单晶硅表面均匀小尺寸金字塔制备及其特性研究

表面织构是一种通过有效的光俘获增加短路电流从而提高太阳电池效率的主要途径之一.在加入间隙式超声和NaClO添加剂的碱性四甲基氢氧化铵(TMAH)溶液中对单晶硅表面进行织构化处理,研究超声与NaClO在织构过程中对金字塔成核和生长的影响,以及金字塔大小对高温工艺之后的单晶硅少子寿命的影响.研究表明,通过在织构溶液中加入间隙式超声控制气泡停留在硅片表面的时间和脱离硅片表面速度,增强了小尺寸金字塔的均匀分布.织构之后硅片在AM1.5G光谱下的加权平均反射率能够达到12.4%,在高温扩散和氧化之后少子寿命的大小与金字塔大小之间存在近似于指数衰减函数的关系. 关键词： 表面织构化 反射率 少子寿命 单晶硅太阳电池     

晶硅太阳电池中Fe-B对与少子寿命、陷阱浓度及内量子效率的相关性

以太阳电池级直拉单晶硅片为材料,利用瞬态微波反射光电导衰减仪研究了硅片分别经过单、双面扩散后Fe-B对与少子寿命τ、陷阱浓度及制备成电池的内量子效率（IQE）的相关性.对于单面扩散后的样品,Fe-B对浓度分布在较大程度上决定了少子寿命分布;对于双面扩散后的样品,Fe-B对浓度显著降低（在135×10¹¹ cm^-3左右）,已不及其他杂质和缺陷对少子寿命的影响.结合瞬态微波衰减信号和陷阱模型,对单、双面吸杂前后硅片的陷阱浓度进行数值计算,发现经过扩散 关键词： 少子寿命 陷阱浓度 内量子效率 Fe-B对     

钙钛矿/硅叠层太阳电池中平面a-Si:H/c-Si异质结底电池的钝化优化及性能提高

最近,旋涂法制备的钙钛矿/平面硅异质结高效叠层太阳电池引起人们广泛关注,主要原因是相比于绒面硅衬底制备的钙钛矿/硅叠层太阳电池,其制备工艺简单、制备成本低且效率高.对于平面a-Si:H/c-Si异质结电池, a-Si:H/c-Si界面的良好钝化是获得高转换效率的关键,进而决定了钙钛矿/硅异质结叠层太阳电池的性能.本文主要从硅片表面处理、a-Si:H钝化层和P型发射极等方面展开研究,通过对硅片表面的氢氟酸(HF)浸泡时间和氢等离子体预处理气体流量、a-Si:H钝化层沉积参数、钝化层与P型发射极(I/P)界面富氢等离子体处理的综合调控,获得了相应的优化工艺参数.对比研究了p-a-Si:H和p-nc-Si:H两种缓冲层材料对I/P界面的影响,其中高电导、宽带隙的p-nc-Si:H缓冲层既能够降低I/P界面的缺陷态,又可以增强P型发射层的暗电导率,提高了前表面场效应钝化效果.通过上述优化,制备出最佳的P-type emitter layer/aSi:H(i)/c-Si/a-Si:H(i)/N-type layer (inip)结构样品的少子寿命与implied-Voc分别达到2855μs和709 mV,表现出良好的钝化效果.应用于平面a-Si:H/c-Si异质结太阳电池,转换效率达到18.76%,其中开路电压达到681.5 mV,相对于未优化的电池提升了34.3 mV.将上述平面a-Si:H/c-Si异质结太阳电池作为底电池,对应的钙钛矿/硅异质结叠层太阳电池的开路电压达到1780 mV,转换效率达到21.24%,证明了上述工艺优化能够有效地改善叠层太阳电池中的硅异质结底电池的钝化及电池性能.     

SiON钝化膜对硅衬底氮化镓绿光LED可靠性的影响

研制了4种不同表面钝化类型Si衬底GaN基绿光LED,分别标记为样品A、B、C、D.样品A无钝化层,样品B为台面SiON钝化,样品C为侧面SiON钝化,样品D为台面和侧面均钝化.将4种样品进行了常温60 mA(电流密度312 A/cm2)下168 h的加速老化,并对比了老化前后的I-V和光衰等特性.结果表明:侧边的Si...     

电注入退火对多晶硅PERC太阳电池性能的影响

对掺镓和掺硼的二种多晶硅钝化发射极和背面电池进行了电注入退火研究,分别用Halm电学性能测试仪和量子效率测试仪分析了它们在不同条件处理后的电学性能和外量子效率变化.结果表明,以8.0A的注入电流在260℃的温度下处理2h,有利于促进电池由衰减态向再生态转变,电注入退火后电池的转换效率增加了0.83%,在光照5h后比初始值仅衰减了0.61%.电注入退火能有效降低多晶硅钝化发射极和背面电池的光致衰减效应,掺镓多晶硅钝化发射极和背面电池具有更低的光致衰减效应,相比掺硼多晶硅钝化发射极和背面电池光致衰减值降低了约50%.     

银铜双原子MACE法可控制备倒金字塔多晶黑硅的结构与性能

采用一步银铜双原子金属辅助化学腐蚀法,室温下在多晶硅表面制备纳米陷光结构,再利用纳米结构修正溶液在温度为50℃时对硅片进行各向异性重构,可控制备出不同尺寸的倒金字塔陷光结构.用分光光度计测量了多晶硅表面的反射率,用扫描电镜观察了多晶硅表面形貌,用少子寿命测试仪测量了多晶硅钝化后的少子寿命.结果表明:影响倒金字塔结构尺寸的主要影响因素是制备态黑硅纳米结构的深度,当深度越深,最终形成的结构尺寸也越大;纳米结构修正溶液重构时间越长,所形成的倒金字塔结构尺寸越大,反射率也变大;经原子层沉积钝化后的倒金字塔结构中少子寿命随其尺寸的增大而增加;当倒金字塔边长为600nm时综合效果最佳,反射率为9.87%,少子寿命为37.82μs.     

压强对低频PECVD制备SiNx:H薄膜特性的影响

氢化氮化硅薄膜在晶体硅太阳电池工艺中是一种有效的减反射、钝化薄膜．利用Centrotherm公司的直接法低频PECVD设备在抛光后的p型硅衬底(1.0 Ωcm)表面制作氢化氮化硅,得到了具有较好钝化效果且折射率为2.017～2.082的薄膜．随着压强的增加,薄膜的折射率略有增加．利用傅里叶变换红外光谱技术研究了薄膜中成键结构特性随压强的变化．结果表明沉积压强强烈的影响了H键的浓度和Si-N键的浓度．其中硅的悬挂键浓度是影响薄膜钝化特性的关键因素．最后给出了样品有效少子寿命随时间的衰减特性,并利用成键结构对钝化的影响给出了这种衰减的原因.     

基于隧穿氧化物钝化接触的高效晶体硅太阳电池的研究现状与展望

在当今的光伏市场,晶体硅电池占据超过九成的份额,并且被认为在未来将依旧占据主导地位.在高效晶硅电池中,隧穿氧化物钝化接触太阳电池(tunnel oxide passivated contact solar cell, TOPCon)因其优异的表面钝化效果以及与传统产线兼容性好的优势而受到持续关注.该电池最显著的特征是其高质量的超薄氧化硅和重掺杂多晶硅的叠层结构,对全背表面实现了高效钝化,同时载流子选择性地被收集,具有制备工艺简单、使用N型硅片无光致衰减问题和与传统高温烧结技术相兼容等优点.本文首先介绍了隧穿氧化物钝化接触太阳电池的基本结构和基本原理,然后对现有超薄氧化硅层和重掺杂多晶硅层的制备方式进行了对比,最后在分析研究现状基础上指出了该电池未来的研究方向.     

1 MeV电子辐照下晶格匹配与晶格失配GaInP/GaInAs/Ge三结太阳电池辐射效应研究

对采用MOCVD方法制备的晶格匹配(LM)与晶格失配(UMM)GaInP/GaInAs/Ge三结太阳电池进行了1MeV电子辐射效应研究。结果表明:在电子辐照下,两种电池的I-V特性参数(开路电压Voc,短路电流Isc,最大输出功率Pmax)均发生衰降,且晶格失配电池的I-V特性参数衰降均大于晶格匹配电池。在光谱响应方面,对于顶电池,晶格匹配电池的衰降大于晶格失配电池;而中间电池则前者衰降小于后者;另外,Ge底电池的光谱响应表现特殊,辐照后光谱响应变强。     

硅异质结太阳电池中钝化层和发射层的优化设计

本征钝化层及p型发射层对硅异质结太阳电池的性能具有重要的影响.本文在常规钝化层与晶硅衬底(c-Si)之间插入一层低功率、高氢稀释比沉积的超薄缓冲层,以此来提高钝化效果,并拓宽钝化层工艺窗口.此外,设计并制备了具有宽带隙、高电导特性的重掺杂纳米晶硅/轻掺杂p型双层复合发射极.实验结果表明,双层钝化层具有更加稳定与优异的钝化效果,钝化样品的少子寿命达到4.197 ms,隐含开路电压(implied-V_(OC),iV_(OC))达到726 mV.同时双层复合发射层中,轻掺杂的掺杂层可以减弱掺杂剂向本征钝化层的扩散,保证良好的钝化效果,而重掺杂的掺杂层不仅能够提供足够的内建电场,而且可以改善掺杂层与氧化铟锡薄膜的接触特性,进而提升电池的输出特性.并且高氢稀释比的前掺杂层还可以对钝化层起到氢处理的作用,减少钝化层表面的悬挂键,从而增强化学钝化效果,进而提高电池的开路电压.最终,基于商业化制绒的硅片,获得了效率达到20.96%的硅异质结太阳电池,其中开路电压为710 mV,短路电流密度为39.88 mA/cm~2,填充因子为74.02%.     

Effects of phosphorus diffusion gettering on minority carrier lifetimes of single-crystalline,multi-crystalline and UMG silicon wafer

Phosphorus diffusion gettering, which can effectively reduce the transition-metal impurities in the bulk of Si wafer and enhance the minority carrier lifetime (MCLT), is a well-known process to improve the performances of solar cells. Especially, the appropriate gettering process is further required for manufacturing solar cells using an upgraded metallurgical-grade silicon (UMG Si) wafer. In this work, an improvement in the MCLT of the UMG Si wafer including the single-crystalline and multi-crystalline Si wafer after phosphorus diffusion gettering was confirmed by using the quasi-steady state photo-conductivity (QSSPC) measurement and the microwave photo-conductance decay (μW-PCD) method. The experimental results were compared with the MCLT variations calculated through the simulation of the Fe distributions in the Si wafers. It was also observed that the efficiency of the UMG Si solar cell increased by 0.53% due to the two-step gettering process.     

Laser illumination for manipulation of hydrogen charge states in silicon solar cells

This Letter investigates the important parameters of illumination for control of hydrogen charge states in p‐type silicon solar cells. Through variations in the wavelength and intensity of illumination, evidence is provided for the importance of the neutral charge state of interstitial hydrogen, H⁰, for the passivation of defects in upgraded metallurgical grade (UMG) silicon. It is shown that through this approach minority carrier lifetimes may be achieved in excess of those realised through previous techniques, resulting in open‐circuit voltages (iV_OC) over 710 mV. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Direct detection of carrier traps in Si solar cells after light‐induced degradation

In solar cells fabricated from boron‐doped Cz‐Si wafers minority and majority carrier traps were detected by deep level transient spectroscopy (DLTS) after so‐called “light‐induced degradation” (LID). The DLTS signals were detected from mesa‐diodes with the full structure of the solar cells preserved. Preliminary results indicate metastable traps with energy levels positioned at E_V + 0.37 eV and E_C – 0.41 eV and apparent carrier capture cross‐sections in the 10^–17–10^–18 cm² range. The concentration of the traps was in the range of 10¹²–10¹³ cm^–3. The traps were eliminated by annealing of the mesa‐diodes at 200 °C. No traps were detected in Ga‐doped solar cells after the LID procedure or below the light protected bus bar locations in B‐doped cells. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Silicone oxidation for a‐Si:H passivation of wafers bonded to glass

A possible scenario for wafer‐based silicon photovoltaics is the processing of solar modules starting from thin silicon wafers bonded to glass. However, interactions between the adhesive used for bonding and the solar cell processing can affect the surface passivation of the bonded wafer and decrease cell performances. A method that suppresses these interactions and leads to state‐of‐the‐art a‐Si:H surface passivation is presented in this Letter. The method is based on an increase of the surface cross‐linking of a silicone adhesive by means of an O₂ plasma and it is successfully tested on three different silicones. (© 2014 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Plasma hydrogenated,reactively sputtered aluminium oxide for silicon surface passivation

The intentional addition of hydrogen during reactive sputtering of AlO_x films has led to a dramatic improvement of the surface passivation of crystalline silicon wafers achieved with this technique. The 5 ms effective minority carrier lifetime measured on 1.5 Ω cm n‐type CZ silicon wafers is close to the 6 ms of a control wafer coated by atomic layer deposition (ALD) of AlO_x. Hydrogen‐sputtered films also provide excellent passivation of 1 Ω cm p‐type silicon, as demonstrated by an effective lifetime of 1.1 ms. It is likely that the improved passivation is related to the formation of an interfacial silicon oxide layer, as indicated by FTIR measurements. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Role of a‐Si:H bulk in surface passivation of c‐Si wafers

The low thermal stability of hydrogenated amorphous silicon (a‐Si:H) thin films limits their widespread use for surface passivation of c‐Si wafers on the rear side of solar cells. We show that the thermal stability of a‐Si:H surface passivation is increased significantly by a hydrogen rich a‐Si:H bulk, which acts as a hydrogen reservoir for the a‐Si:H/c‐Si interface. Based on this mechanism, an excellent lifetime of 5.1 ms (at injection level of 10¹⁵ cm^–3) is achieved after annealing at 450 °C for 10 min. (© 2010 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

19.4%‐efficient large‐area fully screen‐printed silicon solar cells

We demonstrate industrially feasible large‐area solar cells with passivated homogeneous emitter and rear achieving energy conversion efficiencies of up to 19.4% on 125 × 125 mm² p‐type 2–3 Ω cm boron‐doped Czochralski silicon wafers. Front and rear metal contacts are fabricated by screen‐printing of silver and aluminum paste and firing in a conventional belt furnace. We implement two different dielectric rear surface passivation stacks: (i) a thermally grown silicon dioxide/silicon nitride stack and (ii) an atomic‐layer‐deposited aluminum oxide/silicon nitride stack. The dielectrics at the rear result in a decreased surface recombination velocity of S_rear = 70 cm/s and 80 cm/s, and an increased internal IR reflectance of up to 91% corresponding to an improved J_sc of up to 38.9 mA/cm² and V_oc of up to 664 mV. We observe an increase in cell efficiency of 0.8% absolute for the cells compared to 18.6% efficient reference solar cells featuring a full‐area aluminum back surface field. To our knowledge, the energy conversion efficiency of 19.4% is the best value reported so far for large area screen‐printed solar cells. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Excellent passivation of thin silicon wafers by HF‐free hydrogen plasma etching using an industrial ICPECVD tool

In this work, hydrogen plasma etching of surface oxides was successfully accomplished on thin (～100 µm) planar n‐type Czochralski silicon wafers prior to intrinsic hydrogenated amorphous silicon [a‐Si:H(i)] deposition for heterojunction solar cells, using an industrial inductively coupled plasma‐enhanced chemical vapour deposition (ICPECVD) platform. The plasma etching process is intended as a dry alternative to the conventional wet‐chemical hydrofluoric acid (HF) dip for solar cell processing. After symmetrical deposition of an a‐Si:H(i) passivation layer, high effective carrier lifetimes of up to 3.7 ms are obtained, which are equivalent to effective surface recombination velocities of 1.3 cm s^–1 and an implied open‐circuit voltage (V_oc) of 741 mV. The passivation quality is excellent and comparable to other high quality a‐Si:H(i) passivation. High‐resolution transmission electron microscopy shows evidence of plasma‐silicon interactions and a sub‐nanometre interfacial layer. Using electron energy‐loss spectroscopy, this layer is further investigated and confirmed to be hydrogenated suboxide layers. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Influence of precursor gas ratio and firing on silicon surface passivation by APCVD aluminium oxide

Using a high throughput, in‐line atmosphere chemical vapor deposition (APCVD) tool, we have synthesized amorphous aluminum oxide (AlO_x) films from precursors of trimethyl‐aluminum (TMA) and O₂, yielding a maximum deposition 150 nm min^–1 per wafer. For p‐type crystalline silicon (c‐Si) wafers, excellent surface passivation was achieved with the APCVD AlO_x films, with a best maximum effective surface recombination velocity (S_eff,max) of 8 cm/s following a standard industrial firing step. The findings could be attributed to the existence of large negative charge (Q_f ≈ –3 × 10¹² cm^–2) and low interface defect density (D_it ≈ 4 × 10¹¹ eV^–1 cm^–2) achieved by the films. This data demonstrates a high potential for APCVD AlO_x to be used in high efficiency, low cost industrial solar cells. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Effect of rapid thermal oxidation on structure and photoelectronic properties of silicon oxide in monocrystalline silicon solar cells

This paper concerns the topic of surface passivation properties of rapid thermal oxidation on p-type monocrystalline silicon wafer for use in screen-printed silicon solar cells. It shows that inline thermal oxidation is a very promising alternative to the use of conventional batch type quartz tube furnaces for the surface passivation of industrial phosphorus-diffused emitters. Five minutes was the most favorable holding time for the rapid thermal oxidation growth of the solar cell sample, in which the average carrier lifetime was increased 19.4 μs. The Fourier transform infrared spectrum of the rapid thermal oxidation sample, whose structure was Al/Al-BSF/p-type Si/n-type SiP/SiO₂/SiN_x/Ag solar cell with an active area of 15.6 cm², contained an absorption peak at 1085 cm⁻¹, which was associated with the Si–O bonds in silicon oxide. The lowest average reflectance of this sample is 0.87%. Furthermore, for this sample, its average of internal quantum efficiency and conversion efficiency are respectively increased by 8% and 0.23%, compared with the sample without rapid thermal oxidation processing.