Cu含量对Ni-Cu-P化学镀层组织结构和性能影响

利用化学镀法制备出Ni-Cu-P合金镀层,研究了镀液中CuSO4·5H2O含量对合金镀层沉积速率和成分的影响. 通过XRD和SEM表征了不同CuSO4·5H2O质量浓度下Ni-Cu-P合金镀层的组织结构和表面形貌,运用极化曲线评价了合金镀层在质量分数为3.5%NaCl溶液中的耐蚀性能. 结果表明,随着镀液中CuSO4·5H2O质量浓度的增加,镀层沉积速率和P含量不断下降,Ni-P镀层中P的质量分数为14.98%. 当镀液中CuSO4·5H2O质量浓度为1.0 g/L时,P的质量分数为4.21%;镀层中Cu的含量随着镀液中CuSO4·5H2O含量的增加而增加. 当添加量为1.0 g/L时,镀层中Cu的质量分数达19.04%;镀层的结晶度随着Cu含量的上升不断增大,Cu的加入使镀层的表面形貌更加光滑;镀层的耐蚀性能随着镀液中CuSO4·5H2O含量的增加先上升后下降,当镀液中CuSO4·5H2O质量浓度为0.4 g/L时,Ni-Cu-P镀层表现出最优的耐蚀性能.     

乙烷PBI/H_3PO_4质子传导膜燃料电池性能

研究了以乙烷作为燃料、掺杂了H3PO4的聚苯并咪唑(PBI)材料作为质子传导膜、Pt/C作为电极催化剂构成的燃料电池电化学性能。采用溶液铸造法制备了PBI/H3PO4质子传导膜,考察了在PBI膜中H3PO4的掺杂量与时间的关系及乙烷气体在增湿和不增湿条件下PBI/H3PO4燃料电池的电化学性能;探讨了电池的反应机理及不同操作温度对电池性能的影响。结果表明,PBI膜H3PO4适宜的掺杂时间为8h,电解质中掺杂600mol%H3PO4;乙烷气体增湿后,电池性能变好;操作温度提高,电化学反应速率加快,电池的输出电流与功率密度增加。结构为C2H6,(Pt/C阳极)/PBI/H3PO4膜/(Pt/C阴极),O2的单电池,在200℃和0.1Mpa、乙烷气体的湿度从0增加到0.02kgH2O/kg乙烷时,电池的最大输出电流密度从1.5mA·cm-2增加到34mA·cm-2,最大功率密度从0.33mW·cm-2增加到5.5mW·cm-2。     

2,2′-联吡啶和亚铁氰化钾对乙醛酸化学镀铜的影响

以乙醛酸作还原剂、Na2EDTA为络合剂、2,2′-联吡啶和亚铁氰化钾作为添加剂组成化学镀铜体系,研究了两种添加剂对化学镀铜速率、镀层表面形貌、组成和结构的影响.结果表明:添加适量的2,2′-联吡啶和亚铁氰化钾,不仅提高了镀液的稳定性,而且使沉积速率增加1倍.这两种添加剂的同时使用,使镀层颜色变亮,形貌发生变化.所得镀层是多晶铜,没有发现夹杂Cu2O.     

2,2''''-联吡啶和亚铁氰化钾对乙醛酸化学镀铜的影响

以乙醛酸作还原剂、Na2EDTA为络合剂、2,2'-联吡啶和亚铁氰化钾作为添加剂组成化学镀铜体系,研究了两种添加剂对化学镀铜速率、镀层表面形貌、组成和结构的影响.结果表明:添加适量的2,2'-联吡啶和亚铁氰化钾,不仅提高了镀液的稳定性,而且使沉积速率增加1倍.这两种添加剂的同时使用,使镀层颜色变亮,形貌发生变化.所得镀层是多晶铜,没有发现夹杂Cu20.     

La-CoMoN_x/CNTs催化剂上氨分解反应的本征动力学

以La-CoMoNx/CNTs为催化剂,对氨分解制氢反应的本征动力学进行了研究。考察了N2浓度、H2浓度、NH3浓度以及反应温度对反应速率的影响。采用幂指数方程描述反应动力学,确定了本征动力学参数,推导出了本征动力学方程,得到反应的活化能为93.948 kJ/mol。同时对其反应机理进行了探讨,认为La-CoMoNx/CNTs催化剂上氨分解反应遵循Temkin-Pyzhev机理,即表面氮原子的结合脱附为反应的速率控制步骤。     

固相反应两步法制备纳米CeO2及其机制研究

采用H2C2O4·2H2O和Ce(NO3)3·6H2O进行了低热固相反应. 第一步合成前驱物Ce2(C2O4)3·10H2O, 第二步加入模板剂NaCl, 于800 ℃进行热分解反应. 对分解产物进行了XRD测定和SEM, TEM分析. 结果表明, 得到了表面形貌为短节状、粒度分布均匀、无明显团聚现象、平均粒径在90 nm左右的纳米粉体, 同时对制备反应进行了热力学和动力学的初步研究.     

硝酸铈及热处理对化学镀Ni-W-P合金的性能影响

为提高化学镀Ni-W-P镀层的耐蚀性和耐磨性,拓宽其应用,采用电化学方法和热处理等手段,研究了镀液中添加剂硝酸铈(Ce(NO3)3)的质量分数和热处理对化学镀Ni-W-P镀层的沉积速度、孔隙率、失重腐蚀速度、腐蚀电位、腐蚀电流、交流阻抗、显微硬度、摩擦系数等性能的影响。结果表明:添加1.0 wt%Ce(NO3)3时,所得镀层的沉积速度最大(36.5 g/m2·h),孔隙率最低(0.8个/cm2),耐腐蚀性能最好。镀层的组织均匀、致密、无缺陷和非晶态结构是其耐蚀性能高的重要原因。100~600℃热处理后,镀层硬度和耐磨性有所提高,而400℃热处理之后,合金显微硬度高达1100 HV,是镀态的1.8倍。     

玻璃纤维的表面金属化

采用以甲醛为还原剂、EDTA·Na2和TART·KNa为络合剂的双络合剂体系对玻璃纤维表面进行了化学镀铜.结果表明,在玻璃纤维表面上成功镀覆上一层致密、亮铜色的铜镀层.     

介质阻挡放电等离子体中·OH和HO2·自由基的数值模拟计算

在介质阻挡放电等离子体N2/O2/H2O/HCHO体系中通过解Boitzmann方程,得到电子能量分布函数,利用得到的电子能量分布函数计算电子-分子碰撞反应速率常数.然后把有关的反应速率常数带入速率方程,计算得到该体系在介质阻挡放电时,·OH、HO2·和电子的浓度随时间的演变以及·OH、HO2·浓度随H2O、O2摩尔分数的变化,并将模拟结果与实验值进行了对比,两者符合得较好.     

H3PO→H2POH异构化反应的直接动力学研究

在QCISD(T)/6-311C++G(2df,2pd)//QCISD/6-311C++G(d,p)+ZPE水平上,对H3PO的异构化反应H3PO→(1)H2POH(trans)→(2)H2POH(cis)进行了计算研究.结果表明,H原子由P原子向O原子迁移反应(1)的能垒为250.0kJ/mol,是反应速率控制步骤,而O_H键绕P_O键旋转的构型转化反应(2)的能垒只为12.3kJ/mol.利用经典过渡态理论(TST)与变分过渡态理论(CVT)分别计算了反应(1)在200～2000K温度区间内的速率常数kTST和kCVT,获得了经小曲率隧道效应(SCT)及Eckart模型校正后的速率常数kTST/Eckart和kCVT/SCT.对只涉及H原子迁移的反应(1),量子力学隧道效应的影响在低温段非常明显,而变分效应对反应速率常数的影响很小.     

Effect of 3-Amino-5-mercapto-1,2,4-triazole on Electroless Nickel Deposition

The effects of organic additive, 3-amino-5-mercapto-1,2,4-triazole （AMTA） on bath stability, deposition rate, reaction activation energy, and Ni-P coating composition in acidic electroless nickel plating were investigated. Polarization curve method and infrared reflection spectroscopy were used to analyze the mechanism of the effect of AMTA on electroless nickel deposition. It was observed that AMTA improved bath stability, decreased the deposition rate, and increased the reaction activation energy. It was also revealed that AMTA decreased the phosphorus content and increased the sulfur content in Ni-P coating. In addition, AMTA inhibited the anodic oxidation of hypophosphite and accelerated the cathodic reduction of Ni^2＋. Infrared reflection spectroscopy result indicates that AMTA was adsorbed on the surface of Ni-P and interacted with Ni^2＋ to form an AMTA-Ni^2＋ compound. On the basis of the results of this study, the mechanism of the effect of AMTA on electroless nickel deposition was deduced.     

On the formation of the interlayer between Ni-P coating and AZ33 magnesium alloy substrate by means of in situ SEM observation

Pre-treatment process is the key step for electroless plating. Once a suitable pre-treatment film is in place, the desired metals can be plated. In this paper, Ni-P coating was successfully prepared on AZ33 magnesium alloy with Mg（OH）2 pre-treatment film by electroless plating. To investigate the role of MgF2 in Ni-P coating, the deposition procedures between Mg（OH）2 pre-treatment film and Mg（OH）2-MgF2 pre-treatment film （a traditional process） were compared. The surface morphology variations of coatings were observed with scanning electron microscopy and the compositions were analyzed by energy dispersive spectrometry. The results showed that during the plating, both MgF2 and Ni-P deposited at the initial stage, and MgF2 distributed in the bottom of the coating, forming a transitional interlayer with Ni- P. According to the heat quench test, a poor adhesion of the coating mainly occurred between the MgF2 and Ni-P coating.     

Effect of 3-S isothiuronium propyl sulfonate on electroless nickel deposition

The effects of organic additive, 3-S isothiuronium propyl sulfonate (UPS) on bath stability, deposition rate, reaction activation energy, and Ni-P coating composition in acidic electroless nickel (EN) plating were investigated. The study was performed by measuring the polarization curves and X-ray fluorescence spectrometer (XRF) in combination with X-ray photoelectron spectroscopy (XPS) analysis. The results show that UPS improves bath stability and increases the reaction activation energy. At lower concentration, UPS is an effective accelerator for EN deposition; whereas, at higher concentration, it decreases deposition rate. It also reveals that UPS inhibits the anodic oxidation of hypophosphite and accelerates the cathodic reduction. In addition, UPS decreases the phosphorus content in Ni-P deposit and can be adsorbed on the deposit surface and compound with Ni²⁺. On the basis of these results, the effect mechanism of UPS on electroless nickel deposition was deduced.     

NH4F对化学镀镍液的作用机理及镀层性能的影响

氟元素是周期表中最活泼的非金属元素,有着最强的电负性,氟化物有着特殊的化学性能。关于氟化物在化学镀镍磷工艺中的应用已有报道,在镁基体上化学镀的前处理过程中,常用氢氟酸或氟化氢铵来进行活化处理;硅片表面上的化学镀也通常用HF与HNO3或HCl的混酸来活化,使硅片表面产生Si-H键。另外,如果在化学镀液中添加少量的氟化钠,则起到加速的作用[1]。对于氟化物在化学镀镍磷工艺中的报道仅限于此,未见有关氟化物在化学镀中其它作用的研究。鉴于此,本工作以氟化铵为研究对象,对其在弱碱性的条件下对化学镀液的缓冲能力、沉积速度以及所得镀层性能的影响进行了研究。     

表面活性剂对陶瓷基底化学镀镍的作用机理及镀层性能的影响

采用酸性化学镀技术在Al₂O₃陶瓷片表面沉积Ni-P镀层,通过电感耦合等离子体发射光谱,X射线衍射光谱和扫描电子显微镜等分析测试,对镀层的成分、物相和形貌进行了表征,考察了表面活性剂种类、掺量等因素对镀层表面性貌和性能的影响。结果表明,当添加5 mg·L^-1 SDS时,镀速从14 μm·h^-1增加到17 μm·h^-1,随表面活性剂添加量继续增加,镀速呈减少趋势。添加表面活性剂能够不同程度的消除化学镀Ni-P镀层固有的胞状组织,提高表面致密性和平整性;镀层自腐蚀电流密度从43 μA·cm^-2减小至3.5 μA·cm^-2,镀层的耐腐蚀性能显著提高。根据电化学理论和实验规律,探讨了表面活性剂在化学镀镍磷合金反应过程的影响机理。     

负载型纳米Ni催化剂用于对氯硝基苯选择加氢

以TiO2为载体,N iB为诱导剂,粉末化学镀法制备了负载型纳米N i催化剂.通过TEM、HRTEM、XRD和ICP技术对催化剂物性进行了表征.结果表明,碱性镀液可使载体表面均匀负载微晶结构纳米N i团簇,尺度为35nm左右.该负载型纳米N i在对氯硝基苯选择加氢反应中表现出很高催化加氢活性,并能有效抑制脱氯,达到了工业骨架镍水平.由酸性镀液得到的负载型非晶态纳米N i-P合金具有较弱的催化对氯硝基苯加氢活性.反应温度对反应时间和脱氯率有明显影响.     

Ni-P-TiO2化学复合镀层电极的乙醇电催化氧化

于Ni-P镀液添加TiO2颗粒,用化学镀法在黄铜基底上制备不同TiO2含量的Ni-P-TiO2复合镀层电极.采用循环伏安法、线性扫描法、计时电流和交流阻抗法测定Ni-P-TiO2/Cu电极的电化学性能.结果表明:常温下Ni-P-TiO2/Cu电极在碱性溶液中对乙醇氧化有很高的电催化活性;Ni-P-TiO2电极上乙醇的电催化氧化活性随镀层TiO2量的不同而异;镀液中TiO2含量为5 g.L-1时,所得电极的电催化乙醇氧化的活性最佳.     

Electrochemical characteristics and interfacial contact resistance of Ni-P/TiN/PTFE coatings on Ti bipolar plates

The Ni-P/TiN/PTFE (poly tetra fluoroethylene) composite coatings were prepared by electroless plating method on Ti plate, which was used as bipolar plates of proton exchange membrane fuel cells (PEMFCs). The morphology, crystallographic texture, electrochemical corrosion, contact resistance, and hydrophobic property of the Ti bipolar plates with coatings were investigated. The results revealed that Ni-P/TiN/PTFE coating had a dense surface morphology, uniform distribution of composite particles. Ti with coating showed 0.48 μA cm² of corrosion current in the simulated solution of PEMFCs and 6 mΩ cm² of interfacial contact resistance (ICR). The hydrophobicity test showed that the coating interface was flat and the wetting angle was 112.4°. In conclusion, The Ni-P/TiN/PTFE composite coatings exhibit superior improvement in corrosion resistance, interface hydrophobicity, and conductivity to Ni-P, Ni-P/TiN, and Ni-P/PTFE coatings. The Ni-P/TiN/PTFE coating was suited for bipolar plate surface modification of bipolar plates.     

Ni-P-无机类富勒烯WS_2纳米材料化学复合镀层的制备及其摩擦学性能初步研究

用化学复合镀技术制备了含有无机类富勒烯硫化钨纳米材料的Ni-P-(IF-WS_2) 复合镀层。用环-块摩擦实验测试了Ni-P-(IF-SW_2)的摩擦学性能。研究结果表明 它比与Ni-P，Ni-P-(层状2H-WS_2)和Ni-P-石墨复合镀层具有更高的耐磨性能和更 低的摩擦系数。分析了无机类富勒烯纳米材料改善镀层摩擦学性能的机理。     

Ti基化学镀Ni-P和Ni-P-Cg镀层晶化动力学

利用化学镀技术在Ti基体材料表面制备了Ni-P合金镀层和Ni-P-Cg复合镀层。利用SEM、XRD和EDS等分析了镀层的晶化过程,用差热分析仪研究了Ni-P合金镀层和复合镀层的晶化动力学,运用Ozawa、Freeman-Carroll、Achar和Coats-Redfern方法对非等温动力学数据进行了分析和比较。结果发现,复合镀层的特征温度T_m和晶化激活能E均高于Ni-P合金镀层,而热焓值｜ΔH｜却低于Ni-P镀层;计算出Ni-P合金镀层和Ni-P-Cg复合镀层晶化激活能分别为308.9 kJ·mol^-1和412.99 kJ·mol^-1、指前因子A分别为58.03 s^-1和77.84 s^-1,确定了Ni-P合金镀层和复合镀层晶化动力学方程。