金刚石衬底上GaN HEMT沟道温度建模:各向异性且非均匀热导率的影响

为了改善GaN HEMT的自热效应,集成高热导率的金刚石衬底有助于增强器件有源区的热量耗散。然而,化学气相淀积(CVD)生长的多晶金刚石(PCD)具有柱状晶粒结构,导致了各向异性的材料热导率,且其热导率值与生长厚度有关。为此,通过建模金刚石生长过程中晶粒尺寸的演变过程,计算了金刚石沿面内和截面方向的热导率。基于该PCD热导率模型,利用计入材料非线性热导率的GaN器件热阻解析模型,计算得到了GaN HEMT沟道温度的波动范围,并分析了其与器件结构(栅长、栅宽、栅间距、衬底厚度)和功耗的依赖关系。最后,通过与有限元(FEM)仿真结果对比,分区域提取了GaN HEMT器件中PCD衬底的有效热导率,分别为260~310 W/(m·K)和1 250~1 450 W/(m·K)。本文的计算为预测金刚石衬底上GaN HEMT器件的沟道温度提供了快速、有效的方法。     

Environmentally Stable Polymer Gels with Super Deformability and High Recoverability Enhanced by Sub‐5 nm Particles in the Nonvolatile Solvent

It remains challenging to satisfy the combined performances for hydrogels with excellent mechanical behavior, high deformability, and super recoverability under harsh environmental conditions. In this study, we first established a strong polymer network via the crosslinking of polymer chains on the surfaces of sub‐5‐nm calcium hydroxide nanospherulites in ethylene glycol solvent. The organic gel expressed excellent mechanical properties such as a recoverable compressive engineering stress of 249 MPa and an elongation stress of 402 KPa, which was attributed to the uniform nanosized crosslinking structure as characterized by SEM. Moreover, the nonvolatile solvent remained in the gel, meaning that the sample can resist a wide temperature range of ?56 to 100 °C without losing the elastic properties. This novel organic gel could provide promising routes to develop the ideal elastic carriers for wearable devices, smart skin sensors, and damping materials. © 2019 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2019 , 57, 713–721     

Biological and catalytic evaluation of Ru(II)‐p‐cymene complexes of Schiff base ligands: Impact of ligand appended moiety on photo‐induced DNA and protein cleavage,cytotoxicity and C‐H activation

Two organometallic Ru(II)‐p‐cymene complexes of the type [Ru(η⁶‐p‐cymene)(L)Cl]PF₆ 1 and 2 , where L is N,N‐bis(4‐isopropylbenzylidene)ethane‐1,2‐diamine (bien, L1 ) or N,N‐bis (pyren‐2‐ylmethylene)ethane‐1,2‐diamine (bpen, L2 ) have been prepared and characterized well. Because of appended pyrenyl groups in coordinated bpen ligand, the complex 2 exhibits higher DNA and protein binding than complex 1 in which isopropylbenzyl groups are incorporated. Interestingly, the luminescent characteristic complex 2 is unique in displaying DNA cleavage after light activation by UVA light at 365 nm through oxygen dependent mechanism. AFM analysis attests the photo‐induced DNA fragmentation ability of complex 2 . Also, the complex 2 cleaves the protein after light exposure in a non‐specific manner suggesting that it can act as a protein photo cleaving agent. In contrast to the trend of DNA and protein interaction of complexes, the complex 1 exhibits cytotoxic activity against human breast carcinoma ( MCF‐7 ) and liver carcinoma ( HepG2 ) with potency higher than that of complex 2 due to enhanced hydrophobicity of isopropyl groups present in p‐cymene and bien ligands. Indeed, complex 2 is inactive against MCF‐7 and HepG2 cancer cell lines even up to 200 μM concentration. The AO/EB staining assay reveals that the complex 1 is able to induce late apoptotic mode of cell death in breast cancer cells, which is further confirmed by inter‐nucleosomal DNA cleavage. Furthermore, the complexes 1 and 2 are evaluated for their catalytic activities and found to be working well for the β‐carboline directed C–H arylation to afford the desired products in good yield (40–47%).     

A conjugated alkyne functional bicyclic polybenzoxazine with superior heat resistance

A difunctional benzoxazine (coPh‐apa) with a conjugated alkyne group is synthesized by the oxidative coupling reaction from a monocycle‐benzoxazine (Ph‐apa) containing an alkyne group. A model compound, 1,4‐diphenylbutadiyne (coPa), is used to study the curing reaction process of coPh‐apa by DSC, Fourier transform infrared spectroscopy, and ¹³C NMR, and the results suggest that the conjugated alkyne groups are involved in the crosslinking reaction via the trimerization reaction of the conjugated alkynyl groups and the Diels–Alder reaction. Furthermore, thermal properties of the polybenzoxazine are studied by dynamic thermomechanical analysis and thermogravimetric analysis. A glass‐transition temperature (T_gs) of as high as 412 °C and a char yield of 75.6% at 800 °C under nitrogen are obtained with the aid of the conjugated alkyne groups. Its excellent heat resistance dominates most thermosetting resins and will serve for heat shields. © 2019 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2019, 57, 1587–1592     

大尺寸电阻加热式碳化硅晶体生长热场设计与优化

大尺寸低缺陷碳化硅(SiC)单晶体是功率器件和射频(RF)器件的重要基础材料,物理气相传输(physical vapor transport, PVT)法是目前生长大尺寸SiC单晶体的主要方法。获得大尺寸高品质晶体的核心是通过调节组分、温度、压力实现气相组分在晶体生长界面均匀定向结晶,同时尽可能减小晶体的热应力。本文对电阻加热式8英寸(1英寸=2.54 cm)碳化硅大尺寸晶体生长系统展开热场设计研究。首先建立描述碳化硅原料受热分解热质输运及其多孔结构演变、系统热输运的物理和数学模型,进而使用数值模拟方法研究加热器位置、加热器功率和辐射孔径对温度分布的影响及其规律,并优化热场结构。数值模拟结果显示,通过优化散热孔形状、保温棉的结构等设计参数,电阻加热式大尺寸晶体生长系统在晶锭厚度变化、多孔介质原料消耗的情况下均能达到较低的晶体横向温度梯度和较高的纵向温度梯度。     

正电子冲击下氦电离三重微分截面的理论计算

我们发展了一种正电子碰撞原子电离的畸变波Born近似方法， 在这个方法中，正负电子偶素通道通过一个ab initio的光学势附加到入射粒子和靶的相互作用势上，且通道对电离作用被第一次被考虑在正电子碰撞原子电离的过程中. 应用这个方法计算了在50 eV入射能量范围氦的电离的三重微分截面，计算结果和实验数据很好的符合.     

Influence of thermal and UV treatment on the polypropylene/graphite composite

Electrically conductive polypropylene/graphite (PP/graphite) composites were prepared via blending granulated PP with maleic anhydride grafted PP and natural graphite. Electrical conductivity of prepared samples containing either 65, 70, or 75 wt% of graphite was measured and the most conductive sample containing 75 wt% of graphite was exposed to UV irradiation for 1 and 24 h or thermally treated at 170 °C for 1 h. The influence of thermal and UV exposure on the structural and electrical changes in such treated samples was studied. Local current measurements on the surface were made using scanning spreading resistance microscopy and morphology of the surface was studied by atomic force microscopy. X-ray diffraction analysis, infrared and Raman spectroscopy were also used for the structural characterization. Properties of treated and untreated samples are compared and differences are discussed.     

不同抗凝比例对凝血四项检测结果的影响

目的观察并分析凝血四项检测结果与不同比例下的全血与抗凝剂之间的关系。方法研究对象取2015年6月来湖北省宜昌市第二人民医院参加体检的110例健康人员,抽取全血血液样本后按照不同比例与抗凝剂混匀,常规分离血浆并测定受试者凝血酶时间(TT)、凝血酶原时间(PT)、激活部分促凝血酶原激酶时间(APTT)以及纤维蛋白原(FIB),并对研究结果相关数据作统计学处理。结果当血液量与抗凝剂比例为1∶5时,标本TT、PT、APTT以及FIB各项指标较1∶9时差异显著而具有统计学意义(P0.05);抗凝比例1∶7的情况下,TT指标差异与1∶9抗凝比例标本相比差异具有统计学意义(P0.05),而PT、FIB以及APTT三项指标差异并无统计学意义(P0.05);抗凝比例为1∶11与1∶13的情况下,TT指标与1∶9抗凝比例标本相比差异具有统计学意义(P0.05),而PT、FIB以及APTT三项指标差异并无统计学意义(P0.05)。结论凝血四项检测工作中,标本质量检测控制最关键的环节在于准确采集血液量,倘若采集血量过多或过少,导致与抗凝剂比例失调往往会影响测定结果准确性,检验科工作人员应予以重视。     

基于拉曼热测量技术的铜基复合物法兰GaN基晶体管的热阻分析

采用拉曼热测量技术结合有限元热仿真模型,分析比较新型铜/石墨复合物法兰封装与传统铜钼法兰封装的GaN器件的结温与热阻,发现前者的整体热阻比铜钼法兰器件的整体热阻低18.7%,器件内部各层材料的温度分布显示铜/石墨复合物法兰在器件中的热阻占比相比铜钼法兰在器件中的热阻占比低13%,这证明使用高热导率铜/石墨复合物法兰封装提高GaN器件热扩散性能的有效性.通过对两种GaN器件热阻占比的测量与分析,发现除了封装法兰以外,热阻占比最高的是GaN外延与衬底材料之间的界面热阻,降低界面热阻是进一步提高器件热性能的关键.同时,详细阐述了使用拉曼光热技术测量GaN器件结温和热阻的原理和过程,展示了拉曼光热技术作为一种GaN器件热特性表征方法的有效性.     

Metastable states in high carbon C–(Fe,Ni, Co) films obtained by three-electrode ion-plasma sputtering

Abstract

The effect of ion-plasma deposition on the structure of high-carbon films (at. %) Fe–(20–84) % С, Co–(5–52) % С, Ni–(7–61) % С was investigated. The lattice periods and crystallite sizes of nonequilibrium phases in the as-deposited state and after heating are determined. The temperatures of the beginning and end of the decay of metastable phases during heating at a constant speed are established. The transition from an amorphous to an equilibrium crystalline state in Fe–C films passes through the stage of formation and subsequent decomposition of an intermediate, metastable hcp phase of variable composition. The electrical and hysteretic magnetic properties of the films were measured in the as-deposited state and after heat treatment. The compositions and conditions for producing films with low values of the temperature coefficient of electrical resistance and high coercive force are established. Thus, high-carbon films of Ni–61% C in the as-depoteted state and Fe–69% C films after heating to 900?K are characterized by small TCR values (± 10^?6 К^?1) over a wide temperature range.