金属规则表面形貌影响二次电子产额的解析模型

表面形貌是影响二次电子发射特性的重要因素, 但目前仍缺乏刻画这一影响规律的解析模型. 本文通过分析发现表面结构的遮挡作用是影响二次电子发射特性的主要因素. 基于二次电子以余弦角分布出射的规律, 提出了建立表面形貌参数与二次电子产额之间定量关系的方法, 并以矩形槽和三角槽为例, 建立了电子正入射和斜入射时的一代二次电子产额的解析模型. 将推导的解析模型与Monte Carlo模拟结果和实验结果进行了比较, 结果表明本文建立的模型能够正确反映规则表面形貌的二次电子产额. 本文的模型对于反映常用规则结构影响二次电子出射的规律以及指导通过表面结构调控二次电子发射特性都具有参考价值.     

Effect of Cu doping on the secondary electron yield of carbon films on Ag-plated aluminum alloy

Reducing the secondary electron yield (SEY) of Ag-plated aluminum alloy is important for high-power microwave components. In this work, Cu doped carbon films are prepared and the secondary electron emission characteristics are studied systematically. The secondary electron coefficient δ_max of carbon films increases with the Cu contents increasing at first, and then decreases to 1.53 at a high doping ratio of 0.645. From the viewpoint of surface structure, the higher the content of Cu is, the rougher the surface is, since more cluster particles appear on the surface due to the small solid solubility of Cu in the amorphous carbon network. However, from viewpoint of the electronic structure, the reduction of the sp² hybrid bonds will increase the SEY effect as the content of Cu increases, due to the decreasing probability of collision with free electrons. Thus, the two mechanisms would compete and coexist to affect the SEY characteristics in Cu doped carbon films.     

介质材料二次电子发射特性对微波击穿的影响

以介质填充的平行板放电结构为例,本文主要研究了介质填充后微波低气压放电和微放电的物理过程.为了探究介质材料特性对微波低气压放电和微放电阈值的影响,本文采用自主研发的二次电子发射特性测量装置,测量了7种常见介质材料的二次电子发射系数和二次电子能谱.依据二次电子发射过程中介质表面正带电的稳定条件,计算了介质材料稳态表面电位与二次电子发射系数以及能谱参数的关系.在放电结构中引入与表面电位相应的等效直流电场后,依据电子扩散模型和微放电中电子谐振条件,分别探讨了介质表面稳态表面电位的大小对微波低气压放电和微放电阈值的影响.结果表明,介质材料的二次电子发射系数以及能谱参数越大,介质材料的稳态表面电位也越大,对应的微波低气压放电和微放电阈值也越大.所得结论对于填充介质的选择有一定的理论指导价值.     

基于微陷阱结构的金属二次电子发射系数抑制研究

近年来,金属二次电子发射系数的抑制研究在加速器、大功率微波器件等领域得到了广泛关注.为评估表面形貌对抑制效果的影响,利用唯象概率模型计算方法对三角形沟槽、矩形沟槽、方孔及圆孔4种不同形状微陷阱结构的二次电子发射系数进行了研究,分析了微陷阱结构的形状、尺寸对二次电子发射系数抑制特性的影响规律.理论研究结果表明:陷阱结构的深宽比、孔隙率越大,则其二次电子发射系数抑制特性越明显;方孔形和圆孔形微陷阱结构的二次电子发射系数抑制效果优于三角形沟槽和矩形沟槽;具有大孔隙率的微陷阱结构表面的二次电子发射系数对入射角度的依赖显著弱于平滑表面.制备了具有不同表面形貌的金属样片并进行二次电子发射系数测试,所得实验规律与理论模拟规律符合较好.     

微米量级表面结构形貌特性对二次电子发射抑制的优化

抑制二次电子倍增效应是提高空间大功率微波器件和粒子加速器等设备性能的重要课题,而使用表面处理降低材料的二次电子发射系数是抑制二次电子倍增的有效手段.为优化寻找抑制效果最好的表面形貌,本文采用蒙特卡罗方法模拟了各种微米量级不同表面形貌的二次电子发射特性,研究占空比、深宽比、结构形状及排列方式等的影响.模拟结果表明,正方形、圆形、三角形凸起和凹陷结构的二次电子发射系数随占空比和深宽比的增大而减小,但存在饱和值;凸起结构的排列方式对二次电子发射系数的影响不大,但是凸起结构形状却对二次电子发射系数的影响较大,其中三角形的抑制效果最佳.对凹陷结构而言,不同形状的抑制效果差别不大;同时,占空比和深宽比相同时,凸起结构较凹陷结构抑制效果更佳.究其原因,核心在于垂直侧壁的“遮挡效应”,凹陷结构遮挡效应的大小与“陷阱”垂直高度有关,而凸起结构遮挡效应的大小和凸起部分的斜方向投影大小有关.     

等离子体浸没离子注入非导电聚合物的适应性及栅网诱导效应的研究

本文建立了绝缘材料等离子体浸没离子注入过程的动力学Particle-in-cell(PIC)模型, 将二次电子发射系数直接与离子注入即时能量建立关联, 研究了非导电聚合物厚度、介电常数和二次电子发射系数对表面偏压电位的影响规律以及栅网诱导效应. 研究结果表明: 非导电聚合物较厚时, 表面自偏压难以实现全方位离子注入, 栅网诱导可以间接为非导电聚合物提供偏压, 并抑制二次电子发射, 为厚大非导电聚合物表面等离子体浸没离子注入提供了有效途径.     

电子入射角度对聚酰亚胺二次电子发射系数的影响

采用具有负偏压收集极的二次电子发射系数测试系统, 对聚酰亚胺样品的二次电子发射系数与入射电子角度和入射电子能量的关系进行了测量. 测量结果表明, 在电子小角度入射样品的情况下, 随着入射角度的增加, 二次电子发射系数单调增加, 并符合传统的规律, 但是在电子大角度入射时, 却与此不符合. 测量显示, 出现偏差时对应的临界电子入射角度随着入射电子能量的降低而减小. 采用简化的电子弹性散射过程和卢瑟福弹性散射截面公式对这种偏差的出现进行了分析, 并推导出修正后的二次电子发射系数的计算公式. 修正后的二次电子发射系数的计算结果更加符合实验结果.     

Heat flow through a plasma sheath in the presence of secondary electron emission from plasma‐wall interaction

The formation of a plasma sheath in front of a negative wall emitting secondary electron is studied by a one‐dimensional fluid model. The model takes into account the effect of the ion temperature. With the secondary electron emission (SEE ) coefficient obtained by integrating over the Maxwellian electron velocity distribution for various materials such as Be, C, Mo, and W, it is found that the wall potential depends strongly on the ion temperature and the wall material. Before the occurrence of the space‐charge‐limited (SCL ) emission, the wall potential decreases with increasing ion temperature. The variation of the sheath potential caused by SEE affects the sheath energy transmission and impurity sputtering yield. If SEE is below SCL emission , the energy transmission coefficient always varies with the wall materials as a result of the effect of SEE , and it increases as the ion temperature is increased. By comparison of with and without SEE , it is found that sputtering yields have pronounced differences for low ion temperatures but are almost the same for high ion temperatures.     

Secondary electron emission characteristics of graphene films with copper substrate

For modern and future circular accelerators, especially high-intensity proton synchrotrons or colliders, the electron cloud effect is a key issue. So, in order to reduce the electron cloud effect, exploring very low secondary electron yield (SEY) material or coating used in vacuum tubes becomes necessary. In this article, we studied the SEY characteristics of graphene films with different thicknesses which were deposited on copper substrates using chemical vapor deposition. The SEY tests were done at temperatures of 25℃ and vacuum pressure of (2-6)×10^-9 torr. The properties of the deposited graphene films were investigated by X-ray photoelectron spectroscopy (XPS) and Raman spectroscopy. The SEY curves show that the number of graphene layers has a great effect on the SEY of graphene films. The maximum SEY of graphene films decreases with the increase of the number of layers. The maximum SEY of 6-8 layers of graphene film is 1.25. These results have a great significance for next-generation particle accelerators.     

Characteristics of secondary electron emission from few layer graphene on silicon (111) surface

As a typical two-dimensional (2D) coating material, graphene has been utilized to effectively reduce secondary electron emission from the surface. Nevertheless, the microscopic mechanism and the dominant factor of secondary electron emission suppression remain controversial. Since traditional models rely on the data of experimental bulk properties which are scarcely appropriate to the 2D coating situation, this paper presents the first-principles-based numerical calculations of the electron interaction and emission process for monolayer and multilayer graphene on silicon (111) substrate. By using the anisotropic energy loss for the coating graphene, the electron transport process can be described more realistically. The real physical electron interactions, including the elastic scattering of electron—nucleus, inelastic scattering of the electron—extranuclear electron, and electron—phonon effect, are considered and calculated by using the Monte Carlo method. The energy level transition theory-based first-principles method and the full Penn algorithm are used to calculate the energy loss function during the inelastic scattering. Variations of the energy loss function and interface electron density differences for 1 to 4 layer graphene coating GoSi are calculated, and their inner electron distributions and secondary electron emissions are analyzed. Simulation results demonstrate that the dominant factor of the inhibiting of secondary electron yield (SEY) of GoSi is to induce the deeper electrons in the internal scattering process. In contrast, a low surface potential barrier due to the positive deviation of electron density difference at monolayer GoSi interface in turn weakens the suppression of secondary electron emission of the graphene layer. Only when the graphene layer number is 3, does the contribution of surface work function to the secondary electron emission suppression appear to be slightly positive.     

Sheath structure in plasma with two species of positive ions and secondary electrons

The properties of a collisionless plasma sheath are investigated by using a fluid model in which two species of positive ions and secondary electrons are taken into account. It is shown that the positive ion speeds at the sheath edge increase with secondary electron emission(SEE) coefficient, and the sheath structure is affected by the interplay between the two species of positive ions and secondary electrons. The critical SEE coefficients and the sheath widths depend strongly on the positive ion charge number, mass and concentration in the cases with and without SEE. In addition, ion kinetic energy flux to the wall and the impact of positive ion species on secondary electron density at the sheath edge are also discussed.     

二次电子发射和负离子存在时的鞘层结构特性

 建立了包括电子、离子、器壁发射二次电子以及负离子多种成分的等离子体无碰撞鞘层的基本模型,讨论了二次电子发射和负离子对1维稳态等离子体鞘层结构的影响,并且分析了多种成分等离子体鞘层内的二次电子和负离子的相互作用。结果表明：二次电子发射系数的增加和负离子含量的增加,都将导致鞘层的厚度有所减小;二次电子发射系数超过临界发射系数之后,鞘层不再是离子鞘。随着器壁材料二次电子发射系数的增加,鞘层中的负离子密度分布也逐渐增加;负离子的增加,导致二次电子临界发射系数有所增加。另外,在等离子体鞘层中二次电子发射和负离子的存在,也影响着鞘层中电子的放电特性与器壁材料的腐蚀。     

激光刻蚀对镀金表面二次电子发射的有效抑制

使用红外激光刻蚀技术在镀金铝合金表面制备了多种形貌的微孔及交错沟槽阵列.表征了两类激光刻蚀微阵列结构的三维形貌和二维精细形貌,分析了样品表面非理想二级粗糙结构的形成机制.研究了微阵列结构二次电子发射特性对表面形貌的依赖规律.实验结果表明:激光刻蚀得到的微阵列结构能够有效抑制镀金表面二次电子产额(secondary electron yield,SEY),且抑制能力明显优于诸多其他表面处理技术;微阵列结构对SEY的抑制能力与其孔隙率及深宽比呈现正相关,且孔隙率对SEY的影响更为显著.使用蒙特卡罗模拟方法并结合二次电子发射唯象模型和电子轨迹追踪算法,仿真了各微结构表面二次电子发射特性,模拟结果从理论上验证了微阵列结构孔隙率及深宽比对表面SEY的影响规律.本文获得了能够剧烈降低镀金表面SEY的微阵列结构,理论分析了SEY对微结构特征参数的依赖规律,对开发空间微波系统中低SEY表面及提高镀金微波器件性能有重要意义.     

Influence of surface topography on the secondary electron yield of clean copper samples

Secondary electron yield (SEY) due to electron impact depends strongly on surface topography. The SEY of copper samples after Ar-ion bombardment is measured in situ in a multifunctional ultrahigh vacuum system. Increasing the ion energy or duration of ion bombardment can even enlarge the SEY, though it is relatively low under moderate bombardment intensity. The results obtained with scanning electron microscopy and atomic force microscopy images demonstrate that many valley structures of original sample surfaces can be smoothed due to ion bombardment, but more hill structures are generated with stronger bombardment intensity. With increasing the surface roughness in the observed range, the maximum SEY decreases from 1.2 to 1.07 at a surface characterized by valleys, while it again increases to 1.33 at a surface spread with hills. This phenomenon indicates that hill and valley structures are respectively effective in increasing and decreasing the SEY. These obtained results thus provide a comprehensive insight into the surface topography influence on the secondary electron emission characteristics in scanning electron microscopy.     

一种二次电子发射的复合唯象模型

二次电子发射模型的精度对二次电子倍增击穿阈值的模拟计算影响很大, 针对现有两种经典二次电子发射唯象模型的不足, 以修正Vaughan模型作为Furman模型中的真二次电子发射系数计算模型, 建立起一种二次电子发射的复合唯象模型. 该模型不仅适用于倍增击穿过程的数值模拟, 还很大程度上提高了与实验数据拟合的准确性. 通过对银和铝合金两种材料二次电子发射系数实验结果和模型拟合结果的对比发现, 在不同入射角情况下, 复合唯象模型的平均误差较原有两种模型降低了10%以上. 关键词： 二次电子发射 唯象模型 击穿阈值     

On characteristics of sheath damping near a dielectric wall with secondary electron emission

A preliminary investigation is conducted to study the characteristics of sheath damping near a dielectric wall with secondary electron emission (SEE). Making use of the linear analysis of the sheath stability, we have found two major contributions to the sheath damping, one similar to the Landau damping in uniform plasmas and another determined by local electric field and electron density of the steady-state sheath. It indicates that in a classical sheath regime the damping in the sheath region monotonically increases towards the wall and decreases with the enhancement of SEE effect. In order to verify the theoretical analysis, sheath oscillation processes induced by an initial disturbance are simulated with a time-dependent one-dimensional (1D) sheath model. Numerical results obtained are consistent with the theoretical analysis qualitatively.     

聚合物物理属性对离子注入效应的影响

聚合物导电性能差, 表面电荷积聚所产生的电容效应致使其表面电位衰减, 采用等离子体浸没离子注入对其表面改性是非常困难的. 建立了绝缘材料等离子体浸没离子注入过程的粒子模拟(PIC)模型, 实时跟踪离子在等离子体鞘层中的运动形态及特性并进行统计分析. 并基于PIC模型, 将聚合物表面的二次电子发射系数直接与离子注入即时能量建立关联, 研究了聚合物厚度、介电常数和二次电子发射系数等物理量对鞘层演化、离子注入能量和剂量的影响规律. 研究结果表明: 当聚合物厚度小于200 μ m, 相对介电常数大于7, 二次电子发射系数小于0.5时, 离子注入剂量和高能离子所占的份额与导体离子注入情况相当. 通过对聚合物表面离子注入剂量和高能离子所占份额的研究, 为绝缘材料和半导体材料表面等离子体浸没离子注入的实现提供了理论和实验依据.     

材料二次电子产额对腔体双边二次电子倍增的影响

采用蒙特卡罗抽样与粒子模拟相结合的方法,数值研究了材料二次电子产额对腔体双边二次电子倍增瞬态演化及饱和特性的影响.研究发现:随着材料二次电子产额的增加,二次电子增长率以及稳态二次电子数目和振幅均呈现增加的趋势,放电电流起振时间逐步缩短,稳态电流幅值以及放电功率平均值和振幅值均呈现逐步增加并趋于饱和的规律,沉积功率波形延时以及脉宽呈现逐步增加并趋于饱和的趋势.粒子模拟给出了高/低二次电子产额情况下的电子相空间分布、电荷密度分布、平均碰撞能量、平均二次电子产额、二次电子数目和放电电流的细致物理图像.模拟结果表明:高二次电子产额材料,饱和时更倾向趋于单边二次电子倍增类型分布;低二次电子产额材料的二次电子倍增饱和特性由空间电荷场的"去群聚"效应和"反场"效应同时决定,而高二次电子产额材料的二次电子倍增饱和特性则主要是由发射面附近的强空间电荷场"反场"效应决定的.