Si衬底功率型GaN基绿光LED性能

对本实验室在Si(111)衬底上MOCVD法生长的芯片尺寸为400 μm×600μm功率型绿光LED的光电性能进行研究.带有银反射镜的LED在20 mA的电流下正向工作电压为3.59 V,主波长518 nm,输出光功率为7.3 mW,90 mA下达到28.2 mW,发光功率效率为7.5%,光输出饱和电流高达600 mA.在200 mA电流下加速老化216 h,有银反射镜的LED光衰小于尤银反射镜的LED,把这一现象归结于Ag反射镜在提高出光效率的同时,降低了芯片奉身的温度.本器件有良好的发光效率,光衰和光输出饱和电流等综合特性表明,Si衬底GaN基绿光LED具有诱人的发展前景.     

SiO2图形化蓝宝石衬底对GaN生长及LED发光性能的影响

为了提高氮化镓(GaN)基发光二极管(LEDs)的发光性能,采用等离子体增强化学气相沉积(PECVD)在蓝宝石衬底上沉积SiO_2薄膜,经过光刻和干法刻蚀技术制备了SiO_2图形化蓝宝石衬底(SiO_2 patterned sapphire substrate, SPSS),利用LED器件的外延生长和微纳加工技术获得了基于SPSS的GaN基LED器件。通过分析GaN外延层晶体质量、光提取效率和LED器件性能,重点研究了SPSS对GaN生长及LED发光性能的影响。实验及模拟仿真结果表明,与常规图形化蓝宝石衬底(Conventional patterned sapphire substrate, CPSS)相比,SPSS上生长的GaN外延层位错密度较低,晶体质量较高,SPSS-LED的光提取效率提高26%、光输出功率和亮度均提高约5%。     

转移基板材质对Si衬底GaN基LED芯片性能的影响

在Si衬底上生长了GaN基LED外延材料,分别转移到新的硅基板和铜基板上,制备了垂直结构蓝光LED芯片。研究了这两种基板GaN基LED芯片的光电性能。在切割成单个芯片之前,对大量尺寸为(300μm×300μm)的这两种芯片分别通高达1 A的大电流在测试台上加速老化1 h。结果显示,铜基板Si衬底GaN基LED芯片有更大的饱和电流,光输出效率更高,工作电压随驱动电流的变化不大,光输出在老化过程中衰减更小。铜基板芯片比硅基板芯片可靠性更高,在大功率半导体照明器件中前景诱人。     

GaN基高压直流发光二极管制备及其性能分析

GaN基高压直流发光二极管工艺制备, 采用蓝宝石图形衬底(PSS) 外延片制备正梯形芯粒结构的GaN基高压直流LED.相对其他结构器件, 该结构器件发光效率最高, 封装白光后, 在色温4500 K, 驱动电流20 mA时, 光效116.06 lm/W, 对应电压50 V. 测试其I-V曲线表明, 开启电压为36 V, 对应驱动电流为1.5 mA; 在电流15 mA至50 mA时, 光功率随驱动电流增加近似于线性增加, 在此区域光效随电流增加而降低的幅度比较缓慢, 表明GaN基高压直流LED适宜于采用大电流密度驱动, 而不会出现驱动电流密度增加导致量子效率明显下降(efficiency droop), 为从芯片层面研究解决量子效率下降难题提供了一种新思路.     

条形叉指n阱和p衬底结的硅LED设计及分析

采用0.35μm双栅标准CMOS工艺最新设计和制备了叉指型SiLED发光器件。器件结构采用n阱和p衬底结,n阱为叉指结构,嵌入到p衬底中而结合成Sipn结LED。观察了SiLED发光显微图形及实际器件的版图,并在对器件进行了正、反向I-V特性测试、光功率及光谱特性的测量。SiLED的正向偏置时开启电压为0.9V,反向偏置时在15V左右可观察到发光。器件在室温下反向偏置时,10V,100mA电流下所得输出光功率为12.6nW,发光峰值在758nm处。     

电流阻挡层对大功率LED光电热特性的影响

LED芯片作为LED光源的核心,其质量直接决定了器件的性能、寿命等,因此在内量子效率已达到高水平的情况下,致力于提高光提取效率是推动LED芯片技术发展的关键一步。由于蓝宝石衬底具有绝缘特性,传统LED将N和P电极做在芯片出光面的同一侧,而芯片出光面上的P电极焊盘金属会遮挡吸收其正下方发光区发出的大部分光而造成光损失,为改善这一现象并缓解P电极周围的电流拥挤效应,本文设计制备了在P电极正下方的氧化铟锡(ITO)透明导电层和p-GaN之间插入SiO_2薄膜作为电流阻挡层(CBL)的大功率LED,并与无CBL结构的大功率LED相比较。对未封装的有无CBL结构的LED在350 mA电流下进行正向偏压,辐射通量,主波长等裸芯性能测试,结果显示两种芯片的正向偏压均集中在3～3.1 V,而有CBL结构的LED光输出功率有明显提升,这是因为CBL阻挡了电流在P电极正下方的扩散,减少流向有源区的电流密度,故减小了P电极对光的吸收和遮挡,且电流通过CBL引导至远离P电极的区域,缓解了电极周围的电流拥挤。对两种芯片进行相同结构和工艺条件的封装,并对封装样品进行热特性及10～600 mA的变电流光电特性测试,得到两种器件的发光光谱及光功率等光学特性。结果表明随着电流增加,两种器件的光谱曲线均发生蓝移,且有CBL结构的LED主波长偏移量较无CBL结构LED少10 nm,可见有CBL结构的LED光谱受驱动电流变化的影响更小,因此其显色性能更为稳定。而在小电流条件下, CBL对器件光功率的影响不大,随着工作电流的增大, CBL对器件光功率的改善效果逐渐提升。在大电流条件下,无CBL结构的LED结温更高,正向电压更低,随电流的增大二者之间的电压差增大。在25℃的环境温度, 350 mA工作电流下,加入CBL结构使器件电压升高约0.04 V,但器件光功率最高提升了9.96%,且热阻明显小于无CBL结构器件,说明有CBL结构LED产热更少。因此CBL结构大大提高了器件的光提取效率,并使其光谱漂移更小,显色性能更为稳定。     

图形硅衬底GaN基发光二极管薄膜去除衬底及AlN缓冲层后单个图形内微区发光及 应力变化的研究

研究了图形硅衬底上外延生长的氮化镓(GaN)基发光二极管(LED)薄膜、去除硅衬底后的无损自由状态LED薄膜以及去除氮化铝(AlN)缓冲层后的自由状态LED薄膜单个图形内的微区光致发光(PL)性能, 用荧光显微镜与扫描电镜观测了去除AlN缓冲层前后LED薄膜断面弯曲状况的变化. 研究结果表明: 1)去除硅衬底后, 自由支撑的LED薄膜朝衬底方向呈柱面弯曲状态, 且相邻图形的柱面弯曲方向不一致, 当进一步去除AlN缓冲层后薄膜会由弯曲变为平整; 2)LED薄膜在去除硅衬底前后同一图形内不同位置的PL谱具有显著差异, 而当去除AlN缓冲层后不同位置的PL谱会基本趋于一致; LED薄膜每一位置的PL 谱在去除硅衬底后均出现明显红移, 进一步去除AlN缓冲层后PL谱出现程度不一的微小蓝移; 3)自由支撑的LED薄膜去除AlN缓冲层后, PL光强随激光激发密度变化的线性关系增强, 光衰减得到改善.     

Si衬底GaN基蓝光LED老化性能

报道了芯片尺寸为500μm×500μm硅衬底GaN基蓝光LED在常温下经1000h加速老化后的电学和发光性能,其光功率随老化时间的变化分先升后降两个阶段;老化后的反向漏电流和正向小电压下的电流均有明显的增加;老化后器件的外量子效率(EQE)比老化前低;老化前后EQE衰减幅度在不同的注入电流下存在明显差异,衰减幅度最小处出现在发光效率最高时对应的电流密度区间。     

中高温GaN插入层厚度对蓝光LED光电性能的影响

利用金属有机气相化学沉积(MOCVD)技术在蓝宝石图形衬底上生长GaN基蓝光LED,并系统研究了不同中高温GaN插入层厚度对其光电性能的影响。利用芯片测试仪和原子力显微镜(AFM)表征了GaN基蓝光LED外延片的光电性能以及表面形貌。当中高温GaN插入层厚度从60 nm增加至100 nm时,V形坑尺寸从70~110 nm增加至110~150 nm。当注入电流为20 mA时,LED芯片的光功率从21.9 mW增加至24.1mW;当注入电流为120 mA时,LED芯片的光功率从72.4 mW增加至82.4 mW。对V形坑尺寸调控LED光电性能的相关物理机制进行了分析,结果表明:增大V形坑尺寸有利于增加空穴注入面积和注入效率,进而提高LED器件的光功率。     

不同基板1W硅衬底蓝光LED老化性能研究

将硅(Si)衬底上外延生长的氮化镓(GaN)基LED薄膜,通过电镀的方法转移到铜支撑基板、铜铬支撑基板以及通过压焊的方法转移到新的硅支撑基板,获得了垂直结构蓝光LED器件,并对其老化特性进行了对比研究。研究结果表明,在三种基板中铜支撑基板的器件老化后光电特性最稳定。把这一现象归结于三种样品的应力状态以及基板热导率的不同,其中应力状态可能是影响器件可靠性的最主要因素。     

Improved light extraction efficiency of GaN-based LEDs with patterned sapphire substrate and patterned ITO

To improve the light extraction efficiency of GaN-based light-emitting diodes (LEDs), periodic semisphere patterns with 3.5 μm width, 1.2 μm height, and 0.8 μm spacing were formed on sapphire substrate by dry etching using BCl₃/Cl₂ gas chemistry. The indium tin oxide (ITO) transparent conductive layer was patterned by wet etching to reduce the total internal reflection existing along between p-GaN, ITO, and air. At 350 mA injection current, the high power LED by integrating patterned sapphire substrate with patterned ITO technology exhibited a 36.9% higher light output power than the conventional LEDs.     

InGaN/GaN多量子阱结构发光二极管发光机理转变的低频电流噪声表征

本文对InGaN/GaN多量子阱结构发光二极管开启后的电流噪声进行了测试, 结合低频电流噪声的特点和载流子之间的复合机理, 研究了低频电流噪声功率谱密度与发光二极管发光转变机理之间的关系. 结论表明, 当电流从0.1 mA到10 mA逐渐增大的过程中, InGaN/GaN发光二极管的电流噪声行为从产生-复合噪声逐渐接近于低频1/f噪声, 载流子的复合机理从非辐射复合过渡为电子与空穴之间载流子数的辐射复合, 并具有标准1/f噪声的趋势, 此时多量子阱中的电子和空穴之间的复合趋向于稳定. 本文的结论提供了一种表征InGaN/GaN多量子阱发光二极管发光机理转变的有效方法, 为进一步研究发光二极管中载流子的复合机理、优化和设计发光二极管、提高其发光量子效率提供理论依据.     

Low threshold voltage light-emitting diode in silicon-based standard CMOS technology

Low-voltage silicon(Si)-based light-emitting diode(LED) is designed based on the former research of LED in Si-based standard complementary metal oxide semiconductor(CMOS) technology.The low-voltage LED is designed under the research of cross-finger structure LEDs and sophisticated structure enhanced LEDs for high efficiency and stable light source of monolithic chip integration.The device size of low-voltage LED is 45.85×38.4(μm),threshold voltage is 2.2 V in common condition,and temperature is 27 ℃.The external quantum efficiency is about 10-6 at stable operating state of 5 V and 177 mA.     

High power and high reliability GaN/InGaN flip-chip light-emitting diodes

High-power and high-reliability GaN/InGaN flip-chip light-emitting diodes (FCLEDs) have been demonstrated by employing a flip-chip design, and its fabrication process is developed. FCLED is composed of a LED die and a submount which is integrated with circuits to protect the LED from electrostatic discharge (ESD) damage. The LED die is flip-chip soldered to the submount, and light is extracted through the transparent sapphire substrate instead of an absorbing Ni/Au contact layer as in conventional GaN/InGaN LED epitaxial designs. The optical and electrical characteristics of the FCLED are presented. According to ESD IEC61000-4-2 standard (human body model), the FCLEDs tolerated at least 10\,kV ESD shock have ten times more capacity than conventional GaN/InGaN LEDs. It is shown that the light output from the FCLEDs at forward current 350mA with a forward voltage of 3.3\,V is 144.68\,mW, and 236.59\,mW at 1.0\,A of forward current. With employing an optimized contact scheme the FCLEDs can easily operate up to 1.0\,A without significant power degradation or failure. The life test of FCLEDs is performed at forward current of 200\,mA at room temperature. The degradation of the light output power is no more than 9\% after 1010.75\,h of life test, indicating the excellent reliability. FCLEDs can be used in practice where high power and high reliability are necessary, and allow designs with a reduced number of LEDs.     

GaN-based light-emitting diodes directly grown on sapphire substrate with holographically generated two-dimensional photonic crystal patterns

As an approach to enhance light extraction from GaN-based light-emitting diodes (LEDs), we inserted a submicron period photonic crystal (PC) pattern at the interface between GaN epilayer and sapphire substrate. A two-dimensional square-lattice pillar array of 600-nm period was produced directly onto the sapphire substrate by a combination of laser holography and inductively-coupled-plasma etching. A standard GaN LED heterostructure was grown on top of the nano-patterned substrate, which was then processed to conventional bottom-emitting LED chips. At the drive current of 20 mA, the PC-LED produced surface-normal output power about 40% higher than that of the reference LED (with no PC integrated). Temperature-dependent photoluminescence measurement indicated that the emission enhancement was solely a structural effect by the integrated PC pattern.     

全息技术制作二维光子晶体蓝宝石衬底提高发光二极管外量子效率

为了提高GaN基发光二极管(LED)的外量子效率,在蓝宝石衬底制作了二维光子晶体.衬底上的二维光子晶体结构采用激光全息技术和感应耦合等离子体(ICP)干法刻蚀技术制作,然后采用金属氧化物化学气相沉积(MOCVD)技术在图形蓝宝石衬底(PSS)上生长2μm厚的n型GaN层,4层量子阱和200nm厚的p型GaN层,形成LED结构.衬底上制作的二维光子晶体为六角晶格结构,晶格常数为3.8μm,刻蚀深度为800nm.LED器件光强输出测试结果显示,在PSS上制作的LED(PSS-LED)的发光强度普遍高于蓝宝石平 关键词： 全息 发光二极管 图形蓝宝石衬底 外量子效率     

Micro-light-emitting-diode array with dual functions of visible light communication and illumination

We demonstrate high-speed blue 4 × 4 micro-light-emitting-diode(LED) arrays with 14 light-emitting units(two light-emitting units are used as the positive and negative electrodes for power supply, respectively) comprising multiple quantum wells formed of Ga N epitaxial layers grown on a sapphire substrate, and experimentally test their applicability for being used as VLC transmitters and illuminations. The micro-LED arrays provide a maximum-3-d B frequency response of 60.5 MHz with a smooth frequency curve from 1 MHz to 500 MHz for an optical output power of 165 mW at an injection current of 30 mA, which, to our knowledge, is the highest response frequency ever reported for blue Ga N-based LEDs operating at that level of optical output power. The relationship between the frequency and size of the device single pixel diameter reveals the relationship between the response frequency and diffusion capacitance of the device.     

Improving the optical performance of InGaN light-emitting diodes by altering light reflection and refraction with triangular air prism arrays

The effect of triangular air prism (TAP) arrays with different distance-to-width (d/w) ratios on the enhancement of light extraction efficiency (LEE) of InGaN light-emitting diodes (LEDs) is investigated. The TAP arrays embedded at the sapphire/GaN interface act as light reflectors and refractors, and thereby improve the light output power due to the redirection of light into escape cones on both the front and back sides of the LED. Enhancement in radiometric power as high as 117% and far-field angle as low as 129° are realized with a compact arrangement of TAP arrays compared with that of a conventional LED made without TAP arrays under an injection current of 20 mA.     

MOCVD生长InGaN/GaN MQW紫光LED

利用LP－MOCVD系统生长了InGaN/GaN MQW紫光LED外延片，双晶X射线衍射测试获得了2级卫星峰，室温光致发光谱的峰值波长为399.5nm，FWHM为15.5nm，波长均匀性良好。制成的LED管芯，正向电流20mA时，工作电压在4V以下。     

A facile method for flexible GaN‐based light‐emitting diodes

Flexible GaN‐based light‐emitting diodes (LEDs) on polyethylene terephthalate (PET) substrates are demonstrated. The process uses commercial LEDs on patterned sapphire substrates, laser lift‐off (LLO), wet etching for additional surface roughening, and mounting of the freestanding LED on a PET substrate. Electrical and optical properties from the free‐standing LLO‐LEDs mounted on the flexible PET substrates were characterized. The process is scalable to large wafer diameters. (© 2012 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)