ZnTe(ZnTe∶Cu)多晶薄膜的XPS研究

用共蒸发法在室温下制备了ZnTe及ZnTe∶Cu多晶薄膜,测量了电导率温度曲线,发现不掺杂的ZnTe薄膜的暗电导随温度的增加而线形增加,呈常规的半导体材料特征;掺Cu的ZnTe薄膜在温度较低时,lnσ随温度升高而缓慢增加,随后缓慢降低,达到一极小值,当温度继续升高时又陡然增加,呈现异常现象。用XPS研究了N₂气氛下退火前后表面状态,发现不掺Cu的ZnTe薄膜呈现富Te现象。掺Cu后Te氧化明显,以ZnTe形式存在的Te明显减少;ZnTe∶Cu薄膜中Zn的含量在退火前后变化明显,退火前,Zn主要以ZnTe形式存在,退火后Zn原子向表面扩散,使表面成分更加均匀,谱峰变宽;退火时,部分Cu原子进入晶格形成Cu_xTe相,引起载流子浓度变化,导致ZnTe∶Cu多晶薄膜的电导温度关系异常。     

ZnTe（ZnTe：Cu）多晶薄膜的XPS研究

用共蒸发法在室温下制备了ZnTe及ZnTe：Cu多晶薄膜，测量了电导率温度曲线，发现不掺杂的ZnTe薄膜的暗电导随温度的增加而线形增加，呈常规的半导体材料特征；掺Cu的ZnTe薄膜在温度较低时，lnσ随温度升高而缓慢增加，随后缓慢降低，达到一极小值，当温度继续升高时又陡然增加，呈现异常现象。用XPS研究了N2气氛下退火前后表面状态，发现不掺Cu的ZnTe薄膜呈现富Te现象。掺Cu后Te氧化明显，以ZnTe形式存在的Te明显减少；ZnTe：Cu薄膜中Zn的含量在退火前后变化明显，退火前，Zn主要以ZnTe形式存在，退火后Zn原子向表面扩散，使表面成分更加均匀，谱峰变宽；退火时，部分Cu原子进入晶格形成CuxTe相，引起载流子浓度变化，导致ZnTe：Cu多晶薄膜的电导温度关系异常。     

沉积条件对ZnTe/ZnTe:Cu薄膜结构及CdTe电池性能的影响

用共蒸发法沉积了ZnTe/ZnTe:Cu复合多晶薄膜,通过XRD,XPS,C-V,I-V等研究了沉积温度对薄膜结构、Cu浓度分布及电池性能的影响.结果表明,沉积温度对薄膜的结构影响不明显,薄膜呈立方相,经185 ℃退火后出现了六方相.对薄膜的剖析发现,Cu浓度分布呈现先上升到一极大值而后快速下降的趋势, 100 ℃沉积的ZnTe/ZnTe:Cu薄膜,ZnTe层起到了阻止Cu扩散作用,用这种薄膜制作的太阳电池X_D较大 关键词： ZnTe多晶薄膜 沉积温度 薄膜结构 器件性能     

反应离子刻蚀ZnTe的THz辐射和探测研究

运用电光采样技术揭示了反应离子刻蚀（RIE）ZnTe晶体表面THz辐射的光学整流产生机制， 观察到0.25 ps的THz场分布.通过比较刻蚀前后以及不同刻蚀条件下ZnTe样品在不同激发功 率下的THz辐射强度，发现由于反应离子刻蚀破坏了ZnTe样品表面的有序性，晶体的电光系 数随射频功率的增加而减小.借助于计算不同刻蚀条件下ZnTe晶体的频率响应函数，分析了 随射频功率增加ZnTe晶体响应频谱展宽的现象. 关键词： THz辐射 反应离子刻蚀 ZnTe     

用光电子能谱研究CdTe太阳电池的背接触特性

CdTe太阳电池的背电极须采用高功函数金属。通过采用光电子能谱(XPS)分析了高功函数金属Au和Ni分别作为背电极的CdTe太阳电池背接触特性,发现在背电极剥离后,Au在ZnTe/ZnTe∶Cu背接触层表面以Au单质形式存在,扩散深度较浅;Ni扩散到ZnTe/ZnTe∶Cu复合层的深度比Au大,且大多呈离子态,与ZnTe/ZnTe∶Cu复合层中的富Te离子形成Ni_xTe,提高了掺杂浓度,使电池性能获得改善。在两样品中还发现,不论是Te的峰还是Zn的峰,其峰的位移变化都很小,说明两样品中Te和Zn的存在形式没有发生变化。     

稀土掺杂CdTe太阳电池背接触层ZnTe的第一性原理研究

结合CdS/CdTe太阳电池背接触层的制备要求考虑, 利用基于密度泛函理论平面波超软赝势方法和广义梯度近似, 计算了未掺杂ZnTe、稀土Y、Gd掺杂ZnTe的能带和电子态密度, 得到了不同体系下系统总能和晶格常数. 研究表明, 稀土Y和Gd掺杂后ZnTe结构的稳定性均提高, 掺杂Y使ZnTe与CdTe的晶格匹配更好. 计算表明, 掺杂可使载流子发生简并, 掺Y比掺Gd电子有效质量小, 掺Y与掺Gd的载流子浓度数量级相同. 根据计算结果分析了稀土掺杂对ZnTe背接触层的影响. 关键词： ZnTe 稀土掺杂 第一性原理 太阳电池背接触层     

直流磁控溅射YBCO非晶薄膜的卢瑟福背散射研究

利用直流磁控溅射(D.C.Magnetron Sputtering)法,选取总气压为80Pa,沉积时间为60min,溅射靶尺寸为φ80,在磁场强度、靶与基片之间的距离及Ar/O₂比等参数变化的情况下,制备了四组YBCO/Al₂O₃非晶薄膜样品。用MeV Li卢瑟福背散射(RBS)分析技术,测量了各块样品中Ba和Cu相对Y的含量和薄膜厚度随基片的横向分布。分析结果表明:在不同的沉积条件下,薄膜中各点的Ba和Cu相对浓度差别较大,薄膜厚度分布也 关键词：     

退火温度对Cu:ZnO薄膜绿光发射的影响

利用溶胶-凝胶法在Si衬底上制备了不同退火温度的Cu:ZnO薄膜.利用X射线衍射(XRD)、X射线光电子能谱(XPS)、扫描电子显微镜和光致发光谱研究了样品的晶格结构、表面形貌、成分及其发光特性.结果表明:所有样品均具有高度的c轴择优取向,随着退火温度的升高,样品的结晶质量变好,样品的表面都被晶粒覆盖,强而稳定的绿光发射被观察到.绿光强度随退火温度的升高先增加后减小,发光中心位置不随退火温度的变化而改变,这样的绿光发射强而稳定.XRD和XPS结果表明,随退火温度的升高Cu2+还原为Cu+,导致Cu:ZnO薄膜形成的缺陷是VZn,所以绿光发射是由VZn引起的.Cu2+还原为Cu+时,Cu:ZnO薄膜中VZn浓度增加,使绿光发射强度增大.当退火温度超过800?C时,Cu2+的还原能力变差,绿光发射强度减弱.     

直流三极溅射法制备CuInS2 薄膜

采用直流三极溅射装置制备获得了CuInS₂薄膜, 其中溅射靶采用一定面积比的[Cu]/[In]混合靶,反应气体采用CS₂气体. 本文中主要研究了0.02 Pa分压反应气体条件下不同面积比的[Cu]/[In]混合靶和沉积基板温度对CuInS₂薄膜结构和成分的影响, 其中CuInS₂薄膜制备所用时间为2 h生长的厚度为1—2 μm. 通过对CuInS₂薄膜的EPMA, X射线衍射测试分析表明, 最佳的CuInS₂薄膜可在面积比[Cu]/[In]混合靶为1.4:1和可控温度(150, 250和350 ℃)的条件下制备获得, 并且其结构被确认为黄铜矿结构. 通过实验结果计算出CuInS₂薄膜层有约为8.9%的C杂质含量.     

(CdZnTe,ZnSeTe)/ZnTe复合量子阱中激子隧穿过程

设计了(CdZnTe,ZnSeTe)/ZnTe复合量子阱结构,并用吸收光谱、室温光致发光谱和飞秒脉冲抽运-探测方法研究了该复合结构中的激子隧穿过程.分别测量了该结构中CdZnTe/ZnTe量子阱层和ZnSeTe/ZnTe量子阱层中激子衰减时间.观察到从CdZnTe/ZnTe量子阱层向ZnSeTe/ZnTe量子阱层的快速激子隧穿,隧穿时间为5.5ps. 关键词： (CdZnTe ZnSeTe)/ZnTe复合量子阱 激子 隧穿 抽运-探测     

Effects of metal doping on the physical properties of ZnTe thin films

Zinc telluride (ZnTe) thin films were sublimated on a glass substrate using closed space sublimation (CSS) technique. ZnTe thin films of same thickness were tailored with copper (Cu) & silver (Ag) doping, considered for comparative study. X-ray diffraction (XRD) patterns of as-deposited ZnTe thin film and doped ZnTe samples exhibited polycrystalline behavior. The preferred orientation of (111) having cubic phase was observed. XRD patterns indicated that the crystallite size had increased after silver and copper immersion in as-deposited ZnTe thin films. Scanning electron microscopy (SEM) was used to observe the change of as-deposited and doped sample's grains sizes. EDX confirmed the presence of Cu and Ag in the ZnTe thin films after doping respectively. The optical studies showed the decreasing trend in energy band gap after Cu and Ag-doping. Transmission also decreased after doping. Resistivity of as-deposited ZnTe thin film was about 10⁶ Ω cm. The resistivity was reduced to 68.97 Ω cm after Cu immersion, and 10⁴ Ω cm after Ag immersion. Raman spectra were used to check the crystallinity of as-deposited, Cu and Ag-doped ZnTe thin film samples.     

The influence of substrate temperature on the morphology, optical and electrical properties of thermal-evaporated ZnTe Thin Films

The structural, morphological, optical and electrical properties of ZnTe films deposited by evaporation were investigated as a function of substrate temperature (at −123 and 27 °C) and post-deposition annealing temperature (at 200, 300 and 400 °C). It was determined that films deposited at both substrate temperatures were polycrystalline in nature with zinc-blende structure and a strong (1 1 1) texture. A small Te peak was detected in XRD spectra for both substrate temperatures, indicating that as-deposited ZnTe films were slightly rich in Te. Larger grains and a tighter grain size distribution were obtained with increased substrate temperature. Scanning electron microscopy (SEM) studies showed that the microstructures of the as-deposited films agreed well with the expectations from structure zone model. Post-deposition annealing induced further grain growth and tightened the grain size distribution. Annealing at 400 °C resulted in randomization in the texture of films deposited at both substrate temperatures. Optical spectroscopy results of the films indicated that the optical band gap value increased from 2.13 to 2.16 eV with increased substrate temperature. Increasing the annealing temperature sharpened the band-edge. Resistivity measurements showed that the resistivity of films deposited at substrate temperatures of −123 and 27 °C were 32 Ω cm, and 1.0 × 10⁴ Ω cm, respectively with corresponding carrier concentrations of 8.9 × 10¹⁵ cm⁻³ and 1.5 × 10¹⁴ cm⁻³. Annealing caused opposite changes in the film resistivity between the samples prepared at substrate temperatures of −123 and 27 °C.     

Microstructures and optical properties of Cu-doped ZnO films prepared by radio frequency reactive magnetron sputtering

Pure and Cu-doped ZnO (ZnO:Cu) thin films were deposited on glass substrates using radio frequency (RF) reactive magnetron sputtering. The effect of substrate temperature on the crystallization behavior and optical properties of the ZnO:Cu films have been studied. The crystal structures, surface morphology and optical properties of the films were systematically investigated by X-ray diffraction (XRD), scanning electron microscopy (SEM) and a fluorescence spectrophotometer, respectively. The results indicated that ZnO films showed a stronger preferred orientation toward the c-axis and a more uniform grain size after Cu-doping. As for ZnO:Cu films, the full width at half maxima (FWHM) of (0 0 2) diffraction peaks decreased first and then increased, reaching a minimum of about 0.42° at 350 °C and the compressive stress of ZnO:Cu decreased gradually with the increase of substrate temperature. The photoluminescence (PL) spectra measured at room temperature revealed two blue and two green emissions. Intense blue-green luminescence was obtained from the sample deposited at higher substrate temperature. Finally, we discussed the influence of annealing temperature on the structural and optical properties of ZnO:Cu films. The quality of ZnO:Cu film was markedly improved and the intensity of blue peak (∼485 nm) and green peak (∼527 nm) increased noticeably after annealing. The origin of these emissions was discussed.     

Cu/SiO2/Si(111)体系中Cu和Si的扩散及界面反应

室温下利用磁控溅射在p型Si(111)衬底上沉积了Cu薄膜. 利用X射线衍射和卢瑟福背散射分别对未退火以及在不同温度点退火后样品的结构进行了表征. 在此基础上，研究了Cu/SiO₂/Si(111)体系的扩散和界面反应. 实验结果表明：当退火温度高于450℃时出现明显的扩散现象，并且随着温度的升高，体系扩散现象会更加显著. 当退火温度低于450℃时没有铜硅化合物生成，当温度达到500℃时才有铜硅化合物生成. 关键词： 薄膜 扩散 界面反应 硅化物     

基片温度对磁控溅射HfO2薄膜结构和性能影响分析

在纯氧条件下,采用直流磁控溅射技术在单晶硅基片上沉积氧化铪（HfO2）薄膜,并研究了沉积过程中基片温度对薄膜结构和性能的影响规律。利用X射线衍射仪（XRD）和X射线能谱（XPS）表征了薄膜的晶体结构和组分,利用原子力显微镜（AFM）观察薄膜表面形貌,利用纳米力学测试系统表征了薄膜的纳米硬度和弹性模量。结果表明:磁控溅射制备的HfO2薄膜样品呈(111)择优生长,其晶粒尺寸随着基片温度的升高而增大,但其晶型并不发生转变。随着基片温度的增加,基片中的硅元素向薄膜内扩散,影响了薄膜的化学计量比。沉积薄膜的表面形貌和力学性能亦受到其结构和组分变化的影响。在200 ℃条件下制备的HfO2薄膜纯度高,O、Hf元素化学计量达到了1.99,其表面质量和力学性能均达到了最佳值,随着基片温度升高至300 ℃以上,薄膜纯度下降,表面质量和力学性能均产生劣化。     

Microstructural parameters and optical constants of ZnTe thin films with various thicknesses

Different thickness of polycrystalline ZnTe films have been deposited onto glass substrates at room temperature by vacuum evaporation technique. The structural characteristics studied by X-ray diffraction (XRD) showed that the films are polycrystalline and have a zinc blende (cubic) structure. The calculated microstructure parameters revealed that the crystallite size increases and microstrain decreases with increasing film thickness. The transmittance and reflectance have been measured at normal and near normal incidence, respectively, in the spectral range 400-2500 nm. For ZnTe films of different thicknesses, the dependence of absorption coefficient, α on the photon energy showed the occurrence of a direct transition with band gap energy (For ZnTe films of different thicknesses) confirming the independency of deduced energy gap on film thickness. The refractive indices have been evaluated in terms of envelope method, which has been suggested by Swanepoul in the transparent region. The refractive index could be extrapolated by Cauchy dispersion relationship over the whole spectra range, which extended from 400 to 2500 nm. It was observed that the refractive index, n increased upon increasing the film thickness up to 508 nm, lying within the experimental error for further increases in film thickness.     

Atomic diffusion in annealed Cu/SiO2/Si（100） system prepared by magnetron sputtering

Cu thin films are deposited on p-type Si (100) substrates by magnetron sputtering at room temperature. The inter-face reaction and atomic diffusion of Cu/SiO2/Si (100) systems are studied by x-ray diffraction (XRD) and Rutherford backscattering spectrometry (RBS). Some significant results can be obtained. The onset temperature of interdiffusion for Cu/SiO2/Si(100) is 350 C. With the annealing temperature increasing, the interdiffusion becomes more apparent. The calculated diffusion activation energy is about 0.91 eV. For the Cu/SiO2/Si (100) systems copper silicides are not formed below an annealing temperature of 350 C. The formation of the copper silicides phase is observed when the annealing temperature arrives at 450 C.