给定度序列图的覆盖成本和反向覆盖成本的研究

具有n个顶点且度序列为(m,2,…,2,1,…,1)(1的重数为m)的连通图不止一个(这些图均为树),而每个树对应唯一一个段序列(l₁,l₂,…,l_m).通过对任意一树移动最长段的悬挂点到最短段悬挂点的方式得到另一树,比较前后两树的覆盖成本和反向覆盖成本,给出了具有最小覆盖成本和反向覆盖成本的极树,并且进一步给出了取得最小覆盖成本和反向覆盖成本的顶点.     

白云石制备似立方体状方解石型碳酸钙晶体及其机理研究

以轻烧白云石粉、氯化铵和二氧化碳为原料,在未使用晶型控制剂的情况下,通过蒸氨-沉钙过程制备出了似立方体状碳酸钙。研究了反应温度、溶液中钙离子浓度、通气速率、搅拌速度以及陈化时间对碳酸钙中方解石相含量以及晶体形貌的影响,并探索了沉钙反应的晶型控制机理。结果表明,在反应温度40 ℃、钙离子浓度0.05 mol/L、通碳速率100 mL/min、搅拌速度400 r/min和陈化时间2 h的条件下,制备出形貌规整、粒径分布均匀的似立方体状碳酸钙,平均粒径为5~10 μm。该研究为提升白云石的使用价值、生产高附加价值的碳酸钙产品,以及提高白云石资源的利用率提供理论基础。     

Discussion of “Virtual age,is it real?”

In this note, some point of views on virtual ages are presented in terms of the discussion paper written by Finkelstein and Cha, which include generalized stochastic order‐based virtual ages, system‐level virtual ages, virtual ages in Weibull distribution and repair degrees with virtual ages. Finally, some possible future researches on virtual ages are described.     

The chromatic number of random Borsuk graphs

We study a model of random graph where vertices are n i.i.d. uniform random points on the unit sphere S^d in , and a pair of vertices is connected if the Euclidean distance between them is at least 2??. We are interested in the chromatic number of this graph as n tends to infinity. It is not too hard to see that if ?>0 is small and fixed, then the chromatic number is d+2 with high probability. We show that this holds even if ?→0 slowly enough. We quantify the rate at which ? can tend to zero and still have the same chromatic number. The proof depends on combining topological methods (namely the Lyusternik–Schnirelman–Borsuk theorem) with geometric probability arguments. The rate we obtain is best possible, up to a constant factor—if ?→0 faster than this, we show that the graph is (d+1)‐colorable with high probability.25     

Effect of Environment on the Scattering of Electrons by a Junction of Different Topological Materials

The studies of electron transport through a junction of topological materials in the literature so far ignore the coupling of a topological material to its surrounding environment. Here, the dynamics of an open system through a stochastic Hamiltonian are simulated to investigate the influence of the environment on the scattering of electrons by a junction of different topological materials, such as a Dirac–Weyl magnetic junction and a topological insulator. It is found that, although the detrimental effect of the environment is inevitable, the Landauer conductance can be enhanced via adjusting the system–environment coupling strength. This result supplies the possibilty of changing the transport feature of topological materials by modulating the surrounded environment. It is also demonstrated that a non-Hermitian Hamiltonian can be used to replace the stochastic Hamiltonian for this study, when the system and the environment coupling are weak.     

Prediction of branch on branch and topological characteristics of low‐density polyethylene polymerization by a novel stochastic approach

A novel approach using Monte Carlo method applied to simulation of low‐density polyethylene (LDPE) polymerization in tubular reactor showing topological characteristics, and the comprehensive kinetic mechanism has been taken into consideration. The results show the precise details of the structure of a chain in the three levels of the backbone, the main branches, and branches on branch. The chain types include dead polymer, dead polymer with unsaturated end, and live polymer with primary radical, secondary radical, and tertiary radical. In this work, the branches on branch were identified in terms of number, length, and position of the branch. Sixty percent of branches on branch are 1 to 5 carbons long, and the longest branch on branch is about 50 carbons. Thus, this study provides a tool for more accurately mapping the polymer chains architecture, superior to determine the number, and position of long‐ and short‐chain branches in past researches. Finally, this approach will advance the prediction of microstructure‐related properties of polymer one step further.