Stress intensity factors for an edge interface crack in a bonded semi-infinite plate for arbitrary material combination

Although a lot of interface crack problems were previously treated, few solutions are available under arbitrary crack lengths and material combinations. In this paper the stress intensity factors of an edge interface crack in a bonded strip are considered under tension with varying the crack length and material combinations systematically. Then, the limiting solutions are provided for an edge interface crack in a bonded semi-infinite plate under arbitrary material combinations. In order to calculate the stress intensity factors accurately, exact solutions in an infinite bonded plate are also considered to produce proportional singular stress fields in the analysis of FEM by superposing specific tensile and shear stresses at infinity. The details of this new numerical solution are described with clarifying the effect of the element size on the stress intensity factor. It is found that for the edge interface crack the normalized stress intensity factors are not always finite depending upon Dunders’ parameters. This behavior can be explained from the condition of the singular stress at the end of bonded strip. Convenient formulas are also given by fitting the computed results.     

界面裂纹问题中的权函数方法

本文将Ｐａｒｉｓ等确定均匀材料中裂纹尖端应力强度因子的权函数方法推广应用到界面裂纹问题，给出了界面裂纹尖端附近或无限大体半无限界面裂纹问题的权函数的显式表达式。利用此权函数表达式可以很简便地求解界面裂纹尖端附近一些外来作用引起的应力强度因子，比如任意分布力、相变应变、位错和热等。作为一个算例，本文计算了界面一侧一个刃型位错引起的应力强度因子。     

An Interface Crack for a Functionally Graded Strip Sandwiched Between Two Homogeneous Layers of Finite Thickness

In this paper, the behavior of an interface crack for a functionally graded strip sandwiched between two homogeneous layers of finite thickness subjected to an uniform tension is resolved using a somewhat different approach, named the Schmidt method. The Fourier transform technique is applied and a mixed boundary value problem is reduced to two pairs of dual integral equations in which the unknown variables are the jumps of the displacements across the crack surface. To solve the dual integral equations, the jumps of the displacements across the crack surfaces are expanded in a series of Jacobi polynomials. This process is quite different from those adopted in previous works. Numerical examples are provided to show the effects of the crack length, the thickness of the material layer and the materials constants upon the stress intensity factor of the cracks. It can be obtained that the results of the present paper are the same as ones of the same problem that was solved by the singular integral equation method. As a special case, when the material properties are not continuous through the crack line, an approximate solution of the interface crack problem is also given under the assumption that the effect of the crack surface interference very near the crack tips is negligible. Contrary to the previous solution of the interface crack, it is found that the stress singularities of the present interface crack solution are the same as ones of the ordinary crack in homogenous materials.     

Dynamic behavior of two collinear interface cracks between two dissimilar functionally graded piezoelectric/piezomagnetic material strips

The dynamic interaction of two collinear interface cracks between two dissimilar functionally graded piezoelectric/piezomagnetic material strips subjected to the anti-plane shear harmonic stress waves was investigated. By using the Fourier transform, the problem can be solved with the help of a pair of triple integral equations in which the unknown variable is jump of displacement across the crack surfaces. These equations are solved using the Schmidt method. Numerical examples are provided to show the effect of the functionally graded parameter, the circular frequency of the incident waves and the thickness of the strip upon stress, electric displacement and magnetic flux intensity factors of cracks.     

Interface crack problems for mode II of double dissimilar orthotropic composite materials

The fracture problems near the similar orthotropic composite materials are interface crack tip for mode Ⅱ of double disstudied. The mechanical models of interface crack for mode Ⅱ are given. By translating the governing equations into the generalized hi-harmonic equations, the stress functions containing two stress singularity exponents are derived with the help of a complex function method. Based on the boundary conditions, a system of non-homogeneous linear equations is found. Two real stress singularity exponents are determined be solving this system under appropriate conditions about bimaterial engineering parameters. According to the uniqueness theorem of limit, both the formulae of stress intensity factors and theoretical solutions of stress field near the interface crack tip are derived. When the two orthotropic materials are the same, the stress singularity exponents, stress intensity factors and stresses for mode II crack of the orthotropic single material are obtained.     

一种确定结合材料界面端应力强度因子的数值方法

基于弹性力平面问题的基本方程，给出了结合材料界面端的应力奇异性特征方程以及位移场和奇异应力场。提出了一种确定结合材料界面端应力强度因子的数值外插方法。对界面端区域进行了有限元网格单元划分。经过具体实例检验进一步确定了求解应力强度因子的最佳方向，该数值外插法的计算结果精度符合工程应用的要求，为工程材料强度的评价提供了有效的计算途径。     

界面裂纹问题中的弹性T项和应力强度因子

研究两相材料有限板含单边界面裂纹的断裂力学特性，对不同的材料组合用广义变分法分析了不同尺寸试件和裂纹长度下的应力强度因子和弹性T项，讨论了材料特性对应力强度因子和弹性T项的作用．分析了试件尺寸和裂纹长度对应力强度因子和弹性T项的影响．     

界面端附近裂纹的应力强度因子

结合材料的断裂形式可分为从界面端产生裂纹（沿界面或向母材内部层折）然后断裂与稍稍离开界面端处产生裂纹然后断裂这两种情况，在金属／陶瓷类结合材料中，后者出现的概率更大，本文利用结合材料界面端的奇异应力场和叠加原理，给出了界面端附近裂纹的应力强度因子近似计算公式，并用边界元数值计算验证了其有效性。     

弹性波与单侧界裂纹相互作用问题的边界元法

措助边界元法设计了一种迭代修正方法来求解单侧界面裂纹模型与弹性波的相互作用问题,作为对算法的检验,用这种方法我们具体地分析了平面简谐弹性波对一个则界面裂纹的入射,给出了裂纹面的接触形态及应力场。     

Mode-III interface edge crack between two bonded quarter-planes of dissimilar piezoelectric materials

Summary  The problem of an interface edge crack between two bonded quarter-planes of dissimilar piezoelectric materials is considered under the conditions of anti-plane shear and in-plane electric loading. The crack surfaces are assumed to be impermeable to the electric field. An integral transform technique is employed to reduce the problem under consideration to dual integral equations. By solving the resulting dual integral equations, the intensity factors of the stress and the electric displacement and the energy release rate as well as the crack sliding displacement and the electric voltage across the crack surfaces are obtained in explicit form for the case of concentrated forces and free charges at the crack surfaces and at the boundary. The derived results can be taken as fundamental solutions which can be superposed to model more realistic problems. Received 10 November 2000; accepted for publication 28 March 2001     

Fracture analysis of mode-II crack perpendicular to imperfect bimaterial interface

The problem of a mode-II crack close to and perpendicular to an imperfect interface of two bonded dissimilar materials is investigated.The imperfect interface is modelled by a linear spring with the vanishing thickness.The Fourier transform is used to solve the boundary-value problem and to derive a singular integral equation with the Cauchy kernel.The stress intensity factors near the left and right crack tips are evaluated by numerically solving the resulting equation.Several special cases of the mode-II crack problem with an imperfect interface are studied in detail.The effects of the interfacial imperfection on the stress intensity factors for a bimaterial system of aluminum and steel are shown graphically.The obtained observation reveals that the stress intensity factors are dependent on the interface parameters and vary between those with a fully debonded interface and those with a perfect interface.     

Dynamic behavior of two unequal parallel permeable interface cracks in a piezoelectric layer bonded to two half piezoelectric materials planes

IntroductionDuetotheintrinsicelectro_mechanicalcouplingbehavior,piezoelectricmaterialsareveryusefulinelectronicdevices.However,mostpiezoelectricmaterialsarebrittlesuchasceramicsandcrystals.Therefore ,piezoelectricmaterialshaveatendencytodevelopcriticalcracksduringthemanufacturingandthepolingprocesses.So ,itisimportanttostudytheelectro_elasticinteractionandfracturebehaviorsofpiezoelectricmaterials.Theincreasingattentiontothestudyofcrackproblemsinpiezoelectricmaterialshasledtoalotofsignificantw…     

Scattering of SH-waves by an interacting interface linear crack and a circular cavity near bimaterial interface

An analytical method is developed for scattering of SH-waves and dynamic stress concentration by an interacting interface crack and a circular cavity near bimaterial interface. A suitable Green‘s function is contructed, which is the fundamental solution of the displacement field for an elastic half space with a circular cavity impacted by an out-plane harmonic line source loading at the horizontal surface. First, the bimaterial media is divided into two parts along the horizontal interface, one is an elastic half space with a circular cavity and the other is a complete half space. Then the problem is solved according to the procedure of combination and by the Green‘s function method. The horizontal surfaces of the two half spaces are loaded with undetermined anti-plane forces in order to satisfy continuity conditions at the linking section, or with some forces to recover cracks by means of crack-division technique. A series of Fredholm integral equations of first kind for determining the unknown forces can be set up through continuity conditions as expressed in terms of the Green‘s function. Moreover, some expressions are given in this paper, such as dynamic stress intensity factor (DSIF) at the tip of the interface crack and dynamic stress concentration factor (DSCF) around the circular cavity edge. Numerical examples are provided to show the influences of the wave numbers, the geometrical location of the interface crack and the circular cavity, and parameter combinations of different media upon DSIF and DSCF.     

SCATTERING OF ANTI-PLANE SHEAR WAVES IN A FUNCTIONALLY GRADED MATERIAL STRIP WITH AN OFF-CENTER VERTICAL CRACK

The scattering problem of anti-plane shear waves in a functionally graded material strip with an off-center crack is investigated by use of Schmidt method. The crack is vertically to the edge of the strip. By using the Fourier transform, the problem can be solved with the help of a pair of dual integral equations that the unknown variable is the jump of the displacement across the crack surfaces. To solve the dual integral equations, the jump of the displacement across the crack surfaces was expanded in a series of Jacobi polynomials. Numerical examples were provided to show the effects of the parameter describing the functionally graded materials, the position of the crack and the frequency of the incident waves upon the stress intensity factors of the crack.     

The scattering of general SH plane wave by interface crack between two dissimilar viscoelastic bodies

The scattering of general SH plane wave by an interface crack between two dissimilar viscoelastic bodies is studied and the dynamic stress intensity factor at the crack-tip is computed. The scattering problem can be decomposed into two problems: one is the reflection and refraction problem of general SH plane waves at perfect interface (with no crack); another is the scattering problem due to the existence of crack. For the first problem, the viscoelastic wave equation, displacement and stress continuity conditions across the interface are used to obtain the shear stress distribution at the interface. For the second problem, the integral transformation method is used to reduce the scattering problem into dual integral equations. Then, the dual integral equations are transformed into the Cauchy singular integral equation of first kind by introduction of the crack dislocation density function. Finally, the singular integral equation is solved by Kurtz's piecewise continuous function method. As a consequence, the crack opening displacement and dynamic stress intensity factor are obtained. At the end of the paper, a numerical example is given. The effects of incident angle, incident frequency and viscoelastic material parameters are analyzed. It is found that there is a frequency region for viscoelastic material within which the viscoelastic effects cannot be ignored. This work was supported by the National Natural Science Foundation of China (No.19772064) and by the project of CAS KJ 951-1-20     

Dynamic behavior of two parallel symmetric permeable cracks in a piezoelectric strip

The dynamic behavior of two parallel symmetric cracks in a piezoelectric strip under harmonic anti-plane shear waves is studied using the Schmidt method for permeable crack surface conditions. The cracks are parallel to the edge of the strip. By means of the Fourier transform, the problem can be solved with the help of two pairs of dual integral equations. These equations are solved using the schmidt method. The results show that the stress and the electric displacement intensity factors depend on the geometry of the cracks, the frequency of incident waves, the distance between cracks and the thickness of the strip. It is also found that the electric displacement intensity factors for the permeable crack surface conditions are much smaller than those for the impermeable crack surface conditions. Project supported by the Post Doctoral Science Foundation of Heilongjiang Province, the Natural Science Foundation of Heilongjiang Province, the National Science Foundation with the Excellent Young Investigator Award (No. 19725209) and the Scientific Research Foundation of Harbin Institute of Technology (HIT.2000.30).     

两种各向异性材料界面共线裂纹的反平面问题

本文研究两种各向异性材料界面共线裂纹的反平面剪切问题。利用复变函数方法，提出了一般问题公式和某些实际重要问题的封闭形式解。考察了裂纹尖端附近的应力分布并给出了应力强度因子公式。从本文解签的特殊情形，可以直接导出两种各向同性材料界面裂纹，均匀各向异性材料共线裂纹以及均匀各向同性材料共线裂纹的相应问题公式，其中包括已有的经典结果。     

An interface crack with partially electrically conductive crack faces under antiplane mechanical and in-plane electric loadings

An interface crack in a bimaterial piezoelectric space under the action of antiplane mechanical and in-plane electric loadings is analyzed. One zone of the crack faces is electrically conductive while the other part is electrically permeable. All electro-mechanical values are presented using sectionally-analytic vector-functions and a combined Dirichlet-Riemann boundary value problem is formulated. An exact analytical solution of this problem is obtained. Simple analytical expressions for the shear stress, electric field and also for mechanical displacement jump of the crack faces are derived. These values are also presented graphically along the corresponding parts of the material interface. Singular points of the shear stress, electric field and electric displacement jump are found. Their intensity factors are determined as well. Intensity factors variations with respect to the external electric field and different ratios between the electrically conductive and electrically permeable crack face zones are also demonstrated.     

INTERFACE CRACK IN BIPIEZOTHERMOELASTIC MEDIA

By using the extended version of Eshelby-Stroh's formulation and the method of analyt-ical continuation,the problems of interface cracks are reduced to a Hilbert problem of vector form.Ageneral explicit closed form solution for the piezothermoelastic interface crack problem is then ob-tained,the whole field solutions of temperature,heat flux,displacements,electric field,stress andelectric induction are given,the explicit expressions for the crack opening displacements and electricpotential are also provided.     

Stress intensity factors for interface crack in finite size specimen using a generalized variational approach

A generalized variational approach together with eigenfunction expansion is applied to determine the stress intensity factors for interface crack in finite size specimen. Application is also made of the complex potentials such that a complex stress intensity factor with components corresponding to the Mode I and II stress intensity factors can be identified with one of the leading coefficients in the eigenfunction expansion. Obtained are the numerical values of the stress intensity factors for an interface edge crack in a bimaterial rectangular specimen. The outside boundary is subjected to uniform stress normal and parallel to the crack. Solutions are also obtained for the same crack aand specimen geoinetry is subjected to a pair of equal and opposite concentrated forces along the open end away from the edge crack. The third example pertains to the case of three-point bending where the centre concentrated load is directed along the interface dividing the two materials. Numerical results are obtained for four different combinations of the bimaterial specimen with an interface edge crack.