硅衬底生长的InGaN/GaN多层量子阱中δ型硅掺杂n-GaN层对载流子复合过程的调节作用

为了解决在单晶硅衬底上生长的InGaN/GaN多层量子阱发光二极管器件发光效率显著降低的问题,使用周期性δ型Si掺杂的GaN取代Si均匀掺杂的GaN作为n型层释放多层界面间的张应力。采用稳态荧光谱及时间分辨荧光谱测量,提取并分析了使用该方案前后的多层量子阱中辐射/非辐射复合速率随温度（10~300 K）的变化规律。实验结果表明引入δ-Si掺杂的n-GaN层后,非辐射复合平均激活能由（18±3）meV升高到（38±10）meV,对应非辐射复合速率随温度升高而上升的趋势变缓,室温下非辐射复合速率下降,体系中与阱宽涨落有关的浅能级复合中心浓度减小,PL峰位由531 nm左右红移至579 nm左右,样品PL效率随温度的衰减受到抑制。使用周期性δ型Si掺杂的GaN取代Si均匀掺杂的GaN作为生长在Si衬底上的InGaN/GaN多层量子阱LED器件n型层,由于应力释放,降低了多层量子阱与n-GaN界面、InGaN/GaN界面的缺陷密度,使得器件性能得到了改善。     

Si(110)和Si(111)衬底上制备InGaN/GaN蓝光发光二极管

分别在Si(110)和Si(111)衬底上制备了In Ga N/Ga N多量子阱结构蓝光发光二极管(LED)器件.利用高分辨X射线衍射、原子力显微镜、室温拉曼光谱和变温光致发光谱对生长的LED结构进行了结构表征.结果表明,相对于Si(111)上生长LED样品,Si(110)上生长的LED结构晶体质量较好,样品中存在较小的张应力,具有较高的内量子效率.对制备的LED芯片进行光电特性分析测试表明,两种衬底上制备的LED芯片等效串联电阻相差不大,在大电流注入下内量子效率下降较小;但是,相比于Si(111)上制备LED芯片,Si(110)上LED芯片具有较小的开启电压和更优异的发光特性.对LED器件电致发光(EL)发光峰随驱动电流的变化研究发现,由于Si(110)衬底上LED结构中阱层和垒层存在较小的应力/应变而在器件中产生较弱的量子限制斯塔克效应,致使Si(110)上LED芯片EL发光峰随驱动电流的蓝移量更小.     

纳米柱高度对GaN基绿光LED光致发光谱的影响

纳米柱结构是释放高In组分InGaN/GaN绿光LED量子阱层应变的有效方法。本文采用自组装的聚苯乙烯微球掩模、感应耦合等离子体干法刻蚀和KOH溶液的湿法腐蚀,在GaN基绿光LED外延片上制备了3种高度的纳米柱结构,通过扫描电子显微镜观察纳米柱结构的形貌,并测试了常温和10 K低温时的光致发光谱(PL)。结果表明:应变释放对压电场的影响显著,使得纳米柱结构样品的内量子效率(IQE)提高,PL谱峰值波长蓝移;应变在量子阱中的不均匀分布还使得PL谱半高全宽(FWHM)展宽。与普通平面结构相比,高度为747 nm的纳米柱结构可使得IQE提升917%,PL谱峰值波长蓝移18 nm、FWHM展宽7 nm。另外,纳米柱结构样品的有源区有效面积减小可使得PL谱FWHM减小。     

Improving InGaN-LED performance by optimizing the patterned sapphire substrate shape

The epitaxial growths of GaN films and GaN-based LEDs on various patterned sapphire substrates(PSSes) with different values of fill factor(f) and slanted angle(θ) are investigated in detail.The threading dislocation(TD) density is lower in the film grown on the PSS with a smaller fill factor,resulting in a higher internal quantum efficiency(IQE).Also the ability of the LED to withstand the electrostatic discharge(ESD) increases as the fill factor decreases.The illumination output power of the LED is affected by both θ and f.It is found that the illumination output power of the LED grown on the PSS with a lower production of tan θ and f is higher than that with a higher production of tan θ and f.     

Auger carrier leakage in III‐nitride quantum‐well light emitting diodes

Auger induced leakage is shown to be a contributing factor for the internal quantum efficiency (IQE) droop in III‐nitride quantum‐well light emitting diodes (LEDs). The mechanism is based on leakage current from carrier spill‐out of the well originating from energy transfer during Auger recombination. Adding this leakage reduces the Auger coefficient by 50% when compared to a standard Auger model with cubic density dependence. As reference, experimental data of a green quantum‐well LED are taken. Direct leakage due to non‐ideal carrier capture and re‐emission out of the well affects the IQE at current densities much larger than the maximum IQE point. (© 2012 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Modeling and simulation of efficiency droop in GaN-based blue light-emitting diodes incorporating the effect of reduced active volume of InGaN quantum wells

The efficiency droop of InGaN-based blue light-emitting diodes (LEDs) is analyzed using numerical simulations with a modified ABC carrier recombination model. The ABC model is modified to include the effect of reduced effective active volume of InGaN quantum wells (QWs) and incorporated into the numerical simulation program. It is found that the droop of internal quantum efficiency (IQE) can be well explained by the effect of reduced light-emitting active volume without assuming a large Auger recombination coefficient. A simulated IQE curve with the modified ABC model is found to fit quite well with a measured efficiency curve of an InGaN LED sample when the effective active volume takes only 2.5% of the physical volume of QWs. The proposed numerical simulation model incorporating the reduced effective active volume can be advantageous for use in the modeling and simulation of InGaN LEDs for higher efficiency.     

高Al组分AlGaN多量子阱结构材料发光机制探讨

紫外LED的发光功率和效率还远不能令人们满意,波长短于300 nm的深紫外LED的发光效率普遍较低。厘清高Al组分Al Ga N多量子阱结构的发光机制将有利于探索改善深紫外LED的发光效率的新途径、新方法。为此,本文通过金属有机气相外延技术外延生长了表面平整、界面清晰可辨且陡峭的高Al组分AlGa N多量子阱结构材料,并对其进行变温光致发光谱测试,结合数值计算,深入探讨了Al Ga N量子阱的发光机制。研究表明,量子阱中具有很强的局域化效应,其发光和局域激子的跳跃息息相关,而发光的猝灭则与局域激子的解局域以及位错引起的非辐射复合有关。     

Enhanced performance of InGaN light-emitting diodes with InGaN and composition-graded InGaN interlayers

The effects of InGaN light-emitting diodes (LEDs) with InGaN and composition-graded InGaN interlayers in the space of multiple quantum wells and electron blocking layer are studied numerically. The electrostatic field, energy band diagrams, carrier concentrations, light–current–voltage performances, and internal quantum efficiency (IQE) are investigated. Simulation results show that the light output power and IQE are both largely improved over the conventional LED structure due to the improvement in hole injection efficiency and electron blocking capability, especially for the LED with composition-graded InGaN interlayer.     

硅衬底氮化镓基LED薄膜转移至柔性黏结层基板后其应力及发光性能变化的研究

本文将硅(Si)衬底上外延生长的氮化镓(GaN)基发光二极管(LED)薄膜转移至含有柔性黏结层的基板上, 获得了不受衬底和支撑基板束缚的LED薄膜. 利用高分辨率X射线衍射仪(HRXRD)研究了薄膜转移前后的应力变化, 同时对其光致发光(PL)光谱的特性进行了研究. 结果表明: 硅衬底GaN基LED薄膜转移至柔性基板后, GaN受到的应力会由转移前巨大的张应力变为转移后微小的压应力, InGaN/GaN量子阱受到的压应力则增大; 尽管LED薄膜室温无损转移至柔性基板其InGaN阱层的In组分不会改变, 然而按照HRXRD倒易空间图谱通用计算方法会得出平均铟组发生了变化; GaN基LED薄膜从外延片转移至柔性基板时其PL谱会发生明显红移.     

Luminescent-wavelength tailoring silicon-rich silicon nitride LED

Wavelength tunable photoluminescence （PL） of Si-rich silicon nitride （SRSN） film with buried Si nanocrystals （Si-ncs） grown by plasma enhanced chemical vapor deposition （PECVD） under Sill4 and NH3 environment is investigated. Intense broadband visible emissions tunable from blue to red can be obtained from the as-deposited SiNs thin films with increasing NH3 flow rate from 150 to 250 sccm and detuning the SiH4/NH3 flow ratio during deposition. To date, the normalized PL wavelength of SiNx films after anneal- ing could be detuned over the range of 385-675 nm by decreasing the NH3 flow rate, corresponding to an enlargement on Si-nc size from 1.5-2 to 4-5 nm. The PL linewidth is decreased with increasing ammonia flow rate due to the improved uniformity of Si-ncs under high NH3 flow rate condition. In addition, the PL intensity is monotonically increasing with the blue shift of PL wavelength due to the increasing density of small-size Si-ncs. The ITO/SiNx/p-Si/Al diode reveals highly resistive property with the turn-on voltage and power-voltage slope of only 20 V and 0.18 nW/V, respectively. The turn-on voltage can further reduce from 20 to 3.8 V by improving the carrier injection efficiency with p-type Si nano-rods.     

Signature of the ideality factor in III-nitride multi quantum well light emitting diodes

The ideality factor in recent III-nitride light emitting diodes (LED) is expected to approach values close to \(\eta \approx 1\) near the maximum of the internal quantum efficiency (IQE) because the bimolecular recombination dominates there. However, the electrical characterisation of multi quantum well (MQW) LEDs often yields values which are more close to \(\eta \approx 2\) or even more. To analyse the effect of the MQW on the ideality factor we derive an electrical model based on lumped circuit elements. By comparing the model results with the physical simulations of the ideality factor we demonstrate its validity. The detailed analysis of the circuit elements reveals that the electron scattering has a major impact on the ideality factor near the maximum of the IQE. We show that the ideality factor presents a signature for the hole injection efficiency and thus can be used to estimate the IQE characteristic in the high current regime.     

Improving InGaN-LED performance by optimizing the patterned sapphire substrate shape

The epitaxial growths of GaN films and GaN-based LEDs on various patterned sapphire substrates (PSSes) with different values of fill factor (f) and slanted angle (θ) are investigated in detail. The threading dislocation (TD) density is lower in the film grown on the PSS with a smaller fill factor, resulting in a higher internal quantum efficiency (IQE). Also the ability of the LED to withstand the electrostatic discharge (ESD) increases as the fill factor decreases. The illumination output power of the LED is affected by both θ and f. It is found that the illumination output power of the LED grown on the PSS with a lower production of tanθ and f is higher than that with a higher production of tanθ and f.     

Effect of localized states on internal quantum efficiency of III‐nitride LEDs

A model is suggested accounting for effects of localized electron and hole states formed by composition fluctuations in the InGaN active region of a III‐nitride LED on non‐radiative carrier recombination at threading dislocations. The model enables explanation of the abnormal temperature dependence of internal quantum efficiency (IQE) of a green LED structure recently observed at low current densities. The theoretical predictions are in quantitative agreement with experiment in the temperature range between 200 K and 453 K. (© 2010 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Optimum Quantum Yield of the Light Emission from 2 to 10 nm Hydrosilylated Silicon Quantum Dots

Optimizing the light‐emitting efficiency of silicon quantum dots (Si QDs) has been recently intensified by the demand of the practical use of Si QDs in a variety of fields such as optoelectronics, photovoltaics, and bioimaging. It is imperative that an understanding of the optimum light‐emitting efficiency of Si QDs should be obtained to guide the design of the synthesis and processing of Si QDs. Here an investigation is presented on the characteristics of the photoluminescence (PL) from hydrosilylated Si QDs in a rather broad size region (≈2–10 nm), which enables an effective mass approximation model to be developed, which can very well describe the dependence of the PL energy on the QD size for Si QDs in the whole quantum‐confinement regime, and demonstrates that an optimum PL quantum yield (QY) appears at a specific QD size for Si QDs. The optimum PL QY results from the interplay between quantum‐confinement effect and surface effect. The current work has important implications for the surface engineering of Si QDs. To optimize the light‐emission efficiency of Si QDs, the surface of Si QDs must be engineered to minimize the formation of defects such as dangling bonds at the QD surface and build an energy barrier that can effectively prevent carriers in Si QDs from tunneling out.     

Enhanced carrier injection in InGaN/GaN multiple quantum wells LED with polarization-induced electron blocking barrier

In this report, we designed a light emitting diode (LED) structure in which an N-polar p-GaN layer is grown on top of Ga-polar In_0.1Ga_0.9N/GaN quantum wells (QWs) on an n-GaN layer. Numerical simulation reveals that the large polarization field at the polarity inversion interface induces a potential barrier in the conduction band, which can block electron overflow out of the QWs. Compared with a conventional LED structure with an Al_0.2Ga_0.8N electron blocking layer (EBL), the proposed LED structure shows much lower electron current leakage, higher hole injection, and a significant improvement in the internal quantum efficiency (IQE). These results suggest that the polarization induced barrier (PIB) is more effective than the AlGaN EBL in suppressing electron overflow and improving hole transport in GaN-based LEDs.     

Elastic strain at the interface in Ge clusters on Si substrate—a Raman spectroscopic measurement

Ge clusters are grown on Si substrate at room temperature (Ge-RT) and also at liquid nitrogen temperature (Ge-LNT) by cluster evaporation technique. These clusters show blue luminescence. Raman measurement demonstrates the increase in strain with annealing in diffused disordered Si at the interface between Ge-LNT clusters and Si substrate. This manifests in strain-relaxation in the clusters as observed by Photoluminescence (PL) measurements. The decrease in PL intensity for Ge-RT with annealing has been attributed to reduction in surface oxide species, which is supported by Raman spectroscopic measurements. The objective of the paper is to understand the effect of thermal annealing on both interfacial strain and interdiffusion of elemental Si at the interface, together with luminescence characteristics of the clusters.     

Quantum confined luminescence in Si/SiO2 superlattices

Amorphous Si/SiO₂ superlattices with periodicities between 2 and 5 nm have now been grown on (1 00) Si wafers by several different techniques: molecular beam epitaxy, magnetron sputtering, and plasma enhanced chemical vapor deposition (PECVD). With the first two methods little or no hydrogen is incorporated during growth and visible photo-luminescence (PL) is obtained at wavelengths from 520 to 800 nm. The shift in the PL peak position with Si layer thickness is consistent with quantum confined band-to-band recombination. Annealing the sputtered superlattices at temperatures up to 1100°C results in a very bright red PL that is similar in intensity to that observed in porous Si samples. For large numbers of periods (e.g., 425) the PL is strongly modulated in intensity owing to optical interference within the superlattice. Similar quantum confined, but defect induced, PL is also observed in the PECVD grown superlattices, where the amorphous Si layers are heavily hydrogenated.     

Photoluminescence and electroluminescence investigations at Ge-rich SiO2 layers

Strong blue and violet photo (PL) and electroluminescence (EL) at room temperature was obtained from SiO₂-films grown on crystalline Si, which were either single (SI) or double implanted (DI) with Ge ions and annealed at different temperatures. The PL spectra of Ge-rich layers reach a maximum after annealing at 500–700°C for DI layers or 900–1000°C for SI layers, respectively. Both, PL and EL of 500 nm thick Ge-rich layers are easily visible by the naked eye at ambient light due to their high intensity. Based on excitation spectra we tentatively interpret the blue PL as due to the oxygen vacancy in silicon dioxide.

The EL spectrum of the Ge-implanted oxide correlates very well with the PL one and shows a linear dependence on the injected current over three orders of magnitude. For DI layers much higher injection currents than for SI layers can be achieved. An EL efficiency in the order of 10⁻⁴ for Ge⁺-implanted silicon dioxide was determined.     

Improvement of characteristics of InGaN light-emitting diode by using a staggered AlGaN electron-blocking layer

The optical and physical properties of InGaN light-emitting diode (LED) with a specific design of staggered AlGaN electron-blocking layer (EBL) are investigated numerically in detail. The electrostatic field distribution, energy band, carrier concentration, electroluminescence (EL) intensity, internal quantum efficiency (IQE), and the output power are simulated. The results reveal that this specific design has a remarkable improvement of optical performance compared with the design of conventional LED. The lower electron leakage current, higher hole injection efficiency, and consequently mitigated efficiency droop are achieved. The significant decrease of electrostatic field at the interface between the last barrier and the EBL of LED could be one of the main reasons for these improvements.     

SiC缓冲层对Si表面生长的 ZnO薄膜结构和光电性能的改善

用脉冲激光沉积(PLD)技术制备了ZnO/SiC/Si和 ZnO/Si薄膜并制成了紫外探测器。利用X射线衍射(XRD),光致发光(PL)谱,I-V曲线和光电响应谱对薄膜的结构和光电性能进行了研究。实验结果表明:SiC缓冲层改善了ZnO薄膜的结晶质量和光电性能,其原因可能是SiC作为柔性衬底能够减少ZnO与Si 之间大的晶格失配和热失配导致的界面缺陷和界面态。