Investigation of nucleation processes under the influence of magnetic fields

The present work demonstrates the possibilities and the limits of the in situ electrochemical scanning tunneling microscopy for investigation of nucleation processes in magnetic fields on the examples of Cu and Co electrodeposition onto Au(111) electrodes from sulfate electrolytes with pH 3. Cyclic voltammograms of Cu in the underpotential range (UPD) exhibit no significant change in the cathodic and anodic peaks recorded in magnetic fields parallel to the surface. In magnetic fields of a permanent magnet, the reconstruction of Au has been annihilated during UPD of Cu. In the overpotential range, the dissolution of Cu is inhibited. This triggers the formation of a Cu–Au surface alloy. The UPD deposition of Co onto Au(111) could be proven without magnetic field, which leads to the formation of two monolayers. The nucleation in an applied field could not be observed due to higher induced fluctuations and microconvective effects. Contribution to special issue “Magnetic field effects in Electrochemistry”.     

铅在铜上电沉积的原位椭圆偏振法

采用循环伏安法(CV)和原位椭圆偏振法(SE)研究铅在铜电极上的电沉积行为。 原位椭圆偏振参数Ψ和Δ值的变化率在CV图峰电位处同时出现极值。 通过建立单层膜模型描述“电极-溶液”界面的结构并对椭圆偏振光谱数据进行拟合得到铅沉积层厚度随电位的变化规律。 拟合结果显示,铅在铜电极上的电沉积有3个不同的沉积速率,-0.20～-0.35 V之间沉积速率为0.003 nm/mV,-0.35～-0.48 V之间沉积速率为0.025 nm/mV,-0.48～-0.60 V之间沉积速率为0.116 nm/mV,由此表明铅的电沉积分为3个不同阶段：欠电位沉积阶段、欠电位沉积向本体沉积的过渡阶段和本体沉积阶段。     

Underpotential deposition of Cu on partially oxidized Rh electrodes

The underpotential deposition (UPD) of copper on partially oxidized rhodium electrodes was studied in acid medium using potentiodynamic techniques. The process was analyzed as a function of the potential and time of deposition. The potentiodynamic I-E patterns for the oxidative dissolution of Cu provide evidence for the existence of a chemical reaction between Cu and oxygen existing on the electrode surface. Redistribution of the active sites is also possible when appreciable quantities of oxidized species are simultaneously reduced by the UPD process. The partially oxidized rhodium electrodes were prepared by cyclic voltammetry and anodic polarization. The later method provided the most oxidized surfaces, but, even in this case, the degree of oxygen surface coverage was lower than that corresponding to a monolayer. Received: 11 July 1997 / Accepted: 10 February 1998     

Copper underpotential deposition at gold surfaces in contact with a deep eutectic solvent: New insights

The electrodeposition of copper on a polycrystalline gold electrode and on Au(hkl) single crystals was investigated in a deep eutectic solvent (DES). The DES employed consisted of a mixture of choline chloride and urea (1:2). The Au(hkl)/DES interface was studied using cyclic voltammetry in the capacitive region. The blank voltammograms showed characteristic features, not previously reported, that demonstrate the surface sensitivity of this solvent. Copper electrodeposition was then studied and it was found that this takes place through the formation of an underpotential deposition (UPD) adlayer, demonstrating the surface sensitivity of this process. Voltammetric profiles showed similarities with those obtained in aqueous solutions containing chloride, suggesting that the copper UPD in this DES is strongly influenced by the presence of chloride.     

Three-dimensional porous Au nanocoral structure decorated with Pt submonolayer via galvanic displacement of copper adatoms for electrooxidation of formic acid

Three-dimensional (3D) porous Au nanocoral network (GNN) structure was fabricated on glassy carbon (GC) electrode by one-step, template-free electrodeposition and decorated with ultrathin Pt film by combining the underpotential deposition (UPD) of copper adatoms and the galvanic displacement (GD) between PtCl₆^2- and Cu. The thickness of Pt atomic layers can be controlled precisely by repeating the UPD–GD process. Scanning electron microscopy (SEM) and high-resolution transmission electron microscopy (HRTEM) were employed to characterize the morphology of GNN and Pt_n/GNN (n, the cycles of repeating the UPD–GD process). Cyclic voltammometric and chronoamperometric tests indicate that all Pt_n/GNN samples effectively support the direct oxidation of formic acid and show higher electrocatalytic performance than the commercial Pt/C catalyst (Pt, 20 wt %, Johnson Matthey Co.), where Pt₁/GNN completely eliminates the indirect oxidation of formic acid, exhibiting the best electrocatalytic activity and stability among all Pt_n/GNN samples due to the optimal coverage and distribution of Pt atoms on GNN.     

Silver UPD ultra-thin film modified nanoporous gold electrode with applications in the electrochemical detection of chloride

Nanoporous noble metals are usually expected to exhibit much higher surface areas than smooth ones, making them of particular importance in many electrochemical applications. This paper describes a simple electrochemical method to modify a nanoporous Au (NPG) surface by using an under potentially deposited (UPD) Ag adlayer. The NPG electrode was obtained by the dealloying of Zn from Au_xZn_1−x in a 40-60 mol% zinc chloride-1-ethyl-3-methylimidazolium chloride (ZnCl₂-EMIC) ionic liquid. The Ag UPD modified nanoporous gold (NPG/Ag(UPD)) electrode possessed dual properties, including an intrinsic high surface area from the nanoporous structure and the characteristics of the Ag UPD adlayer. The potential utility of using NPG/Ag(UPD) for sensors was demonstrated by its excellent sensitivity and selectivity in the electrochemical determination of chloride ions. An atomic scale metal monolayer obtained in the UPD process was selected as a sensing agent. The long-term storability and operational stability of the electrode were strongly demonstrated. Specifically, two couples of redox waves at ∼552 mV and ∼272 mV, respectively, were observed in the cyclic voltammograms (CVs) of the NPG/Ag(UPD) after the adsorption of chloride ions. The first couple of redox waves was related to the UPD and silver stripping and the second couple of redox waves was induced by the adsorption of Cl⁻. The Cl⁻ adsorption process on the NPG/Ag(UPD) electrode followed the transient Langmuir adsorption kinetic model. The ratio of the integrated charges for these two anodic stripping peaks was selectively used to determine dilute chloride ion levels. The calibration curve was linear in the Cl⁻ concentration range of 0.5-30.0 μM.     

Copper UPD on Selenium-Modified Polycrystalline Pt Electrode

Underpotential deposition of Cu onto an Se-modified smooth polycrystalline Pt electrode in an acidic CuSO₄ solution was investigated using a cyclic voltammetry. It was obtained that the specific voltammetric pattern of Cu UPD observed for a clean Pt electrode disappeared and a new current peak at potentials much closer to bulk Cu deposition was formed. This feature of a cyclic voltammogram is similar to that observed earlier for clean Pt electrode in acidic CuSO₄ solutions containing selenite and also to that described for S-modified Pt electrode in an additive-free CuSO₄ solution. The reasons for the difference in the voltammetric behavior of bare Pt and Se-modified Pt in the potential range characteristic of Cu UPD were considered. A model of Cu deposition taking place onto the free Pt sites at more positive potentials and onto the Se-covered ones at less positive potentials was discussed with closer scrutiny.     

A general model of metal underpotential deposition in the presence of thiol-based additives based on an in situ STM study

Bis(3-sulfopropyl)disulfide (SPS) is a common additive in commercial copper electroplating baths. We have studied the influence of SPS on Cu underpotential deposition (UPD) on a Au(111) single crystal surface by means of cyclic voltammetry (CV) and electrochemical scanning tunneling microscopy (EC-STM). By combining our results with the results from the literature we propose a model that describes different stages of Cu UPD in the presence of SPS. Further analysis shows that our model is also applicable to a more general case of UPD of different metals, e.g. Cu and Ag, on a thiol-modified single-crystal surface, where the bond between the substrate and the thiol is adatom mediated. In addition, we have verified our model by in situ observation of the lifting of the Herringbone reconstruction on the Au(111) surface by Cu UPD.     

Cadmium atomic layers on tellurium electrodes

The process of electrodeposition of atomic layers of cadmium Cd_ad at order of magnitude polycrystalline tellurium electrodes at potentials in excess of equilibrium potential E _Cd ²⁺/_Cd (underpotential deposition, UPD) is studied. In acid sulfate solutions (0.1 M H₂SO₄ + 0.05 M CdSO₄), the magnitude of underpotential (underpotential shift) ΔE ^UPD = 0.41 V. In cyclic voltammograms, the anodic oxidation of Cd_ad is recorded in the form of two peaks of anodic current that are displaced relative to one another in the potential scale (weakly and strongly bound adatoms). The cadmium UPD process on tellurium is accompanied by the diffusion of cadmium into the bulk of tellurium and a transition from a 2D structure Cd_ad/Te to 3D CdTe nanostructures, which are distributed in the tellurium matrix. In contrast with tellurium, the Te/CdTe_nano heterostructure exhibits photoelectrochemical activity, i.e. it generates a cathodic photocurrent.     

Characterization of Pt@Cu core@shell dendrimer-encapsulated nanoparticles synthesized by Cu underpotential deposition

Dendrimer-encapsulated nanoparticles (DENs) containing averages of 55, 147, and 225 Pt atoms immobilized on glassy carbon electrodes served as the electroactive surface for the underpotential deposition (UPD) of a Cu monolayer. This results in formation of core@shell (Pt@Cu) DENs. Evidence for this conclusion comes from cyclic voltammetry, which shows that the Pt core DENs catalyze the hydrogen evolution reaction before Cu UPD, but that after Cu UPD this reaction is inhibited. Results obtained by in situ electrochemical X-ray absorption spectroscopy (XAS) confirm this finding.     

离子液体中Au(111)和Pt(111)表面Ge欠电位沉积的现场STM研究

本文研究BMIPF₆离子液体中Au(111)和Pt(111)表面Ge的电沉积行为. 循环伏安法测试结果表明,在含0.1 mol·L^-1 GeCl₄的BMIPF₆溶液Au(111)和Pt(111)表面均有两个与Ge沉积过程相关的还原峰. 第一个还原峰包含了Ge⁴⁺还原成Ge²⁺及Ge的欠电位沉积,第二个还原峰对应Ge的本体沉积. 现场扫描隧道显微镜研究结果表明,Ge在Au(111)和Pt(111)表面均有两层欠电位沉积. 第一层欠电位沉积厚度约为0.25 nm、形貌平整、带有缝隙的亚单层结构. 第二层欠电位沉积形貌相对粗糙的点状团簇结构. 该欠电位沉积过程伴随表面合金化.     

Electrochemical deposition of praseodymium (III) and copper (II) and extraction of praseodymium on copper electrode in LiCl-KCl melts

Cyclic voltammogram and square wave voltammograms indicated that Cu (II) ion being reduced to Cu(0) was a two-electron process: Cu(II)?+?e^??→?Cu(I) and Cu(I)?+?e^??→?Cu(0). The diffusion activation energy for Cu (I) ions was calculated as 42.85 kJ mol^?1. The equilibrium potential and apparent standard potential for Cu (I)/Cu(0) redox couple was measured by open circuit chronopotentiometry at a temperature of 773–923 K. Three reduction peaks, corresponding to the formation of Pr_xCu_y intermetallic compounds, were detected from cyclic voltammogram and square wave voltammogram obtained by co-reduction of Pr (III) and Cu (II) or electrodeposition of Pr (III) on Cu electrode. Furthermore, potentiostatic electrolysis was performed to extract the element Pr on Cu electrode, and the electrolytic products were analyzed by scanning electron microscopy equipped with energy dispersive spectrometry. Meanwhile, the highest extraction efficiency of Pr (III) ions could reach about 99.81% at ??2.20 V for 22 h at 823 K.     

Cu + Au alloy particles formed in the underpotential deposition region of copper in acid solutions

Cu + Au alloy particles electrodeposited on an amorphous carbon electrode at the underpotential region of Cu in both perchloric acid and sulfuric acid solutions were investigated by means of transmission electron microscopy. The fraction of Cu in the Cu + Au alloy particles grown in both acid solutions with a concentration of 1 mM Au ion increased while the underpotential deposition (UPD) potential was decreased. However, it was independent of the concentration of Cu ion in solution. It is inferred that the composition of the Cu + Au alloy particles is dependent on the UPD potential. The fraction of Cu in the Cu + Au alloy particles grown at around the reversible Nernst potential of Cu in 0.1 mM HAuCl₄ + 50 mM Cu(ClO₄)₂ containing perchloric acid solution was 505. This result suggests a layer-by-layer formation of the Cu + Au alloy particles. The fraction of Cu in the Cu + Au alloy particles formed in the presence of sulfate was lower than that in the perchloric acid solution as the UPD potential and the concentration of Cu ion were the same. This is attributed to an influence of coadsorbed sulfate ions.     

Underpotential Deposition‐Induced Synthesis of Composition‐Tunable Pt?Cu Nanocrystals and Their Catalytic Properties

Pt? Cu alloy octahedral nanocrystals (NCs) have been synthesized successfully by using N,N‐dimethylformamide as both the solvent and the reducing agent in the presence of cetyltrimethylammonium chloride. Cu underpotential deposition (UPD) is found to play a key role in the formation of the Pt? Cu alloy NCs. The composition in the Pt? Cu alloy can be tuned by adjusting the ratio of metal precursors in solution. However, the Cu content in the Pt? Cu alloy NCs cannot exceed 50 %. Due to the fact that Cu precursor cannot be reduced to metallic copper and the Cu content cannot exceed 50 %, we achieved the formation of the Pt? Cu alloy by using Cu UPD on the Pt surface. In addition, the catalytic activities of Pt? Cu alloy NCs with different composition were investigated in electrocatalytic oxidation of formic acid. The results reveal that the catalytic performance is strongly dependent on Pt? Cu alloy composition. The sample of Pt₅₀Cu₅₀ exhibits excellent activity in electrocatalytic oxidation of formic acid.     

Open circuit stability of underpotentially deposited Pb monolayer on Cu(1 1 1)

The stability of underpotentially deposited (UPD) Pb layer on Cu(1 1 1) is investigated by conventional electrochemical techniques in perchlorate solution at open circuit potential (OCP). In situ scanning tunneling microscopy (STM) is employed to monitor and ascertain structural and morphological changes at characteristic potentials. A corrosion-like mechanism associated with UPD layer stripping powered by reduction processes is found to operate in the system of interest in absence of potential control. OCP transients suggest strong dependence of the Pb layer stability upon the concentration of oxidizing agents, such as oxygen and/or nitrate ions, present in the solution. It is found that the increase of the oxidizing agent concentration results in a proportional decrease of the Pb UPD layer stripping time at OCP. The concentration of the dissolved oxygen is found to affect the UPD layer behavior in the entire range of underpotentials in accordance with the strong affinity of the Pb²⁺/Cu(1 1 1) system to the oxygen reduction reaction (ORR). In contrast to oxygen, nitrate ions appear to play active role only in the potential range positive to the UPD peaks where mostly bare Cu surface is in contact with the solution. Specifically adsorbing Cl⁻ ions are examined as a possible inhibitor of the reduction processes operating in the Pb underpotential range. Concentrations of Cl⁻ ions as low as 1 × 10⁻⁴ M are found to stabilize the Pb UPD layer by a factor of 2.5.     

Underpotential Deposition Study and Determination of Bismuth on Gold Electrode by Using Voltammetry

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In situ STM imaging of bis-3-sodiumsulfopropyl-disulfide molecules adsorbed on copper film electrodeposited on Pt(111) single crystal electrode

The adsorption of bis-3-sodiumsulfopropyldi-sulfide (SPS) on metal electrodes in chloride-containing media has been intensively studied to unveil its accelerating effect on Cu electrodeposition. Molecular resolution scanning tunneling microscopy (STM) imaging technique was used in this study to explore the adsorption and decomposition of SPS molecules concurring with the electrodeposition of copper on an ordered Pt(111) electrode in 0.1 M HClO(4) + 1 mM Cu(ClO(4))(2) + 1 mM KCl. Depending on the potential of Pt(111), SPS molecules could react, adsorb, and decompose at chloride-capped Cu films. A submonolayer of Cu adatoms classified as the underpotential deposition (UPD) layer at 0.4 V (vs Ag/AgCl) was completely displaced by SPS molecules, possibly occurring via RSSR (SPS) + Cl-Cu-Pt → RS(-)-Pt(+) + RS(-) (MPS) + Cu(2+) + Cl(-), where MPS is 3-mercaptopropanesulfonate. By contrast, at 0.2 V, where a full monolayer of Cu was presumed to be deposited, SPS molecules were adsorbed in local (4 × 4) structures at the lower ends of step ledges. Bulk Cu deposition driven by a small overpotential (η < 50 mV) proceeded slowly to yield an atomically smooth Cu deposit at the very beginning (<5 layers). On a bilayer Cu deposit, the chloride adlayer was still adsorbed to afford SPS admolecules arranged in a unique 1D striped phase. SPS molecules could decompose into MPS upon further Cu deposition, as a (2 × 2)-MPS structure was observed with prolonged in situ STM imaging. It was possible to visualize either SPS admolecules in the upper plane or chloride adlayer sitting underneath upon switching the imaging conditions. Overall, this study established a MPS molecular film adsorbed to the chloride adlayer sitting atop the Cu deposit.     

Pd/Pt二元合金电极的制备及氧还原性能

本文利用欠电位沉积亚单层的Cu及Pt置换取代Cu的方法, 制备了具有不同表面元素组成的Pd/Pt二元合金电极(用Pd/Ptx表示, x指欠电位沉积Cu-Pt置换取代Cu过程的次数),并对其表面元素组成、氧还原性能进行了表征. 在控制欠电位沉积Cu的下限电位恒定(0.34 V)的前提下, 表面Pt/Pd的元素组成比通过重复欠电位沉积Cu及Pt置换取代Cu的次数(1~5次)来可控地调变. 光电子能谱(XPS) 以及红外光谱实验表明,Pd/Ptx电极表层区的Pt：Pd元素组成比随着Pt沉积次数增加而增加, 对Pd/Pt4电极, 在电极表层区约2~3 nm内的Pt/Pd的原子比大约是1:4,而最表层裸露Pd原子的比例仍在20%以上。循环伏安结果显示, 随着Pt沉积次数的增加(1-5次), Pd/Ptx电极表面越不易被氧化。氧还原测试结果显示随着Pt沉积次数的增加(1~4次), Pd/Ptx二元金属电极的氧还原活性依次增加, 经过第3次沉积后其氧还原活性已优于纯Pt,而经4次以上沉积,其氧还原活性基本不变。在其它反应条件相同条件的前提下, Pd/Pt4电极上氧还原的半波电位与纯Pt相比右移约25 mV。结合本文与文献的实验结果,我们初步认为Pd/Ptx二元金属体系氧还原性能改善主要源自表层Pd原子导致其邻近的Pt原子上含氧物种吸附能的降低.     

Zinc underpotential deposition at Pt(111) and Pt(110) under the influence of boric acid and chloride anions

Zinc underpotential deposition (Zn UPD) was studied by cyclic voltammetry in solutions of various pH and composition, where the effects of the presence of boric acid or chloride in the solution were observed. We have found that the cyclic voltammograms of Zn UPD at Pt(111) were dependent on boric acid concentrations, zinc ion concentrations, and pH in acidic solutions. These suggest that the induced adsorption of borate by releasing of H⁺ is accompanied with Zn UPD. The preadsorbed chloride species on Pt(110) accelerate the UPD process by their removal just before the UPD, making the surface sites available for the process, and the UPD remains at identical electrode potentials, while the chloride ions do not take part in the induced adsorption on UPD Zn at Pt, as clearly found by the radiotracer method. These show that the anions play versatile roles in the process of adlayer formation by their different but essential chemical characteristics. Published in Russian in Elektrokhimiya, 2008, Vol. 44, No. 6, pp. 745–751 The text was submitted by the authors in English.     

Cobalt-modified nickel–zinc catalyst for electrooxidation of methanol in alkaline medium

Cobalt-modified nickel-zinc catalyst CuNi(Zn)Co is prepared on a copper substrate by using electrodeposition. Its catalytic efficiency for methanol oxidation is studied with cyclic voltammetry, chronoamperometry, and chronopotentiometry techniques. The surface morphology and chemical composition of catalyst are characterized by scanning electron microscopy and energy dispersive X-ray spectroscopy. The oxidation kinetic parameters activation energy (Ea), active species on the surface (Γ), and rate constant (k) are determined from cyclic voltammograms which are performed at different methanol concentrations and temperatures. The results show that Ni(Zn)Co catalyst has higher catalytic activity than Ni, Co, and NiZn coatings as a composite catalyst for a promising choice of methanol electrooxidation in the alkaline medium.