High-speed energy efficient selective removal of large area copper layer by laser induced delamination |
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Authors: | Bla? Kmetec Drago Kova?i? Boštjan Podobnik |
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Institution: | a LPKF Laser & Elektronika d.o.o., Polica 33, SI-4202 Naklo, Slovenia b University of Ljubljana, Faculty of Mechanical Engineering, Ašker?eva 6, SI-1000 Ljubljana, Slovenia |
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Abstract: | An indirect laser-induced method for selective removal of large copper areas from a printed circuit board is theoretically and experimentally investigated. The results show that the threshold condition for the process involves phase transition of the epoxy-based substrate resin. Optimal parameters for maximizing process speed are found and discussed. |
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Keywords: | 79 20 Ds 42 62 Cf 44 05 +e |
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