Si(001)基片上反应射频磁控溅射ZnO薄膜的两步生长方法

利用反应射频磁控溅射技术，采用两步生长方法制备了ZnO薄膜，探讨了基片刻蚀时间和低温过渡层沉积时间对ZnO薄膜生长行为的影响.研究结果表明，低温ZnO过渡层的沉积时间所导致的薄膜表面形貌的变化与过渡层在Si(001)表面的覆盖度有关.当低温过渡层尚未完全覆盖基片表面时，ZnO薄膜的表面岛尺度较小、表面粗糙度较大，薄膜应力较大；当低温过渡层完全覆盖Si(001)基片后，ZnO薄膜的表面岛尺度较大、表面粗糙度较小，薄膜应力较小.基片刻蚀时间对薄膜表面形貌的影响与低温过渡层的成核密度有关.随着刻蚀时间的增加，ZnO薄膜的表面粗糙度逐渐下降，表面形貌自仿射结构的关联长度逐渐减小. 关键词： ZnO薄膜 反应射频磁控溅射 两步生长 形貌分析     

缓冲层对InSb/GaAs薄膜质量的影响

InSb是制作3~5μm红外探测器的重要材料。在GaAs衬底上外延生长InSb,存在的主要问题在于两种材料间14.6%的晶格失配度,会引入较大的表面粗糙度以及位错密度,使外延材料的结构和电学性能均会受到不同程度的影响。通过系列实验,研究了在生长过程中缓冲层对薄膜质量的影响。利用高能电子衍射仪(RHHEED)得到了合适的生长速率和Ⅴ/Ⅲ比,研究了异质外延InSb薄膜生长中低温InSb缓冲层对材料生长质量以及不同外延厚度对材料电学性质的影响。采用原子力显微镜(AFM)、透射电子显微镜(TEM)、X射线双晶衍射(DCXRD)等方法研究了InSb/GaAs薄膜的表面形貌、界面特性以及结晶质量。通过生长合适厚度的缓冲层,获得了室温下DCXRD半高峰宽为172″,77 K下迁移率为64300 cm²·V^-1·s^-1的InSb外延层。     

低温缓冲层对氧化锌薄膜质量的影响

利用金属有机化学气相沉积(MOCVD)法,在Si衬底上外延生长ZnO薄膜。为了改善氧化锌薄膜的质量,首先在Si衬底上生长低温ZnO缓冲层,然后再生长高质量的ZnO薄膜。通过XRD、SEM、光致发光(PL)光谱的实验研究,发现低温ZnO缓冲层可有效降低ZnO薄膜和Si衬底之间的晶格失配以及因热膨胀系数不同引起的晶格畸变。利用低温缓冲层生长的ZnO薄膜的(002)面衍射峰的强度要比直接在Si上生长的ZnO薄膜样品的高,并且衍射峰的半高宽也由0.21°减小到0.18°,同时有低温缓冲层的样品室温下的光致发光峰也有了明显的增高。这说明利用低温缓冲层生长的ZnO薄膜的结晶质量和光学性质都得到了明显改善。     

两步生长法生长的Inx Ga1-x As/GaAs材料及性质

利用LP-MOCVD技术,采用两步生长法在GaAs(100)单晶衬底上外延生长InxGa1-xAs材料。通过扫描电子显微镜( SEM)与原子力显微镜( AFM)观察了缓冲层厚度对外延层表面形貌、表面粗糙度的影响;利用X射线衍射( XRD)分析了缓冲层厚度对外延层结晶质量的影响;利用拉曼光谱分析了缓冲层厚度对外延层材料合金有序度的影响;通过透射电子显微镜( TEM)观察了外延层材料位错的分布状态,计算了外延层的位错密度。实验结果表明,两步生长法生长的Inx Ga1-x As/GaAs异质结材料的缓冲层厚度存在一个最优值。     

ZnO/A1lN/Si(111)薄膜的外延生长和性能研究

用常压金属化学气相沉积法(MOCVD)在Si(111)衬底上制备了马赛克结构ZnO单晶薄膜.引入低温AlN缓冲层以阻止衬底氧化、缓解热失配和晶格失配.薄膜双晶X射线衍射2θ/ω联动扫描只出现了Si(111)、ZnO(000l)及AlN(000l)的衍射峰.ZnO/AlN/Si(111)薄膜C方向晶格常量为0.5195 nm,表明在面方向处于张应力状态;其对称(0002)面和斜对称(1012)面的双晶X射线衍ω摇摆曲线半峰全宽分别为460"和1105";干涉显微镜观察其表面有微裂纹,裂纹密度为20 cm-1;3 μm×3μm范围的原子力显微镜均方根粗糙度为1.5 nm激光实时监测曲线表明薄膜为准二维生长,生长速率4.3μm/h.低温10 K光致发光光谱观察到了薄膜的自由激子、束缚激子发射及它们的声子伴线.所有结果表明,采用金属化学气相沉积法并引入AlN为缓冲层能有效提高Si(111)衬底上ZnO薄膜的质量.     

ZnO／AlN／Si（111）薄膜的外延生长和性能研究

用常压金属化学气相沉积法(MOCVD)在Si(111)衬底上制备了马赛克结构ZnO单晶薄膜。引入低温Al N缓冲层以阻止衬底氧化、缓解热失配和晶格失配。薄膜双晶X射线衍射2θ/ω联动扫描只出现了Si(111)、ZnO(000l)及Al N(000l)的衍射峰。ZnO/Al N/Si(111)薄膜C方向晶格常量为0.5195nm,表明在面方向处于张应力状态;其对称(0002)面和斜对称(1012)面的双晶X射线衍ω摇摆曲线半峰全宽分别为460″和1105″;干涉显微镜观察其表面有微裂纹,裂纹密度为20cm-1;3μm×3μm范围的原子力显微镜均方根粗糙度为1.5nm;激光实时监测曲线表明薄膜为准二维生长,生长速率4.3μm/h。低温10K光致发光光谱观察到了薄膜的自由激子、束缚激子发射及它们的声子伴线。所有结果表明,采用金属化学气相沉积法并引入Al N为缓冲层能有效提高Si(111)衬底上ZnO薄膜的质量。     

硅基锗薄膜选区外延生长研究

利用超高真空化学气相沉积系统, 基于低温Ge缓冲层和选区外延技术, 在Si/SiO₂图形衬底上选择性外延生长Ge薄膜. 采用X射线衍射、扫描电镜、原子力显微镜、拉曼散射光谱等表征了其晶体质量和应变等参数随图形尺寸的变化规律. 测试结果显示, 位错密度随着图形衬底外延窗口的尺寸减小而减少, Ge层中的张应变随窗口尺寸的增大先增大而后趋于稳定. 其原因是选区外延Ge在图形边界形成了(113)面, 减小了材料系统的应变能, 而单位体积应变能随窗口尺寸的增加而减少; 选区外延厚度为380 nm的Ge薄膜X射线衍射曲线半高宽为678", 表面粗糙度为0.2 nm, 表明选区生长的Ge材料具有良好的晶体质量, 有望应用于Si基光电集成.     

六方氮化硼成核层减小MOCVD外延生长氮化铝薄膜的应力及裂纹（英文）

利用单层六方BN材料(hexagonal BN:hBN)作为成核层,用金属有机物化学气相沉积法生长AlN薄膜,得到应力小裂纹少的外延材料。实验中,对hBN材料进行人为表面化学修饰,以增加hBN的缺陷和后续AlN生长的成核中心。对比分析了有无hBN成核层时生长的AlN薄膜质量,证实了hBN有助于减少AlN外延层中的裂纹,空气孔隙及应力。研究了V/III生长参数对AlN薄膜表面形貌、晶体质量和应力的影响,得到合适的生长窗口,获得完全无应力的氮化铝外延层,且其位错密度与蓝宝石上生长的氮化铝相当.     

在c-面蓝宝石上控制生长高质量的ZnO单晶薄膜

利用Mg O和低温Zn O的缓冲层技术,在c面蓝宝石衬底上用等离子体辅助分子束外延(P-MBE)的方法生长了高质量的Zn O单晶薄膜。通过XRD测试,Zn O薄膜样品具有c轴方向的择优取向,其(002)方向摇摆曲线的半高宽(FWHM)仅为68.4 arcsec,(102)方向摇摆曲线的半高宽(FWHM)为1 150 arcsec,显示了外延薄膜极高的晶体质量。另外从扫描电子显微测试结果和原子力显微测试结果来看,Zn O薄膜具有极为平整的表面,3μm×3μm面积内的均方根粗糙度仅为0.842 nm,接近原子级的平整。拉曼光谱(Raman)和荧光光谱(PL)测试结果显示,Zn O薄膜样品内部的应力基本释放,而且具有极低的点缺陷密度。高质量Zn O单晶薄膜的实现为Zn O基的光电器件的制备提供了坚实的基础。     

薄膜光学 制膜技术与装置

O484.1 2006043380ZnO/AlN/Si(111)薄膜的外延生长和性能研究=Growthand properties of ZnO fil m grown on Si (111) substratewith Al N buffer by MOCVD[刊,中]/郑畅达(南昌大学材料科学研究所教育部发光材料与器件工程研究中心.江西,南昌(330047)) ,王立…∥光学学报.—2006 , 26(3) .—463-466采用低温Al N为缓冲层在Si(111)衬底上生长出具有较高结晶质量和少裂纹的ZnO马赛克结构单晶薄膜。薄膜的生长为准二维过程,生长速率4 .3μm/h;样品表面裂纹密度仅为20 cm-1,3μm×3μm范围的原子力显微镜均方根粗糙度为1 .5 nm;低温10 …     

FORMATION OF A BURIED LAYER OF ALUMINIUM NITRIDE BY HIGH DOSE N2+ IMPLANTATION INTO ALUMINIUM

Aluminium films with various thickness between 700 nm and 1μm were deposited on Si (100) substrates, and 400 keV N₂⁺ ions with doses ranging from 4.3×10¹⁷ to 1.8×10¹⁸ N/cm² were implanted into the alu-minium films on silicon, Rutherford Backscattering (RBS) and channeling, secondary ion mass spectroscopy (SIMS), Fourier transform infrared spectra (FTIR), X-ray diffraction (XRD), transmission electron microscopy (TEM) and spreading resistance probes (SRP) were used to characterize the synthesized aluminium nitride. The experiments showed that when the implantation dose was higher than a critical dose N_c, a buried stoichiometric AlN layer with high resistance was formed, while no apparent AlN XRD peaks in the as-implanted samples were observed; however, there was a strong AlN(100) diffraction peak appearing after annealing at 500 ℃ for 1h. The computer program, Implantation of Reactive Ions into Silicon (IRIS), has been modified and used to simulate the formation of the buried AlN layer as N₂⁺ is implanted into aluminium. We find a good agreement between experimental measurements and IRIS simulation.     

Characterization of hetero-interfaces between group III nitrides formed by PLD and various substrates

We have grown group III nitride epitaxial films on various substrates by pulsed laser deposition and investigated structural properties of the surfaces and the hetero-interfaces using grazing incidence angle X-ray reflectivity (GIXR) and atomic force microscopy (AFM). It has been found that hetero-interfaces between PLD AlN and conventional substrates such as Al₂O₃ and Si are quite abrupt (about 0.5 nm) probably due to a less reactive growth ambience. However, we observed a thin interfacial layer (less than 10 nm) at the hetero-interface between AlN and (Mn,Zn)Fe₂O₄. The surface roughness of AlN is mainly determined by the extent of the lattice mismatch. It has been also found that the roughness at the hetero-interface between GaN and AlN formed by PLD coincides with the surface roughness of the AlN layer.     

Numerical investigation on threading dislocation bending with InAs/GaAs quantum dots

The threading dislocations (TDs) in GaAs/Si epitaxial layers due to the lattice mismatch seriously degrade the performance of the lasers grown on silicon. The insertion of InAs quantum dots (QDs) acting as dislocation filters is a pretty good alternative to solving this problem. In this paper, a finite element method (FEM) is proposed to calculate the critical condition for InAs/GaAs QDs bending TDs into interfacial misfit dislocations (MDs). Making a comparison of elastic strain energy between the two isolated systems, a reasonable result is obtained. The effect of the cap layer thickness and the base width of QDs on TD bending are studied, and the results show that the bending area ratio of single QD (the bending area divided by the area of the QD base) is evidently affected by the two factors. Moreover, we present a method to evaluate the bending capability of single-layer QDs and multi-layer QDs. For the QD with 24-nm base width and 5-nm cap layer thickness, taking the QD density of 10¹¹ cm^-2 into account, the bending area ratio of single-layer QDs (the area of bending TD divided by the area of QD layer) is about 38.71%. With inserting five-layer InAs QDs, the TD density decreases by 91.35%. The results offer the guidelines for designing the QD dislocation filters and provide an important step towards realizing the photonic integration circuits on silicon.     

用激光分子束外延在Si衬底上外延生长高质量的TiN薄膜

采用激光分子束外延技术,利用两步法,在Si单晶衬底上成功地外延生长出TiN薄膜材料.原子力显微镜分析结果显示, TiN薄膜材料表面光滑,在10 μm×10 μm范围内,均方根粗糙度为0842nm.霍耳效应测量结果显示,TiN薄膜在室温条件下的电阻率为36×10^-5Ω·cm,迁移率达到5830 cm²/V·S,表明TiN薄膜材料是一种优良的电极材料.X射线θ—2θ扫描结果和很高的迁移率均表明,高质量的TiN薄膜材料被外延在Si衬底 关键词： 激光分子束外延 TiN单晶薄膜 外延生长     

硅基低位错密度厚锗外延层的UHV/CVD法生长

利用超高真空化学气相淀积系统, 基于低温缓冲层和插入应变超晶格的方法, 在Si(100)衬底上外延出厚度约为880 nm的纯Ge层. 采用X射线双晶衍射、高分辨透射电镜、原子力显微镜和光致发光谱分别表征了其结构及光学性质. 测试结果显示外延Ge的X射线双晶衍射曲线半高宽为273", 表面均方根粗糙度为0.24 nm, 位错密度约为1.5×10⁶ cm². 在室温下观测到外延Ge的直接带跃迁光致发光, 发光峰值位于1540 nm. 表明生长的Si基Ge材料具有良好的结晶质量, 可望在Si基光电子器件中得到应用.     

退火温度对新型有源层WZTO薄膜晶体管性能的影响

通过溶液法制备了新型有源层钨锌锡氧化物(WZTO)薄膜晶体管(TFT),研究了不同退火温度对WZTO薄膜和TFT器件性能的影响。XRD结果表明即使退火温度达到500℃,WZTO薄膜仍为非晶态结构。W掺杂显著降低了薄膜表面粗糙度,其粗糙度均从0. 9 nm降低到0. 5 nm以下;但不影响薄膜可见光透过率,其透过率均大于85%。同时XPS分析证实随退火温度升高,WZTO薄膜中对应氧空位的峰增加。制备的WZTO器件阈值电压由8. 04 V降至3. 48 V,载流子迁移率随着退火温度的升高而增大,开关电流比达到107。     

VIOLET LIGHT-EMISSION FROM Ge+-IMPLANTED SiO2 FILMS ON Si SUBSTRATE

Germanium ions were implanted into SiO₂ films which were thermally grown on crystalline Si at an energy of 60 keV and with doses of 1×10¹⁵ and 1×10¹⁶ cm^-2.Under an ultraviolet excitation of ～5.0 eV,the implanted f ilms annealed at various temperatures exhibit intense violet luminescence with a peak at 396 nm.It is ascribed to the T₁→S₀ transition in GeO,which was formed during implantation and annealing process.     

Thermal stability of SiGe films on an ultra thin Ge buffer layer on Si grown at low temperature

The thermal stability of SiGe films on an ultra thin Ge buffer layer on Si fabricated at low temperature has been studied. The microstructure and morphology of the samples were investigated by high-resolution X-ray diffraction, Raman spectra and atomic force microscopy, and using a diluted Secco etchant to reveal dislocation content. After thermal annealing processing, it is observed that undulated surface, threading dislocations (TDs) and stacking faults (SFs) appeared at the strained SiGe layer, which developed from the propagation of a misfit dislocation (MD) during thermal annealing, and no SFs but only TDs formed in strain-relaxed sample. And it is found that the SiGe films on the Ge layer grown at 300 °C has crosshatch-free surface and is more stable than others, with a root mean square surface roughness of less than 2 nm and the threading dislocation densities as low as ∼10⁵ cm⁻². The results show that the thermal stability of the SiGe films is associated with the Ge buffer layer, the relaxation extent and morphology of the SiGe layer.