宽调谐范围垂直腔面发射激光器特性分析及设计

运用光学传输矩阵和有限元方法对波长可调谐垂直腔面发射激光器(VCSELs)的波长调谐范围进行了研究.对中心波长为980nm的可调谐VCSELs的波长调谐特性和微电子机械系统(MEMS)悬臂梁结构进行了设计，并进行了实验研究.结果表明，MEMS可调谐VCSELs调谐特性同时受到光波谐振腔结构和悬臂梁最大位移的共同影响.在悬臂梁几何尺寸和激光器有源区结构一定的条件下，通过优化可调谐VCSELs的牺牲层厚度可实现大范围波长调谐.同时，对可调谐VCSELs整体结构进行了设计，计算结果显示波长调谐范围达到30nm以 关键词： 悬臂梁 可调谐垂直腔面发射激光器     

AlGaInP thin-film LED with omni-directionally reflector and ITO transparent conducting n-type contact

In this paper a novel A1GalnP thin-film light-emitting diode （LED） with omni-directionally reflector （ODR） and transparent conducting indium tin oxide （ITO） n-type contact structure is proposed, and fabrication process is developed. This reflector is realized with the combination of a low-refractive-index dielectric layer and a high reflectivity metal layer. This allows the light emitted or internally reflected downwardly towards the GaAs substrate at any angle of incidence to be reflected towards the top surface of the chip. ITO n-type contact is used for anti-reflection and current spreading layers on the ODR-LED with ITO. The sheet resistance of the ITO films （95 nm） deposited on n- ohmic contact of ODR-LED is of the order 23.5Ω/△ with up to 90% transmittance （above 92% for 590-770 nm） in the visible region of the spectrum. The optical and electrical characteristics of the ODR-LED with ITO are presented and compared to conventional AS-LED and ODR-LED without ITO. It is shown that the light output from the ODR-LED with ITO at forward current 20mA exceeds that of AS-LED and ODR-LED without ITO by about a factor of 1.63 and 0.16, respectively. A favourable luminous intensity of 218.3 mcd from the ODR-LED with ITO （peak wavelength 620 nm） could be obtained under 20 mA injection, which is 2.63 times and 1.21 times higher than that of AS-LED and ODR-LED without ITO, respectively.[第一段]     

A Flip-Chip AlGaInP LED with GaN/Sapphire Transparent Substrate Fabricated by Direct Wafer Bonding

A red-light AIGalnP light emitting diode （LED） is fabricated by using direct wafer bonding technology. Taking N-GaN wafer as the transparent substrate, the red-light LED is flip-chiped onto a structured silicon submount. Electronic luminance （EL） test reveals that the luminance flux is 130% higher than that of the conventional LED made from the same LED wafer. Current-voltage （I- V） measurement indicates that the bonding processes do not impact the electrical property of AIGalnP LED in the small voltage region （V 〈 1.5 V）. In the large voltage region （V 〉 1.5 V）, the I-V characteristic exhibits space-charge-limited currents characteristic due to the p-GaAs/n-GaN bonding interface.     

GaN基多量子阱发光二极管的极化效应和载流子不均匀分布及其影响

制备了GaN基绿光发光二极管.利用耦合法求解了在自发极化和压电极化效应影响下的GaN/InGaN量子阱的极化电场强度.考虑载流子在量子阱间的不均匀分布，模拟计算了系统的一维薛定谔方程、稳态速率方程和泊松方程，得到了载流子在各个阱间的分布比值和辐射复合速率.同时还得到了不同电流下电致发光(EL)谱的峰值波长、谱峰半高宽及EL谱强度的变化情况.发现当测试电流由10 mA 增加到70 mA时，理论结果与实验结果能很好符合. 关键词： 极化 载流子不均匀分布 复合速率     

GaN基双波长发光二极管电致发光谱特性研究

通过同时调节同一有源区内不同阱层和垒层的In组分，制备了GaN基单有源区蓝、绿光双波长发光二极管(LED).实现了20mA下蓝、绿光同时发射.实验发现随注入电流由10mA增大到60mA，电致发光(EL)谱中绿光峰强度相对于蓝光峰强度不断增强，峰值波长蓝移也更加明显.同时考虑极化效应和载流子不均匀分布的影响，通过对一维薛定谔方程、稳态速率方程和泊松方程的联立自洽求解.分析了测试电流下蓝、绿光EL谱峰值波长和功率的变化情况.发现理论结果与实验结果有很好地符合. 关键词： 极化 载流子不均匀分布 双波长     

High power and high reliability GaN/InGaN flip-chip light-emitting diodes

High-power and high-reliability GaN/InGaN flip-chip light-emitting diodes (FCLEDs) have been demonstrated by employing a flip-chip design, and its fabrication process is developed. FCLED is composed of a LED die and a submount which is integrated with circuits to protect the LED from electrostatic discharge (ESD) damage. The LED die is flip-chip soldered to the submount, and light is extracted through the transparent sapphire substrate instead of an absorbing Ni/Au contact layer as in conventional GaN/InGaN LED epitaxial designs. The optical and electrical characteristics of the FCLED are presented. According to ESD IEC61000-4-2 standard (human body model), the FCLEDs tolerated at least 10\,kV ESD shock have ten times more capacity than conventional GaN/InGaN LEDs. It is shown that the light output from the FCLEDs at forward current 350mA with a forward voltage of 3.3\,V is 144.68\,mW, and 236.59\,mW at 1.0\,A of forward current. With employing an optimized contact scheme the FCLEDs can easily operate up to 1.0\,A without significant power degradation or failure. The life test of FCLEDs is performed at forward current of 200\,mA at room temperature. The degradation of the light output power is no more than 9\% after 1010.75\,h of life test, indicating the excellent reliability. FCLEDs can be used in practice where high power and high reliability are necessary, and allow designs with a reduced number of LEDs.