Theoretical and experimental investigations on rotary ultrasonic surface micro-machining of brittle materials

Many brittle materials, such as single-crystal materials, amorphous materials, and ceramics, are widely used in many industries such as the energy industry, aerospace industry, and biomedical industry. In recent years, there is an increasing demand for high-precision micro-machining of these brittle materials to produce precision functional parts. Traditional ultra-precision micro-machining can lead to workpiece cracking, low machined surface quality, and reduced tool life. To reduce and further solve these problems, a new micro-machining process is needed. As one of the nontraditional machining processes, rotary ultrasonic machining is an effective method to reduce the issues generated by traditional machining processes of brittle materials. Therefore, rotary ultrasonic micro-machining (RUμM) is investigated to conduct the surface micro-machining of brittle materials. Due to the small diameter cutting tool (<500 μm) and high accuracy requirements, the impact of input parameters in the rotary ultrasonic surface micro-machining (RUSμM) process on tool deformation and cutting quality is extremely different from that in rotary ultrasonic surface machining (RUSM) with relatively large diameter cutting tool (∼10 mm). Up till now, there is still no investigation on the effects of ultrasonic vibration (UV) and input variables (such as tool rotation speed and depth of cut) on cutting force and machined surface quality in RUSμM of brittle materials. To fill this knowledge gap, rotary ultrasonic surface micro-machining of the silicon wafer (one of the most versatile brittle materials) was conducted in this study. The effects of ultrasonic vibration, tool rotation speed, and depth of cut on tool trajectory, material removal rate (MRR), cutting force, cutting surface quality, and residual stress were investigated. Results show that the ultrasonic vibration could reduce the cutting force, improve the cutting surface quality, and suppress the residual compressive stress, especially under conditions with high tool rotation speed.     

Study of laser carving three-dimensional structures on ceramics: Quality controlling and mechanisms

Three-dimensional (3D) laser carving is a new, very flexible process and is very useful for machining the hard and/or brittle materials such as ceramics, carbide and hardened steel with high precision, excellent productivity and surface quality. In this paper, the effects of laser processing parameters on single-layer carving depth and surface quality are analyzed by laser carving on an Al₂O₃ ceramic with different processing parameters. The mechanisms of laser carving are also studied. A mathematical model of the relationship between the laser processing parameters and the laser carving depth is established, which is useful in obtaining the best machining parameters with the shortest time. Finally, a 3D pattern is successfully carved using the optimum parameters.     

Analysis the complex interaction among flexible nanoparticles and materials surface in the mechanical polishing process

Mechanical polishing (MP), being the important technique of realizing the surface planarization, has already been widely applied in the area of microelectronic manufacturing and computer manufacturing technology. The surface planarization in the MP is mainly realized by mechanical process which depended on the microdynamic behavior of nanoparticle. The complex multibody interaction among nanoparticles and materials surface is different from interaction in the macroscopic multibody system which makes the traditional classical materials machining theory cannot accurately uncover the mystery of the surface generation in the MP. Large-scale classical molecular dynamic (MD) simulation of interaction among nanoparticles and solid surface has been carried out to investigate the physical essence of surface planarization. The particles with small impact angle can generate more uniform global planarization surface but the materials removal rate is lower. The shear interaction between particle and substrate may induce large friction torque and lead to the rotation of particle. The translation plus rotation makes the nanoparticle behaved like micro-milling tool. The results show that the nanoparticles may aggregrate together and form larger cluster thus deteriorate surface the quality. This MD simulation results illuminate that the final planarized surface can only be acquired by synergic behavior of all particles using various means such as cutting, impacting, scratching, indentation and so on.     

A numerical study of residual stress induced in machined silicon surfaces by molecular dynamics simulation

Residual stresses in machined surface are regarded as a critical factor affecting the quality and service life of components. However, little research has been conducted to reveal the formation of residual stresses as well as the relation between machining conditions and residual stresses at the nanometric scale. In this study, residual stresses in machined surfaces of monocrystalline silicon are computed based on molecular dynamics simulation. An orthogonal machining configuration is adopted, and diamond cutting tools are used. The numerical approach developed is able to reveal stress evolution during and after machining, as well as in-depth residual stress distributions. The results indicate that the material stresses are stabilized within a manageable amount of computation time, and the in-depth normal stress along the tool moving direction has a more dynamical and significant pattern compared with other stress components. Meanwhile, the effects of depth of cut and tool rake angle are investigated. It is found that the increase of depth of cut results in the decrease of maximum tensile residual stress on the machined surfaces and the increase of maximum compressive residual stress underneath the surface. Similar observations are observed when the tool rake angle changes from positive to negative. It is believed that the more negative tool rake angles or the larger depths of cut induce a more drastic phase transformation to the machined surfaces, and this makes the in-depth residual stress distributions more compressive.     

切削参数对新型光学铝级金刚石车削刀具磨损的影响

光学器件和光学测量系统的关键部件主要通过超精密加工制造。铝合金具有很多优势,通常用于光子产业。光学领域对铝合金使用和需求的不断增加,促进了在铸造过程中采用快速凝固技术对铝合金等级重新改良的发展。优异的微观结构和改进的机械和物理性能是新型铝合金等级的特点。目前主要问题在于采用金刚石车削时,由于在切削性方面缺乏对铝合金性能的充分研究,导致机械加工数据库非常有限。本文通过改变金刚石的切削参数,测量切齿安装距超过4km时金刚石刀具的磨损,研究了快速凝固铝合金RSA 905的切削性能。改变的机械加工参数为切削速度、进给速度和切削深度。结果表明切削速度对金刚石刀具的磨损影响最大。主轴转速为500rpm、进给速度为25mm/min、切削深度为15μm时,刀具磨损达到最大值12.2μm;主轴转速为1750rpm、进给速度为5mm/min、切削深度为5μm时,刀具磨损达到最小值2.45μm。通常,较高的切削速度、较低的进给速度和较短的切削深度的组合可以减少金刚石刀具磨损。建立了模型统计以分析金刚石刀具磨损。通过该模型可以生成磨损图,从而确定切削参数产生最小磨损的区域。结果证明,快速凝固铝是更好的选择,为机械工程师使用这种材料提供了参考。     

Investigation of material removal mechanism of silicon wafer in the chemical mechanical polishing process using molecular dynamics simulation method

Chemical mechanical polishing (CMP) technology, being the mainstream technique of acquiring global planarization and nanometer level surface, has already become an attractive research item. In the case of CMP process, the indentation depth lies in the range of nanometer or sub-nanometer, huge hydrostatic pressure induced in the local deformation area which makes the material removal and surface generation process different from traditional manufacturing process. In order to investigate the physical essence of CMP technique, the authors carry out molecular dynamics (MD) analysis of chemical mechanical polishing of a silicon wafer. The simulation result shows that huge hydrostatic pressure is induced in the local area and leads to the silicon atom transform from the classical diamond structure (α silicon) to metal structure (β silicon). This important factor results in the ductile fracture of silicon and then in the acquisition of a super-smooth surface.     

电火花放电通道蚀除绝缘工程陶瓷的热力学特性研究

 研究开发出一种绝缘工程陶瓷电火花加工新技术,它是利用电火花放电通道流经绝缘工程陶瓷表面时产生的瞬时高温作用进行蚀除加工的。建立了电火花放电通道热蚀除加工绝缘工程陶瓷的温度场和热应力场数学模型,对绝缘工程陶瓷表面上的温度梯度和热应力场进行了数值模拟,给出了火花放电通道在绝缘工程陶瓷表面上形成的温度梯度和热应力分布规律。模拟结果为揭示绝缘工程陶瓷的电火花微观去除机理、预测绝缘工程陶瓷表面的微观形貌和电加工参数的选择等奠定了理论基础。     

超精抛光中边缘效应对材料去除量的影响

 传统环抛加工一般将工件整个包围在抛光盘内,加工之后虽然可以获得较好的工件表面,但是需耗费较多的时间,生产效率较低。针对这种情况,借助PPS快速抛光机床,依据Preston公式,对露出抛光盘的工件部分,即对所谓的边缘效应进行研究,用新的表面模型表示非线性压强分布,合理地避开了线性模型造成的压强负值问题。并且对工件材料去除量进行仿真计算,建立了新的去除模型,得出了偏心距、工件半径和抛光盘转速比值对材料去除量的影响。根据此模型,选择适当的偏心距和转速比对工件进行加工,可获得较好面型。     

基于非牛顿流体新型液浮法抛光技术研究

提出一种新的柔性抛光技术——液浮法抛光,通过软件仿真及实验对其进行探索性研究。针对抛光液为具有剪切增稠效应的流体,利用软件对该类液体的液浮法抛光技术模型进行流场分析,得到液浮抛光模型的流场压强、剪切力分布情况。仿真结果表明,液浮抛光技术对被加工件表面具有一定的剪切效果,可以实现对工件材料的去除。搭建实验平台,设计一组实验,其中配置以粒径12 nm的二氧化硅为溶质,分子量200的聚乙二醇为溶剂的非牛顿幂律流体作为抛光液的剪切增稠基液(其中二氧化硅质量分数为9 %),加入质量分数为18 %的氧化铈作为磨料的抛光液,对于初始粗糙度为23.97 nm的K9玻璃经过90 min的抛光,其粗糙度可达到1.023 nm,实验结果表明,该技术可用于光学元件的抛光加工。     

具有公自转运动模式的高效轮式抛光工具设计

为了提高光学加工效率,缩短大口径光学元件制造周期,本文提出了一种具有公自转运动模式的新型高效抛光方式,对其结构、工作原理以及去除特性进行了研究。首先,介绍了公自转抛光装置机械结构及工作原理。接着,根据Hertz接触理论和Preston方程进行了去除函数建模,讨论了不同转速比情况下的去除函数形状。然后,根据理论模型进行了去除函数实验、工艺参数实验以及稳定性实验,研究了压入深度、转速等工艺参数对去除结果的影响。最后,进行了200 mm口径SiC工件的仿真加工。实验结果表明:在2 mm压入深度、200 rpm转速情况下,去除区域直径为19.23 mm,体去除率达到0.197 mm~3/min,去除效率高于同等去除区域大小的传统小磨头加工方式;仿真加工结果表明:SiC仿真镜经过3.7 h加工,面形从3.008λPV,0.553λRMS提高到0.065λPV,0.005λRMS,收敛效率为达到98.18%。     

Effect of akermanite morphology on precipitation of bone-like apatite

Bioactivity in vivo of ceramic materials has been related to their surface micro-topography and may be estimated by means of simulated body fluid method in vitro. In order to investigate the effect of surface topographies of akermanite ceramics on bioactivity in vitro, akermanite ceramics were synthesized by sol-gel method and different surface topographies of disc-shaped akermanite ceramics were prepared by polishing with different SiC sandpapers. Atomic force microscopy (AFM) was used to evaluate the surface morphology and roughness. The bioactivity in vitro of ceramics with different surface states was evaluated by soaking the ceramics in simulated body fluid (SBF). And the samples after being soaked were characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD) and energy dispersive spectrometry (EDS). The results showed that the amounts of precipitated apatite on the ceramics with different surface roughness after being soaked in SBF were different and the bioactivity in vitro of ceramic with rough surface was significantly higher than that of ceramic with smooth surface. The study suggested that suitable surface roughness may improve the bioactivity in vitro of akermanite ceramics.     

光学元件亚表面缺陷的损伤性检测方法

在磨削、研磨和抛光加工过程中产生的微裂纹、划痕、残余应力等亚表面缺陷会导致熔石英元件抗激光损伤能力下降,如何快速、准确地检测亚表面损伤成为光学领域亟待解决的关键问题。采用HF酸蚀刻法、角度抛光法和磁流变斜面抛光法对熔石英元件在研磨加工中产生的亚表面缺陷形貌特征及损伤深度进行了检测和对比分析,结果表明,不同检测方法得到的亚表层损伤深度的检测结果存在一定差异,HF酸蚀刻法检测得到的亚表面损伤深度要比角度抛光法和磁流变斜面抛光法检测结果大一些。且采用的磨粒粒径越大,试件表面及亚表面的脆性断裂现象越严重,亚表面缺陷层深度越大。     

Models of nanoparticles movement,collision, and friction in chemical mechanical polishing (CMP)

Nanoparticles have been widely used in polishing slurry such as chemical mechanical polishing (CMP) process. The movement of nanoparticles in polishing slurry and the interaction between nanoparticles and solid surface are very important to obtain an atomic smooth surface in CMP process. Polishing slurry contains abrasive nanoparticles (with the size range of about 10–100 nm) and chemical reagents. Abrasive nanoparticles and hydrodynamic pressure are considered to cause the polishing effect. Nanoparticles behavior in the slurry with power-law viscosity shows great effect on the wafer surface in polishing process. CMP is now a standard process of integrated circuit manufacturing at nanoscale. Various models can dynamically predict the evolution of surface topography for any time point during CMP. To research, using a combination of individual nanoscale friction measurements for CMP of SiO₂, in an analytical model, to sum these effects, and the results scale CMP experiments, can guide the research and validate the model. CMP endpoint measurements, such as those from motor current traces, enable verification of model predictions, relating to friction and wear in CMP and surface topography evolution for different types of CMP processes and patterned chips. In this article, we explore models of the microscopic frictional force based on the surface topography and present both experimental and theoretical studies on the movement of nanoparticles in polishing slurry and collision between nanoparticles, as well as between the particles and solid surfaces in time of process CMP. Experimental results have proved that the nanoparticle size and slurry properties have great effects on the polishing results. The effects of the nanoparticle size and the slurry film thickness are also discussed.     

内凹面磁流变槽路抛光方法的研究

针对高陡度非球面光学元件的内凹面抛光难题,提出了一种内凹面磁流变槽路抛光方法。设计与待加工内凹面形状匹配的凸模,并在凸模上开出供磁流变液循环通过的槽路,当磁流变液经过设有磁场的区域时发生流变作用形成柔性抛光磨头对内凹面产生材料去除作用。通过工件的旋转和外部磁极的移动完成对整个内凹面的抛光加工。建立了实验平台并开展了相关初步实验和分析。结果表明该方法能够适应内凹面抛光加工的需要,可获得较高表面质量,具有一定的可行性和应用潜力。     

Removal of scratch on the surface of MgO single crystal substrate in chemical mechanical polishing process

Etching and chemical mechanical polishing (CMP) experiments of the MgO single crystal substrate with an artificial scratch on its surface are respectively performed with the developed polishing slurry mainly containing 2 vol.% phosphoric acid (H₃PO₄) and 10-20 nm colloidal silica particles, through observing the variations of the scratch topography on the substrate surface in experiments process, the mechanism and effect of removing scratch during etching and polishing are studied, some evaluating indexes for effect of removing scratch are presented. Finally, chemical mechanical polishing experiments of the MgO substrates after lapped are conducted by using different kinds of polishing pads, and influences of the polishing pad hardness on removal of the scratches on the MgO substrate surface are discussed.     

抛光垫磨损非均匀性研究

抛光垫是化学机械抛光的重要组成部分,其磨损的非均匀性对被加工工件面型精度和抛光垫修整有重要影响。基于直线摆动式抛光方式,研究了抛光过程中抛光垫与工件的相对运动,建立了抛光垫磨损模型,分析了抛光工艺参数对抛光垫磨损及均匀性的影响。研究结果表明,工件与抛光垫的转速比为1.11,正弦偏心直线摆动形式,摆动幅度系数为2,摆动频率系数在0.1~0.2之间,抛光垫表面磨损更均匀,并根据抛光垫表面磨损特性优化了抛光垫形状。优化的抛光垫具有更好的面型保持性,延长了修整间隔,为抛光工艺设计提供理论指导。     

Effect of the geometry of workpiece on polishing velocity in free annular polishing

Base on Coulomb friction model, the workpieces with different geometry rotating in free annular polishing are simulated. From simulation, the following conclusions are drawn. The angular velocity of workpiece is higher than that of polishing pad if the ring rotates uncontrolled in free annular polishing. The circular workpiece can synchronize with polishing pad through controlling the rotation of ring, which depends on the radii of ring and workpiece, the friction coefficients of polishing pad-workpiece and ring-workpiece,and the angular velocity of polishing pad. The workpiece with sharp corner cannot contact with the ring contiguously, which causes the contact state changing and the angular velocity of workpiece fluctuating ceaselessly, and this type of workpiece should be controlled with clamp to rotate synchronistically with the polishing pad.     

CFETR 1/32����һ��ӹ����ļ�������о�

The laser tracker is used to determine the locating data of the 1/32 vacuum vessel during its later machining on the machine tool platform. Firstly, the design coordinate system of the workpiece and the base points of assembly are determined by the laser tracker when the workpiece is clamped to the platform of machining tool. Secondly, an auxiliary standard block with XY, YZ, XZ three orthogonal planes features is machined outside the workpiece to establish the machine coordinate system. Then the workpiece and auxiliary standard block are measured simultaneously with the laser tracker to determine the relative positional relationship between the workpiece and the auxiliary standard block. Finally, the machine tool uses the auxiliary standard block as the locating data to complete the machining of the workpiece. Through this method, the machining work of two 1/32 vacuum vessels have been completed, and the machining accuracy is within the range of tolerance requirements, as illustrates the rationality and practicability of the method.     

Particle surface treatment for nanocomposites containing ceramic particles

Polymer matrix composites containing dispersed ceramic nanoparticles were formed by UV activated photopolymerization from the reactive liquid monomer hexanediol-diacrylate (HDODA). The polymer forming reaction proceeds by a free-radical mechanism. In forming polymer composites that contain nanoparticles, dispersing the particles as discrete entities is critical for developing optimum properties. In the as-received condition, ceramic particles are aggregated. They must be dispersed in the monomer but if the particles are not surface treated and stabilized, they rapidly settle out of the suspension. Surface modification of the ceramic allows the particles to be suspended in the organic monomer and stabilizes the dispersion so that the particles will not reagglomerate. In this study silanes were employed as surface modifiers to disperse two nano-particulate ceramics in the HDODA monomer. The ceramic particles used are silicon carbide (SiC) and barium titanate (BaTiO₃). The shapes and sizes of the ceramic particles were established using transmission electron microscopy (TEM). A method for dispersing nanoparticles was developed in which silane-treated particles were stabilized so that they did not settle out of the liquid monomer. An analytical method based on atomic force microscopy (AFM) was used to characterize the particle distribution in the cured composites. Focusing on work with SiC nanoparticles in HDODA as a model system, the process for silane application was advanced so that it successfully yielded composites having no aggregates with particle sizes closely matching those of the neat ceramic particles.     

CFETR1/32真空室机加工件的激光测量研究

在1/32真空室部件后期机加工时，采用激光跟踪仪对工件进行测量，从而解决了其在机床平台上定位基准的问题。在工件安放在机床平台后，首先通过测量拟合出工件的设计坐标系，确定其装配基准点；其次在工件外部加工出具备XY、YZ、XZ三正交平面特征的辅助标准块，建立机床坐标系；然后使用激光跟踪仪同时测量工件和辅助标准块，确定工件与辅助标准块的相对位置关系；最后机床以辅助标准块作为定位基准来完成工件的加工。使用该方法已完成两个1/32真空室部件的加工，并且加工精度在公差要求范围之内，验证了该方法的合理性和可操作性。