Preparation of reflective and electrically conductive surface-silvered polyimide films from silver(I) complex and PMDA/ODA via an in situ single-stage technique

Optically reflective and/or electrically conductive surface-silvered polyimide films have been prepared by thermal curing of the (1,1,1-trifluoro-2,4-pentadionato) silver(I) (AgTFA)-containing poly(amic acid) derived from pyromellitic dianhydride (PMDA) and 4,4′-oxydianiline (4,4′-ODA) in dimethylacetamide. Films with specular reflectivity of 20-40% and surface electrical resistivity less than 7 Ω/sq were obtained. Two different thermal curing cycles were applied for the imidization and silver reduction process, and film conductivity were only obtained under rapid thermal treatment. The metallized films exhibit mechanical properties close to that of the parent polyimide films. Films were characterized by dynamic mechanical thermal analysis, X-ray diffraction, transmission electron microscopy, atomic force microscopy and mechanical measurements.     

Structural characterization of silica modified polyimide membranes

Polyimide and hybrid polyimide‐siloxane were synthesized by polycondensation, imidization, and sol‐gel reaction. The polyimides were prepared from pyromellitic dianhydride (PMDA) and 4,4‐oxydianiline (ODA) in N‐methyl‐2‐pyrollidone (NMP). Trimethoxyvinyl silane (TMVS) was used as a source of silica. Their surface morphologies, structures and thermal performances were determined using scanning electron microscopy (SEM), infrared spectroscopy (IR), thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC). The results showed that the silica particles were finely and rather homogeneously dispersed in polymers. The glass transition temperature (T_g) of hybrid membrane materials increased with the increasing silica content. TGA analysis showed that polyimides were thermally stable with silica. Modified polyimide‐siloxane films, thermal characteristics were found to be better than the polyimide films without silica. Copyright © 2006 John Wiley & Sons, Ltd.     

Synthesis and properties of photosensitive polyimide-nanocrystalline titania optical thin films

In this study, synthesis, morphology, and properties of high refractive index photosensitive polyimide-nanocrystalline titania hybrid materials are reported. A soluble polyimide grafted with carboxylic acid or methacrylate groups (P1) was first synthesized from 4,4′-(hexafluoroisopropylidene) diphthalic anhydride (6FDA), 3,5-diaminobenzoic acid (DABA), 4-aminobenzoic acid (4ABA), and 2-hydroxyethyl methacrylate (2HEMA). The residual carboxylic acid groups could undergo an esterification reaction with titanium butoxide to provide an organic-inorganic bonding. On the other hand, the grafted methacrylate groups rendered photosensitive property for photopatterning. A homogeneous hybrid solution was obtained through the formulation on different mole ratios of titanium butoxide/carboxylic acid, water/acid content in a mixed solvent. It was followed by spin-coating, photocuring and post-baking. The titania domain size in the hybrid materials analyzed by high resolution transmission electron microscopy (HRTEM) and X-ray diffraction (XRD) was around 4-7 nm. The prepared optically transparent films had tunable refractive index (1.583 < n < 2.029), relatively good surface planarity and high thermal stability. A fine pattern with a line width of 50 μm was produced by direct lithographic process on the hybrid films. The present study demonstrates a novel approach for preparing high refractive index hybrid photosensitive materials with patternability.     

Synthesis and characterization of fluorinated polyimides for pervaporation of n-heptane/thiophene mixtures

Soluble fluoro-polyimides have been synthesized by reacting of a fluorine-containing aromatic dianhydride, 2,2′-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride, with aromatic diamine to yield poly(amic acid)s which were then cyclized to yield polyimide by chemical imidization method. The polyimides have excellent solubility both in strong bipolar solvents, such as NMP and DMAc, and in common organic solvents, such as THF and dioxane, etc. The glass transition temperature of these polyimides were determined by DSC and ranged from 281 to 289 °C. Thermogravimetric analysis indicated that these polyimides have good thermal stability with initial thermal decomposition temperature of 520-526 °C. The polyimide asymmetric membranes were prepared by phase inversion method and the inner structure was observed by method of SEM. The pervaporation properties of the prepared polyimides asymmetric membranes for n-heptane/thiophene mixtures were investigated at 40-77 °C and the permeation flux and the sulfur enrichment factor of the polyimide membranes are in the range of 0.56-1.68 kg/m² h and 3.12-2.24, respectively. The result demonstrated that the pervaporation method could be very effective method for desulfurization by polyimides asymmetric membranes with ultrathin skin.     

Porphyrin-containing polyimide films deposited by high vacuum co-evaporation

Thin films of porphyrin-containing polyimide were produced by high vacuum co-evaporation of 4,4′-hexafluoroisopropylidene diphthalic anhydride (6FDA), 3,3′-diaminodiphenyl sulfone (DDS) and 5,10,15,20 meso-tetraphenyl porphyrin (TPP). The films were characterized by FT-IR analysis, optical absorption and emission spectroscopy. FT-IR analysis shows that the film matrix is comprised of only unreacted monomers. The conversion of monomers to polyamic acid and the following condensation to polyimide were studied by curing the samples at temperatures up to 240 °C. The amount of polyamic acid increases from room temperature to 120 °C, while at higher temperature it starts to condense to polyimide. Optical analysis shows that TPP is incorporated in the film matrix and its chemical state is determined by the interaction with the monomers, polyamic acid and polyimide. After curing the TPP molecules are finely dispersed in the polyimide matrix and their absorption and fluorescence properties are wholly preserved.     

Preparation and characterization of polyimide/mesoporous silica hybrid nanocomposites based on water-soluble poly(amic acid) ammonium salt

Recently, mesoporous silica was blended with polyimide to develop low dielectric constant (k) materials with improving mechanical and thermal properties of polyimide by utilizing both the nanoporous structure and silica framework. However, even the use of mesoporous silica did not show a significant decrease of k due to the phase segregation in between polyimide and the mesoporous silica materials. In this work, we attempted to prepare polyimide/mesoporous silica hybrid nanocomposites having relatively good phase mixing behavior by utilizing polyimide synthesized from a water soluble poly(amic acid) ammonium salt, which lead to low k up to 2.45. The thermal properties of polyimide were improved by adding mesoporous silicas. For this work, we have fabricated mesoporous silicas through surfactant-templated condensation of tetraethyl orthosilicate (TEOS). Pyromellitic dianhydride (PMDA)-4,4′-oxydianiline (ODA) polyimide was prepared from poly(amic acid) ammonium salt, which had been obtained by incorporating triethylamine (TEA) into PMDA-ODA poly(amic acid) in dimethylacetamide (DMAc), followed by thermal imidization.     

Preparation and properties of a high temperature, flexible and colorless ITO coated polyimide substrate

A new high temperature, flexible and colorless indium-tin-oxide (ITO) coated plastic substrate has been prepared from a thermally stable, high glass transition temperature (T_g) and colorless polyimide film. The polyimide was synthesized from 3,3′-diaminodiphenylsulfone (3,3′-DDS) and 4,4′-(hexafluoroisopropylidene) diphthalic anhydride (6FDA) monomers. Its heat distortion temperature was 278 °C. The ITO was deposited on the polyimide film using the magnetron-sputtering process. After annealing at 250 °C under nitrogen for 1 h, the resistivity of the ITO film was 4.0 × 10⁻⁴ Ω cm, and its transmittance was 83.5%. Scanning electron microscope (SEM) and X-ray diffraction (XRD) were used to observe the surface and morphology of the ITO film. UV-visible spectroscopy and the four-probe method were used to study their optical and electrical properties. The high performance ITO-plastic substrate can be used in the next generation flat panel displays.     

Synthesis and Properties of Hyperbranched Polyimides Combined with Silica

Summary: The novel hyperbranched polyimide - silica hybrid materials containing theoretically 16 wt% of an inorganic phase were prepared via a sol-gel process. An amine terminated polyimide precursor (hyperbranched polyamic acid) was prepared from commercially available monomers 4,4′,4″-triaminotriphenylmethane and 4,4′-oxydiphthalic anhydride in molar ratio 1:1. Tetramethoxysilane and/or 3-glycidoxypropyltrimethoxysilane (also used as a coupling agent) were used as silica precursors. During thermal exposition the polyimide precursor was transformed to hyperbranched polyimide and hydrolyzed alkoxy groups reacted mutually to form silica. The final products were self-standing films, whose structure was characterized by using IR and ¹³C and ²⁹Si solid state NMR spectroscopy. The influence of the amount of silica and/or coupling agent on their structure and thermal properties was described.     

Synthesis and characterization of fluorinated polyimides derived from novel unsymmetrical diamines

Two kinds of aromatic, unsymmetrical diamines with ether-ketone group, 3-amino-4′-(4-amino-2-trifluoromethylphenoxy)-benzophenone and 4-amino-4′-(4-amino-2-trifluoromethylphenoxy)-benzophenone, were successfully synthesized with two different synthetic routes. Then, they were polymerized with 4,4′-oxydiphthalic anhydride, 3,3′,4,4′-benzophenone tetracarboxylic dianhydride, and 2,2′-bis(3,4-dicarboxyphenyl)-hexafluoropropane dianhydride to form a series of fluorinated polyimides via a conventional two-step thermal or chemical imidization method. The resulting polyimides were characterized by measuring their solubility, viscosity, mechanical properties, IR-FT, and thermal analysis. The results showed that the polyimides had inherent viscosities of 0.48-0.68 dl/g and were easily dissolved in bipolarity solvents and common, low-boiling point solvents. Meanwhile, the resulting strong and flexible polyimide films exhibited excellent thermal stability, e.g., decomposition temperatures (at 10% weight loss) are above 575 °C and glass-transition temperatures in the range of 218-242 °C. The polymer films also showed outstanding mechanical properties, such as tensile strengths of 86.5-132.8 MPa, elongations at break of 8-14%, and initial moduli of 1.32-1.97 GPa. These outstanding combined features ensure that the polymers are desirable candidate materials for advanced applications.     

Effect of carbon nanotubes on mechanical and electrical properties of polyimide/carbon nanotubes nanocomposites

Multi-walled carbon nanotubes (MWNTs) reinforced polyimide nanocomposites were synthesized by in situ polymerization using 4,4′-oxydianilline, MWNTs, and pyromellitic dianhydride followed by casting, evaporation and thermal imidization. A homogeneous dispersion of chemically modified MWNTs was achieved in polyimide matrix as evidenced by scanning electron microscopy and atomic force microscopy. The incorporation of the modified MWNTs enhanced the mechanical properties of the polyimide due to the presence of strong interfacial interaction between the polymer matrix and the nanotubes in polymer composites. The resultant polyimide/MWNTs nanocomposites were electrically conductive with significant conductivity enhancement at 3 wt% MWNTs, which is favorable for many practical uses.     

Microstructure and properties of 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA)‐p‐phenylene diamine (PDA) polyimide/poly(vinylsilsesquioxane) hybrid nanocomposite films

Hybrid nanocomposite films of poly(vinylsilsesquioxane) (PVSSQ) and polyimide (PI) (PI/PVSSQ) were prepared via sol‐gel process from triethoxyvinylsilane (VSSQ) and thermal imidization from 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA)‐p‐phenylene diamine (PDA) polyamic acid (BPDA‐PDA PAA). We investigated the microstructure; interfacial interaction; and optical, thermal, dielectric, and mechanical properties of the hybrid films. The phase morphologies and degree of surface roughness were evaluated by scanning electron microscope (SEM) and atomic force microscope (AFM), respectively. It was found that the surface topography was influenced by the composition of PVSSQ. Hydrogen bonding interactions between polyimide (PI) matrix and PVSSQ domains were proved with FT‐IR spectroscopy. The transparency of the hybrid films was found to be dependent on the PVSSQ content. Incorporating of the PVSSQ in the hybrid composites increased the glass transition temperature of PI. Dielectric constants of the hybrid films were in the range of 2.37–3.59. Properties of the PI films were also significantly enhanced by adding 5–30 wt % of PVSSQ. For comparison, we also prepared the hybrid composites of PI and mixtures of VSSQ and tetraethoxysilane (TEOS) and the PI/silica hybrid composite containing 30 wt % of silica obtained from TEOS. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 5189–5199, 2004     

聚酰亚胺/二氧化硅/银杂化薄膜的制备及其结构与性能研究

采用溶胶-凝胶和原位自金属化相结合方法制备聚酰亚胺(PI)/二氧化硅(SiO2)/银(Ag)三元复合薄膜,通过红外(FTIR)、透射电镜(TEM)、动态粘弹谱仪(DMTA)等系统地考察了热处理过程中杂化薄膜结构形态变化以及SiO2含量对金属银向基体表面迁移情况和杂化薄膜各种性能的影响.实验结果表明,在热处理过程中可以同时完成聚酰胺酸的亚胺化、SiO2粒子的形成及银的还原,并且可以通过改变热处理温度和时间或改变SiO2含量来控制银粒子向聚合物基体表面的迁移.     

Preparation, morphology and properties of nano-sized Al2O3/polyimide hybrid films

Nano-sized Al₂O₃/polyimide (PI) hybrid films based on 4,4′-oxydianiline (ODA) and pyromellitic dianhydride (PMDA) were prepared by incorporation with different content of nano-sized Al₂O₃ via in situ polymerization. The TEM and SEM micrographs indicated that the Al₂O₃ particles were homogenously dispersed in the polyimide matrix by means of the ultrasonic treatment and the addition of coupling agent. The mechanical properties and thermal stability of the pure PI film can be improved by adequate addition of Al₂O₃. The PI hybrid film was strengthened and toughened simultaneously by the introduction of the well-dispersed Al₂O₃ particles. The PI hybrid films showed improved electrical aging performance as compared with pure PI film. Especially, the PI hybrid films with 10 wt.% of Al₂O₃ content exhibited obviously enhanced electrical aging performance with the time to failure of 3.4 times longer than that of pure PI film. The improved electrical aging performance of the hybrid film was attributed to the nano-sized Al₂O₃ particles highly dispersed in the hybrid film, which confirmed by the investigation of the morphology and the surface composition of PI hybrid film before and after electrical aging.     

Novel inorganic morphologies formed in polyimide/silica hybrid films

2-(4-Aminophenyl)-5-aminobenzimidazole was used to prepare polyimide/silica hybrid films via sol-gel process. At 40 wt.% silica content, hybrid films were still translucent. No noticeable silica particle has been observed. Unexpectedly, after treating at 800 °C, novel morphologies of silica were observed on the surface of inorganic films, which changed from homogeneous to sea-island and to co-continuous structure with increasing silica content in the matrix. Hydrogen bonding between NH in imidazole and silanol group results that silica tends to linear structures, which is considered as the main reason for this morphological change.     

Novel thermally stable and chiral poly(amide-imide)s bearing from N,N′-(4,4′-diphthaloyl)-bis-l-isoleucine diacid: Synthesis and characterization

Novel optically active aromatic poly(amide-imide)s (PAIs) were prepared from newly synthesized N,N′-(4,4′-diphthaloyl)-bis-l-isoleucine diacid (3) via polycondensation with various diamines. The diacid was synthesized by the condensation reaction of 3,3′,4,4′-biphenyltetracarboxylic dianhydride (1) with l-isoleucine (2) in a mixture of acetic acid and pyridine (3:2 v/v). All the polymers were obtained in quantitative yields with inherent viscosities of 0.20-0.43 dL g⁻¹. All the polymers were highly organosoluble in solvents like N-methyl-2-pyrrolidinone (NMP), N,N-dimethylacetamide (DMAc), N,N-dimethylformamide (DMF), dimethyl sulfoxide (DMSO), tetrahydrofuran, γ-butyrolactone, cyclohexanone and chloroform at room temperature or upon heating. These poly(amide-imide)s had glass transition temperatures between 198 and 231 °C, and their 10% weight-loss temperatures were ranging from 368 to 398 °C and 353 to 375 °C under nitrogen and air, respectively. The polyimide films had tensile strengths in the range of 63-88 MPa and tensile moduli in the range of 0.8-1.4 GPa. These poly(amide-imide)s possessed chiral properties and the specific rotations were in the range of −3.10° to −72.92°.     

The synthesis and characteristic study of 6FDA-6FHP-NLO polyimide/SiO2 nanohybrid materials

Hybrid nanocomposite films of silica (SiO₂) in polyimide (PI) from 4,4^′-(hexafluoroisopropylidene) diphthalic arhydride (6FDA), 2,2-Bis (3-amino-4-hydroxyphenyl) hexafluoropropane (6FHP) and nonlinear optical (NLO) molecule have been successfully fabricated by an in situ sol-gel process. The silica content in the hybrid films was varied from 0 to 22.5 wt%. These nanocomposite films exhibit fair good optical transparency. Fourier transform infrared (FTIR) spectroscopy results confirm the formation of SiO₂ particles in PI matrix. Scanning electron microscope (SEM) images show that the SiO₂ phase is well dispersed in the polymer matrix. Their glass transition behavior and thermal stability were investigated by differential scanning calorimeter (DSC) and thermal gravimetric analysis (TG).     

High strength electrospun polymer nanofibers made from BPDA-PDA polyimide

A series of high molecular weight PI precursors, poly(p-phenylene biphenyltetracarboxamide acid), were synthesized from 3,4,3′,4′-biphenyltetracarboxylic dianhydride (BPDA) and p-phenylenediamine (PDA) by using intense mechanical stirring at −15 to 0 °C for 48-72 h. The as-synthesized PI precursor solution was used to make BPDA/PDA polyimide thin films and electrospun nanofibers. IR, Ostward Viscometer, CMT-8102 Electromechanical Universal Testing Machine and scanning electron microscope (SEM) were used for the characterizations of the as-synthesized PI precursor, PI films and nanofiber sheets. The high molecular weight BPDA/PDA PI thin films and electrospun nanofiber sheets possess excellent mechanical properties of up to 900 MPa tensile strength with up to 18.0 GPa E-modulus and up to 210 MPa tensile strength with up to 2.5 GPa E-modulus, respectively.     

Synthesis and characterization of soluble polyimides derived from a novel unsymmetrical diamine monomer: 1,4-(2′,4″-diaminodiphenoxy)benzene

A new aromatic unsymmetrical diamine monomer, 1,4-(2′,4″-diaminodiphenoxy)benzene (OAPB), was successfully synthesized in three steps using hydroquinone as starting material and polymerized with various aromatic tetracarboxylic acid dianhydrides, including 4,4′-oxydiphthalic anhydride (ODPA), 3,3′,4,4′-benzophenone tetracarboxylic dianhydride (BTDA), 2,2′-bis(3,4-dicarboxyphenyl)-hexafluoropropane dianhydride (6FDA) and pyromellitic dianhydride (PMDA) via the conventional two-step thermal or chemical imidization method to produce a series of the unsymmetrical aromatic polyimides. The polyimides were characterized by solubility tests, viscosity measurements, IR, ¹H NMR, and ¹³C NMR spectroscopy, X-ray diffraction studies, and thermogravimetric analysis. The polyimides obtained had inherent viscosities ranged of 0.38-0.58 dL/g, and were easily dissolved in common organic solvents. The resulting strong and flexible PI films exhibited excellent thermal stability with the decomposition temperature (at 5% weight loss) of above 505 °C and the glass transition temperature in the range of 230-299 °C. Moreover, the polymer films showed outstanding mechanical properties with the tensile strengths of 41.4-108.5 MPa, elongation at breaks of 5-9% and initial moduli of 1.15-1.68 GPa.     

Polyimide–silica hybrid coatings: morphological,mechanical, and thermal investigations

In this study, polyimide–silica (PI–silica) based hybrid coating compositions were prepared from tetraethoxysilane (TEOS), γ‐glycidyloxypropyl trimethoxy silane (GOTMS), and polyamic acid (PAA) via a combination of sol–gel and thermal imidization techniques. PAA was synthesized from 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA) and 3,3'‐Diaminodiphenyl sulfone (DDS) in N‐Methyl‐2‐pyrrolidone (NMP). The silica content in the hybrid coatings was varied from 0 to 20 wt%. The structural characterization of the hybrid coatings was performed using FTIR and ²⁹Si‐NMR spectroscopies. Results from both pendulum hardness and micro indentation test show that the hardness of hybrid coatings improves with the increase in silica content. The tensile tests also demonstrated that the mechanical properties at low silica content are rather striking. Their surface morphologies were characterized by scanning electron microscopy (SEM). SEM studies revealed that inorganic particles were distributed homogenously through the PI matrix. It was also found that, incorporation of the silica domains increased the thermal stability of the hybrid coatings. Copyright © 2007 John Wiley & Sons, Ltd.     

Preparation of nonwoven polyimide/silica hybrid nanofiberous fabrics by combining electrospinning and controlled in situ sol-gel techniques

A controlled in situ sol-gel synthesis combined with the electrospinning technique and postspun imidization was applied in the fabrication of polyimide/silica hybrid nonwoven nanofiberous fabrics with excellent thermal and mechanical performance. The nanofiberous fabrics were prepared by electrospinning of the solution of tetraethoxysilane (TEOS) and polyamic acid (PAA). The different silica contents in the fabrics were achieved by varying the amount of TEOS while fitting the solid content of PAA. The final polyimide/silica fabrics was obtained after imidization of PAA and gelation of silica phase simultaneously accomplished through a step-wise heating process. Some specific IR techniques and other characterizations indicated the successful incorporation of the silicon dioxide (SiO₂) into the PI matrix and the relatively even distribution of the SiO₂ in the fabrics. An increase of 133 °C in the decomposition temperature and 4-fold enhancement of the ultimate tensile strength were achieved for the hybrids with a 6.58 wt.% of SiO₂ content, compared to the pure PI fabric. The excellent performance could be attributed to the good compatibility between the polyimide and silica, and good adhesion among the fibers, which resulted from the controlled TEOS hydrolysis and the simultaneous imidization and gelation process.