首页 | 官方网站   微博 | 高级检索  
     


Thermal resistance matrix representation of thermal effects and thermal design in multi-finger power heterojunction bipolar transistors
Authors:Jin Dong-Yue  Zhang Wan-Rong  Chen Liang  Fu Qiang  Xiao Ying  Wang Ren-Qing and Zhao Xin
Affiliation:College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
Abstract:The thermal resistance matrix including self-heating thermal resistance and thermal coupling resistance is presented to describe the thermal effects of multi-finger power heterojunction bipolar transistors. The dependence of thermal resistance matrix on finger spacing is also investigated. It is shown that both self-heating thermal resistance and thermal coupling resistance are lowered by increasing the finger spacing, in which the downward dissipated heat path is widened and the heat flow from adjacent fingers is effectively suppressed. The decrease of self-heating thermal resistance and thermal coupling resistance is helpful for improving the thermal stability of power devices. Furthermore, with the aid of the thermal resistance matrix, a 10-finger power heterojunction bipolar transistor (HBT) with non-uniform finger spacing is designed for high thermal stability. The optimized structure can effectively lower the peak temperature while maintaining a uniformity of the temperature profile at various biases and thus the device effectively may operate at a higher power level.
Keywords:heterojunction bipolar transistor  power  thermal stability  thermal resistance matrix
本文献已被 维普 等数据库收录!
点击此处可从《中国物理 B》浏览原始摘要信息
点击此处可从《中国物理 B》下载免费的PDF全文
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司    京ICP备09084417号-23

京公网安备 11010802026262号