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High-speed energy efficient selective removal of large area copper layer by laser induced delamination
Authors:Bla? Kmetec  Drago Kova?i?  Boštjan Podobnik
Institution:a LPKF Laser & Elektronika d.o.o., Polica 33, SI-4202 Naklo, Slovenia
b University of Ljubljana, Faculty of Mechanical Engineering, Ašker?eva 6, SI-1000 Ljubljana, Slovenia
Abstract:An indirect laser-induced method for selective removal of large copper areas from a printed circuit board is theoretically and experimentally investigated. The results show that the threshold condition for the process involves phase transition of the epoxy-based substrate resin. Optimal parameters for maximizing process speed are found and discussed.
Keywords:79  20  Ds  42  62  Cf  44  05  +e
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