聚酰亚胺基导热绝缘复合薄膜的研究进展

聚酰亚胺(PI)薄膜作为综合性能最优异的聚合物材料之一,已经被广泛应用于各类微电子器件。随着电子元器件的功率密度急剧增加,热积累问题已经成为制约其发展的瓶颈。具有高导热性能的PI绝缘薄膜材料被认为是解决上述热积累问题的有效方法之一。由于PI薄膜的本征导热性能较差,近年来,国内外研究学者在提高PI薄膜导热性能方面做了大量工作。本文从阐述热量在PI薄膜中的传输机理出发,概述了近年来导热PI绝缘薄膜的研究进展与发展现状,重点讨论了绝缘导热型填料、导电导热型填料以及三维导热骨架等增强PI绝缘复合薄膜导热性能的策略,最后对PI基导热绝缘复合薄膜研究进展和未来可能的发展趋势进行了总结和展望。     

导热橡胶研究进展北大核心CSCD

橡胶是热的不良导体,但在实际应用中,许多领域需要橡胶具备一定的导热性能,以满足使用要求。因此,人们对于橡胶导热的研究越来越重视。本文概述了导热填料种类、形状、粒径、界面结合状态以及填料在橡胶基体中的分散性等因素对橡胶复合材料导热性能的影响,从实验角度分析了填充型导热橡胶的导热机理,阐述了目前研究中人们所建立的各种物理和数学模型,浅析了这些模型的优缺点及适用范围,并将其应用于橡胶材料导热性能的预测,最后介绍了导热橡胶的应用领域,以及导热橡胶未来的发展方向。     

氮化硼/聚合物导热复合材料研究进展

电子信息产业的高速发展,使得电子装置或装备在使用过程中产生的热量越来越剧烈,需要及时导出以保证其正常运行,聚合物基导热复合材料由于其优异的加工性和较低的成本得到了应用。六方氮化硼(hBN)兼具优异的导热性和绝缘性,因此作为导热填料在导热绝缘聚合物复合材料领域受到越来越多的关注。本文主要从氮化硼填料尺寸、表面性质、取向结构以及杂化等方面综述了近年来氮化硼/聚合物导热复合材料的研究进展。     

导热膨胀石墨/聚醚酰亚胺复合材料的制备与性能

利用膨胀石墨(EG)经高温处理后比表面积大的特点, 以膨胀石墨作为导热填料, 通过球磨和热模压方法制备了膨胀石墨/聚醚酰亚胺(PEI)导热复合材料, 并对其加工过程、 微观形貌、 热性能和导热性能进行了研究. 结果表明, 球磨处理可以打破膨胀石墨的“泡沫”状态并减少石墨纳米片间的间隙, 热压可以诱使和促进石墨纳米片沿着水平方向排列和取向, 从而显著提升了复合材料的平面内导热性能. 当膨胀石墨在复合材料中的质量分数为20%时, EG/PEI复合材料的面内导热系数为2.38 W?m^?1?K^?1. 与PEI相比, 复合材料导热系数的增幅约为12倍. 所制备的EG/PEI复合材料均具有良好的散热能力、 较好的热稳定性和较高的储能模量, 是一种综合性能优异的导热材料.     

导热增强聚乙二醇相变复合材料的制备及其性能

本文以聚乙二醇(PEG)为相变材料,通过添加不同的无机填料,采用熔融共混浇筑方式制备了导热增强型相变复合材料。 通过扫描电子显微镜(SEM)、热常数分析仪、差示扫描量热仪(DSC)、红外热成像和热重分析仪研究了所制备复合材料的微观结构、导热性能与相变过程。 研究结果表明,相比于碳酸钙和氧化铝,在相同添加含量下,氮化硼(BN)可有效提高PEG的导热系数,当BN质量分数为40%时,导热系数可达到3.40 W/(m·K);当填料添加量相同时,片状BN和不规则纳米碳酸钙(CaCO₃)比球形氧化铝(Al₂O₃)对PEG具有更加优良的定型效果,在相变过程中,能够更加有效阻隔PEG的流动,保持复合材料的形状稳定性。     

高导热聚合物复合材料结构与性能研究进展

由于电子信息、通信、航空航天、汽车等技术领域中元器件的功率密度迅速增大,导致设备因局部过热产生性能、稳定性和寿命降低的问题日益严重.因此,运用高导热材料将电子设备中产生的热量尽可能快速且有效地移除,以维持设备的操作温度十分必要.聚合物材料具有轻质、柔性、易加工成型、良好的力学性能、耐化学腐蚀、电绝缘、低成本等优势,在各类电子器件中获得广泛应用.然而大多数聚合物热导率低,难以满足现代电子设备中散热的要求.本文针对导热聚合物复合材料的最新研究进展进行系统介绍,着重探讨填料结构、尺寸、无序性、几何结构,聚合物基体化学结构、链运动、取向、结晶、分子间作用力,以及填料-基体界面热阻对复合材料热导率、导热机制以及函数(线性/非线性)等诸多方面因素对导热性能的影响.     

酯交换反应对PBT/PC/Al_2O_3复合材料导热性能的影响

以聚对苯二甲酸丁二醇酯(PBT)与双酚A型聚碳酸酯(PC)为基体、氧化铝(Al2O3)作为导热填料,通过熔融共混法制备了PBT/PC/Al_2O_3导热复合材料,采用亚磷酸三苯酯(TPPi)作为酯交换反应抑制剂调节材料中树脂基体的相态结构,并通过红外光谱分析(FTIR)、激光导热仪、扫描电子显微镜(SEM)、示差扫描量热仪(DSC)及力学性能测试仪等对材料中的酯交换反应、导热性能、相态结构、结晶参数及力学性能进行了表征.实验结果表明,TPPi的加入可有效抑制体系中酯交换反应的发生,使PBT/PC共混物的相态结构改变,进而对填料的分布状态产生影响.当PBT/PC配比为1/1时,向其中加入1 wt%的TPPi可使体系的相态结构趋向于形成双连续相态结构,并有效提升材料的导热系数;在该体系中加入60 wt%的Al_2O_3后,材料的导热系数达到0.89 W/(m·K),相对于未加入TPPi的相同体系提升了13%.     

导热塑料的研究与应用

随着科学的进步导热塑料应用领域不断扩大,尤其近些年来蓬勃发展的信息产业,为导热塑料提供了新的发展空间.本文对比了高分子材料、金属材料及金属氧化物导热性能,介绍了聚合物的导热机理,并对不同填充含量可适用的导热模型进行了介绍.讨论了提高塑料导热性能的途径和近年来提高导热性能新的研究方法,对非绝缘导热塑料、绝缘导热塑料的应用研究和最新进展作了综述,提出了导热塑料目前存在的问题,展望了导热塑料的应用前景.     

相变储能高分子纳米复合材料的研究进展

讲述了亚稳态及高分子亚稳材料的概念,并从亚稳态的观点出发探讨了相变的分类及机理,说明对高分子材料亚稳态的研究不仅有理论上的意义,更具有重要的实用价值。描述了相变储能材料的分类,以及不同类型相变储能材料的特性及发展概况。介绍了相变储能高分子纳米复合材料的制备方法,着重概括了纳米技术在高分子相变储能材料领域的应用及研究进展。相变储能技术对节能、环保有着重要的应用价值,已经成为新材料科学领域的热点之一。     

基于纳米碳填料可拉伸导电聚合物复合材料的制备

碳系材料具有导电性强、稳定性好、价格低廉等优点,被广泛用于制备可拉伸导电复合材料,并且在可拉伸、可穿戴电子设备等领域有巨大的应用潜力,引起了研究者的密切关注。本文介绍了碳系材料的种类,主要有炭黑、碳纳米管和石墨烯等;总结了3种纳米复合材料的主要制备工艺:原位聚合法、熔融共混法和溶液混合法,并介绍了传统印刷技术和新型打印技术。分析了复合材料的导电机理,介绍了渗流阈值理论;并重点探讨了其在可拉伸传感器和可拉伸能量储存设备领域的应用。针对基于纳米碳填料制备的可拉伸导电聚合物复合材料指出目前研究的不足之处:导电填料分散性差、导电网络不稳定和无法大规模生产等,并提出了多种解决方案。对基于纳米碳填料制备的可拉伸导电聚合物复合材料在微型化、可拉伸、可穿戴电子设备领域的应用前景作出了展望。     

Bubble-templated Construction of Three-dimensional Ceramic Network for Enhanced Thermal Conductivity of Silicone Rubber Composites

With the continuous development of the electronics industry, the energy density of modern electronic devices increases constantly,thus releasing a lot of heat during operation. Modern electronic devices take higher and higher request to the thermal interface materials.Achieving high thermal conductivity needs to establish an interconnecting thermal conductivity network in the matrix. For this purpose, the suspension of Al_2 O_3 and curdlan was first foamed to construct a bubble-templated continuous ceramic framework. Owing to the rapid gelation property of curdlan, we can easily remove moisture by hot air drying. Finally, the high thermally conductive composites are prepared by vacuum impregnation of silicone rubber. The result showed that composites prepared by our method have higher thermal conductivity than the samples obtained by traditional method. The thermal conductivity of the prepared composite material reached 1.253 W·m~(–1)·K~(–1) when the alumina content was 69.6 wt%. This facile method is expected to be applied to the preparation of high-performance thermal interface materials.     

Achieving a high thermal conductivity for segregated BN/PLA composites via hydrogen bonding regulation through cellulose network

Normally, the effective dispersion of thermal conductive fillers is a prerequisite for ensuring thermally conductive networks formed in polymer composites. In this work, a facile method was provided by using cellulose to alter the distribution state of boron nitride (BN) for the preparation of high thermally conductive polylactic acid (PLA). After powder mixing and hot‐pressing process, the Cellulose@BN was located at the boundaries of PLA granules to form consecutive thermally conductive networks with more compact structure. Morphology observation and FTIR spectra confirmed that BN edges absorbed on the cellulose surface under the intermolecular hydrogen bond interaction between PLA and BN. At the BN content of 25 wt%, contrasted with traditional BN/PLA segregated polymer composites (SPCs), thermal conductivity coefficient of Cellulose@BN/PLA SPCs improved by 53.5% from 0.71 to 1.09 Wm^?1 K^?1. This enhancement could be attributed to the reason that the cellulose regulated stripe aggregation allowed the BN connect with each other more compact, thus a thermal conduction networks with reduced phonon scattering were formed.     

Multifunctional Thermally Conductive Composite Films Based on Fungal Tree-like Heterostructured Silver Nanowires@Boron Nitride Nanosheets and Aramid Nanofibers

Thermal conduction for electronic equipment has grown in importance in light of the burgeoning of 5G communication. It is imperatively desired to design highly thermally conductive fillers and polymer composite films with prominent Joule heating characteristics and extensive mechanical properties. In this work, “solvothermal & in situ growth” method is carried out to prepare “Fungal tree”-like hetero-structured silver nanowires@boron nitride nanosheet (AgNWs@BNNS) thermally conductive fillers. The thermally conductive AgNWs@BNNS/ANF composite films are obtained by the method of “suction filtration self-assembly and hot-pressing”. When the mass fraction of AgNWs@BNNS is 50 wt%, AgNWs@BNNS/ANF composite film presents the optimal thermal conductivity coefficient of 9.44 W/(m ⋅ K) and excellent tensile strength of 136.6 MPa, good temperature-voltage response characteristics, superior electrical stability and reliability, which promise a wide application potential in 5G electronic devices.     

石墨烯导热研究进展

石墨烯具有目前已知材料中最高的热导率,在电子器件、信息技术、国防军工等领域具有良好的应用前景。石墨烯导热的理论和实验研究具有重要意义,在最近十年间取得了长足的发展。本文综述了石墨烯本征热导率的研究进展及应用现状。首先介绍应用于石墨烯热导率测量的微纳尺度传热技术,包括拉曼光谱法、悬空热桥法和时域热反射法。然后展示了石墨烯热导率的理论研究成果,并总结了石墨烯本征热导率的影响因素。随后介绍石墨烯在导热材料中的应用,包括高导热石墨烯膜、石墨烯纤维及石墨烯在热界面材料中的应用。最后对石墨烯导热研究的成果进行总结,提出目前石墨烯热传导研究中存在的机遇与挑战,并展望未来可能的发展方向。     

Poly(lactic acid)-based polymer composites with high electric and thermal conductivity and their characterization

Electrically and thermally conductive polymer composites on the basis of biodegradable poly(lactic acid) (PLA) were developed and studied in this work. Pristine single-walled carbon nanotubes (CNTs) and powder of natural graphite (G) were used as fillers in polymer composites. PLA-based composites were prepared by melt-compounding method. The volume resistivity of PLA/CNT composites can be changed by more than ten orders of magnitude compared to that for neat PLA. The thermal conductivity of PLA/G composites can be changed from 0.193 W⋅m⁻¹⋅K⁻¹ (neat PLA) up to 2.73 W⋅m⁻¹⋅K⁻¹. Loading small quantity of CNTs into PLA/G composites increases the thermal conductivity not less than by 40% of magnitude. Besides, all developed PLA-based composites are suitable for processing by injection molding, extrusion or additive manufacturing technology (3D printing).     

Thermophysical properties of polyethylene filled with metal coated polyamide particles

A new type of thermally conductive particles based on a polyamide core and a silver shell was prepared and characterized. The particles were employed for the preparation of thermally conductive polymeric composites based on a high density polyethylene matrix. It was shown that silver coated particles significantly improved thermal conductivity of composites despite the low silver volume content. Experimental data were discussed in respect with various theoretical models.     

石墨烯/环氧复合材料导热性能的研究进展

石墨烯作为时下最热门的纳米材料,吸引了国内外众多科研工作者的注意力。而石墨烯所具有的超高导热性能,使其在环氧导热复合材料中有着巨大的应用前景。本文主要综述了当前石墨烯/环氧复合材料导热性能的研究进展,详细介绍了石墨烯的尺寸、与其它填料的复配以及石墨烯表面改性等因素对导热性能的影响。此外,还分析了复合材料的微观结构对导热性能的影响。最后,对导热型石墨烯/环氧复合材料的发展进行了展望,并指出了该领域存在的技术难点和未知机理。     

Tailoring the Thermal Conductivity of Rubber Nanocomposites by Inorganic Systems: Opportunities and Challenges for Their Application in Tires Formulation

The development of effective thermally conductive rubber nanocomposites for heat management represents a tricky point for several modern technologies, ranging from electronic devices to the tire industry. Since rubber materials generally exhibit poor thermal transfer, the addition of high loadings of different carbon-based or inorganic thermally conductive fillers is mandatory to achieve satisfactory heat dissipation performance. However, this dramatically alters the mechanical behavior of the final materials, representing a real limitation to their application. Moreover, upon fillers’ incorporation into the polymer matrix, interfacial thermal resistance arises due to differences between the phonon spectra and scattering at the hybrid interface between the phases. Thus, a suitable filler functionalization is required to avoid discontinuities in the thermal transfer. In this challenging scenario, the present review aims at summarizing the most recent efforts to improve the thermal conductivity of rubber nanocomposites by exploiting, in particular, inorganic and hybrid filler systems, focusing on those that may guarantee a viable transfer of lab-scale formulations to technological applicable solutions. The intrinsic relationship among the filler’s loading, structure, morphology, and interfacial features and the heat transfer in the rubber matrix will be explored in depth, with the ambition of providing some methodological tools for a more profitable design of thermally conductive rubber nanocomposites, especially those for the formulation of tires.     

Design of thermal hybrid composites based on liquid crystal polymer and hexagonal boron nitride fiber network in polylactide matrix

Development of high thermally conductive and electrically insulative composites is of interest for electronic packaging industry. Advancements in smaller and more compact electronic devices required improvements in packing materials, including their weight, thermal conductivity, and electrical resistivity. In addition, with the increasing environmental awareness, the usage of green (bio‐based) alternatives was equally important. In the present study a hybrid based on fibers of highly concentrated hexagonal boron nitride (hBN) in liquid crystal polymer (LCP) matrix were fabricated. These hybrids were formed by arranging hBN platelets into LCP fiber form to reach high filler concentration and then randomly mix it in polylactide (PLA) matrix. With appropriate filler interaction within the hybrid, thermal conductivity similar to that of pure fiber could be achieved. Filler interaction may be tailored by optimizing the fibers aspect ratio. This study demonstrated the effect of random fillers in fibers shape in increasing the overall thermal conductivity of PLA polymeric hybrid using hBN and LCP fibers. © 2015 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2016 , 54, 457–464     

Spherical filler-promoting thermally conductive pathway in graphite-containing polymer composites for high heat radiation

Graphite is an efficient and affordable filler for polymer composites, allowing the control of thermal conductivity. In comparison to other thermally conductive fillers, graphite is lightweight and flexible but affords anisotropic thermal conductivity. Herein, the control of thermal conductivity of graphite-containing polymer composite sheet using spherical polymer particles as additional fillers is described. The thermal conductivity in the through-plane direction (λ_t) of the composite sheet is enhanced by varying the composition ratio of the two fillers (flaky graphite and spherical particles), and optimizing the forming temperature and pressure. Graphite-containing (25 wt%) polymer composite sheet formed by compression at 150 °C and 10 MPa exhibits λ _t value of 0.66 W/m K. Upon mixing of polystyrene microspheres, λ _t is successfully increased. The maximum value of thermal conductivity for a composite sheet with 35 wt% of graphite and 50 wt% of spherical particles is 7.51 W/m K, at 180 °C and 10 MPa. The graphite-containing polymer matrix forms a sequentially connected network-like structure in the composite sheet. Excess polymer microspheres lead to the formation of void structures inside the composite sheet, reducing the thermal conductivity. Thermo-camera observations proved that the composite sheets with higher λ _t value showed comparably high heat radiations. © 2020 Wiley Periodicals, Inc. J. Polym. Sci. 2020 , 58, 607–615