衬底温度对反应磁控溅射W掺杂ZnO薄膜的微观结构及光电性能的影响

采用直流脉冲反应磁控溅射方法生长W掺杂ZnO（WZO）透明导电氧化物薄膜并研究了衬底温度对薄膜微观结构、组分、表面形貌以及光电性能的影响.实验结果表明,WZO薄膜具有良好的（002）晶面择优取向,且适当的衬底温度是制备优质WZO薄膜的关键因素.随着衬底温度升高,薄膜表面粗糙度先增大后减小;衬底温度较高时,薄膜的结构致密,结晶质量好,电子迁移率高.当衬底温度为325℃时,WZO薄膜获得最低电阻率9.25×10^-3Ω·cm,方块电阻为56.24Ω/□,迁移率为11.8 cm² V^-1·s^-1,其在可见光及近红外区域（400—1500 nm）范围的平均透过率达到85.7%.     

生长条件对Ga掺杂ZnO薄膜微观结构及光致发光性能的影响

利用热氧化法在不同参数条件下生长了Ga掺杂范围较宽的ZnO薄膜, 研究了ZnO薄膜的表面微观结构和光致发光性能. 研究表明: Ga以Ga³⁺存在并掺入ZnO晶格取代Zn²⁺, Ga的掺入改变了ZnO薄膜中的缺陷类型及浓度、化学计量比、薄膜表面结晶质量, 进而影响了薄膜的光致发光性能. 随着热氧化温度升高, Ga掺杂量增大, ZnO薄膜的晶粒尺寸增大, 尺寸更均一, 紫外光与可见光强度比增大. 随着热氧化时间延长, Ga掺杂量降低, ZnO薄膜的晶粒尺寸均一性变差, 紫外光与可见光强度比减小.     

Co,Sn共掺ZnO薄膜结构与光致发光的研究

采用溶胶-凝胶旋涂法在玻璃衬底上制备了Co,Sn掺杂ZnO系列薄膜.通过金相显微镜和X射线衍射(XRD)研究了Co与Sn掺杂对薄膜的表面形貌和微结构的影响.XRD结果表明,所有ZnO薄膜样品都存在(002)择优取向,特别Sn单掺ZnO薄膜的c轴择优取向最为显著,而且晶粒尺寸最大.XPS测试表明样品中Co和Sn的价态分别为2+和4+,证实Co²⁺,Sn⁴⁺进入了ZnO的晶格.室温光致发光谱(PL)显示在所有的样品中都有较强的蓝光双峰发射和较弱的绿光发 关键词： ZnO薄膜 溶胶-凝胶 掺杂 光致发光     

溶胶-凝胶法制备Li-N双掺p型ZnO薄膜的结构、光学和电学性能

采用溶胶-凝胶法在n型Si(100)衬底上沉积Li-N双掺杂ZnO薄膜,经X射线衍射和扫描电镜图片分析,所制备薄膜具有多晶纤锌矿结构和高的c轴择优取向.室温下霍尔效应测试结果显示Li-N双掺杂ZnO薄膜具有p型导电特性.在Li掺杂量为15.0at%,Li/N（摩尔比）为1∶1,700℃退火等优化条件下得到的最佳电学性能结果是：电阻率为0.34 Ω·cm,霍尔迁移率为16.43 cm²/V·s,载流子浓度为2.79×10¹⁹ cm^{-3关键词： Li-N双掺 p型ZnO薄膜 溶胶-凝胶 性能}     

B掺杂ZnO透明导电薄膜的实验及理论研究

采用脉冲直流磁控溅射技术与基于密度泛函理论的平面波赝势方法对B掺杂ZnO （BZO）薄膜进行了研究. 以B₂O₃：ZnO陶瓷靶为溅射靶材,制备了低电阻率、可见和近红外光区高透过率的BZO薄膜. 系统地研究了衬底温度对BZO薄膜的结构、光电特性的影响. 结果表明：适当的增加衬底温度可以促进BZO薄膜结晶质量改善,晶粒尺寸增加,迁移率增大,电阻率降低. 在200 ℃时制备了电阻率为7.03×10^-4 Ω·cm,400–1100 nm平均透过率为89%的BZO薄膜. 理论模拟结果表明：在BZO薄膜中,以替位方式掺入的B （B_Zn）的形成能最低,B主要以替位形式掺入ZnO,其次分别为八面体间隙（B_IO）和四面体间隙（B_IT）的掺杂方式. B 掺入后,费米能级穿过导带,材料表现出n型半导体特性,光学带隙展宽,导电电子主要来源于B 2p,O 2p及Zn 4s电子轨道. 关键词： BZO薄膜 第一性原理计算 磁控溅射 太阳电池     

γ-LiAlO2上非极性ZnO薄膜制备及其光谱性质研究

利用激光脉冲沉积(PLD)技术在(302)γ-LiAlO₂衬底上成功生长了非极性的a面(1120) ZnO薄膜. 衬底温度为350℃时，薄膜是混合取向(a向和c向)，以c面ZnO为主，且晶粒尺寸分布很宽；提高温度达500℃，薄膜变为单一的(1120)取向，摇摆曲线半高宽0.65°，晶粒尺寸分布趋窄，利用偏振透射谱可以明显看出其面内的各向异性. 衬底温度650℃下制备的样品晶粒继续长大，虽然摇摆曲线半高宽变大，但光致发光谱(PL)带边发射峰半高宽仅为105meV，比在350℃，500℃下制备的样品小1/5. 关键词： 非极性ZnO 2')" href="#">γ-LiAlO₂ PLD 透射谱     

退火温度对Cr掺杂ZnO薄膜的微结构与机械性能的影响研究

本研究利用射频磁控溅镀法在玻璃基板上制备3 at.%的Cr掺杂ZnO薄膜,再以300℃～500℃温度退火处理25 mins,并探讨了退火温度对Al掺杂ZnO薄膜的微观结构与机械性能的影响.微观结构分析结果表明Cr掺杂ZnO薄膜的结晶方向为(002),且沿(002)方向的成长随退火温度升高而越加明显,但薄膜的表面却随退火温度升高而变得越来越粗糙.机械性能分析结果揭示晶粒尺寸随退火温度升高而增大,导致差排原子的动能随之降低,致使Cr掺杂ZnO薄膜的硬度随退火温度升高而增大,但对其对杨氏模量却没有太大的影响;此外,Cr掺杂ZnO薄膜的耐磨性与韧性均随退火温度升高而增强,表明退火处理对该薄膜的抗塑性形变能力有很大帮助.     

退火温度对Cr掺杂ZnO薄膜的微结构与机械性能的影响研究

本研究利用射频磁控溅镀法在玻璃基板上制备3 at.%的Cr掺杂ZnO薄膜,再以300℃～500℃温度退火处理25 mins,并探讨了退火温度对Al掺杂ZnO薄膜的微观结构与机械性能的影响.微观结构分析结果表明Cr掺杂ZnO薄膜的结晶方向为(002),且沿(002)方向的成长随退火温度升高而越加明显,但薄膜的表面却随退火温度升高而变得越来越粗糙.机械性能分析结果揭示晶粒尺寸随退火温度升高而增大,导致差排原子的动能随之降低,致使Cr掺杂ZnO薄膜的硬度随退火温度升高而增大,但对其对杨氏模量却没有太大的影响;此外,Cr掺杂ZnO薄膜的耐磨性与韧性均随退火温度升高而增强,表明退火处理对该薄膜的抗塑性形变能力有很大帮助.     

退火温度对Cr掺杂ZnO薄膜的微结构与机械性能的影响研究

本研究利用射频磁控溅镀法在玻璃基板上制备3 at.%的Cr掺杂ZnO薄膜,再以300℃～500℃温度退火处理25 mins,并探讨了退火温度对Al掺杂ZnO薄膜的微观结构与机械性能的影响.微观结构分析结果表明Cr掺杂ZnO薄膜的结晶方向为(002),且沿(002)方向的成长随退火温度升高而越加明显,但薄膜的表面却随退火温度升高而变得越来越粗糙.机械性能分析结果揭示晶粒尺寸随退火温度升高而增大,导致差排原子的动能随之降低,致使Cr掺杂ZnO薄膜的硬度随退火温度升高而增大,但对其对杨氏模量却没有太大的影响;此外,Cr掺杂ZnO薄膜的耐磨性与韧性均随退火温度升高而增强,表明退火处理对该薄膜的抗塑性形变能力有很大帮助.     

衬底温度对非极性ZnO薄膜结晶性能和发光特性的影响

采用金属有机化学汽相沉积(MOCVD)设备在LiGaO2(100)衬底上制备了结晶性能良好的非极性ZnO薄膜.研究了衬底温度对ZnO薄膜结晶性能的影响.X射线衍射(XRD)分析结果表明在衬底温度为500℃时可以获得高质量的(1100)晶面取向的非极性ZnO薄膜.采用原子力显微镜(AFM)观察ZnO薄膜的表面形貌及晶体尺...     

Optimization of pulsed laser deposited ZnO thin-film growth parameters for thin-film transistors (TFT) application

In this work we present the optimization of zinc oxide (ZnO) film properties for a thin-film transistor (TFT) application. Thin films, 50±10 nm, of ZnO were deposited by Pulsed Laser Deposition (PLD) under a variety of growth conditions. The oxygen pressure, laser fluence, substrate temperature and annealing conditions were varied as a part of this study. Mobility and carrier concentration were the focus of the optimization. While room-temperature ZnO growths followed by air and oxygen annealing showed improvement in the (002) phase formation with a carrier concentration in the order of 10¹⁷–10¹⁸/cm³ with low mobility in the range of 0.01–0.1 cm²/V?s, a Hall mobility of 8 cm²/V?s and a carrier concentration of 5×10¹⁴/cm³ have been achieved on a relatively low temperature growth (250 °C) of ZnO. The low carrier concentration indicates that the number of defects have been reduced by a magnitude of nearly a 1000 as compared to the room-temperature annealed growths. Also, it was very clearly seen that for the (002) oriented films of ZnO a high mobility film is achieved.     

Double-layer indium doped zinc oxide for silicon thin-film solar cell prepared by ultrasonic spray pyrolysis

Indium doped zinc oxide(ZnO:In) thin films were prepared by ultrasonic spray pyrolysis on corning eagle 2000 glass substrate.1 and 2 at.% indium doped single-layer ZnO:In thin films with different amounts of acetic acid added in the initial solution were fabricated.The 1 at.% indium doped single-layers have triangle grains.The 2 at.% indium doped single-layer with 0.18 acetic acid adding has the resistivity of 6.82×10-3Ω·cm and particle grains.The doublelayers structure is designed to fabricate the ZnO:In thin film with low resistivity(2.58×10-3Ω·cm) and good surface morphology.It is found that the surface morphology of the double-layer ZnO:In film strongly depends on the substratelayer,and the second-layer plays a large part in the resistivity of the double-layer ZnO:In thin film.Both total and direct transmittances of the double-layer ZnO:In film are above 80% in the visible light region.Single junction a-Si:H solar cell based on the double-layer ZnO:In as front electrode is also investigated.     

The Effects of Thermal Treatments on Microstructure Phosphorus-Doped ZnO Layers Grown by Thermal Evaporation

The ZnO films doped with 3 wt% phosphorus (P) were produced by activating phosphorus doped ZnO (ZnO:P) thin films in oxygen (O₂) ambient at 600°C for 30, 60, 90 and 120 min, respectively. As-deposited films doped with phosphorus are highly conductive and n type. All the films showed p-type conduction after annealing, in an O₂ ambient atmosphere. The activation energies of the phosphorus dopant in the p-type ZnO under O₂ ambient gases indicate that phosphorus substitution on the O site yielded a deep level in the gap. With a further increase of the annealed durations, the crystalline quality of the ZnO:P sample is degraded. The best p-type ZnO:P film deposited at 600°C for 30 min shows a resistivity of 1.85 Ω cm and a relatively high hole concentration of 5.1 × 10¹⁷cm^–3 at room temperature. The films exhibit a polycrystalline hexagonal wurtzite structure without preferred orientation. The mean grain sizes are calculated to be about 60, 72, 78, 85 and 90 nm for the p-type ZnO films prepared at 600°C for 30, 60, 90 and 120 min, respectively. Room temperature photoluminescence (PL) spectra of the ZnO film exhibit two emission bands — paramount excitonic ultraviolet (UV) emission and weak deep level visible emission. The excellent emission from the film annealed at 600°C for 30 min is attributed to the good crystalline quality of the p-type ZnO film and the low rate of formation of intrinsic defects at such short duration. The visible emission consists of two components in the green range.     

Spray pyrolised Al/ZnO: Al heterojunction: Effect of Al on junction properties

Al/ZnO: Al heterojunction was fabricated by depositing ZnO: Al film on Al substrate by spray pyrolysis technique at 220 °C substrate temperature. XRD, SEM and EDAX techniques were used to study the properties of thin films. Heterojunction properties were studied by I–V and C–V measurements. The fabricated Al/ZnO: Al junctions were rectifying in character. The room temperature ideality factors of Al/ZnO: Al junctions are found to vary from 2.56 to 5.45. The reverse saturation currents are 5.21 × 10⁻⁹, 1.35 × 10⁻⁶, 1.99 × 10⁻⁶, 9.99 × 10⁻⁷ and 1.02 × 10⁻⁷ A for Al/ZnO: Al junctions. Junction forward current depends on doping concentrations and temperature, whereas reverse saturation current remains independent for Al concentration. The built-in-potential calculated from capacitance for Al/ZnO: Al junctions are 2.74, 2.60, 2.0, 2.50 and 2.43 V corresponding to 1, 2, 3, 4 and 5 mol% of Al. X-ray diffraction study confirmed that the films are polycrystalline, orientated in (0 0 2) plane. Scanning electron microscopy study confirmed circular ring patterns with inside ribbon type structure for Al doped ZnO films.     

蓝宝石基片的处理方法对ZnO薄膜生长行为的影响

采用反应射频磁控溅射方法,在经过不同方法处理的蓝宝石基片上,在同一条件下沉积了ZnO薄膜.利用原子力显微镜、X射线衍射、反射式高能电子衍射等分析技术,对基片和薄膜的结构、表面形貌进行了系统表征.研究结果显示,不同退火条件下的蓝宝石基片表面结构之间没有本质的差异,均为α-Al₂O₃ (001)晶面,但基片表面形貌的变化较大.在不同方法处理的蓝宝石基片上生长的ZnO薄膜均具有高c轴取向的织构特征,但薄膜的表面形貌差异较大.基片经真空退火处 关键词： ZnO薄膜 反应磁控溅射 基片处理 形貌分析     

大面积六硼化镧薄膜阴极制备及性能

 采用电子束蒸发方法在大面积玻璃基底和钽基底上沉积六硼化镧薄膜阴极。分别对玻璃基底上沉积的六硼化镧薄膜的生长取向、附着力与不同蒸发角度(0°, 30°,45°和60°)的关系进行了研究;对钽基底上沉积的六硼化镧薄膜阴极的逸出功进行了研究。结果表明:在基底温度为250 ℃时,制备的六硼化镧薄膜具有(100)晶面择优生长的特点;蒸发角度为45°时,六硼化镧薄膜(100)晶面的晶格常数与靶材相差最小,晶粒较小;根据优化的工艺制备的六硼化镧薄膜阴极的逸出功为2.56 eV。     

Effects of Mn‐doping on surface acoustic wave properties of ZnO films

Surface acoustic wave (SAW) filters based on Mn‐doped ZnO films have been fabricated and effects of Mn‐doping on SAW properties are investigated. It is found that the electromechanical coupling coefficient (K²) of Zn_0.913Mn_0.087O films is 0.73 ± 0.02%, which is 73.8% larger than that of undoped ZnO films (0.42 ± 0.02%). Zn_0.913Mn_0.087O film filters also exhibit a lower absolute value of insertion loss (|IL|) of 16.1 dB and larger bandwidth (BW) of 5.9 MHz compared with that of undoped ZnO film filter. However, Zn_0.952Mn_0.048O film filters exhibit a smaller K² of 0.34 ± 0.02%, larger |IL| of 26.9 dB and smaller BW of 3.5 MHz. It is suggested that the SAW properties can be improved by appropriate Mn‐doping and Mn–ZnO/Si multilayer structure with large d₃₃ is promising for wide‐band and low‐loss SAW applications. (© 2012 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

ZnO薄膜微结构变化对光电特性的影响

使用脉冲激光淀积(PLD)技术在n型Si衬底上沉积氧化锌(ZnO)薄膜,在O2气氛下对样品进行了500℃(Sample1,S1),600℃(Sample2,S2),700℃(Sample3,S3)和800℃(Sample4,S4)退火,随后进行了X射线衍射(XRD)谱,椭偏光折射率,热激电流(TSC)和电容-电压(C-V)的测量。研究发现:S1中晶界的电子陷阱由高浓度的深能级杂质(Zni)提供的电子填充,该能级位于ET=EC-0.24±0.08eV。S3中出现与中性施主(D0)有关的深能级中心,其ET=EC-0.13±0.03eV,推测D0的出现与高温氧气条件退火下晶界处形成的复合体缺陷有关。XRD和椭偏光折射率测量结果表明:氧气对ZnO薄膜微结构的修饰是改变ZnO/Si结构光电特性的主要因素。     

Optimization of magnetron deposition process for formation of high-quality oriented ZnO films

The thickness distribution and structure of ZnO films deposited by DC-magnetron sputtering of a zinc target in argon-oxygen gaseous medium at substrate temperature of 27°C and gas pressure in the chamber within 5×10^?3 ? 5×10^?2 mm Hg was investigated. It was revealed that the use of a target with a certain depression in the sputtering zone allows depositing high quality c-oriented films at lower gas pressure than with a flat target. The dependence of film quality on geometric factors is interpreted on the basis of theoretical computations with the assumption that the film structure is improved when the flux of deposited Zn particles decreases while their energy increases.