P2+和P+注入硅固相外延过程时间分辨的反射率研究

本文以时间分辨的反射率测量结合背散射和沟道分析、透射电子显微镜分析,比较和研究了在77K温度下180keV,1×10¹⁴/cm²P₂⁺和90KeV,2×10¹⁴/cm²P⁺注入硅于550℃退火时的固相外延过程。发现了P₂⁺,P⁺注入硅样品的固相外延过程具有不同的特征。这种差异是由于P₂⁺和P⁺在硅中引入不同的损伤造成的。P⁺注入的硅样品测量得到的时间分辨的反射谱是反常的。这种反常谱可用样品退火时从表面层到非晶硅层与从衬底到非晶硅层的双向外延的过程给出满意的解释。 关键词：     

磷分子离子(P_2~+)注入硅的损伤行为

本文研究了不同能量(5—600keV)和不同剂量(10~(14)-10~(16)atom/cm~2)下的P_2~+和P~+注入〈100〉单晶硅后的损伤及退火行为。实验结果表明,P_2~+注入所产生的损伤总是大于P~+注入所产生的损伤。由移位效率之比N_D~*(mol)/2N_D~*(atom)所表征的分子效应随入射能量的改变而变化并在100keV(P_2~+),50keV(P~+)处达到极大值。P_2~+与P~+注入的样品,退火后的载流子分布也有某些区别。我们认为,产生这些分子效应的基本原因是位移尖峰效应,但当入射离子的能量较高时,还应该考虑离子、靶原子之间的多体碰撞效应的贡献。     

BF2+注入多晶硅栅常规热退火氟迁移特性的二次离子质谱分析

借助二次离子质谱（SIMS）技术，深入地、系统地分析了80keV，2×10¹⁵ cm^-2BF₂⁺注入多晶硅栅在常规热退火条件下，F在多晶硅栅中的分布及迁移特性．F在多晶硅栅中的迁移，不但存在着扩散机制，而且还存在着发射和吸收机制，据此成功地解释了实验结果 关键词：     

Isospin-conserving hadronic decay of the Ds1(2460) into Dsπ+π-

The internal structure of the charm-strange mesons D_s0^*(2317) and D_s1(2460) are the subject of intensive studies.Their widths are small because they decay dominantly through isospinbreaking hadronic channels D_s0^*(2317)⁺→D_s⁺π⁰ and D_s1(2460)⁺→D_s^*+π⁰.The D_s1(2460) can also decay into the hadronic final states D_s⁺ππ...     

H1+,H2+,H3+和He,Ne,Ar碰撞过程中的巴耳末系Hα,Hβ,Hγ发射

实验利用TN-1710光学多道分析系统(OMA),对H₁⁺,H₂⁺,H₃⁺和He,Ne,Ar碰撞过程中产生的巴耳末系H_α,H_β,H_γ发射进行了测量,入射离子H₁⁺,H₂⁺,H₃⁺的 关键词：     

超冷铯分子0u+(6P3/2)长程态的高灵敏光缔合光谱研究

利用发展的调制俘获损耗荧光光谱技术实验测量了超冷铯分子0_u⁺(6P_3/2)长程态的高灵敏光缔合光谱. 光谱探测范围较国际已有报道扩大了60 cm^-1, 观察到25个长程区域新的振动能级. 通过LeRoy-Bernstein公式对振动束缚能数据进行拟合, 获得了超冷铯分子0_u⁺(6P_3/2)态的长程系数C₃ 为16.103±0.010. 构建了超冷铯分子0_u⁺(6P_3/2)态长程区域的势能曲线.     

自离子辐照对兆伏注P+硅中二次缺陷的影响

用平面透射电子显微术和剖面透射电子显微术以及卢瑟福背散射沟道谱技术研究了兆伏注P⁺硅中的二次缺陷以及自离子辐照对它们的影响.实验结果表明，二次缺陷峰的深度稍大于平均投影射程.实验还发现，用适当能量和剂量的自离子在退火之前辐照兆伏注P⁺硅样品，可以抑制二次缺陷的生成，但如果在退火之后辐照，则会得到相反效果.对此现象的物理原因进行了讨论.另外，还给出了Si⁺，P⁺在硅中形成二次缺陷带的临界剂量，并且对临界剂量与注入能量的关 关键词：     

N2微空心阴极放电特性及其阴极溅射的PIC/MC模拟

采用两维PIC/MCC模型模拟了氮气微空心阴极放电以及轰击离子 (N₂⁺,N⁺) 的钛阴极溅射. 主要计算了氮气微空心阴极放电离子 (N₂⁺,N⁺) 及溅射原子Ti的行为分布, 并研究了溅射Ti 原子的热化过程. 结果表明: 在模拟条件下, 空心阴极效应是负辉区叠加的电子震荡; 在对应条件下, 微空心较传统空心放电两种离子 (N₂⁺,N⁺) 密度均大两个量级, 两种离子的平均能量的分布及大小几乎相同; 在放电空间N⁺的密度约为N₂⁺的1/6, 最大能量约大2倍; 在不同参数 (P, T, V)下, 轰击阴极内表面的氮离子(N₂⁺,N⁺)的密度近似均匀, 其平均能量几乎相等; 从阴极溅射出的Ti原子的初始平均能量约6.8 eV, 离开阴极约0.15 mm处几乎完全被热化. 模拟结果为N₂微空心阴极放电等离子体特性的认识提供了参考依据. 关键词： 微空心阴极放电 PIC/MC模拟 2等离子体')" href="#">N₂等离子体     

Ca4LaNbMo4O20:Pr3+荧光粉的发光性质

采用高温固相法成功制备出荧光粉Ca₄LaNbMo₄O₂₀:Pr³⁺,通过X射线衍射分析了样品的结构,其结构与CaMoO₄结构相似。在Ca₄LaNbMo₄O₂₀:Pr³⁺的激发光谱中出现了NbO₄^3-和MoO₄^2-的电荷迁移(CTS)吸收和Pr³⁺离子的4f→4f5d激发跃迁,以及Pr³⁺-金属离子的价间电荷迁移(IVCT)吸收;另外在420~520 nm处,还观测到属于Pr³⁺离子的典型f-f激发跃迁。发射光谱中,在452 nm激发下,主要出现绿光和红光两种发射,其峰值位于490 nm和607 nm处,分别是Pr³⁺的³P₀→³H₄和¹D₂→³H₄的跃迁作用;在紫外287 nm激发下出现NbO₄^3-和MoO₄^2-发射和Pr³⁺离子的4f5d→4f跃迁宽带,以及Pr³⁺离子的4f→4f发射峰。     

用椭圆偏光法研究硅中砷离子注入的损伤和退火效应

我们用椭圆偏光法对As⁺离子注入Si的损伤和退火效应进行了测量。对As⁺注入能量为150keV、注入剂量为10¹⁶cm^-2的情况,测得的折射率分布呈现平台型,表明出现了非晶质层。在600—700℃间有一转变温度,高于此温度退火,可消除非晶质层。实验结果表明椭圆偏光法亦是测定辐射损伤的有用工具。 关键词：     

Defects formation in the dual B+ and N+ ions implanted silicon

Silicon wafers were implanted with 40 keV B⁺ ions (to doses of 1.2×10¹⁴ or 1.2×10¹⁵ cm^–2) and 50 or 100 keV N⁺ ions (to doses from 1.2×10¹⁴ to 1.2×10¹⁵ cm^–2). After implantations, the samples were furnace annealed at temperatures from 100 to 450 °C. The depth profiles of the radiation damages before and after annealing were obtained from random and channeled RBS spectra using standard procedures. Two damaged regions with different annealing behaviour were found for the silicon implanted with boron ions. Present investigations show that surface disordered layer conserves at the annealing temperatures up to 450 °C. The influence of preliminary boron implantation on the concentration of radiation defects created in subsequent nitrogen implantation was studied. It was shown that the annealing behaviour of the dual implanted silicon layers depends on the nitrogen implantation dose.The authors would like to thank the members of the INP accelerator staff for the help during the experiments. The work of two authors (V.H. and J.K.) was partially supported by the Internal Grant Agency of Academy of Science of Czech Republic under grant No. 14805.     

离子注入形成SOI结构的界面及埋层的俄歇能谱研究

本文中研究了O⁺(200keV,1.8×10¹⁸/cm²)和N⁺(190keV,1.8×10¹⁸/cm²)注入Si形成SOI(Silicon on Insulator)结构的界面及埋层的化学组成。俄歇能谱的测量和研究结果表明:注O⁺的SOI结构在经1300℃,5h退火后,其表层Si和氧化硅埋层的界面存在一个不饱和氧化硅状态,氧化硅埋层是由SiO₂相和这不饱和氧化硅态组成,而且氧化硅埋层和体硅界面不同于表层Si和氧化硅埋层界面;注N⁺的SOI结构在经1200℃,2h退火后,其氮化硅埋层中存在一个富N的疏松夹层,表层Si和氮化硅埋层界面与氮化硅埋层和体硅界面性质亦不同。这些结果与红外吸收和透射电子显微镜及离子背散射谱的分析结果相一致。还对两种SOI结构界面与埋层的不同特征的原因进行了分析讨论。 关键词：     

X射线衍射研究N2+注入Si

本文首先给出了180keV的N₂⁺注入Si的X射线衍射(XRD)分布,然后用Levenberg-Marquardt最优化方法模拟实验曲线。根据XRD运动学理论,在我们给出的试探胁变函数和多层模型的基础上,用自编程序计算给出了晶格胁变随注入深度、剂量和退火温度的变化。最后我们对实验和计算结果进行了初步的分析讨论。 关键词：     

钴离子注入对二氧化钛晶体的结构和光学性能的影响

采用离子注入法制备了钴离子掺杂的金红石相TiO₂样品;离子注入能量、注量分别为40 keV(1×10¹⁶cm^-2),80 keV(5×10¹⁵,1×10¹⁶,5×10¹⁶,1×10¹⁷cm^-2),120 keV(1×10¹⁶cm^-2). 通过XRD,XPS和UV-Vis等手段对掺杂前后样品的结构和光学性能进行了表征,分析了掺杂元素在金红石TiO₂中的存在形式. XRD测试表明随着注入能量的增加晶体的损伤程度增加. UV-Vis测试表明掺杂后所有样品在可见光区的吸收增强; 并且随着注量的增加,注量为5×10¹⁵cm^-2到5×10¹⁶cm^-2范围内注入样品的光学带隙逐渐变小. 关键词： 钴 二氧化钛 离子注入 掺杂     

Blue-cathodoluminescent layers synthesis by high-dose N, C and B SiO2 implantation

Thermal silicon oxide layers have been implanted at 600 °C with N⁺+C⁺, N⁺+B⁺ and N⁺+C⁺+B⁺ ions. Two different implantation doses have been chosen in order to introduce peak concentrations at the projected range comparable to the SiO₂ density. Some pieces of the samples have been annealed in conventional furnace at 1200 °C for 3 h. After annealing, cathodoluminescence measurements show in all cases a main broad band centered at 460 nm (2.7 eV). High doses of C implantation give rise to an intensity attenuation. Phases formed in the oxides have been investigated by Fourier transform infrared spectroscopy before and after annealing. The spectra suggest that N incorporates as BN and probably as a ternary BCN phase in the triply implanted samples, while C seems to bond mainly with B. Boron is also bonded to O in B-O-Si configuration. Depth structure and quantitative composition of the films were deduced from fittings of the spectroscopic ellipsometry measurements.     

Boron electrical activation in dual B+ + N+ + and B+ + Ar+ ion-implanted silicon

Silicon wafers were implanted with 40 keV B⁺ ions and then with 50 keV N⁺ or 100 keV Ar+ ions to doses from 1.2 x 1014 to 1.2 x 1015 cm^–2. The implanted samples were studied using the Hall effect and standard van der Pauw methods. The dependences of the sheet resistivity and the sheet concentration of charge carriers on the annealing temperature in the range from 700 to 1300 K were obtained. Models describing the influence of additional implantation of nitrogen and argon ions on the process of boron electrical activation during annealing are proposed.     

Effect of implantation temperature on the blistering behavior of hydrogen implanted GaN

GaN epitaxial layers were implanted by 100 keV H⁺ ions at different implantation temperatures (LN₂, RT and 300 °C) with a fluence of 2.5×10¹⁷ cm^?2. The implanted samples were characterized using Nomarski optical microscopy, AFM, XRD, and TEM. Topographical investigations of the implanted surface revealed the formation of surface blistering in the as-implanted samples at 300 °C and after annealing at higher temperature for the implantation at LN₂ and RT. The physical dimensions of the surface blisters/craters were dependent on the implantation temperature. XRD showed the dependence of damage-induced stress on the implantation temperature with higher stress for the implantation at 300 °C. TEM investigations revealed the formation of a damage band in all the cases. The damage band was filled with large area microcracks for the implantation at 300 °C, which were responsible for the as-implanted surface blistering.     

Mg+注入对GaN晶体辐射损伤的研究

在蓝宝石衬底上通过金属有机物化学气相沉积(metal-organic chemical vapor deposition，MOCVD)方法外延生长的GaN薄膜具有良好的结晶品质，χ_min达到2.00%. 结合卢瑟福背散射/沟道(Rutherford backscattering/channeling，RBS/C)和高分辨X射线衍射(high-resolution X-ray diffraction，HXRD)的实验测量，研究了不同剂量和不同角度Mg⁺注入GaN所造成的辐射损伤. 实验结果表明，随注入剂量的增大，晶体的辐射损伤也增大，注入剂量在1×10¹⁵atom/cm²以下，χ_min小于4.78%，1×10¹⁶atom/cm²是Mg⁺注入GaN的剂量阈值，超过这个阈值，结晶品质急剧变差，χ_min达到29.5%；随机注入比沟道注入的辐射损伤大，且在一定范围内随注入角度的增大，损伤也增大，在4×10¹⁵atom/cm²剂量下偏离〈0001〉沟道0°，4°，6°，9°时的χ_min(%)分别为6.28，8.46，10.06，10.85；经过700℃/10min+1050℃/20s两步退火和1000℃/30s高温快速退火后，晶体的辐射损伤都有一定程度的恢复，而且1000℃/30s高温快速退火的效果更好，晶体的辐射损伤可以得到更好的恢复. 关键词： GaN 卢瑟福被散射/沟道 高分辨X射线衍射 辐射损伤     

Nitrogen centers in GaP produced by hot implantation

Backscattering yields of 1.5 MeV?He⁺ ions and low temperature photoluminescence (PL) spectra were measured in GaP crystals implanted with 200 keV?N⁺ ions as functions of ion-dose, temperature during implantation and annealing temperature after implantation. Backscattering results indicate that hot implantation at 500°C greatly reduces radiation damage. The PL intensities of NN lines become maximum in the sample implanted with N⁺ ions of 3 × 10¹⁴cm^?2 at 500°C, and annealed at 1000°C for 1 hr with aluminum glass. The PL intensity is comparable to that of the nitrogen-doped sample during liquid phase epitaxy which is widely accepted as the best method of introducing nitrogen into GaP crystals. In the case of 500°C—hot implantation, the radiation damage produced during implantation is annealed out at 700 ~ 800°C and the implanted nitrogen substitutes for the phosphorous sites after annealing at 900 ~ 1000°C. Some kinds of defects or strains remain around the NN centers even in implanted samples with a maximum PL efficiency. These defects or strains don't seem to reduce the PL efficiency. In the case of room temperature implantation, PL efficiency decreases to one-hundredth or one-thousandth due to the formation of the non-crystalline state compared with hot implantation.