高电荷态离子207Pb36+与金属Nb表面作用产生的二次离子产额

本文报道了利用兰州重离子加速器国家实验室ECR源引出的高电荷态离子207Pb36+入射到金属Nb表面产生二次离子溅射的实验测量结果.实验发现,二次离子产额Y随入射初动能Ek的增加有先增加后减小的关系,二次离子产额有一个峰值.理论分析认为,这一过程是势能沉积作用与线性级联碰撞过程协同作用的结果.     

高电荷态离子^207Pb^36＋与金属Nb表面作用产生的二次离子产额

本文报道了利用兰州重离子加速器国家实验室ECR源引出的高电荷态离子^207Pb^36＋入射到金属Nb表面产生二次离子溅射的实验测量结果，实验发现。二次离子产额Y随入射初动能B的增加有先增加后减小的关系，二次离子产额有一个峰值。理论分析认为，这一过程是势能沉积作用与线性级联碰撞过程协同作用的结果。     

低速多电荷态离子He2+、O2+和Ne2+与W靶表面

本文报道了He2+,O2+和Ne2+与W靶表面相互作用中的动能电子产额随离子入射速度变化的实验测量结果.结果表明：在本实验的入射速度范围内,对同一入射离子,动能电子产额随入射离子的速度增大而线性增加.基于动能电子发射的机理,我们分析了影响动能电子产额的因素,理论上得出动能电子产额与入射速度增长呈线性增加的关系,取得了实验上和理论上一致的结果.     

低速多电荷态离子He2+、O2+和Ne2+与W靶表面相互作用的动能电子发射研究

本文报道了He2 ,O2 和Ne2 与W靶表面相互作用中的动能电子产额随离子入射速度变化的实验测量结果.结果表明:在本实验的入射速度范围内,对同一入射离子,动能电子产额随入射离子的速度增大而线性增加.基于动能电子发射的机理,我们分析了影响动能电子产额的因素,理论上得出动能电子产额与入射速度增长呈线性增加的关系,取得了实验上和理论上一致的结果.     

O~(2+)离子穿过碳膜引起的前后表面电子发射

测量了入射能为1.9~11.3 keV/u的O~(2+)离子穿过碳膜诱导的前向、后向(分别对应出射表面和入射表面)电子发射产额。实验中,通过改变入射离子的能量和流强,系统地研究了电子能损和离子束流强度对前向、后向电子发射产额的影响。结果表明,在本实验的能量范围内,前向、后向电子发射产额与对应表面的电子能损有近似的正比关系,而与束流强度无关。分析还发现引起后向电子发射的动能阈值约为0.2 keV/u,势能电子发射产额约为1 e~-/ion。     

高电荷态离子40Arq+与Si表面作用中的电子发射产额

报道了在兰州重离子加速器国家实验室电子回旋共振离子源原子物理实验平台上，用高电荷态⁴⁰Ar^q+(1≤q≤12)离子作用于半导体Si固体表面时的电子发射产额实验测量.实验中，通过改变炮弹离子的电荷态和引出电压选取其不同的势能和动能，系统地研究了入射离子势能沉积和与其在固体中的电子能损对表面电子发射产额的贡献.结果表明，作为引起表面电子发射的两个主要因素，单离子的电子发射产额与炮弹离子在固体表面的势能沉积和电子能损都有近似的正比关系.     

脉冲离子束作用下靶面次级电子的抑制

论述了离子束作用下固体表面次级电子产生的机制,介绍了特种真空器件中次级电子抑制的各种方法及其优缺点,提出了脉冲离子束作用下靶面次级电子抑制的自偏势法和曲面靶法等设计思路,并在实验上进行了初步验证。实验结果表明,自偏势电压大于80 V后,次级电子得到很好的抑制。在相同束流情况下,曲面靶较平面靶的次级电子产额少。利用实验结果进行估算得到了近似的次级电子产额约为0.67,比文献中的结果(0.58)偏大。对实验中自偏势法抑制反峰电子电流的效果进行了分析和讨论,结果表明:自偏势法不但能够有效抑制离子打靶产生的次级电子,还能抑制由功率源不稳定带来的入射反峰电子流。     

近玻尔速度Ne2+离子穿过碳膜引起的电子发射

本文测量了入射能为2–25 keV/u的Ne²⁺离子穿过不同厚度碳膜诱导的前向、后向 (分别对应出射表面和入射表面) 电子发射产额. 实验中通过改变炮弹离子的能量, 系统的研究了势能沉积、电子能损以及反冲原子对前向、后向电子发射产额的贡献. 结果表明, 离子的势能沉积只对后向电子发射有贡献, 前向、后向电子发射产额分别与Ne²⁺离子在薄膜出射、入射表面的电子能损近似成正比关系, 其中电子能损很低 (对应于离子能量很低) 的时候, 反冲原子对电子发射的贡献不能忽略. 关键词： 近玻尔速度 电子发射 电子能损 反冲原子     

高电荷态离子207Pbq+(24≤q≤36)与Si(110)固体表面作用的电子发射研究

报道了利用兰州重离子加速器国家实验室ECR源引出的高电荷态离子²⁰⁷Pb^q+(24≤q≤36)入射到Si(110)表面产生的电子发射的实验测量结果.结果表明,高电荷态离子与固体表面相互作用产生的电子发射产额Y与入射离子的电荷态q、入射角度ψ和入射能量E都有很强的关联.首次发现,电子发射产额Y与入射角度ψ间有接近1/tanψ的关系.理论分析认为,这些过程与基于经典过垒模型的势能电子发射过程密切相关. 关键词： 高电荷态离子 经典过垒模型 电子发射产额     

129Xeq+轰击N型和P型Si表面时的电子发射产额研究

在兰州重离子加速器国家实验室测量了1.8 MeV Xeq+离子分别轰击N型和P型Si两种靶材表面时的电子发射产额。实验中,通过改变入射离子的电荷态,研究了入射离子势能沉积对两种靶材表面电子发射产额的贡献。结果发现同一离子入射时,N型Si表面的电子发射产额高出P型Si表面的电子发射产额约12.5%;对于具有相同入射动能的Xeq+离子,两种靶材表面的电子发射产额均随着入射离子势能的增加而线性增加。此外,还测量了3.4 MeV Xeq+离子分别轰击以上两种靶材时的电子发射产额,得到了类似的结果。本文利用功函数分别从动能电子发射和势能电子发射两个角度对实验结果进行了分析讨论。The electron emissions from N-type Si and P-type Si induced by 1.8 MeV 129Xeq+are measured in the National Laboratory of Heavy Ion Research Facility in Lanzhou,The contribution to electron emission yield from potential energy of incident ions is studied through changing the charge state of incident ions.The results show that for the same incident ion,electron emission yield of N type Si surface is higher than that of P-type Si surface about 12.5%.For incident ions with the same kinetic energy,both electron emission yields of two targets increase linearly with incident ion energy.In addition,the electron emissions induced by 3.4 MeV 129Xeq+from N-type Si and P-type Si mentioned above are measured,which give similar results.The experimental results are analyzed and discussed using work function from two angles of the kinetic electron emission and the potential energy electron emission.     

离子轰击引起的表面形貌对Ag的溅射产额的影响

用捕获膜技术和卢瑟福背散射(RBS)谱仪测定Ag靶在27keV Ar⁺离子轰击下的溅射原子角分布,从而确定不同剂量下Ag的溅射产额,并对其靶点表面形貌进行扫描电子显微镜(SEM)观察。结果发现,所有的角分布都呈over-cosine形状,但其溅射产额却随着表面形貌不同而不同。根据溅射产额Y与轰击离子入射角φ变化关系,讨论不同轰击剂量下溅射产额的差别,肯定了表面形貌是影响溅射产额的一个重要因素,并由此提出“表观产额”的新概念。 关键词：     

Nanoparticle ejection from Au induced by single Xe ion impacts

In situ transmission electron microscopy has been used to observe sputtered Au during Xe ion irradiation in transmission geometry. The sputtered Au was collected on an electron transparent carbon foil. Nanoparticles were observed on the collector foil after they were ejected by single ion impacts. The ejection is from the melt zone formed during the thermal spike phase of a displacement cascade produced near the surface by a single ion impact. Such single ion impacts are also capable of producing craters. Ejected nanoparticles can make a significant contribution to sputtering.     

Electronic structure of alkali halide surfaces upon ion irradiation

By a careful analysis of the electron loss spectra of some alkali halide crystals after ion irradiation we have demonstrated that defect generation depends on ion energy nonmonotonously. This effect is connected with inelastic interaction between ion and surface atoms.     

Ion beam sputtering of multicomponent targets: Surface composition change and cluster emission

Preferential sputtering effect, which occurs during irradiation of a multicomponent target by medium energy ions, was under our investigation. A new term characterizing the preferential sputtering, called “surface sputtering yield” and defined as average number of components i sputtered from a top surface layer per one primary ion, was suggested. A direct proportionality between the dimer emission and surface concentration of the component, forming the dimer, was concluded; this let us estimate the preferential sputtering of any target from the composition of the flux of secondary particles, analyzed directly during the ion sputtering process, and define the composition of the ion sputtered surface.     

Ionization probability of sputtered particles as a function of their energy: Part II. Positive Si ions

In this paper we represent the experimental ionization probability of sputtered silicon atoms as a function of their energy, which has been obtained for positive Si⁺ ions sputtered from silicon by O₂⁺ ion beam. To explain the experimental data, we have considered ionization of an outgoing atom at a critical distance from the surface, which occurs due to the electron transition between this atom and the surface, and suggested the formation of a local surface charge with the polarity opposite to that of the outgoing ion that has just been formed. Then we have considered the interaction between those two charges, outgoing ion, and surface charge as a process of the particle passage through a spherical potential barrier; as a result, we have obtained the theoretical energy distribution of secondary ions. Together with the well-known Sigmund-Thompson energy distribution of sputtered atoms, the obtained ion energy distribution allowed us to derive the equation for the secondary ion yield versus the sputtered particle energy. Both equations derived have exhibited a quite good correlation with our experimental results and also with a large number of published experimental data.     

Al-50wt% Sn合金的离子溅射研究

用捕获膜技术和卢瑟福背散射(RBS)分析,测定Al-Sn多相合金在30keV Ar⁺离子轰击时Al和Sn的溅射原子角分布。溅射后的样品用扫描电子显微镜(SEM)进行观察,并用电子微探针分析仪(EPMA)对轰击样品(靶点)和未轰击样品作成分分析。结果表明,Al的溅射原子角分布近于cosine形状,而Sn却是over-cosine型角分布。本文给出一个按不同表面形貌特征划分的各元素富集区i进行叠加的产额表达式,Y(θ)=∑Y_i(θ),解释了实验结果。 关键词：     

Deflection of sputtered ions by surface charges

The trajectories of ions sputtered from an insulating surface carrying a surface charge have been computed. The results show that yields measured in particular directions can be in serious error as the trajectories of low energy sputtered ions depend critically on surface charge and point of origin of the ion. The distorted yield curves for 1.2 eV ions and 10 eV ions leaving a surface with a ten volt surface potential are calculated.     

Energy dependence of the ionization probability of sputtered Cu and Ni

Despite its great sensitivity, the usefulness of secondary ion mass spectrometry (SIMS) for many applications has been limited by an inadequate understanding of the probability of sputtering an atom in an ionized state. To determine this ionization probability for clean Cu and Ni surfaces, I have measured the energy distribution of sputtered neutrals and ions by quadrupole mass filtering and retarding potential analysis using potential modulation differentiation. Analysis of sputtered neutrals was accomplished by electron impact ionization. Because the neutrals outnumber the ions by at least two orders of magnitude, the ratio of sputtered ions to neutrals is an accurate measure of the ionization probability. For energies below 20 eV the dependence of the ionization probability on energy goes as P(E) α Eⁿ, where n = 0.65 for clean Cu. The absorption of oxygen on the Cu surface increases the total ion yield while causing a reduction in the value of the exponent n. Similar results are found for nickel, where n = 0.54 for the clean surface.     

Predicting secondary ion formation in molecular dynamics simulations of sputtering

We present a model to incorporate the excitation and ionization of sputtered particles into molecular dynamics simulations of ion bombardment-induced collision cascades in metals. The kinetic excitation of the solid is described by electronic friction experienced by all moving particles and electron promotion in close atomic collisions. Transport of the resulting excitation energy is treated by a nonlinear diffusion equation. The resulting space- and time-dependent electron temperature is then introduced into a rate equation model describing the ionization of ejected particles. This way, secondary ion formation is described by assigning an individual ionization probability to every sputtered atom. Averaging over the entire flux, this allows the prediction of measurable quantities like integral or spectral ionization probabilities as well as velocity spectra of secondary ions.     

Low sputter damage of metal single crystalline surfaces investigated with medium energy ion scattering spectroscopy

It was observed clearly that the sputter damage due to Ar⁺ ion bombardment on metal single crystalline surfaces is extremely low and the local surface atomic structure is preserved, which is totally different from semiconductor single crystalline surfaces. Medium energy ion scattering spectroscopy (MEIS) shows that there is little irradiation damage on the metal single crystalline surfaces such as Pt(111), Pt(100), and Cu(111), in contrast to the semiconductor Si(100) surfaces, for the ion energy of 3–7 keV even above 10¹⁶–10¹⁷ ions/cm² ion doses at room temperature. However, low energy electron diffraction (LEED) spots became blurred after bombardment. Transmission Electron Microscopy (TEM) studies of a Pt polycrystalline thin film showed formation of dislocations after sputtering. Complementary MEIS, LEED and TEM data show that on sputtered single-crystal metal surfaces, metal atoms recrystallize at room temperature after each ion impact. After repeated ion impacts, local defects accumulate to degrade long range orders.