大功率GaN基发光二极管等效串联电阻的功率耗散及其对发光效率的影响

由于自加热效应的存在，大功率GaN基发光二极管(LED)的芯片温度有可能高出环境温度很多，实验中，芯片温度超出环境高达147 K.从实验测量的大功率LED电流电压特性曲线中，将p-n结和等效串联电阻上的电压降落分离出来，得到了大功率LED等效串联电阻随芯片温度的变化情况.在输入电功率自加热效应的影响下，大功率GaN基LED等效串联电阻呈现出剧烈的变化，其阻值由低输入功率时的1.2 Ω降低到0.9 Ω,然后再升高到1.9 Ω，等效串联电阻的功率耗散在输入功率中所占的比例也随着输入功率的增加迅速增加，最高时接     

大功率GaN基发光二极管的电流扩展效应及电极结构优化研究

定性分析了GaN基LED的电流扩展效应,发现电流密度和电流横向扩展的有效长度对电流均匀扩展有很大影响.基于此,对GaN基大功率LED提出了优化的电极结构,以减缓电流拥挤效应,降低器件串联电阻.通过用红外热像仪测量器件表面的温度分布,发现具有优化的环形插指电极结构的GaN基大功率LED表面温度分布比较均匀,证明芯片接触处电流扩展均匀,局部电流密度降低,减小了焦耳热的产生,增强了器件的可靠性. 关键词： 氮化镓 发光二极管 电流扩展 电极结构优化     

GaN基蓝光发光二极管正向电压温度特性研究

对GaN基蓝光发光二极管（LED）正向电压温度特性进行了研究,发现在温度较高时,正向电压随温度的变化系数逐渐减小,直至出现拐点,正向电压随温度的变化系数由负数变为正数.此时若继续升高温度,则正向电压随温度升高迅速增加,并常常伴随有器件失效的现象发生.在小电流情况下,这种现象不很明显,随着电流的增加,现象表现得越来越明显,拐点出现的温度也越来越低,而且温度超过拐点之后,正向电压值增加得更快.通过与相同封装的另一组器件测试结果对比,排除了封装材料玻璃转换温度的影响.分析认为,这一现象的出现是由器件等效串联电阻 关键词： 发光二极管 氮化镓 正向电压 温度系数     

大功率GaN基发光二极管的电流扩展效应及电极结构优化研究

定性分析了GaN基LED的电流扩展效应，发现电流密度和电流横向扩展的有效长度对电流均匀扩展有很大影响.基于此，对GaN基大功率LED提出了优化的电极结构，以减缓电流拥挤效应，降低器件串联电阻.通过用红外热像仪测量器件表面的温度分布，发现具有优化的环形插指电极结构的GaN基大功率LED表面温度分布比较均匀，证明芯片接触处电流扩展均匀，局部电流密度降低，减小了焦耳热的产生，增强了器件的可靠性.     

电极结构优化对大功率GaN基发光二极管性能的影响

在台面结构的GaN基发光二极管(LED)里，电流要侧向传输，当尺寸与电流密度加大之后，由于n型GaN层和下限制层的横向电阻不能忽略，造成了横向电流分布不均匀.通过优化电极结构，以减小电流横向传输距离，制作出两种不同电极结构的大功率GaN基倒装LED.通过比较这两种不同电极结构的GaN基倒装大功率LED的电、光性能，发现在350mA正向电流下，插指电极结构的倒装大功率GaN基LED的正向电压为3.35V，比环形插指电极结构的倒装大功率GaN基LED高0.15V.尽管环形插指电极结构GaN基LED的发光面积略小于插指电极结构GaN基LED，但在大电流下，环形插指电极结构倒装GaN基LED的光输出功率比插指电极结构的倒装大功率LED的光输出功率大.并且在大电流下，环形插指电极结构的倒装大功率LED光输出功率饱和速度慢，而插指电极结构的倒装大功率LED光输出功率饱和明显.这说明优化电极结构能提高电流扩展均匀性，减小焦耳热的产生，改善GaN基LED的性能.     

基于金属线路板的新型大功率LED及其光电特性研究

设计、制作了基于金属线路板和板上芯片技术的大功率白光LED,对其光电特性进行了实验测量,输入电流达到800 mA,对应的输入功率3.3 W,大功率LED的输出光通量才达到饱和.输入电流达到900 mA,对应的输入功率3.8 W,大功率LED电流—电压特性仍未表现出饱和特性.实验结果表明,采用金属线路板和板上芯片技术可以得到良好的散热特性,大大提高LED的输入功率.同时还测量了光谱分布、光通量、色坐标随电流的变化情况,对其中的变化规律进行了理论分析.     

GaN基大功率白光LED的高温老化特性

对大功率GaN基白光LED在85℃下进行了高温加速老化实验.经6500 h的老化,样品光通量退化幅度为28％ ～33％.样品的Ⅰ-V特性变化表明其串联电阻和反向漏电流不断增大,原因可归结为芯片欧姆接触的退化及芯片材料中缺陷密度的提高.样品的热特性变化显示出各结构层热阻均明显增大,这是由散热通道上各层材料的老化及焊料层出...     

注入电流对绿光高压LED光电特性的影响

设计并制备了12 V 的GaN基绿光高压发光二极管（LED）,并对其进行了变电流测试。研究了绿光高压LED的正向电压、峰值波长、光功率以及光效等重要参数随注入电流的变化关系,电流变化范围为3~50 mA,测试温度为25 ℃。实验结果表明：电流对绿光高压LED的光电特性有很大影响。在驱动电流为20 mA时,对应电压为14 V。随着注入电流的增大,峰值波长蓝移了2 nm。随着电流的增大,光功率近似于线性增加。在注入电流从3 mA增大到20 mA的过程中,光效降低了约61%;在注入电流从20 mA增大到50 mA的过程中,光效降低了约39%。这说明高压LED在大电流驱动时,光效降低的幅度比较缓慢。上述结果对 GaN基绿光高压 LED 的改进优化具有一定的参考价值。     

注入电流对绿光高压LED光电特性的影响

设计并制备了12 V的GaN基绿光高压发光二极管(LED),并对其进行了变电流测试。研究了绿光高压LED的正向电压、峰值波长、光功率以及光效等重要参数随注入电流的变化关系,电流变化范围为3~50mA,测试温度为25℃。实验结果表明:电流对绿光高压LED的光电特性有很大影响。在驱动电流为20 mA时,对应电压为14 V。随着注入电流的增大,峰值波长蓝移了2 nm。随着电流的增大,光功率近似于线性增加。在注入电流从3 mA增大到20 mA的过程中,光效降低了约61%;在注入电流从20 mA增大到50 mA的过程中,光效降低了约39%。这说明高压LED在大电流驱动时,光效降低的幅度比较缓慢。上述结果对GaN基绿光高压LED的改进优化具有一定的参考价值。     

GaN基白光发光二极管失效机理分析

对小功率白光GaN基发光二极管(LED)在室温、40 ℃和70 ℃下进行温度加速老化寿命实验,通过对老化前后不同时间段器件的电学、光学和热学特性进行测量来分析器件的失效机理,着重分析器件的芯片和荧光粉的失效机理.器件老化前后的I-V特性表明:老化过程中,器件的串联电阻和低正向偏压下的隧道电流增大,这是由于器件工作时其芯片的欧姆接触退化和半导体材料的缺陷密度升高而引起的.器件的热特性表明:高温度应力下器件的热阻迅速变大,封装材料迅速退化,这是器件退化的主要原因;光谱曲线表明温度加速了器件的     

High Doping Density Schottky Diodes in the 3MM Wavelength Cryogenic Heterodyne Receiver

The paper describes a 3mm cryogenic mixer receiver using high doping density (“room-temperature”) Schottky diodes. The measured equivalent noise temperature T_eq of the diodes is 109 K at 20 K, which is much higher than the T_eq of the low doping density (“cryogenic”) diodes. In spite of this, the double-sideband (DSB) noise temperature of the cryogenic receiver developed is 55 K at 110 GHz, owing to the low conversion loss of the mixer and ultra-low noise of the PHEMT IF amplifier. This is the lowest noise temperature ever reported for a Schottky diode mixer receiver. The results obtained are useful for the development of submm receivers in which high doping density Schottky diodes are used.     

Internal power loss in GaN-based lasers: mechanisms and remedies

GaN-based laser diodes transform only a relatively small fraction of the electrical input power into laser light. The inherently large series resistance of these devices causes significant self-heating that leads to the typical power roll-off at high current. We analyze recently reported measurements using advanced numerical laser simulation and investigate the physical mechanisms that limit the lasing power in continuous-wave operation. Contrary to common expectations, our analysis reveals a strong influence of Auger recombination since the self-heating leads to a rising quantum well carrier density above the lasing threshold. As possible remedy, we investigate the effect of a tunnel-junction contact and predict a significant enhancement of lasing power and efficiency.     

Effect of Temperature Variation on the Characteristics of Microwave Power AlGaN/GaN MODFET

The prime motivation for developing the proposed model of AlGaN/GaN microwave power device is to demonstrate its inherent ability to operate at much higher temperature. An investigation of temperature model of a 1 μm gate AlGaN/GaN enhancement mode n-type modulation-doped field effect transistor (MODFET) is presented. An analytical temperature model based on modified charge control equations is developed. The proposed model handles higher voltages and show stable operation at higher temperatures. The investigated temperature range is from 100 °K–600 °K. The critical parameters of the proposed device are the maximum drain current (I_Dmax), the threshold voltage (V_th), the peak dc trans-conductance (g_m), and unity current gain cut-off frequency (f_T). The calculated values of f_T (10–70 GHz) at elevated temperature suggest that the operation of the proposed device has sufficiently high current handling capacity. The temperature effect on saturation current, cutoff frequency, and trans-conductance behavior predict the device behavior at elevated temperatures. The analysis and simulation results on the transport characteristics of the MODFET structure is compared with the previously measured experimental data at room temperature. The calculated critical parameters suggest that the proposed device could survive in extreme environments.     

Thermal resistance matrix representation of thermal effects and thermal design in multi-finger power heterojunction bipolar transistors

The thermal resistance matrix including self-heating thermal resistance and thermal coupling resistance is presented to describe the thermal effects of multi-finger power heterojunction bipolar transistors. The dependence of thermal resistance matrix on finger spacing is also investigated. It is shown that both self-heating thermal resistance and thermal coupling resistance are lowered by increasing the finger spacing, in which the downward dissipated heat path is widened and the heat flow from adjacent fingers is effectively suppressed. The decrease of self-heating thermal resistance and thermal coupling resistance is helpful for improving the thermal stability of power devices. Furthermore, with the aid of the thermal resistance matrix, a 10-finger power heterojunction bipolar transistor (HBT) with non-uniform finger spacing is designed for high thermal stability. The optimized structure can effectively lower the peak temperature while maintaining a uniformity of the temperature profile at various biases and thus the device effectively may operate at a higher power level.     

Thermoelectric power of HfTe5 and ZrTe5

The thermoelectric power and the electrical resistance of the two low-dimensional conductors, HfTe₅ and ZrTe₅ have been measured over the temperature range of 7K to 380K. The thermoelectric power for both materials is large and positive at high temperatures and then drops precipitously and crosses zero at the temperature of the anomalous resistivity peak, T_p. At lower temperatures, the thermoelectric power reaches a large negative peak and then decreases to zero in a metallic fashion. The abrupt change in thermopower, which occurs at T_p for both materials, is indicative of a phase transition where the carrier type changes from hole-like to electron-like.     

The Effect of Preparation Temperature on Phase Transitions of N-Isopropylacrylamide Gel

The spinodal decomposition of N-isopropylacrylamide (NIPA) gels prepared at various onset temperatures, T _on was studied by photon transmission. It was observed that the increase in turbidity is much faster in a gel prepared at higher T _on than at lower T _on values, which indicated that the NIPA-water system reaches the spinodal decomposition much faster for a gel prepared at high T _on. It is understood that a NIPA gel prepared at high T _on possesses more heterogeneities which are gained during gelation and has a low spinodal temperature, T _s. However, NIPA gels prepared at lower T _on values go to spinodal decomposition at higher T _s values.     

Temperature dependence of electroresistance for La0.67Ba0.33MnO3 manganite

The influence of dc biasing current on temperature dependence of resistance of La_0.67Ba_0.33MnO₃ bulk sample is reported. A decrease in the resistance (electroresistance) on the application of higher bias current is observed. The electroresistance is maximum at metal-insulator transition temperature (T_MI) and decreases when the temperature is either increased or decreased from T_MI. A two-phase model is proposed to explain the occurrence of electroresistance. The higher bias current leads to an increase in alignment of spins and thus, in turn, leads to an increase in spin stiffness coefficient and decrease in the resistance at T_MI.     

Determination of the series resistance under the Schottky contacts of AlGaN/AlN/GaN Schottky barrier diodes

Rectangular AlGaN/AlN/GaN heterostructure field-effect transistors (HFETs) were fabricated, and the gate and the source of the HFETs consisted of AlGaN/AlN/GaN Schottky barrier diodes (SBDs). Based on the measured forward current-voltage and the capacitance-voltage characteristics of the AlGaN/AlN/GaN SBDs, the series resistance under the Schottky contacts (R_S) was calculated using the method of power consumption, which has been proved to be valid. Finally, the method of power consumption for calculating R_S was successfully used to study the two-dimensional electron gas electron mobility for a series of circular AlGaN/AlN/GaN SBDs. It is shown that the series resistance under the Schottky contacts cannot be neglected and is important for analysing and characterizing the AlGaN/AlN/GaN SBDs and the AlGaN/AlN/GaN HFETs.     

CuGaSe2 solar cells with 9.7% power conversion efficiency

Heterojunctions, such as ZnO/CdS/CuGaSe₂, were fabricated for photovoltaic applications. Optimization of device structures based on monocrystalline CuGaSe₂ led to the highest-to-date power conversion efficiencies for CuGaSe₂ solar cells. At room temperature under 100 mW/cm² AM1.5 illumination a maximum cell efficiency of 9.7% was achieved, given by an open-circuit voltage of 946 mV, a short circuit current density of 15.5 mA/cm², and a fill factor of 66.5%. Preparation and performance of the optimum device are described. Current voltage characteristics dependent on illumination intensity and temperature, spectral response and electron-beam-induced current measurements were performed to determine the device parameters as well as to analyse the current transport and loss mechanisms. Tunneling, assisted by defect levels in the CdS layer, seems to play a major role. High injection effects are observed at forward bias ofV > 0.5 V or an illumination level ofP > 10 mW/cm². Under such conditions, as well as at low temperatures, the non-zero series resistance comes into play. Effects of the shunt resistance, however, are negligible in all cases.     

Non-equilibrium effects and self-heating in single-electron Coulomb blockade devices

We present a comprehensive investigation of non-equilibrium effects and self-heating in single electron transfer devices based primarily on the Coulomb blockade effect. During an electron trapping process, a hot electron maybe deposited in a quantum dot or metal island, with an extra energy usually of the order of the Coulomb charging energy, which is much higher than the temperature in typical experiments. The hot electron may relax through three channels: tunneling back and forth to the feeding lead (or island), emitting phonons, and exciting background electrons. Depending on the magnitudes of the rates in the latter two channels relative to the device operation frequency and to each other, the system may be in one of three different regimes: equilibrium, non-equilibrium, and self-heating (partial equilibrium). In the equilibrium regime, a hot electron fully gives up its energy to phonons within a pump cycle. In the non-equilibrium regime, the relaxation is via tunneling with a distribution of characteristic rates; the approach to equilibrium goes like a power law of time (frequency) instead of an exponential. This channel is plagued completely in the continuum limit of the single-electron levels. In the self-heating regime, the hot electron thermalizes quickly with background electrons, whose temperature T_e is elevated above the lattice temperature T_ol. We have calculated the coefficient in the well-known T⁵ law of energy dissipation rate, and compared the results to experimental values for aluminum and copper islands and for a two-dimensional semiconductor quantum dot. Moreover, we have obtained different scaling relations between the electron temperature, the operation frequency and device size for various types of devices.