors (TFTs) with room-temperature radio frequency magnetron sputtering SiO₂ as the gate insulator were fabricated successfully on the glass substrate. The ZnO-TFT operates in the enhancement mode with a threshold voltage of 4.2 V, a field effect mobility of 11.2 cm²/V s, an on/off ratio of 3.1 × 10⁶ and a subthreshold swing of 0.61 V/dec. The drain current can reach to 1 mA while the gate voltage is only of 12 V and drain voltage of 8 V. The C–V characteristics of a MOS capacitor with the structure of ITO/SiO₂/ZnO/Al was investigated. The carrier concentration N_D in the ZnO active layer was determined, the calculated N_D is 1.81 × 10¹⁶ cm⁻³, which is the typical value of undoped ZnO film used as the channel layer for ZnO-TFT devices. The experiment results show that SiO₂ film is a promising insulator for the low voltage and high drive capability oxide TFTs.     

Tuning the contact resistance in organic thin-film transistors with an organic-inorganic hybrid interlayer

We demonstrated the tunable contact resistance in pentacene thin film transistor (TFT) by inserting an organic-inorganic hybrid interlayer between Au electrode and pentacene layer. The contact resistance of pentacene-TFT varies with concentration of pentacene-TFT varies with concentration of MoO_x in organic-inorganic hybrid interlayer. MoO_x in organic-inorganic hybrid interlayer. The contact resistance of the device with 55 wt% MoO_x doped pentacene interlayer is about 7.8 times smaller than that of device without interlayer at the gate voltage of −20 V. Comparing the properties of pentacene-TFT without interlayer, the performance of the pentacene-TFT with 55 wt% MoO_x doped pentacene was significantly improved: saturation mobility increased from 0.39 to 0.87 cm²/V s, threshold voltage reduced from −21.3 to −7.2 V, and threshold swing varied from 3.75 to 1.39 V/dec. Our results indicated that the organic-inorganic hybrid interlayer is an effective way to improve the performance of p-channel OTFTs.     

N2O Plasma表面处理对SiNx基IGZO-TFT性能的影响

采用N₂O plasma处理SiN_x薄膜作为绝缘层,以室温下沉积的铟镓锌氧化物(IGZO)作为有源层制备了 IGZO薄膜晶体管。与常规的IGZO-TFT相比,N₂O plasma处理过的IGZO-TFT的迁移率由原来的4.5 cm²·V^-1·s^-1增 加至8.1 cm²·V^-1·s^-1,阈值电压由原来的11.5 V减小至3.2 V,亚阈值摆由原来的1.25 V/decade减小至0.9 V/decade。采用C-V方法计算了两种器件的陷阱态,结果发现N₂O plasma处理过的IGZO-TFT的陷阱态明显小于普通的IGZO-TFT的陷阱态,表明N₂O plasma处理SiN_x绝缘层是一种改善IGZO-TFT器件性能的有效方法。     

Top-gate amorphous IGZO thin-film transistors with a SiO buffer layer inserted between active channel layer and gate insulator

In this paper, top-gate thin-film transistors (TFTs) using amorphous In-Ga-Zn-O as the n-channel active layer and SiO₂ as gate insulator were fabricated by radio frequency magnetron sputtering at room temperature. In this device, a SiO layer was used to be a buffer layer between active layer and gate insulator for preventing the damage of the InGaZnO surface by the process of sputtering SiO₂ with relatively high sputtering power. The thickness of buffer layers was studied and optimized for enhancing the TFTs performances. Contrasting to the TFTs without buffer layer, the optimized thickness of 10 nm SiO buffer layer improved the top-gate TFTs performances greatly: mobility increases 30%, reached 1.29 cm²/V s, the I_on/I_off ratio increases 3 orders, and the trap density at the interface of channel/insulator decreases about 1 order, indicated that the improvement of semiconductor/dielectric interface by buffering the sputtering power.     

Effects of laser pulse wavelength and laser fluence on the characteristics of silver nanoparticle generated by laser ablation

Electrically pumped ultraviolet random lasing was achieved in metal-insulator-semiconductor (MIS) diodes based on ZnO films at room temperature. The ZnO films were grown by plasma assisted molecular beam epitaxy. Two different kinds of insulator layers, SiO _x (0<x≤2) and AlO _x (0<x≤1.5) were deposited by electron beam evaporation. X-ray diffraction experiments found these oxide layers were amorphous (or microcrystals), and X-ray photoelectron spectroscopy confirmed the Si and Al were fully oxidized. Compared with devices using SiO _x as the insulator layer, diodes with evaporated AlO _x layers showed a lower working threshold forward current (～20 mA to ～26 mA) and higher emission intensity. Periodic features indicating formation of closed-loop paths were deduced by the power Fourier transform of electroluminescence spectra. The cavity length of both devices increased as forward currents increased, while a larger cavity length was always obtained in the AlO _x -involved device under the same working current. The improved performance was attributed to larger hole amount in AlO _x layers. These results revealed that evaporated AlO _x can serve as good electron blocking and hole supplying layers for hetero-structures.     

Activation energy of hydrogen desorption from high-performance titanium oxide carrier-selective contacts with silicon oxide interlayers

The impact of hydrogen desorption on the electrical properties of TiO_x on crystalline silicon (c-Si) with SiO_y interlayers is studied for the development of high-performance TiO_x carrier-selective contacts. Compared with the TiO_x/c-Si heterocontacts, a lower surface recombination velocity of 9.6 cm/s and lower contact resistivity of 7.1 mΩ cm² are obtained by using SiO_y interlayers formed by mixture (often called SC2). The hydrogen desorption peaks arising from silicon dihydride (α1) and silicon monohydride (α2) on the c-Si surface of the as-deposited samples are observed. The α1 peak pressure of as-deposited heterocontacts with SiO_x interlayers is lower than that of heterocontacts without a SiO_y interlayer. Furthermore, the hydrogen desorption energies are found to be 1.76 and 2.13 eV for the TiO_x/c-Si and TiO_x/SC2-SiO_y/c-Si heterocontacts, respectively. Therefore, the excellent passivation of the TiO_x/SC2-SiO_y/c-Si heterocontacts is ascribed to the relatively high rupture energy of bonding between Si and H atoms.     

Optimization of transmittance and resistance of indium gallium zinc oxide/Ag/indium gallium zinc oxide multilayer electrodes for photovoltaic devices

We report on the optimization of the optical and electrical properties of IGZO/Ag/IGZO multilayer films as a function of IGZO thickness. The transmission window slightly widened and shifted toward lower energies with increasing IGZO thickness. The IGZO(39 nm)/Ag(19 nm)/IGZO(39 nm) showed transmittance 88.7% at 520 nm. The optical transmittance spectra were examined by finite-difference time-domain (FDTD) simulations. The carrier concentration decreased from 1.73 × 10²² to 4.99 × 10²¹ cm⁻³ with increasing the IGZO thickness, while the charge mobility insignificantly changed from 19.07 to 19.62 cm²/V. The samples had sheet resistances of 4.17–4.39 Ω/sq with increasing IGZO thickness, while the resistivity increased from 1.89 × 10⁻⁵ to 6.43 × 10⁻⁵ Ω cm. The 39 nm-thick IGZO multilayer sample had a smooth surface with a root mean square roughness of 0.63 nm. The IGZO(39 nm)/Ag(19 nm)/IGZO(39 nm) multilayer showed a Haacke's FOM of 49.94 × 10⁻³ Ω⁻¹.     

The influence of interface states and bulk carrier lifetime on the minority carrier behavior in an illuminated metal/insulator/GaN structure

An influence of electronic states at an insulator/GaN interface on the behavior of excess holes in an ultraviolet-illuminated metal/ SiO₂/n-GaN structure has been studied by numerical simulations for weak (gate bias of −0.1 V ) and strong (−1 V ) depletion, in a wide range of excitation light intensities (from 10¹⁰ to 10²⁰ photons cm⁻² s⁻¹) and for various bulk carrier lifetimes (from 1 to 100 ns). It has been found that the interface states with densities of 10¹² eV ⁻¹ cm⁻² dramatically reduce the total (integrated in the whole GaN layer) density of photogenerated holes and thus degrade the sensitivity of the metal/insulator/GaN-based photodetector.     

Room-temperature fabrication of ultra-thin ZrOx dielectric for high-performance InTiZnO thin-film transistors

In this letter, indium–titanium–zinc–oxide thin-film transistors with zirconium oxide (ZrO_x) gate dielectric were fabricated at room temperature. In the devices, an ultra-thin ZrO_x layer was formed as the gate dielectric by sol–gel process followed by ultraviolet (UV) irradiation. The devices can be operated under a voltage of 4 V. Enhancement mode operations with a high field-effect mobility of 48.9 cm²/V s, a threshold voltage of 1.4 V, a subthreshold swing of 0.2 V/decade, and an on/off current ratio of 10⁶ were realized. Our results demonstrate that UV-irradiated ZrO_x dielectric is a promising gate dielectric candidate for high-performance oxide devices.     

用反应溅射法沉积SiO_x绝缘层的InGaZnO-TFT的光照稳定性(英文)

制备了基于反应溅射SiOx绝缘层的InGaZnO-TFT,并系统地研究了InGaZnO-TFT在白光照射下的稳定性,主要涉及到光照、负偏压、正偏压、光照负偏压和光照正偏压5种情况。结果表明,器件在光照和负偏压光照下的阈值偏移较大,而在正偏压光照情况下的阈值偏移几乎可以忽略。采用C-V方法证明阈值电压漂移是源于绝缘层/有源层附近及界面处的缺陷。另外,采用指数模式计算了缺陷态的弛豫时间。本研究的目的就是揭示InGaZnO-TFT在白光照射和偏压下的不稳定的原因。     

高迁移率非晶铟镓锌氧化物薄膜晶体管的制备与特性研究

由于铟镓锌氧化物(IGZO) 薄膜具有高迁移率和高透过率的特点, 它作为有源层被广泛的应用于薄膜晶体管(TFT). 本文利用磁控溅射方法制备了TFT的有源层IGZO和源漏电极, 用简单低成本的掩膜法控制沟道的尺寸, 制备了具有高迁移率、底栅结构的n型非晶铟镓锌氧化物薄膜晶体管 (IGZO-TFT). 利用X 射线衍射仪(XRD) 和紫外可见光分光光度计分别测试了IGZO薄膜的衍射图谱和透过率图谱, 研究了IGZO薄膜的结构和光学特性. 通过测试IGZO-TFT的输出特性和转移特性曲线, 讨论了IGZO有源层厚度对IGZO-TFT特性的影响. 制备的IGZO-TFT器件的场效应迁移率高达15.6 cm²·V^-1·s^-1, 开关比高于10⁷. 关键词： 非晶铟镓锌氧化物 薄膜晶体管 有源层     

Optoelectronic properties of Cu1−xPtxFeO2 (0 ≤ x ≤ 0.05) delafossite for p-type transparent conducting oxide

The samples of Cu_1−xPt_xFeO₂ (0 ≤ x ≤ 0.05) delafossite have been synthesized by solid-state reaction method to investigate their optical and electrical properties. The properties of electrical resistivity and Seebeck coefficient were measured in the high temperature ranging from 300 to 960 K, and the Hall effect and the optical properties were measured at room temperature. The obtained results of Seebeck showed the samples are p-type conductor. The optical properties at room temperature exhibited the samples are transparent visible light material with optical direct gap 3.45 eV. The low electrical resistivity, hole mobility and carrier density at room temperature displayed value ranging from 0.29 to 0.08 Ω cm, 1.8 to 8.6 cm²/V s and 1.56 × 10¹⁸ to 4.04 × 10¹⁹ cm⁻³, respectively. The temperature range for transparent visible light is below 820 K because the direct energy gap contains value above 3.1 eV. Consequently, the Cu_1−xPt_xFeO₂ delafossite enhance performance for materials of p-type transparent conducting oxide (TCO) with low electrical resistivity.     

Enhanced electrical properties of pentacene-based organic thin-film transistors by modifying the gate insulator surface

A reliable surface treatment for the pentacene/gate dielectric interface was developed to enhance the electrical transport properties of organic thin-film transistors (OTFTs). Plasma-polymerized fluorocarbon (CFx) film was deposited onto the SiO₂ gate dielectric prior to pentacene deposition, resulting in a dramatic increase of the field-effect mobility from 0.015 cm²/(V s) to 0.22 cm²/(V s), and a threshold voltage reduction from −14.0 V to −9.9 V. The observed carrier mobility increase by a factor of 10 in the resulting OTFTs is associated with various growth behaviors of polycrystalline pentacene thin films on different substrates, where a pronounced morphological change occurs in the first few molecular layers but the similar morphologies in the upper layers. The accompanying threshold voltage variation suggests that hole accumulation in the conduction channel-induced weak charge transfer between pentacene and CFx.     

双势垒磁性隧道结的磁电阻效应及其在自旋晶体管中的应用

利用磁控溅射方法沉积双势垒磁性隧道结多层膜, 其中Al-O势垒层由等离子体氧化1 nm厚的 金属铝膜方式制备，然后采用深紫外光曝光和Ar离子刻蚀技术、微加工制备出长短轴分别为 6和3 μm大小的椭圆形双势垒磁性隧道结（DBMTJ），并在室温和低温下对其自旋电子输运 特性进行了研究. DBMTJ的隧穿磁电阻(TMR)比值在室温和42 K分别达到27％和423％， 结电阻分别为136 kΩ·μm²和175 kΩ·μm²，并在实验中观 察到平行状 态下存在低电阻态及共振隧穿效应，反平行态下呈现高电阻态以及TMR随外加偏压或直流电 流的增加而发生振荡现象. 由此，设计了一种基于这种双势垒磁性隧道结隧穿特性的自旋晶 体管. 关键词： 双势垒磁性隧道结 隧穿磁电阻 共振隧穿效应 自旋晶体管     

Transport studies of carbon-rich a-SiC x :H film through admittance and deep-level transient spectroscopy measurements

An intrinsic, carbon-rich a-SiC _x :H thin film, prepared by the plasma-enhanced chemical vapour deposition (PECVD) technique, has been studied mainly by AC admittance and small-pulse deep-level transient spectroscopy (DLTS) measurements on an Al/a-SiC _x :H/p-Si metal–insulator–semiconductor (MIS) structure. The effects of measurement temperature, voltage and small-signal AC modulation frequency on the MIS capacitor are qualitatively and quantitatively described. The kinetics of charge injection from the silicon substrate into the a-SiC _x :H film, as a function of temperature and voltage bias stresses, are reported. Nearest-neighbour and variable-range hopping mechanisms are considered. An activation energy of ～?0.09?eV, and a density of states (DOS) of about 10¹⁹?cm^?3/eV were found. The value of the DOS is in agreement with the effective interface DOS of above 10¹²?cm^?2/eV assessed by both capacitance and DLTS measurements. The frequency (or temperature) dependence of the MIS capacitor over the whole DC voltage range is considered in detail. Single- and double-step carrier exchange mechanisms between the a-SiC _x :H film and the silicon substrate, in the accumulation and depletion voltage regimes, respectively, are proposed.     

Charge storage characteristics of nonvolatile memories with chemically-synthesized and vacuum-deposited gold nanoparticles

Carrier injection and charge loss characteristics of nonvolatile memories with chemically-synthesized (CS) and vacuum-deposited (VD) gold nanoparticles (Au-NPs) have been investigated. Compared to CS counterparts, the memories with VD Au-NPs exhibit a higher dot density of 3.77 × 10¹¹ cm⁻², leading to a larger memory window. Further, the energy from valence-band edge to vacuum level (E_{VB_vac}) of tunneling oxide for the samples with CS and VD Au-NPs is found to be 9.04 and 9.85 eV respectively. The small E_{VB_vac} value of the memories with CS Au-NPs is resulted from the formation of a thin chemical oxide (SiO_x) on thermally-grown SiO₂ tunneling layer during the chemically synthesized process, contributing to a slow erasing behavior. Besides, the programming of the memories with VD Au-NPs is saturated at high gate bias, which has been well-explained by the electrons induced potential coupling between Au-NPs. Superior data retention property and high temperature dependence of charge loss are observed for the memories with CS Au-NPs, which can be ascribed to the thick tunneling oxide layer by the additional SiO_x film.     

Probing into the effect of Auger recombination mechanism on zero bias resistance-area product in In1−xGaxAs detector

D* (Detectivity), an important figure of merit for photodetectors, is limited by zero bias resistance-area product (R₀A). R₀A is determined by Auger recombination mechanism, depending on the composition, temperature, carrier concentration and other parameters of the photodetectors. To investigate R₀A of In_1−xGa_xAs infrared photodetectors, in this paper, theoretical analysis of Auger recombination mechanism was carried out in the room temperature, by taking CCCH, CHHL and CHHS into account. The calculated results show that there are significant influences on R₀A for various parameters in both p- and n-type regions of the devices. With carrier concentration around 10¹⁷ to 10¹⁸ cm⁻³, R₀A of 10⁸ Ω cm² (n-region) and 10⁶ Ω cm² (p-region) are obtained for x=0.47, when thickness and surface recombination velocity of the sample are 5 μm and 100 m/s, respectively.     

Ablation of silicon suboxide thin layers

We investigate the ablation of SiO _x thin films on fused silica substrates using single-pulse exposures at 193 nm and 248 nm. Two ablation modes are considered: front side (the surface of a film is irradiated from above) and rear side (a film is irradiated through its supporting substrate). Fluence is varied from below 200 mJ/cm² to above 3 J/cm². SiO _x films of thickness 200 nm, 400 nm, and 600 nm are ablated. In the case of rear-side illumination, at moderate fluences (around 0.5 mJ/cm²) the ablation depth corresponds roughly to the film thickness, above 1 J/cm² part of the substrate is ablated as well. In the case of front-side ablation the single-pulse ablation depth is limited for all film thicknesses to less than 200 nm even at fluences up to 4 J/cm². Experimental results are discussed in relation to film thickness, fluence, and ablation mode. Simple numerical calculations are performed to clarify the influence of heat transport on the ablation process.