Fabrication and characterization of the normally-off N-channel lateral 4H–SiC metal–oxide–semiconductor field-effect transistors

In this paper, the normally-off N-channel lateral 4H–Si C metal–oxide–semiconductor field-effect transistors(MOSFFETs) have been fabricated and characterized. A sandwich-(nitridation–oxidation–nitridation) type process was used to grow the gate dielectric film to obtain high channel mobility. The interface properties of 4H–Si C/SiO_2 were examined by the measurement of HF I–V, G–V, and C–V over a range of frequencies. The ideal C–V curve with little hysteresis and the frequency dispersion were observed. As a result, the interface state density near the conduction band edge of 4H–Si C was reduced to 2 × 10~(11) e V~(-1)·cm~(-2), the breakdown field of the grown oxides was about 9.8 MV/cm, the median peak fieldeffect mobility is about 32.5 cm~2·V~(-1)·s~(-1), and the maximum peak field-effect mobility of 38 cm~2·V~(-1)·s~(-1) was achieved in fabricated lateral 4H–Si C MOSFFETs.     

Atomic-layer-deposited Al_2O_3 and HfO_2 on InAlAs: A comparative study of interfacial and electrical characteristics

Al_2O_3 and HfO_2 thin films are separately deposited on n-type InAlAs epitaxial layers by using atomic layer deposition(ALD).The interfacial properties are revealed by angle-resolved x-ray photoelectron spectroscopy(AR-XPS).It is demonstrated that the Al_2O_3 layer can reduce interfacial oxidation and trap charge formation.The gate leakage current densities are 1.37×10~6 A/cm~2 and 3.22×10~6 A/cm~2 at+1V for the Al_2O_3/InAlAs and HfO_2/InAlAs MOS capacitors respectively.Compared with the HfO_2/InAlAs metal-oxide-semiconductor(MOS) capacitor,the Al_2O_3/InAlAS MOS capacitor exhibits good electrical properties in reducing gate leakage current,narrowing down the hysteresis loop,shrinking stretch-out of the C-V characteristics,and significantly reducing the oxide trapped charge(Q_(ot)) value and the interface state density(D_(it)).     

A quantum explanation of the magnetic properties of Mn-doped graphene

Mn-doped graphene is investigated using first-principles calculations based on the density functional theory(DFT).The magnetic moment is calculated for systems of various sizes,and the atomic populations and the density of states(DOS)are analyzed in detail.It is found that Mn doped graphene-based diluted magnetic semiconductors(DMS)have strong ferromagnetic properties,the impurity concentration influences the value of the magnetic moment,and the magnetic moment of the 8×8 supercell is greatest for a single impurity.The graphene containing two Mn atoms together is more stable in the 7×7 supercell.The analysis of the total DOS and partial density of states(PDOS)indicates that the magnetic properties of doped graphene originate from the p–d exchange,and the magnetism is given a simple quantum explanation using the Ruderman–Kittel–Kasuya–Yosida(RKKY)exchange theory.     

考虑剪切变形的半刚性连接钢框架P-Δ效应研究

在综合考虑剪切变形和梁柱节点连接半刚性影响的基础上,给出了框架柱的抗侧移刚度公式。当不考虑剪切变形时对本文给出的公式进行简化可得到相关文献中的公式,但本文给出公式的应用范围更广。数值算例表明:剪切变形对框架结构的P-Δ效应影响显著,与不考虑剪切变形相比,考虑剪切变形的影响所计算的层间侧移的差值已超出工程上可接受的5%的误差范围;剪切变形降低了结构的抗侧移刚度,增大了层间侧移值,应引起高度的重视。本文所编制的计算表格不仅可供工程设计人员用于前期方案阶段的估算,而且可作为对平、立面均规则的钢框架结构电算结果的校核程序使用。     

Effect of substrate doping on the flatband and threshold voltages of strained-Si pMOSFET

The effect of substrate doping on the flatband and threshold voltages of strained-Si/SiGe p metal-oxide semiconductor field-effect transistor (pMOSFET) has been studied. By physically deriving the models of the flatband and threshold voltages, which have been validated by numerical simulation and experimental data, the shift in the plateau from the inversion region to the accumulation region as the substrate doping increases has been explained. The proposed model can provide valuable reference to the designers of strained-Si devices and has been implemented in software for extracting the parameters of strained-Si MOSFET.     

Simulation study of a mixed terminal structure for 4H-SiC merged PiN/Schottky diode

In this paper, a mixed terminal structure for the 4H-SiC merged PiN/Schottky diode (MPS) is investigated, which is a combination of a field plate, a junction termination extension and floating limiting rings. Optimization is performed on the terminal structure by using the ISE-TCAD. Further analysis shows that this structure can greatly reduce the sensitivity of the breakdown voltage to the doping concentration and can effectively suppress the effect of the interface charge compared with the structure of the junction termination extension. At the same time, the 4H-SiC MPS with this termination structure can reach a high and stable breakdown voltage.     

Study of a double epi-layers SiC junction barrier Schottky rectifiers embedded P layer in the drift region

<正>This paper proposes a double epi-layers 4H—SiC junction barrier Schottky rectifier(JBSR) with embedded P layer (EPL) in the drift region.The structure is characterized by the P-type layer formed in the n-type drift layer by epitaxial overgrowth process.The electric field and potential distribution are changed due to the buried P-layer,resulting in a high breakdown voltage(BV) and low specific on-resistance(R_(on,sp)).The influences of device parameters,such as the depth of the embedded P+ regions,the space between them and the doping concentration of the drift region,etc.,on BV and R_(on,sp) are investigated by simulations,which provides a particularly useful guideline for the optimal design of the device.The results indicate that BV is increased by 48.5%and Baliga's figure of merit(BFOM) is increased by 67.9%compared to a conventional 4H-SiC JBSR.     

基于碳化硅等离子体器件的功率脉冲锐化技术

利用Sentaurus搭建了碳化硅漂移阶跃恢复二极管（DSRD）与雪崩整形二极管（DAS）全电路仿真模型,研究了碳化硅等离子体器件在脉冲锐化方面的能力,并且通过器件内部等离子浓度分布解释了这两种器件实现脉冲锐化的机制。借助碳化硅DSRD可以将峰值超过千伏的电压脉冲的前沿缩短到300 ps;碳化硅DSRD与DAS的组合可以输出脉冲前沿在35 ps、峰值超过2 kV的电压脉冲。仿真与实验发现当触发脉冲与碳化硅DAS匹配时,可以实现快速开启后快速关断,得益于碳化硅DAS这种神奇现象,可以将峰值在两千伏以上脉冲的半高宽缩小到百皮秒量级;通过频谱分析发现脉冲经过DAS整形后,其最高幅值-30 dB对应的频谱带宽扩大了37倍,达到7.4 GHz。     

Temperature dependence on the electrical and physical performance of InAs/AlSb heterojunction and high electron mobility transistors

In this report, the effect of temperature on the In As/Al Sb heterojunction and high-electron-mobility transistors(HEMTs) with a gate length of 2 μm are discussed comprehensively. The results indicate that device performance is greatly improved at cryogenic temperatures. It is also observed that the device performance at 90 K is significantly improved with 27% lower gate leakage current, 12% higher maximum drain current, and 22.5% higher peak transconductance compared to 300 K. The temperature dependence of mobility and the two-dimensional electron gas concentration in the In As/Al Sb heterojunction for the temperature range 90 K-300 K is also investigated. The electron mobility at 90 K(42560 cm2/V·s)is 2.5 times higher than its value at 300 K(16911 cm~2/V·s) because of the weaker lattice vibration and the impurity ionization at cryogenic temperatures, which corresponds to a reduced scattering rate and higher mobility. We also noted that the two-dimensional electron gas concentration decreases slightly from 1.99 × 10~(12) cm~(-2) at 300 K to 1.7 × 10~(12) cm~(-2) at 90 K with a decrease in temperature due to the lower ionization at cryogenic temperature and the nearly constant ?Ec.     

SiC肖特基源漏MOSFET的阈值电压

SiC肖特基源漏MOSFET的阈值电压不同于传统的MOSFET的阈值电压.在深入分析工作机理的基础上,利用二维模拟软件ISE提取并分析了器件的阈值电压.对SiC肖特基源漏MOSFET的阈值电压给出物理描述,得出当源极载流子主要以场发射方式进入沟道,同时沟道进入强反型状态,此时的栅电压是该器件的阈值电压. 关键词： 碳化硅 肖特基接触 阈值电压