单向拉伸聚酰亚胺薄膜

分别以聚酰胺酸法和部分酰亚胺化的“凝胶法”研究了均苯二酐/二苯醚二胺(PMDA/ODA)和联苯二酐/对苯二胺(BPDA/PPD)体系聚酰亚胺薄膜在制膜过程中对单向拉伸比的影响,研究了薄膜在热膨胀系数和力学性能方面的差别。结果表明,“凝胶法”薄膜可以有较高的拉伸比,可以使薄膜有较低的热膨胀系数(对于PMDA/ODA,由35.1×10-6/℃降低到12.5×10-6/℃),可以明显提高拉伸方向的强度和模量,PMDA/ODA可以分别达到236MPa和1.7GPa;BPDA/PPD可以分别达到613MPa和9.3GPa,但伸长率有所降低。     

溶胶陈化对聚酰亚胺/二氧化硅杂化薄膜性能的影响

采用不同陈化时间的酸催化硅溶胶制备SiO2含量一定的聚酰亚胺/二氧化硅杂化薄膜,用FTIR-ATR、SEM、TMA等手段对其微相结构、热稳定性、力学性能进行了研究.结果表明:随着硅溶胶水解和聚合反应的进行,杂化薄膜中的SiO2颗粒由棒状长大为球体,并逐渐团聚、变形,薄膜的光学透明性降低,热膨胀系数逐渐减小,拉伸强度先增大后减小.当球形SiO2颗粒的直径小于1 μm且均匀分布在基体中时,薄膜综合性能最优.     

含苯并咪唑基团聚酰亚胺的合成与表征

使用一种含有苯并咪唑基团的二胺单体2-(3-氨基苯基)-5-氨基苯并咪唑与二酐单体进行缩聚反应, 得到一系列聚酰亚胺薄膜, 并对该类薄膜的热性能和机械性能进行表征.结果表明, 该类薄膜具有较高的耐热性和良好的机械性能.同时, 二胺单体中氨基的相对位置赋予分子链以较高的弯曲性, 使该类聚酰亚胺具有较好的热塑性和较高的热膨胀系数.     

热场效应下聚酰亚胺纤维力学性质有限元分析

利用COMSOL Multiphysics 5.3软件构建了聚酰亚胺纤维三维有限元模型。 该模型实现了固体传热和表面对表面辐射传热产生的温度场中聚酰亚胺纤维固体力学的计算,重点分析了孔洞的大小、位置和热膨胀系数的差异对聚酰亚胺纤维力学性能的影响。 结果表明,聚酰亚胺(PI)纤维在两端固定约束的条件下,在固体传热和表面对表面辐射传热产生的温度场中呈现相似的应力变化趋势,即聚酰亚胺纤维出现孔洞,使纤维的力学性能降低,孔洞越大,应力分布越不均衡,越不利于纤维性质的稳定;温度越高,应力越大;但随着负轴向热膨胀系数的增加,应力逐渐减小。     

新型光敏聚酰亚胺/SiO2杂化材料的制备与性能研究

通过溶胶－凝胶法制备了一种新型的光敏聚酰亚胺／二氧化硅杂化材料。研究表明当ＳｉＯ２的含量≤１０ｗｔ％时杂化材料除了保持光敏聚酰亚胺原有的感光性能外其热稳定性能、力学性能以及与基底的粘附性能均有明显地提高,同时材料的热膨胀系数也显著地降低。     

具有高表面反射性和导电性的聚酰亚胺-银复合薄膜的制备

聚酰亚胺-银的复合薄膜以其表面银层无与伦比的反射性和电导率,再加上聚酰亚胺基体本身优异的热稳定性和物理机械性能,以及其轻质和柔性的特点,在航空航天和微电子等许多领域具有广阔的应用前景,成为近年来广泛研究的多功能材料之一。本文对比了当前用于制备表面金属化的聚酰亚胺薄膜的各种方法及其优缺点,包括外部沉降法、超临界流体法、原位一步自金属化法、表面改性离子交换自金属化法和直接离子交换自金属化法,特别总结了由本课题组近年来所发展起来的表面改性离子交换自金属化法和直接离子交换自金属化法在制备高反射高导电的双面银化的聚酰亚胺薄膜方面所取得的研究进展。这两种方法均基于简单的银盐化合物前驱体即可实现双面高反射高导电的表面银化的聚酰亚胺薄膜的制备,过程简单,成本低廉。所制得的聚酰亚胺-银复合薄膜的表面反射率超过100%,表面电阻接近纯金属银的水平;复合薄膜的表面银层与聚合物基体之间有很优异的粘结性能;且很好地保持了母体聚酰亚胺薄膜优异的机械性能和热性能。其中采用直接离子交换自金属化技术,仅需将聚酰亚胺的预聚体薄膜在极稀的银盐水溶液中(0.01M银氨溶液)处理5min,然后热处理即可实现聚酰亚胺薄膜的双面金属化,是目前效率最高和银利用率最高的方法。     

聚酰亚胺/二氧化硅纳米尺度复合材料的研究

通过正硅酸乙酯（ＴＥＯＳ）在聚酰胺酸（ＰＡＡ）的Ｎ，Ｎ’ 二甲基乙酰胺（ＤＭＡｃ），溶液中进行溶胶 凝胶反应，制备出不同二氧化硅含量的聚酰亚胺／二氧化硅（ＰＩ／ＳｉＯ２）复合薄膜材料．二氧化硅含量低于１０ｗｔ％的样品是透明浅黄色薄膜；二氧化硅含量高于１０ｗｔ％的样品是不透明棕黄色薄膜．利用红外光谱、扫描电镜、热失重分析、动态力学分析、热膨胀系数测试和应力 应变测试等方法研究了此类材料的结构与性能．结果表明，ＰＩ／ＳｉＯ２纳米复合材料具有较聚酰亚胺更高的热稳定性和更高的模量；线膨胀系数显著降低；拉伸强度和断裂伸长随二氧化硅含量而变化，分别在１０ｗｔ％和３０ｗｔ％附近出现最大值     

含嘧啶聚酰亚胺的制备及其粘结性能

综合2,5-二氨苯基嘧啶(PRM)的刚性结构特征和配位化学特征以及二苯醚二胺(ODA)的柔性结构特征,制备出一系列性能可控的含嘧啶聚酰亚胺.含嘧啶聚酰亚胺的玻璃化转变温度、热稳定性、拉伸强度和模量等,均随聚酰亚胺中PRM比例的升高而增加.但热膨胀系数却随PRM比例的增加而降低,当PRM和ODA的比例为1∶1时,热膨胀系数为17×10-6K-1,与铜箔的热膨胀系数一致,可与铜箔形成尺寸稳定的无胶挠性覆铜板;同时,这一比例的含嘧啶聚酰亚胺与铜箔的粘结强度也达到最高(17.3 N·cm-1).这种含嘧啶聚酰亚胺的性能可以满足无胶挠性印制电路对基底膜材料的尺寸稳定性和粘结性能的要求.     

耐高温聚酰亚胺树脂研究

综述了耐高温聚酰亚胺树脂及其碳纤维增强复合材料、耐高温聚酰亚胺超级工程塑料和高性能功能性聚酰亚胺薄膜等的研究进展。耐高温聚酰亚胺树脂包括第一代耐316℃系列、第二代耐371℃系列、第三代耐426℃3个系列的产品;耐高温聚酰亚胺超级工程塑料包括反应性热模压成型和高温注塑成型的材料;高性能聚酰亚胺薄膜包括透明性聚酰亚胺薄膜和抗原子氧PI薄膜树脂。本文介绍了它们的结构,工艺以及性能,并对其在航天、航空空间技术及微电子等其它领域中的应用情况做了简单的介绍。     

聚酰亚胺薄膜材料的各向异性导热行为研究与进展

聚酰亚胺薄膜材料在集成电路、光电显示、柔性电子等领域具有广泛应用,然而其较差的导热性能越来越无法满足器件的快速散热需求.在保持耐热、力学等优势性能基础上,发展新一代高导热各向异性的聚酰亚胺薄膜材料成为国内外研究的重点.本文系统总结了聚酰亚胺本征薄膜及聚酰亚胺/导热填料复合薄膜在各向异性导热行为方面的研究进展,重点从聚酰亚胺分子结构设计、各向异性导热机理、填料取向排列、基体相态结构等方面进行了详细介绍.通过对非晶型与液晶型两类聚酰亚胺结构特点的分析,阐述了聚酰亚胺本征薄膜的分子结构与各向异性导热性能的关系;介绍了基于导热填料取向排列和基于基体相分离结构两类复合薄膜的填料取向与导热通路构建方法,深入分析了导热填料在基体中的分散形态对薄膜各向异性导热行为的影响,最后对导热聚酰亚胺薄膜材料面临的挑战进行了总结与展望.     

The effect of orientation on thermal expansion behavior in polyimide films

The anisotropy of the thermal expansion of polyimide films was investigated . Out-of-plane or thickness direction coefficients of linear thermal expansion (CTE) were calculated from the difference between the coefficient of volumetric expansion (CVE) and the sum of the in-plane or film direction coefficients of linear thermal expansion for commercial and spin-coated PMDA//ODA and BPDA//PPD films and spin coated BTDA//ODA/MPD films. The CVEs were obtained from a pressure-volume-temperature (PVT) technique based on Bridgeman bellows. The CVE was shown to be essentially constant, independent of molecular orientation and thickness. A decrease in the in-plane CTEs therefore occurs at the expense of an increase in the out-of-plane CTE. In all cases the calculated out-of-plane CTE was higher than the measured in-plane CTE. The ratio of the out-of-plane CTE to the in-plane CTE was 1.2, 3.8, and 49.3 for the spin-coated BTDA//ODA/MPD, PMDA//ODA, and BPDA//PPD films, respectively. © 1994 John Wiley & Sons, Inc.     

Structural and compositional effects on thermal expansion behavior in polyimide substrates of varying thicknesses

Polyimide films with thicknesses ranging from 6 μm to 80 μm were prepared with a solvent casting method to explore film thickness effects on the in-plane thermal expansion coefficient (CTE). In the case of polyimide films composed of bulky and flexible molecular units, CTE is consistent regardless of film thickness. In contrast, films with rigid and planar molecular structure show CTE increase according to the increase of film thickness up to 40–50 μm, which then plateau for thicker films. It is apparent that the film thickness dependent thermal expansion originates from complex effects of molecular orientation, charge transfer complex formation, and crystal formation as a function of film thicknesses, through characterization on UV–Vis absorption, crystalline structure, glass transition behavior, and optical retardation. These results provide insight into the design of polymer structures for flexible display substrates that require appropriate CTE values.     

Decreasing the CTE of Thermoplastic Polyimide by Blending with a Thermosetting System

Chinese Journal of Polymer Science - A series of thermoplastic polyimide resins with a low coefficient of thermal expansion (CTE) were prepared by blending a rigid resin system...     

含酰胺结构超低膨胀聚酰亚胺薄膜的热膨胀行为

采用联苯二酐与3种含酰胺结构二胺制备了具有不同取代基团的聚酰胺-酰亚胺薄膜, 考察了酰胺结构对薄膜力学、 耐热及尺寸稳定性的影响, 研究了聚集态结构与薄膜热膨胀行为的关系和规律. 该系列薄膜具有超高强度和优异的耐热性能, 拉伸强度高达280.5 MPa, 玻璃化转变温度在389~409 ℃, 并在30~300 ℃温度范围内表现出超低负膨胀, 热膨胀系数(CTE, ppm/℃, 即10 ⁶ cm·cm ^-1·℃ ^-1)在-3.05~-1.74 ppm/℃之间. 聚集态分析结果表明, 酰胺结构使分子链间形成了强氢键相互作用, 分子链在薄膜面内方向高度有序取向, 并在膜厚方向堆积更为紧密, 使薄膜表现出热收缩现象. 通过不同体积大小的取代基团进一步调控分子链间相互作用及排列堆积, 可实现薄膜在高温下近乎零尺寸形变, 为设计制备超低膨胀聚合物基板材料提供了新思路.     

聚酰亚胺无机纳米杂化材料

聚酰亚胺(PI)作为一种功能材料，具有良好的介电性、优良力学性能，已被广泛应用于航空航天及微电子领域，但其明显的吸水性和热膨胀性限制了其在高温和精密状态下的应用。无机纳米材料具有很低的热膨胀系数和较低的吸水性，非常适合于对PI的改性。本文阐述了PI纳米杂化材料的制备方法。概要介绍了PI纳米杂化材料的类型、特点、性能及应用领域，并对这类材料的发展前景进行了综述。     

Structure and properties of a photosensitive polyimide: Effect of photosensitive group

The photosensitive poly(p-phenylene biphenylteracarboximide) (BPDA-PDA) precursor was synthesized by attaching photocross-linkable 2-(dimethylamino)ethyl methacrylate (DMAEM) monomer to its poly(amic acid) through acid/base complexation. The polyimide thin films were prepared by a conventional cast/softbake/thermal imidization process from the photosensitive precursors with various concentrations of DMAEM. The structure and properties of the polyimide films were investigated by small-angle and wide-angle x-ray scattering, refractive indices and birefringence analysis, residual stress and relaxation analysis, stress-strain analysis, and dynamic mechanical thermal analysis. In comparison with the polyimide film from the poly(amic acid), the films, which were imidized from the photosensitive precursors, exhibited a better molecular order and microstructure; however, they exhibited less molecular orientation in the film plane. Despite the enhancement in both the molecular order and microstructure, the film properties (i.e., mechanical properties, thermal expansion, residual stress, optical properties, dielectric constant, and water sorption) degraded overall due to both the decrease in molecular in-plane orientation and the formation of microvoids caused by the bulky photosensitive group during thermal imidization. That is, on one hand, the PSPI precursor formation provides an advantageous, direct patternability to the BPDA-PDA precursor, and on the other hand, it results in degraded properties to the resulting polyimide film. © 1995 John Wiley & Sons, Inc.     

Partly Imidized Polyamic Acid and Its UniaxialStretched Polyimide Films

Partly imidized polyamic acid(PAA) has been used to prepare high performance polyimide films. The behaviors of two polyamic acids derived from pyromellitic dianhydride(PMDA)/4,4′-oxydianiline(ODA) and 3,3′,4,4′-biphenyltetracarboxylic diahhydride(BPDA)/paraphenylenediamine(PPD) containing dehydrating agents composed of acetic anhydride and a tertiary amine as the catalyst were investigated. The gel point was dependent on imidization degree in despite of temperature and the molar ratio of catalyst to acetic acid. Imdization content was about 35% for PMDA/ODA and about 22% for BPDA/PPD. The effect of catalyst on imidization possessed an order of triethylamine>3-methylpyridine>pyridine>isoquinoline>2-methylpyridine. The stretching of the films greatly reduced the coefficient of linear thermal expansion(CTE) either in the longitudinal direction or transversal direction. Compared to the film from polyamic acid, the partly imidized film had greater stretching ratio, so that the uniaxial stretched polyimide film from partly imidized PAA had higher tensile strength and tensile modulus, but lower elongation in the stretching direction.