通过RAFT聚合制备SiO2/接枝共聚物纳米杂化粒子

以二氧化硅(SiO2)纳米粒子表面键接的二硫代苯甲酸酯作为可逆加成-断裂-链转移(RAFT)聚合反应的链转移剂, 在室温下引发苯乙烯和马来酸酐进行表面RAFT交替共聚反应, 制得了SiO2/苯乙烯-alt-马来酸酐杂化材料. 通过聚氧化乙烯(PEO)的羟基与马来酸酐的酯化反应, 将PEO接枝到SiO2纳米粒子的表面, 增加了硅粒子的生物相容性. 用FTIR, TGA和TEM对杂化材料的结构、组成和形貌进行了表征.     

以微凝胶模板合成P(AM-co-DMC)/SiO_2杂化粒子

以聚(丙烯酰胺-co-甲基丙烯酰氧乙基三甲基氯化铵)[P(AM-co-DMC)]微凝胶为模板,TMOS为硅前驱体,中性水环境下合成了一系列P(AM-co-DMC)/SiO2有机-无机杂化粒子.对杂化粒子的大小、形态及表面形貌等进行研究,发现微凝胶对杂化粒子的形态和大小起主导作用,SiO2在模板上沉积,即使经过灼烧依然保持模板的形态;TMOS的用量对杂化粒子的性质也有重要影响——用量少时,得到的杂化粒子表面粗糙,增加用量会使表面变得光滑.杂化粒子经过灼烧后,表面会变得更加粗糙.     

高分散性SiO_2/PMMA复合材料的制备与表征——稀释分散性

以高无机含量SiO2/聚甲基丙烯酸甲酯(PMMA)接枝复合材料为预分散母料,与PMMA树脂进行熔融共混,制得低无机含量的SiO2/PMMA复合材料.通过切片透射电镜(TEM)观察熔融共混过程中预分散母料内堆积SiO2粒子分散状态的演化.发现预分散母料接枝状态对其影响最为显著,不经接枝修饰的SiO2粒子经熔融共混后,不可避免地会在熔体中产生大量亚微米级的立体团聚体;复杂接枝预分散母料内构成以SiO2粒子为交联点的立体交联结构,其中的堆积SiO2粒子不能在剪切场中得到有效解离和释放;只有在使用简单接枝预分散母料时,基体高分子链才能不断地渗透扩散进入预分散母料内,而预分散母料可被不断地溶胀和撕裂,因而其中的堆积SiO2才可不断地向基体相迁移和扩散,并最终在整个复合材料内实现初级粒子形式的高度均匀稳定分散.     

溶胶陈化对聚酰亚胺/二氧化硅杂化薄膜性能的影响

采用不同陈化时间的酸催化硅溶胶制备SiO2含量一定的聚酰亚胺/二氧化硅杂化薄膜,用FTIR-ATR、SEM、TMA等手段对其微相结构、热稳定性、力学性能进行了研究.结果表明:随着硅溶胶水解和聚合反应的进行,杂化薄膜中的SiO2颗粒由棒状长大为球体,并逐渐团聚、变形,薄膜的光学透明性降低,热膨胀系数逐渐减小,拉伸强度先增大后减小.当球形SiO2颗粒的直径小于1 μm且均匀分布在基体中时,薄膜综合性能最优.     

含氟高分子/SiO_2杂化疏水材料的制备及涂层表面性质

采用自由基溶液聚合与溶胶-凝胶法相结合的方法制备了含氟高分子/SiO2杂化疏水材料.通过甲基丙烯酸十二氟庚酯(FA)与乙烯基三乙氧基硅烷(VTES)共聚合成了含氟硅共聚物(PFAS),进一步通过原硅酸乙酯(TEOS)与PFAS共聚物溶液共水解缩聚制备了具有含氟侧基的碳碳主链高分子和硅氧网络的含氟高分子/SiO2杂化疏水材料.研究结果表明,SiO2组分含量提高可以显著增加杂化材料薄膜的涂敷厚度,改善其耐久性能,而对杂化材料疏水性能的影响不大.     

RAFT聚合制备PBMA/AA-SiO2杂化纳米材料

以三硫代二[4-(甲氧羰基)苄基]碳酸酯为链转移剂(CTA),甲基丙烯酸丁酯(BMA)为单体,通过可逆加成-断裂链转移自由基聚合(RAFT)法修饰丙烯酸(AA)功能化的纳米二氧化硅(SiO2),制备了PBMA/AA-SiO2有机/无机杂化纳米材料。并通过FT-IR、GPC、TGA、TEM表征和分析了杂化材料的结构、分子量、SiO2纳米粒子在基体中的分散性以及杂化材料的热稳定性。结果表明,PBMA/AA-SiO2杂化微球粒径约为22 nm,分布均匀;TGA分析表明此杂化材料的热稳定性良好,PBMA接枝率为19%。     

全氟磺酸树脂/二氧化钛杂化薄膜的制备与表征

利用可溶性全氟磺酸树脂和二氧化钛前躯体钛酸丁酯液-液相体系, 结合蒸汽水热结晶方法制备了全氟磺酸树脂/二氧化钛杂化薄膜, 并通过扫描电子显微镜(SEM)、X-射线衍射(XRD)、红外光谱分析仪(FT-IR)及紫外-可见分光光度计(UV-vis)等测试方法对杂化薄膜的形貌、晶型、结构及光学性能进行了表征. 结果表明: 蒸汽水热结晶法能促进全氟磺酸树脂/二氧化钛杂化薄膜的结晶和相变; 水热后该杂化薄膜表面平整光滑, 没有裂纹, 二氧化钛晶型为锐钛矿并以球形微粒均匀分散在全氟磺酸树脂基体中; 随着杂化体系中二氧化钛含量的增多, 其粒径逐渐减小、团聚现象消失且杂化薄膜的紫外吸收性能显著提高.     

SiO_2粒子对PMMA/SAN共混体系相分离行为的影响

采用小角激光光散射(SALLS)并结合动态流变学方法,考察了气相法二氧化硅(SiO2)粒子的加入对聚甲基丙烯酸甲酯/苯乙烯-丙烯腈无规共聚物(PMMA/SAN)共混体系相行为的影响,得到了添加SiO2粒子前后的相图,发现SiO2粒子对基体相行为的影响与基体的组成有关.对PMMA/SAN(60/40)体系,加入SiO2粒子后相分离温度上升,但并未改变相分离机理,仍为亚稳单相分解过程(spinodal decomposition,SD);而对于PMMA/SAN(30/70)体系,加入SiO2粒子后却降低了体系的相分离温度.该现象可能是SiO2粒子和基体组分界面间组成与PMMA/SAN共混物基体组成的差异造成的.     

光固化环氧丙烯酸酯/SiO2杂化材料的研究

用FTIR、SEM、DSC和TGA表征了光固化环氧丙烯酸酯／SiO2杂化材料[(EA-TMSPM)／SiO2]，研究了盐酸、γ-甲基丙烯酰氧丙基三甲氧基硅烷(TMSPM)和无机物浓度对(EA-TMSPM)／SiO2结构与性能的影响。结果表明，无机物浓度高的(EA-TMSPM)／SiO2杂化体系中SiO2粒子尺寸略大于无机物浓度低的体系；盐酸和无机物浓度的增加，都可以增强杂化材料的耐磨性。     

疏水高分子介导可动芯SiO2杂化纳米粒子的仿生合成

在疏水高分子胶体模板——含氟丙烯酸酯(FA)共聚物乳胶粒中引入能够介导SiO2原位沉积的聚胺催化活性点-甲基丙烯酰氧乙基三甲基氯化铵(DMC),以四甲氧基硅烷(TMOS)为硅源,在环境条件下可控合成了核壳型FA共聚物/SiO2杂化纳米粒子.高温煅烧除去聚合物核质,可得到中空的SiO2纳米粒子,结合FTIR、EDX、TGA以及XPS等表征数据印证了SiO2的沉积主要发生在聚合物模板的表面.进一步考察了反应条件,如聚胺功能单体DMC的浓度、TMOS的浓度以及反应时间对SiO2杂化纳米粒子的形貌与组成的影响.实验结果表明增加DMC或者TMOS的浓度,适当延长反应时间,均可增加SiO2粒子的沉积速率,导致SiO2壳层的厚度增加,并且杂化粒子的形貌由凹陷多褶皱的核壳结构向可动芯结构转变.由于FA共聚物模板的强疏水性,增加有机核层和无机壳层间的不相容排斥,最终导致核壳层间空腔的形成,得到含可动芯的核壳型SiO2杂化粒子.     

Microstructure and properties of organosoluble polyimide/silica hybrid films

Organosoluble polyimide/silica hybrid materials were prepared via the sol-gel process and their pervaporation properties were studied. The organosoluble polyimide (PI) was based on 4,4′-oxydiphthlic dianhydride (ODPA) and 4,4′-diamino-3,3′-dimethyldiphenylmethane (DMMDA). The surface chemical structure of polyimide/silica films was analyzed by Fourier transform infrared (FT-IR) and X-ray photoelectron spectroscopy (XPS) and the results show that the completely hydrolysis of alkoxy groups of precursors and formation of the three-dimensional Si-O-Si network in the hybrid films. The morphology and the silica domain thus obtained were studied by scanning electron microscopy (SEM) and atomic force microscopy (AFM), respectively. The silica particle size in the hybrid is in the range of 40-100 nm for the hybrid films when the amount of silica is less than 20 wt%. The strength and the modulus of the hybrid films are improved and the mechanical properties were found to be strongly dependent on the density of the crosslink. The glass transition temperature (T_g) of the hybrid films was determined by dynamic mechanical analysis (DMA) and the value increased 15-20 °C as the silica content increased. Furthermore, the pervaporation performances of the prepared hybrid films were also investigated for the ethanol/water mixtures at different temperature.     

Structural characterization of silica modified polyimide membranes

Polyimide and hybrid polyimide‐siloxane were synthesized by polycondensation, imidization, and sol‐gel reaction. The polyimides were prepared from pyromellitic dianhydride (PMDA) and 4,4‐oxydianiline (ODA) in N‐methyl‐2‐pyrollidone (NMP). Trimethoxyvinyl silane (TMVS) was used as a source of silica. Their surface morphologies, structures and thermal performances were determined using scanning electron microscopy (SEM), infrared spectroscopy (IR), thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC). The results showed that the silica particles were finely and rather homogeneously dispersed in polymers. The glass transition temperature (T_g) of hybrid membrane materials increased with the increasing silica content. TGA analysis showed that polyimides were thermally stable with silica. Modified polyimide‐siloxane films, thermal characteristics were found to be better than the polyimide films without silica. Copyright © 2006 John Wiley & Sons, Ltd.     

聚酰亚胺/二氧化硅纳米尺度复合材料的研究

通过正硅酸乙酯（ＴＥＯＳ）在聚酰胺酸（ＰＡＡ）的Ｎ，Ｎ’ 二甲基乙酰胺（ＤＭＡｃ），溶液中进行溶胶 凝胶反应，制备出不同二氧化硅含量的聚酰亚胺／二氧化硅（ＰＩ／ＳｉＯ２）复合薄膜材料．二氧化硅含量低于１０ｗｔ％的样品是透明浅黄色薄膜；二氧化硅含量高于１０ｗｔ％的样品是不透明棕黄色薄膜．利用红外光谱、扫描电镜、热失重分析、动态力学分析、热膨胀系数测试和应力 应变测试等方法研究了此类材料的结构与性能．结果表明，ＰＩ／ＳｉＯ２纳米复合材料具有较聚酰亚胺更高的热稳定性和更高的模量；线膨胀系数显著降低；拉伸强度和断裂伸长随二氧化硅含量而变化，分别在１０ｗｔ％和３０ｗｔ％附近出现最大值     

Microstructure and properties of 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA)‐p‐phenylene diamine (PDA) polyimide/poly(vinylsilsesquioxane) hybrid nanocomposite films

Hybrid nanocomposite films of poly(vinylsilsesquioxane) (PVSSQ) and polyimide (PI) (PI/PVSSQ) were prepared via sol‐gel process from triethoxyvinylsilane (VSSQ) and thermal imidization from 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA)‐p‐phenylene diamine (PDA) polyamic acid (BPDA‐PDA PAA). We investigated the microstructure; interfacial interaction; and optical, thermal, dielectric, and mechanical properties of the hybrid films. The phase morphologies and degree of surface roughness were evaluated by scanning electron microscope (SEM) and atomic force microscope (AFM), respectively. It was found that the surface topography was influenced by the composition of PVSSQ. Hydrogen bonding interactions between polyimide (PI) matrix and PVSSQ domains were proved with FT‐IR spectroscopy. The transparency of the hybrid films was found to be dependent on the PVSSQ content. Incorporating of the PVSSQ in the hybrid composites increased the glass transition temperature of PI. Dielectric constants of the hybrid films were in the range of 2.37–3.59. Properties of the PI films were also significantly enhanced by adding 5–30 wt % of PVSSQ. For comparison, we also prepared the hybrid composites of PI and mixtures of VSSQ and tetraethoxysilane (TEOS) and the PI/silica hybrid composite containing 30 wt % of silica obtained from TEOS. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 5189–5199, 2004     

Highly reflective and conductive double-surface-silvered polyimide films prepared from silver fluoride and BTDA/4,4'-ODA

This work focuses on surface silver metallization on a 3,3',4,4'-benzophenonetetracarboxylic dianhydride/4,4'-oxydianiline (BTDA/ODA)-based polyimide matrix via a direct ion-exchange self-metallization technique using a simple silver salt, silver fluoride, as the silver precursor. The method involves performing an ion-exchange reaction of damp-dry poly(amic acid) films in silver aqueous solution to form silver(I)-containing precursor films. Thermal treatment under tension converts the poly(amic acid) into polyimide and simultaneously reduces the silver(I) to silver(0), yielding silver layers with excellent reflectivity and conductivity on both film sides. However, significant property differences were exhibited on the upside and underside surfaces of the metallized films and this has been discussed in detail. The variation of surface properties and surface morphologies during the thermal curing cycle was also investigated. The mechanical and thermal properties of the metallized polyimide films are essentially similar to those of the host polyimide.     

The synthesis and characteristic study of 6FDA-6FHP-NLO polyimide/SiO2 nanohybrid materials

Hybrid nanocomposite films of silica (SiO₂) in polyimide (PI) from 4,4^′-(hexafluoroisopropylidene) diphthalic arhydride (6FDA), 2,2-Bis (3-amino-4-hydroxyphenyl) hexafluoropropane (6FHP) and nonlinear optical (NLO) molecule have been successfully fabricated by an in situ sol-gel process. The silica content in the hybrid films was varied from 0 to 22.5 wt%. These nanocomposite films exhibit fair good optical transparency. Fourier transform infrared (FTIR) spectroscopy results confirm the formation of SiO₂ particles in PI matrix. Scanning electron microscope (SEM) images show that the SiO₂ phase is well dispersed in the polymer matrix. Their glass transition behavior and thermal stability were investigated by differential scanning calorimeter (DSC) and thermal gravimetric analysis (TG).     

Preparation of reflective and electrically conductive surface-silvered polyimide films from silver(I) complex and PMDA/ODA via an in situ single-stage technique

Optically reflective and/or electrically conductive surface-silvered polyimide films have been prepared by thermal curing of the (1,1,1-trifluoro-2,4-pentadionato) silver(I) (AgTFA)-containing poly(amic acid) derived from pyromellitic dianhydride (PMDA) and 4,4′-oxydianiline (4,4′-ODA) in dimethylacetamide. Films with specular reflectivity of 20-40% and surface electrical resistivity less than 7 Ω/sq were obtained. Two different thermal curing cycles were applied for the imidization and silver reduction process, and film conductivity were only obtained under rapid thermal treatment. The metallized films exhibit mechanical properties close to that of the parent polyimide films. Films were characterized by dynamic mechanical thermal analysis, X-ray diffraction, transmission electron microscopy, atomic force microscopy and mechanical measurements.     

Structure and infrared emissivity of polyimide/mesoporous silica composite films

Polyimide/mesoporous silica composite films were prepared by direct mixing of polyamic acid solution and silylated mesoporous silica particles, or by condensation polymerization of dianhydride and diamine with silylated mesoporous silica particles in N,N-dimethylacetamide, followed with thermal imidization. Structure and glass transition temperatures of the composite films were measured with FTIR, SEM, EDX, XPS and DMTA. The results show that the silylated mesoporous silica particles in the composites tend to form the aggregation with a strip shape due to phase separation. The composite films exhibit higher glass transition temperature as comparing with that of pure polyimide. It is found that the composite films present lower infrared emissivity value than the pure polyimide and the magnitude of infrared emissivity value is related to the content of silylated mesoporous silica in the composite films. Inhibiting actions of silylated mesoporous silica on infrared emission of the composite films may be owing to presence of nanometer-scale pores in silylated mesoporous silica.     

Controlled formation of optically reflective and electrically conductive silvered surfaces on polyimide film via a direct ion-exchange self-metallization technique using silver ammonia complex cation as the precursor

Double-surface-silvered polyimide films have been successfully fabricated using silver ammonia complex cation ([Ag(NH3)2]+) as the silver precursor and 3,3',4,4'-benzophenonetetracarboxylic dianhydride/4,4'-oxidianile- (BTDA/ODA-) based poly(amic acid) (PAA) as the polyimide precursor via a direct ion-exchange self-metallization technique. The process has been clarified to involve the loading of silver(I) into PAA via ion exchange, the thermally induced reduction of silver(I) to silver(0) and the concomitant imidization of PAA to polyimide upon thermal treatment, the subsequent silver-catalyzed and oxygen-assisted decomposition of the polyimide overlayer, and the self-accelerated aggregation of silver clusters on the film surface to produce well-defined surface silver layers. By employing [Ag(NH3)2]+ solution with a concentration of only 0.01 M and an ion-exchange time of no more than 10 min, the controlled formation of highly reflective and conductive silver surfaces upon thermal treatment at 300 degrees C for less than 4.5 h indicates that the present work provides an efficient route and an effacious silver species for polyimide surface metallization. Although the alkaline characteristics of [Ag(NH3)2]+ have a strong hydrolysis effect on the polyimide precursor chains, the final metallized films retain the key mechanical and thermal properties of the pure polyimide. Films were characterized by ATR-FTIR, XPS, ICP-AES, SEM, TEM, DSC, TGA, reflectivity, conductivity, and mechanical measurements.     

Novel inorganic morphologies formed in polyimide/silica hybrid films

2-(4-Aminophenyl)-5-aminobenzimidazole was used to prepare polyimide/silica hybrid films via sol-gel process. At 40 wt.% silica content, hybrid films were still translucent. No noticeable silica particle has been observed. Unexpectedly, after treating at 800 °C, novel morphologies of silica were observed on the surface of inorganic films, which changed from homogeneous to sea-island and to co-continuous structure with increasing silica content in the matrix. Hydrogen bonding between NH in imidazole and silanol group results that silica tends to linear structures, which is considered as the main reason for this morphological change.