电沉积法制备的泡沫镍的晶体结构与磁性能

 采用X射线衍射仪、振动样品磁强计分别测试了电沉积法制备的泡沫镍的晶体结构和磁性能，研究了电流密度、温度、占空比、脉冲频率对镍沉积层的晶体结构和磁性能的影响；并用扫描电子显微镜、透射电子显微镜观察了泡沫镍的组织结构与微观形貌。制备出的3维网络状泡沫镍密度为0.25 g/cm³，孔隙率为97.5%、孔径分布为400～500 μm。沉积层大颗粒粒径为1 μm，沉积层晶粒尺寸在10nm以下;泡沫镍为超顺磁材料，具有低的矫顽力和高的磁导率，其磁导率和饱和磁化强度随沉积层晶粒尺寸的增加而增大。     

空心微球结构Au/Ag合金泡沫块体的制备

将平均晶粒尺寸为4.6 nm的金粒子通过静电作用粘附于聚苯乙烯（PS）微球表面用于化学镀,化学镀金后PS表面的金沉积层几乎达到完全包覆,厚度70~90 nm;在Au/PS表面进行化学镀银,沉积的银颗粒堆积紧密,颗粒大小较先前沉积的金颗粒大,镀覆层厚度增厚至200~400 nm;模板去除后,获得了完全自支撑的Au40Ag60空心微球结构的圆柱状泡沫材料。制备的金银合金泡沫由直径约10 m的空心球壳组成,圆柱体直径约5 mm,密度约1.2 g/cm3。     

微型金柱腔中原位成型制备微孔泡沫

 报道了在μm量级圆柱状金柱腔中原位成型制备微孔泡沫的方法。在直径400 μm、长度700 μm、壁厚20 μm、两端开口的金柱腔中原位成型成功制备出密度为50 mg·cm^-3、蜂窝直径不超过1 μm的多元丙烯酸酯聚合物微孔泡沫。干燥过程中泡沫没有明显收缩,在柱腔中填充紧密,无需后续机械加工。     

强辐射源用铜纳米线阵列靶的结构与性能

 采用多孔阳极氧化铝（AAO）模板脉冲电沉积法制备了强辐射源用铜纳米线阵列靶,并用扫描电子显微镜（SEM）、能谱（EDS）和X射线衍射（XRD）对其进行了结构表征。结果表明：去除AAO模板后铜纳米线平均直径比去除AAO模板前的平均孔径大32%,长度缩短5%。对电沉积2 000 s的样品进行铜纳米线长度分布表征,结果显示:距离模板圆心越远,铜纳米线越长。与超短脉冲激光相互作用实验结果表明:纳米线平均长度在18~50 μm范围内,铜Kα光子产额先随纳米线长度增加而增加,当长度大于33 μm时,铜Kα光子产额开始下降。     

银纳米颗粒/多孔硅复合材料的制备与气敏性能研究

采用双槽电化学腐蚀法以电阻率为10-15 Ω·cm的p型<100>晶向的单晶硅片制备了孔径约为1.5 μm, 孔深约为15-20 μm的p型多孔硅, 并以此多孔硅作为基底采用无电沉积法通过调控沉积时间在其表面沉积了不同厚度的银纳米颗粒薄膜. 采用扫描电子显微镜和X 射线衍射仪表征了银纳米颗粒/多孔硅复合材料的形貌和微观结构, 结果表明银纳米颗粒较均匀的分布于多孔硅的表面上且沉积时间对产物的形貌有重要影响. 采用静态配气法在室温下研究了银纳米颗粒/多孔硅复合材料对NH₃的气敏性能. 气敏测试结果表明沉积时间对产物的气敏性能影响较大. 当沉积时间较短时, 适量银纳米颗粒掺杂的多孔硅复合材料由于其较高的比表面积以及特殊的形貌和结构, 对NH₃气体表现出较高的灵敏度、优良的响应/恢复性能. 室温下, 其对50 ppm 的NH₃气体的气敏灵敏度可以达到5.8左右.     

靶用低密度聚4-甲基-1-戊烯泡沫的制备与表征

 通过控制体系的受热历史,改进了惯性约束聚变靶材料聚4-甲基-1-戊烯(TPX)泡沫二元溶剂体系的制备工艺,并利用β射线检测和X射线照相技术,对不同制备工艺的泡沫柱进行密度分布表征。结果表明：两种方法检测的结果基本一致,即凝胶过程的冷却速率为1 ℃/min,且凝胶后采用淬冷使其快速固化的方法能制得密度分布均匀的低密度TPX泡沫样品,从而确定了均匀泡沫的最佳制备工艺。由于二元溶剂体系的超低密度TPX泡沫样品孔径太大,极个别大孔可达数百μm,均匀度极低,所以采用TPX的环己烷一元溶剂体系可以成功制备出最低密度达3 mg/cm³的超低密度TPX泡沫样品,且满足Z箍缩物理实验用靶的需求。     

空腔铜靶的化学镀制研究

 介绍了在预处理芯轴(聚甲基丙烯酸甲酯)表面采用化学镀的方法制备铜空腔的技术,研究了镀液中硫酸铜含量、甲醛含量,镀液pH值、温度等对化学镀铜沉积速率和溶液稳定性的影响。根据实验确定了适宜的化学镀铜工艺规范：硫酸铜质量浓度10~20 g/L,TART·K·Na质量浓度10~30 g/L,EDTA·2Na质量浓度10~28 g/L,甲醛体积浓度10~25 mL/L,添加剂质量浓度10 mg/L,pH值12~13,温度35~65 ℃。通过该工艺制备出的镀层厚度达到10～25 μm,均匀性达到95%,表面无砂眼、裂纹等缺陷,刻蚀芯轴后空腔能自持。该方法为ICF研究制备金属或合金材料靶提供了新的途径。     

碳气凝胶/聚苯乙烯双介质柱状靶的研制

 介绍了碳气凝胶/聚苯乙烯（CRF/CH）双介质柱状靶的制备方法。使用溶胶-凝胶法和微模具原位成型法制备了直径为820 μm的间苯二酚-甲醛（RF）气凝胶微柱,在氮气保护下进行高温碳化后得到直径为730 μm、密度为250 mg·cm^-3的CRF微柱;采用浸渍提拉法在CRF微柱柱面镀制一层厚度为26 μm 的CH薄膜, 形成CRF/CH双介质结构;采用机械微切割技术制备了长度为1 mm, 内径为730 μm,壁厚为26 μm的CRF/CH双介质柱状靶。实验研究了RF,CRF气凝胶微柱的制备工艺、微观形貌及CRF微柱轴向和径向的密度均匀性,探讨了影响CH薄膜厚度的主要因素,并对CH薄膜的表面形貌和两种材料之间的界面进行了表征。     

电沉积－退火工艺制备铜铟硒太阳能电池薄膜及表征

利用电沉积硒气氛下后续退火的工艺制备出了高结晶质量的铜铟硒薄膜．通过X射线衍射、扫描电子显微镜、拉曼光谱、紫外-可见-近红外光谱和阻抗谱技术对退火后的铜铟硒薄膜进行表征,结果表明530 oC硒化退火后的铜铟硒薄膜具有四方的黄铜矿晶体结构,晶粒尺寸达到微米量级,光学带隙为0.98 eV,经过KCN溶液去除表面高导电性的铜硒化合物后铜铟硒薄膜的载流子浓度在10¹⁶ cm^-3量级．利用硒化退火的铜铟硒薄膜作为光吸收层制备了结构为AZO/i-ZnO/CdS/CIS/Mo/glass的太阳能电池,在AM1.5光照条件下对其电流-电压特性测试后发现面积为0.2 cm²的电池可以达到0.96％的能量转换效率,并对限制电池效率的原因做出了初步的分析和讨论.     

用化学镀法制备的铜包覆La0.7Ca0.3MnO3复合体系的巨磁电阻效应

用化学镀法制备了铜包覆的La_(0.7)Ca_(0.3)MnO_3(LCMO)颗粒.这些粉末压片之后在氩气中煅烧,形成铁磁-金属型结构,得到被铜均匀包覆的LCMO复合材料.利用扫描电子显微镜(SEM)观察了LCMO被铜包覆的形貌.研究了不同烧结温度下样品的电输运性质和在0.3T外加磁场下的磁电阻行为.结果表明LCMO在通过包覆铜进行表面修饰后,样品的绝缘体-金属的转变温度(Tp)往高温移动接近室温,室温附近的磁电阻值也得到显著提高.     

磁性ICF靶丸的化学镀工艺制备与表征

 采用化学镀工艺在ICF聚苯乙烯靶丸表面包覆了一层磁性的Ni-P合金镀层，并分别用扫描电子显微镜、能谱仪、X射线衍射仪以及振动样品磁强计对其形貌、组成、结构和磁性能进行了表征。结果表明：通过化学镀工艺制备的Ni-P合金镀层厚度约为4 μm，且为非晶结构，并具有一定的磁性；该磁性ICF靶丸可望用来进行磁悬浮实验研究。最后，对聚苯乙烯靶丸表面磁性涂层的制备机理进行了讨论。     

Fabrication of microelectrodes deeply embedded in LiNbO3 using a femtosecond laser

We present a novel technique to fabricate deeply embedded microelectrodes in LiNbO₃ using femtosecond pulsed laser ablation and selective electroless plating. The fabrication process mainly consists of four steps, which are (1) micromachining of microgrooves on the surface of LiNbO₃ by femtosecond laser ablation; (2) formation of AgNO₃ films on substrates; (3) scanning the femtosecond laser beam in the fabricated microgrooves for modification of the inner surfaces; and (4) electroless copper plating. The void-free electroless copper plating is obtained with appropriate cross section of microgrooves and uniform initiation of the autocatalytic deposition on the inner surface of grooves. The dimension and shape of the microelectrodes could be accurately controlled by changing the conditions of femtosecond laser ablation, which in turn can control the distribution of electric field inside LiNbO₃ crystal for various applications, opening up a new approach to fabricate three-dimensional integrated electro-optic devices.     

Investigation of the structure and the physical properties of nickel-phosphorus ultra-black surfaces

Ultra-black materials with low reflectivity can be applied in many fields of science and technology. We deposited nickel-phosphorus alloys (Ni-P) on copper substrate with the electroless plating method and etched the electroless plating with nitric acid in order to build ultra-black surface. On the one hand, the components of the Ni-P ultra-black surface layer were investigated by XRF and XPS. SEM represented that there are innumerable conical holes with the different diameters on the surface. XRD showed that the whole surface has become amorphous. On the other hand, compared to electroless blackening film by oxidation and black chromium plating materials, the Ni-P ultra-black surface showed lower wavelength dependence and lower reflectance in the range of 380–780 nm. In addition, the temperature of the sample with the Ni-P ultra-black surface increased more highly and quickly compared to the black chromium plating film after exposure in an IR laser for about half an hour. PACS 68.55.-a; 82.80.Kq; 78.68.+m     

Electroless copper coating of epoxide plates in an ultrasonic field.

This paper reports the study of ultrasonic irradiation effects on electroless copper coating on an epoxide resin. Several parameters were monitored, such as plating rates, practical adhesion and internal stress, versus varying acoustic powers at a constant frequency of 530 kHz. Exposure conditions were characterised by both transmitted power and interfacial mass transfer coefficients. Optimum conditions expressed in irradiation time and power were determined. The use of ultrasound during electroless copper plating affects the plating rates and the deposits properties, particularly the practical adhesion which increases whereas the internal stress decreases. Then, the changes in the coating mechanisms are discussed.     

Preparation of Sn films deposited on carbon nanotubes

In this work carbon nanotubes were first grown on copper substrate by chemical vapor deposition method. The Sn deposits were then deposited on the surface of as-grown carbon nanotubes by three different methods: electroplating, electroless plating and displacing methods. The Sn deposits on CNTs surface were characterized by both scanning electron microscope and field emission scanning electron microscope. The compositions of Sn deposits were analyzed by energy dispersive X-ray spectroscope. The results showed that both electroless plating and displacing deposits can but the electroplating deposits cannot cover on the surface of CNTs. Besides C, Sn, Ni and Pd, the electroless deposits also contain element of oxygen and the displacing deposits also contain elements of copper and oxygen.     

Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers

Advanced printed circuit boards (PCBs) with sequential build-up (SBU) layers require alternating dielectric and copper layers on top of a core substrate. This can be achieved by lamination of resin coated copper (RCC) or by coating of dielectric polymers followed by copper deposition. The plating of electroless Ni/Au used as a solderability preservative on top of sequential build-up layers is investigated. For this application a solder mask polymer has to be applied in order to separate solder pads. Experiments showed that on parts of the underlying build-up layer exposed to the electroless Ni plating solution electroless Ni can grow. This overplating is caused by the remains of colloidal Pd/Sn catalyst on top of the build-up layer from preceding electroless Cu deposition. At very small features skipping of the plating can also take place. The overplating and skipping phenomena are influenced by a number of parameters, such as the temperature, the concentration of the stabilizer and pH. The dimensions of features on the board and the thickness of the solder-mask polymer also influence skipping. Based on qualitative analyses of the skipping and overplating phenomena rules of thumb for the solder mask design based on the plating conditions are proposed.     

Highly adhesive metal plating on Zylon fiber via iodine pretreatment

Highly adhesive metal plating was performed on poly(p-phenylene-2,6-benzobisoxazole) fiber named Zylon^® via iodine pretreatment followed by electroless plating. First, iodine components were selectively doped into the inner part of the fiber near the surface through iodine vapor exposure. The doped iodine was converted to palladium iodide particles by treating with palladium chloride solution. After the reduction of the iodide to metal palladium particles, electroless copper plating was conducted on the fiber. A uniform copper layer was deposited on the fiber surface and exhibited high durability in durability tests such as ultrasonic exposure, tape peeling-off, and corrosion in NaCl solution. This durability was attributed to the palladium particles formed at the fiber surface that served as an anchor for the plated layer as well as an electroless plating catalyst. The plated fibers also possessed electrical conductivity. Although the tensile strength of the Zylon^® fiber decreased from 5.8 to 4.9 GPa after undergoing the pretreatment and plating processes, the light shielding effect improved the light resistance of the plated fibers in terms of tensile properties. After 18 days of xenon lamp exposure, the plated fibers retained 74% of its initial strength, whereas that of untreated fibers decreased to 43%.     

Electroless plating of copper on surface-modified glass substrate

This work focuses on developing a novel convenient method for electroless copper deposition on glass material. This method is relied on the formation of amino (NH₂)-terminated film on the surface of glass substrate, by coating polyethylenimine (PEI) on glass matrix and using epichlorohydrin (ECH) as cross-linking agent. The introduced amino groups can effectively adsorb the palladium, the catalysts which could initiate the subsequent Cu electroless plating, onto the glass substrate surface. Finally, a copper film is formed on the palladium-activated glass substrate through copper electroless plating and the surface-coppered glass material is therefore acquired. X-ray diffraction (XRD), atomic force microscope (AFM), scanning electron microscopy (SEM) images combined with energy diffraction X-ray (EDX) analysis demonstrate the successful copper deposition on the surface of glass substrate.     

镍-磷/纳米碳管化学复合镀层的研究

采用化学复合镀方法,在基体铜片上进行Ni-P／纳米碳管复合镀．用金相显微镜、扫描电子显微镜、X射线衍射仪和显微硬度计等实验手段研究复合镀层的组织、结构和性能．结果表明:随着镀液中纳米碳管含量的增加,复合镀层表面的颗粒变小且密度增加;复合镀层的硬度随纳米碳管含量的增加而提高;此外,纳米碳管的加入,使镀层由非晶变成了纳米晶,促进了复合镀层的晶化．