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利用分子动力学方法研究了H原子与C/Be样品的相互作用过程,当H原子轰击C/Be样品时,发现有一些H原子渗入样品中并且滞留在样品中,H原子的滞留率随H原子的初始入射能量的升高呈线性增长,有些沉积在样品中H原子与C原子相互作用形成H-C键。溅射产物以H原子和H2分子为主。H和H2的产额率随初始入射能量的变化趋势相反,分析了不同机制下产物H和H2的产额率随初始入射能量的关系,且通过分析H原子的入射能量和样品的原子密度的关系来研究轰击后的样品,发现样品中原子分布变化很小,同时分析了化合物中的化学键分布变化较小,只是其化学键的分布峰向样品表面移动。     

50-5000 eV电子被C4H8O, C5H10O2, C6H5CH3和C4H8O2散射的总截面

使用电子被C, H和O原子散射总截面的实验数据, 利用修正后的可加性规则计算了能量为50-5000 eV的电子被4个复杂大分子C4H8O, C5H10O2, C6H5CH3和C4H8O2散射的总截面, 并将计算结果与实验结果及其他理论计算结果进行了比较. 结果表明, 即使是在几十电子伏的入射能量下, 修正后的可加性规则计算出的总截面依然能与实验结果符合很好, 而使用未修正的可加性规则进行计算, 即使是在几百电子伏的入射能量下得到的总截面仍偏离实验值较远. 分析表明, 未修正的可加性规则计算得到的总截面在中低能区过大、随电子入射能量的增加而衰减太快的问题是由可加性规则本身引起的, 其实质是未考虑低能下分子内原子间的相互屏蔽对散射总截面的计算所带来的影响.     

入射能量对H2+与SiC表面相互作用影响的分子动力学模拟

用分子动力学方法研究了入射能量对 H2+与 SiC 样品表面相互作用的影响.模拟结果表明,在 H2+轰击 SiC 样品表面的初始阶段,样品中 H 原子的滞留量增加较快,其后,增加的速率减慢,并逐渐趋于饱和.入射能量越大,样品中 H 原子的滞留量也就越大.样品在 H2+的轰击下,样品 Si、C 原子会发生刻蚀.入射能量越...     

质子对BaTiO3薄膜辐照损伤的计算机模拟

本文先应用分子动力学模拟BaTiO₃体系在初级击出原子(primary knock-on atom, PKA)轰击下缺陷产生和复合的动力学过程, 模拟结果表明：PKA的方向和能量对缺陷数目有重要影响, 并计算了Ba, O和Ti原子的平均位移阈能分别为69 eV, 51 eV和123 eV, 远大于SRIM程序默认的位移阈能25 eV. 然后应用蒙特卡罗软件包SRIM, 模拟质子在BaTiO₃薄膜中的能量损失过程, 比较位移阈能对模拟结果的影响, 分析质子能量和入射角度对空位数量以及分布的影响. 结果表明空位数量随着质子能量增加而增加, 增加的速率随能量的增加是降低的;当入射角度大于60°, 空位数量随入射角增大而明显减少.     

分子动力学模拟H原子与Si的表面相互作用

通过分子动力学模拟了入射能量对H原子与晶Si表面相互作用的影响. 通过模拟数据与实验数据的比较, 得到H原子吸附率随入射量的增加 呈先增加后趋于平衡的趋势. 沉积的H原子在Si表面形成一层氢化非晶硅薄膜, 刻蚀产物(H₂, SiH₂, SiH₃和SiH₄)对H原子吸附率趋于平衡有重要影响, 并且也决定了样品的表面粗糙度. 当入射能量为1 eV时, 样品表面粗糙度最小. 随着入射能量的增加, 氢化非晶硅薄膜中各成分(SiH, SiH₂, SiH₃)的量以及分布均有所变化. 关键词： 分子动力学 吸附率 表面粗糙度 氢化非晶硅薄膜     

30-5000eV的电子被若干分子散射的总截面计算的一种修正势方法

利用可加性规则，使用Hartree-Fock波函数，采用由束缚原子概念修正过的复光学势，在30~5000eV这一较大的能域内对电子被N2、NO、NO2、CH4、CF4、CF3H、C2H2及C2H4散射的总截面进行了计算。束缚原子不同于自由原子之处，是束缚原子概念考虑了不同分子中的不同的电子云重叠情况，并根据电子云的重叠情况对复光学势进行修正。文中，将定量的计算结果与实验结果及其它理论计算结果进行了比较，结果显示出在30~5000eV内，计算结果与实验结果及其它理论计算结果间有较好的一致性。同时结果也表明，在较低的能量下，尤其是当入射电子的能量低于500eV时，利用被束缚原子概念修正过的复光学势进行计算得到的结果，要比利用未被束缚原子概念修正的复光学势计算得到的结果更接近于实验值。因此，在复光学势中考虑电子云的重叠效应可改善电子被分子散射的总截面的计算精度。     

电子与钠原子散射的S,T,U参数研究

电子原子散射中的S,T,U参数可用来描述散射前后自旋状态的变化,研究精细结构水平上的散射激发振幅之间的关系,进而揭示电子原子碰撞过程中电子自旋-轨道耦合以及电子-电子交换等自旋相关效应.采用扭曲波玻恩近似计算了钠原子受电子散射S→P跃迁中的S,T,U参数,分析了多种入射能(2.2-60 eV)的电子与钠原子激发S→P跃迁过程的S,T,U参数随散射角的分布,其中对10 eV入射能的Sp参数与已报道实验数据符合一致.结果表明,较低能电子入射下的S,T,U参数随散射角的分布幅度和起伏都比较明显,入射能大于40 eV的电子入射,S,T,U参数的散射角分布变化很小.     

低能离子束诱导Ag表面纳米金字塔微结构

利用离子束溅射诱导实验方法,在单晶Si(100)基底上辅助沉积银膜,研究了低能Ar+离子束30°入射时,不同离子束能量和束流密度以及基底温度对Ag纳米结构的影响.结果表明:在较低基底温度下(32~100℃)辅助沉积银膜,膜层表面会呈现排列紧密、晶粒尺寸一致的金字塔状纳米结构.当温度升高时(32~200℃),纳米微结构横向尺寸λc迅速增加,而粗糙度先减小(32~100℃)后迅速增大(100~200℃);当离子束能量1 400eV、束流密度15~45μA/cm2时,在相同温度下,随着离子束束流密度的增大,纳米晶粒横向尺寸基本不变,粗糙度略有增加;当离子束流密度为15μA/cm2、能量1 000~1 800eV时,在相同温度下,随着离子束能量的增加,银纳米结构尺寸增加,而表面粗糙度先增加,然后缓慢减小.自组织纳米结构的转变是溅射粗糙化和表面驰豫机制相互作用的结果.     

低能Cu原子簇沉积薄膜的分子动力学模拟

用分子动力学计算机模拟研究了能量为5—20eV/atorn,结构为正二十面体的(Cu)₁₃原子簇在Cu（001）表面的沉积过程.采用紧束缚势同Moliers势的结合描述Cu原子间相互作用通过原子簇-衬底相互作用的“快照”研究沉积的动态过程．结果表明,当入射能量较低时,轰击弛豫后,入射原子簇在衬底表面发生重构,生成很好的外延层,靶没有任何损伤．随着轰击能量的增加,原子簇原子穿入靶的深度增加.当入射能量达到20eV/atom时,原子簇完全穿入靶并开始造成辐照损伤,表面出现空位,靶内产生间     

低能原子沉积在Pt(111)表面的分子动力学模拟

采用嵌入原子方法的原子间相互作用势,利用分子动力学方法模拟了六种贵金属原子(Ni,Pd,Pt,Cu,Ag,Au)分别在Pt(111)表面低能沉积的动力学过程.结果表明:随着入射能量从0.1eV升高到200eV,基体表面原子是按层迁移的,沉积过程对基体表面的影响和沉积原子在基体表层的作用均存在两个转变能量(ET1≈5eV,ET2≈70eV).当入射能量低于5eV时,基体表面几乎没有吸附原子和空位形成,沉积原子在基体表层几乎没有注入产生;当入射能量在5—70eV范围内时,沉积原子在基体表层有注入产生,其注入深度小于两个原子层,即为亚注入,此时吸附原子主要由基体表层原子形成,基体表面第三层以下没有空位形成;当入射能量高于70eV时,沉积原子的注入深度大于两个原子层,将会导致表面以下第三层形成空位,并且空位产额随入射能量的升高而急剧增加.基于分子动力学模拟的结果,对低能沉积作用下的薄膜生长以及最优沉积参数的选择进行了讨论.     

CH基团与金刚石(111)面的碰撞反应及其对碳膜生长的影响

等离子体增强化学气相沉积技术中的碳膜选择性自组装机理是高性能碳膜制备过程中的挑战性基础课题.采用经典分子动力学方法,模拟了不同能量(1.625-65 eV)的CH基团在清洁金刚石和吸氢金刚石(111)面上的轰击行为,获得了吸附、反弹、反应等各类事件的发生概率,并据此探讨了含氢碳膜制备过程中CH基团的贡献.结果表明,随着入射能量的增加,CH基团对薄膜生长的贡献由单纯的吸附、反弹机理向反应、吸附混合机理转变,其中最主要的反应过程是释放一个或两个氢原子的反应,而释放氢分子的反应则很少发生.这些反应不仅使薄膜生长过程更均匀、薄膜表面更平整,还降低了薄膜的氢含量.生长机理的转变导致低能量条件下所成薄膜中的多数碳原子都包含一个氢原子作为配位原子,而高能量条件下的薄膜中的碳原子则很少有氢原子作为配位原子.另外,通过分析sp~3-C和sp~2-C数目的变化,研究了CH基团对金刚石基底的破坏作用.     

Hydrocarbon film growth by energetic CH3 molecule impact on SiC (0 0 1) surface

Classic molecular dynamics (MD) calculations were performed to investigate the deposition of thin hydrocarbon film. SiC (1 0 0) surfaces were bombarded with energetic CH₃ molecules at impact energies ranging from 50 to 150 eV. The simulated results show that the deposition yield of H atoms decreases with increasing incident energy, which is in good agreement with experiments. During the initial stages, with breaking Si-C bonds in SiC by CH₃ impacting, H atoms preferentially reacts with resulting Si to form Si-H bond. The C/H ratio in the grown films increases with increasing incident energy. In the grown films, CH species are dominant. For 50 eV, H-Csp3 bond is dominant. With increasing energy to 200 eV, the atomic density of H-Csp2 bond increases.     

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The molecular dynamics simulation of interaction between CH⁺ with various energy and fusion material tungsten is conducted. The simulated results show that in the incident process, the sputtering rates of C and H atoms change suddenly at the different exposure doses when the incident energy is 50, 100 and 150eV respectively, a few of W atoms are sputtered in the interaction process, but the sputtering rate is less than 0.24%. When the exposure dose is about 3.92×10¹⁶cm⁻², the incident energy is 50eV, a hydrocarbon firm without W atom is formed on the sample surface bombarded by the ions. A mixed film of W, C and H is formed at the other energy. The deposited rates of C and H atom first decrease then increase with the incident energy increament, the minimum deposited rats appear at 250 and 200eV respectively. The density profiles of C, H atoms, C−H, C−C, W−C bonds in the sample after bombardment move towards the inside of sample, and the C sp³ dominated the sample.     

石墨烯在Al_2O_3(0001)表面生长的模拟研究

基于密度泛函理论的广义梯度近似法,对用化学气相沉积法在蓝宝石(α-Al_2O_3)(0001)表面上生长石墨烯进行理论研究.研究结果表明:CH_4在α-Al_2O_3(0001)表面上的分解是吸热过程,由CH_4完全分解出C需要较高能量及反应能垒,这些因素不利于C在衬底表面的存在.在α-Al_2O_3(0001)表面,石墨烯形核的活跃因子并不是通常认为的C原子,而是CH基团.通过CH基团在α-Al_2O_3(0001)表面上的迁移聚集首先形成能量较低的(CH)_x结构.模拟研究(CH)_x对揭示后续石墨烯的形核生长机理具有重要意义.     

The influences of the local impact site and incident energy on the transport behaviors of single copper atom onto Cu (0 0 1) surface

Molecular dynamics (MD) simulation is carried out to study the transport behaviors of a single deposited atom in Cu film homoepitaxy. We consider the normal Cu incident atoms impinging on the Cu (0 0 1) surface at four possible local impact sites (top, bridge, hollow and general). The observed transport behaviors of the deposited atom onto the surface include: direct adsorption (DA), penetration by atomic exchange, and transient penetration (TP), which a deposited atom penetrates the interstitial site and then rapidly migrates to a stable site on the surface. The results show that transport behaviors of the deposited atom are closely related to both the local impact site and the incident energy. The maximum increment of kinetic energy at every impact site approaches to a certain value except for the incident energy below 2.0 eV. Furthermore, as the incident energy is higher than the penetration threshold, TP behavior could be observed again in some energy ranges. This interesting phenomenon, which cannot be explained by the existing theories, is possibly attributed to the dynamical competition between the deposited atom and substrate atoms.     

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The scattering behaviour of H atoms on Be surface by molecular dynamics simulations was reported in this paper. When the incident energy increases from 1 to 9eV, the outcome shows the H atoms scattering rate decrease with incident energy increasing, and increase with incident angle increasing. When incident energy is 1eV, all of incident H atoms scatter above the Be surface. When incident energy are 5 and 9eV, 14.7% and 35.8% of H atoms inject into the Be sample and then scatter, respectively, and incident depths increase with energy increasing. Scattering density and energy as function of scattering angle were also discussed.     

Theoretical study on adsorption of thiophenethiolate molecule on Au(1 1 1) surface

We have theoretically studied the adsorption of a thiophenethiolate (C₄H₃S-S) molecule on the Au(1 1 1) surface by first-principles calculations. It is found that the bridge site is the most stable adsorption site with the adsorption energy of 1.02 eV. In the optimized adsorption geometry, the bond between the head S atom and the connected C atom in the tail thiophene molecule is tilted by 57.2° from the surface normal. In addition, the adsorption of thiophenethiolate induces large relaxations of the surface Au atoms around it. Furthermore, weak interactions between the S atom in the tail thiophene ring and the Au atoms also contribute to the adsorption on the Au surface.     

Atomistic study of deposition process of Al thin film on Cu substrate

In this paper we report molecular dynamics based atomistic simulations of deposition process of Al atoms onto Cu substrate and following nanoindentation process on that nanostructured material. Effects of incident energy on the morphology of deposited thin film and mechanical property of this nanostructured material are emphasized. The results reveal that the morphology of growing film is layer-by-layer-like at incident energy of 0.1-10 eV. The epitaxy mode of film growth is observed at incident energy below 1 eV, but film-mixing mode commences when incident energy increase to 10 eV accompanying with increased disorder of film structure, which improves quality of deposited thin film. Following indentation studies indicate deposited thin films pose lower stiffness than single crystal Al due to considerable amount of defects existed in them, but Cu substrate is strengthened by the interface generated from lattice mismatch between deposited Al thin film and Cu substrate.     

The kinetic MC modelling of reversible pattern formation in initial stages of thin metallic film growth on crystalline substrates

The results of kinetic MC simulations of the reversible pattern formation during the adsorption of mobile metal atoms on crystalline substrates are discussed. Pattern formation, simulated for submonolayer metal coverage, is characterized in terms of the joint correlation functions for a spatial distribution of adsorbed atoms. A wide range of situations, from the almost irreversible to strongly reversible regimes, is simulated. We demonstrate that the patterns obtained are defined by a key dimensionless parameter: the ratio of the mutual attraction energy between atoms to the substrate temperature. Our ab initio calculations for the nearest Ag-Ag adsorbate atom interaction on an MgO substrate give an attraction energy as large as 1.6 eV, close to that in a free molecule. This is in contrast to the small Ag adhesion and migration energies (0.23 and 0.05 eV, respectively) on a defect-free MgO substrate.