MeV能量的重离子辐照GaN的HRXRD研究

分别进行了2.3 MeV20 Ne8+ 离子和5.0 MeV84 Kr19+ 离子辐照GaN样品的实验, 并对实验样品进行了HRXRD的分析。结果发现, 随着这两种离子辐照剂量的增大, GaN的HRXRD谱（0002）衍射峰的峰位出现了向小角侧有规律的移动, 并在较高剂量时衍射峰发生分裂。同时, 对衍射峰的峰位的移动和峰形的变化等现象反映的辐照损伤机制进行了研究, 并探讨了电子能损与核能损各自在晶格损伤中的作用。Irradiation experiments of gallium nitride (GaN) with 2.3 MeV20 Ne8+ and 5.0 MeV84 Kr19+ respectively were performed. The irradiated samples were analyzed using the high\|resolution X\|ray diffraction (HRXRD) spectrometry. It was found that the diffraction peak of GaN (0001) exhibited regular shift to smaller diffraction angles with the increase of ion fluence for the both ions, and the diffraction peak split into a few sub\|peaks at higher irradiation dose. Underlying mechanisms of the observed peak shift and split were investigated, the contributions of different energy losses to the damage accumulation in the irradiated GaN were discussed.     

重离子辐照SiO2通过能量损失产生发光色心的研究

通过红外光谱和荧光发射光谱分别对600 keV、4 MeV和5 MeV Kr离子辐照的SiO2进行发光特性的研究。在低能量辐照体系中,简单色心(F2色心)的形成在损伤过程中占据主导地位,其主要诱发蓝光发射带;在高能离子辐照条件下,离子径迹上的能量密度较大,因此缺陷浓度的增大产生了一些缺陷团簇和离子径迹,形成了复杂的色心(F2+和F3+色心等)并诱发了强烈的绿光发射带和红光发射带。该实验结果与能量损失过程中统一热峰理论模型(一个综合的基于电子能损与核能损的非弹性碰撞模型和弹性碰撞模型)的模拟结果能够很好地吻合,表明在keV～MeV能区上存在电子能损过程与核能损过程的协同效应。     

低速高电荷态重离子辐照的GaN晶体表面X射线光电子能谱研究

利用低速高电荷态Xeq+和Pbq+离子对在蓝宝石衬底上生长的GaN晶体膜样品进行辐照,并利用X射线光电子能谱(XPS)对样品表面化学组成和元素化合态进行了分析.结果表明,高电荷态离子对样品表面有显著的刻蚀作用;经高电荷态离子辐照的GaN样品表面氮元素贫乏而镓元素富集;随着入射离子剂量和所携带电荷数的增大,Ga—Ga键相对含量增大;辐照后,GaN样品中Ga—Ga键对应的Ga3d5/2电子的束缚能偏小,晶格损伤使内层轨道电子束缚能向低端方向偏移.     

载能离子辐照的ODS铁素体钢硬化效应的研究

研究了氧化物弥散强化(ODS) 的3 种铁素体钢,包括: 19Cr-3.5Al ODS钢(MA956),16Cr-0.1TiODS和16Cr-0.1Zr ODS铁素体钢,在多能量的氦离子和MeV能量级的Bi、Xe 离子辐照条件下的硬化效应。获得了辐照硬化与原子离位损伤水平(dpa)、He 注入浓度的关系。结果表明,材料的硬度在低剂量范围会随着辐照剂量迅速增加,而在高剂量范围材料的硬度逐渐趋于饱和,可以用1/2 次的幂函数拟合辐照硬化与离位损伤水平之间的关系。不同入射离子——Bi离子和Xe离子都会引起ODS 钢的硬化,而氦离子还会在材料中聚集导致氦泡的形成,造成更加明显的硬化。实验证明,Ti 或Zr 掺杂的16Cr-ODS 铁素体钢较19Cr-3.5AlODS钢具有更强的抗辐照硬化能力,原因可归于其含有更高数密度的细小氧化物粒子——能够有效俘获点缺陷和氦原子,从而有效抑制晶粒内部和晶界出缺陷的长大。The present work investigates the irradiation hardening of ODS ferritic steels after multi-energy Heion implantation, or energetic Bi-ion and Xe-ion irradiation, to get an understanding of dependence of irradiationhardening on atomic displacement damage and gas accumulation. Three kinds of high-Cr ODS ferritic steels including the commercial MA956 (19Cr-3.5Al), the 16Cr-0.1Ti and the 16Cr-0.1Zr ODS ferritic steels were used.The results show that the hardness increases rapidly at the lower doses but tends to saturate at the higher dose.An 1/2-power law dependence on dpa value is obtained. Helium implantation contributes significantly to the irradiation hardening, possibly due to the impediment of the motion dislocations by helium bubbles. 16Cr-ODS (Ti or Zr added) ferritic which contains finer oxide particles in higher number density shows higher resistance to irradiation hardening than the MA056.     

Kr离子注入SiC的拉曼光谱研究

应用拉曼光谱研究了5 MeV Kr离子（注量分别为5×1013,2×1014,1×1015 ions/cm2）室温注入6H SiC单晶及其高温退火处理后结构的变化。 研究表明, 注入样品的拉曼光谱中不仅出现了Si—C振动的散射峰, 还产生了同核Si—Si键和C—C键散射峰。 Si—C散射峰强度随退火温度升高而增强, 当退火温度高达1000 ℃时, 已接近未辐照SiC的散射峰强度。晶体Si—Si键散射峰强度随退火温度变化不大, 而非晶Si—Si键散射峰强度随退火温度的增加逐渐消失。相对拉曼强度（Relative Raman Intensity, 简称RRI）随注量的增加逐渐减小并趋于饱和, 且不同退火温度样品的饱和注量不相同; RRI随退火温度的增加逐渐升高, 这在低注量样品中表现得尤为明显。 低、中、高3种注量样品的RRI随退火温度的增加从重合逐渐分离, 并且退火温度越高, 分离越大。 Raman spectroscopy was used to study the structure changes of 6H SiC single crystal implanted with 5 MeV Kr (Krypton) at room temperature and subsequently annealed at high temperature. The Raman spectrum of the implanted SiC displays not only Si—C bonds vibration peaks, but also homonuclear Si—Si and C—C bond vibration peaks. Si—C bond vibration peaks gradually strengthen with increasing temperature. When annealing at 1000 ℃, the peak intensity of Raman spectrum is close to that of virgin specimen. It is found that crystal Si—Si bond vibration peaks do not change when annealing, but amorphous Si—Si bond vibration peaks disappear with increasing annealing temperature. The Relative Raman Intensity (RRI) values decrease with increasing fluence and tend to saturate, but the saturation fluences is different for various anneal temperature. The RRI values increases with raising annealing temperature, which is more obvious in low implanted specimens. At the same time, the RRI values separate gradually with increasing temperature and this phenomenon is strengthened by annealing temperature.     

高能重离子辐照的低活化钢硬化效应

为了探讨聚变堆候选低活化钢的抗辐照性能,在兰州重离子加速器国家实验室HIRFL的材料辐照终端,利用63 MeV的~(14)N离子和336 MeV的~(56)Fe离子在-50?C下对一种国产低活化钢进行辐照实验.借助离子梯度减能装置,使入射离子能量在0.22—6.17 MeV/u之间变化,从而在样品表面至24μm深度范围内产生0.05—0.20 dpa的原子离位损伤坪区.利用纳米压痕仪测试样品辐照前后的显微硬度,通过连续刚度测量(constant stiffness measurement)得到低活化钢硬度的深度剖面信息.使用Nix-Gao模型很好地描述了纳米压痕硬度随深度递减的现象(压痕尺寸效应,indentation size effect),从而有效避免了低能离子辐照的软基体效应(softer substrate effect).正电子湮灭寿命谱显示低活化钢在辐照之后长寿命成分增加,说明样品中产生了大量缺陷形成空位团,从而导致了材料力学性能的变化,在离子辐照剂量增加至0.2 dpa时,平均寿命τ_m增加量逐渐变慢,材料中辐照产生的缺陷趋于饱和.     

高电荷态氙离子辐照下的6H碳化硅表面纳米结构变形（英）

高电荷态离子比普通的离子携带较高的势能,势能在材料表面的瞬间释放,能在材料表面形成nm量级的结构损伤。它在纳米刻蚀、小型纳米器件、纳米材料、超小尺寸半导体芯片制作、固体表面处理和固体结构分析等领域具有广泛应用前景。因此对高电荷态重离子（Xeq+）引起半导体材料表面（6H-SiC）纳米结构变形进行了研究。采用Xe18+和Xe26+离子,选取从11014到51015 ionscm-2逐渐递增的剂量,以垂直和倾斜60角两种入射方式辐照6H-SiC薄膜样品, 经原子力显微镜分析表明,辐照后的表面肿胀凸起。对于Xe18+离子辐照的样品,辐照区至未辐照区边界的台阶高度随离子剂量增加而连续增大,而对于Xe26+离子辐照的样品则先增加而后减小。在相同入射角和剂量条件下,Xe26+离子辐照样品形成的台阶高度大于Xe18+离子辐照形成的台阶高度,在相同离子和剂量的条件下,垂直照射时形成的台阶高度大于倾斜照射时形成的台阶高度。根据损伤机理和实验数据,首次初步建立了一个包括势能、电荷态、入射角和剂量等物理量的理论模型来预测高电荷态离子在半导体材料表面形成的纳米结构变形。暗示了高电荷态离子的潜在的应用价值及进一步研究的必要性。     

小体积比两相分离早期过程的三维格子气模型研究

采用Monte Carlo模拟方法研究了小体积比三维格子气模型中的相分离过程, 比较了sc, fcc, bcc 等3种晶格类型和T/T_c=0.45–0.85等 5个相对温度的系统演化行为, 计算了系统的结构因子函数, 发现结构因子在相分离早期不满足标度关系, 生长指数等于1/6, 小于经典Lifshitz-Slyozov理论的值. 关键词： 格子气模型 相分离过程 Monte Carlo模拟 生长律     

氦离子注入4H-SiC晶体的纳米硬度研究

4H-SiC晶体经能量为100 keV,剂量为3×10¹⁶ cm^-2的氦离子高温（500 K）注入后,再在773—1273 K温度范围内进行了退火处理,最后使用纳米压痕仪测量了样品注入面的硬度.测试结果表明,在500—1273 K温度范围内样品的硬度随退火温度升高呈现先增大后减小再增大的趋势,其中773 K退火样品的硬度增大明显.分析认为,退火样品的硬度变化是由退火过程中缺陷复合与氦泡生长导致样品内部的Si—C键密度、键长和键角改变引起的. 关键词： SiC 注入 氦泡 纳米压痕     

Study of He-induced nano-cavities as sinks of oxygen for forming silicon-on-insulator

In the present work, a Cz-Silicon wafer is implanted with helium ions to produce a buried porous layer, and then thermally annealed in a dry oxygen atmosphere to make oxygen transport into the cavities. The formation of the buried oxide layer in the case of internal oxidation （ITOX） of the buried porous layer of cavities in the silicon sample is studied by positron beam annihilation （PBA）. The cavities are formed by 15 keV He implantation at a fluence of 2×10^16 cm^-2 and followed by thermal annealing at 673 K for 30 min in vacuum. The internal oxidation is carried out at temperatures ranging from 1073 to 1473 K for 2 h in a dry oxygen atmosphere. The layered structures evolved in the silicon are detected by using the PBA and the thicknesses of their layers and nature are also investigated. It is found that rather high temperatures must be chosen to establish a sufficient flux of oxygen into the cavity layer. On the other hand high temperatures lead to coarsening the cavities and removing the cavity layer finally.