聚乙二醇/氮化硼复合材料相变导热性能及其结晶行为

本文采用熔融共混浇筑的方法制备了聚乙二醇/氮化硼(PEG/BN)相变复合材料,并研究了不同尺度片状BN对相变复合材料导热性能和结晶行为的影响。 通过扫描电子显微镜(SEM)、热常数分析仪、红外热成像分析仪和差示扫描量热仪(DSC)研究了相变复合材料的微观形貌、导热系数和相变过程,并利用莫志深法对DSC结果进行了非等温结晶动力学分析。 结果表明,较大片状直径(50 μm)的BN可以更有效地提高聚乙二醇的导热系数,当BN填料质量分数为40%时,相变复合材料的导热系数可达到5.04 W/(m·K)。 在快速降温条件下,片径为50 μm的BN填料可以缩短PEG的半结晶时间,提高结晶速率,使相变复合材料具有较大的相变焓。     

铜粒子负载泡沫基相变复合材料的制备与性能

以三聚氰胺泡沫(MF)经高温碳化后制得的碳泡沫(CF)为基体, 以氯化铜(CuCl₂)和水合肼(N₂H₄·H₂O)溶液为前驱体, 利用氧化还原反应在泡沫骨架上生成铜粒子, 然后通过真空浸渍法将聚乙二醇(PEG)封装在基体中制得相变复合材料. 利用扫描电子显微镜(SEM)、 X射线衍射仪(XRD)、 差示扫描量热仪(DSC)和红外热成像仪等研究了相变复合材料的形貌、 结构和热性能. 结果表明, 当CuCl₂浓度为1.0 mol/L时, Cu粒子均匀致密地沉积在CF骨架表面, 制得的相变复合材料在具备良好密封性能的前提下, 相变潜热可高达145.2 J/g, 热效率超过80%, 光热转换效率达到83.8%, 且呈现出优异的储热能力和调温性能. 本文为制备综合性能优异的相变复合材料提供了一种策略, 有利于拓宽相变复合材料的应用领域.     

聚乙烯导热复合材料的电子束辐照改性

将低密度聚乙烯(LDPE)、氧化铝(Al₂O₃)和纳米二氧化硅(SiO₂)进行熔融共混,再通过电子束辐照对得到的材料进行改性,得到了同时具有高导热性能和力学性能的复合材料(PE-Al-Si)。 当纳米SiO₂的质量分数为1%,电子束辐照剂量为120 kGy时,与不含SiO₂的复合材料(PE-Al)相比,PE-Al-Si的导热系数达到了0.759 W/(m·K),提高了22%。 另外,PE-Al-Si的拉伸强度比PE-Al提高了17%。 证明SiO₂不仅可以改善复合材料的力学性能,同时还提高了辐照效率及复合材料的导热性能。     

纳米银负载三聚氰胺泡沫基相变复合材料的一步法制备及结构与性能

以轻质柔性的三聚氰胺泡沫(MF)作为基体,将其置于由乙二醇(EG)、硝酸银(AgNO₃)、聚乙烯吡咯烷酮(PVP)和氯化铜(Cu Cl₂)组成的反应溶液中,利用高温环境中发生的氧化还原反应在泡沫骨架上生成纳米银(Ag),随后通过真空浸渍法在泡沫基体中封装月桂酸(LA)制备相变复合材料.采用扫描电子显微镜(SEM)、X射线衍射仪(XRD)、差示扫描量热仪(DSC)和红外热成像仪等对制得的相变复合材料的形貌、结构和热性能进行研究.结果表明,当Ag NO₃浓度为4 mg/m L时,纳米Ag均匀致密地沉积在MF骨架表面,且同时存在Ag纳米粒子(Ag NPs)和Ag纳米线(Ag NWs)两种形态.相变复合材料的相变焓高达144.0 J/g,相变焓效率超过了80%,呈现出优异的温度调节和储热能力.本文提供了一种制备综合性能优异的相变复合材料的新策略,有利于拓宽相变复合材料的应用领域.     

酯交换反应对PBT/PC/Al_2O_3复合材料导热性能的影响

以聚对苯二甲酸丁二醇酯(PBT)与双酚A型聚碳酸酯(PC)为基体、氧化铝(Al2O3)作为导热填料,通过熔融共混法制备了PBT/PC/Al_2O_3导热复合材料,采用亚磷酸三苯酯(TPPi)作为酯交换反应抑制剂调节材料中树脂基体的相态结构,并通过红外光谱分析(FTIR)、激光导热仪、扫描电子显微镜(SEM)、示差扫描量热仪(DSC)及力学性能测试仪等对材料中的酯交换反应、导热性能、相态结构、结晶参数及力学性能进行了表征.实验结果表明,TPPi的加入可有效抑制体系中酯交换反应的发生,使PBT/PC共混物的相态结构改变,进而对填料的分布状态产生影响.当PBT/PC配比为1/1时,向其中加入1 wt%的TPPi可使体系的相态结构趋向于形成双连续相态结构,并有效提升材料的导热系数;在该体系中加入60 wt%的Al_2O_3后,材料的导热系数达到0.89 W/(m·K),相对于未加入TPPi的相同体系提升了13%.     

导热膨胀石墨/聚醚酰亚胺复合材料的制备与性能

利用膨胀石墨(EG)经高温处理后比表面积大的特点, 以膨胀石墨作为导热填料, 通过球磨和热模压方法制备了膨胀石墨/聚醚酰亚胺(PEI)导热复合材料, 并对其加工过程、 微观形貌、 热性能和导热性能进行了研究. 结果表明, 球磨处理可以打破膨胀石墨的“泡沫”状态并减少石墨纳米片间的间隙, 热压可以诱使和促进石墨纳米片沿着水平方向排列和取向, 从而显著提升了复合材料的平面内导热性能. 当膨胀石墨在复合材料中的质量分数为20%时, EG/PEI复合材料的面内导热系数为2.38 W?m^?1?K^?1. 与PEI相比, 复合材料导热系数的增幅约为12倍. 所制备的EG/PEI复合材料均具有良好的散热能力、 较好的热稳定性和较高的储能模量, 是一种综合性能优异的导热材料.     

Al2O3/PDMS复合材料热传导的分子动力学模拟

采用分子动力学模拟方法研究了Al₂O₃/聚甲基二硅氧烷(PDMS)复合材料在300 K时的传热行为, 通过分析热传导、温度梯度以及导热增强等理论数据, 讨论了不同半径以及不同浓度的Al₂O₃填料粒子对PDMS传热的影响. 结果表明随着体积分数的增大, Al₂O₃/PDMS复合材料的热传导先减小后增加. 并且当Al₂O₃填充粒子的半径为5 nm时, Al₂O₃/PDMS复合材料的热传导达到最大值. 通过考察传热过程中的Al₂O₃填料和Al₂O₃/PDMS复合材料的温度和结构变化, 添加有小半径Al₂O₃填料的Al₂O₃/PDMS复合材料在传热的过程中主要以声子的形式进行传热, 此时决定热导率的主要因素有热容c、声子的平均速度v和声子的平均自由程l. 同时, 当体积分数为15%时, 传导链形成, 热量可以顺利通过Al₂O₃填料形成的传导链传播, 有助于热传导的增加.     

石蜡/膨胀石墨/石墨烯复合相变储热材料的制备及性能

以石蜡(PA)作为相变储热材料、 膨胀石墨(EG)作为主导热材料和支撑材料, 石墨烯气凝胶(GA)作为导热增强材料和辅支撑材料制备了PA/EG/GA复合相变材料, 研究了GA添加量对复合相变材料相变温度、 相变潜热、 导热性能以及循环稳定性的影响. 结果表明, 所制备的80%PA-17%EG-3%GA复合相变材料导热性能良好, 循环稳定性出色. 与80%PA-20%EG复合材料相比, 该材料的相变温度、 相变潜热以及循环稳定性无明显变化, 但导热系数由4.089 W/(m·K)提升到了5.336 W/(m·K), 显示出良好的应用前景.     

聚乳酸/矿物填料复合材料的示差扫描量热研究

通过熔融共混法制备了一系列聚乳酸(PLA)/矿物填料复合材料.采用示差扫描量热(DSC)研究了含有碳酸钙(CaCO3)、蒙脱土(MMT)和凹凸棒土(AT)的聚乳酸复合材料在不同热历程中的结晶和熔融行为.研究发现,MMT和AT对PLA的慢速降温结晶无明显影响,而碳酸钙在慢速降温过程中能够有效促进PLA结晶;在2.5 K/min的降温速率下,结晶热焓随碳酸钙含量增加而增加;填料种类和含量会对复合材料升温过程的冷结晶和熔融产生较大影响,低含量矿物填料主要对PLA的冷结晶起成核作用,其中MMT成核效果最好.较高含量下不同填料会对PLA晶体形态产生影响,从而得到多样的DSC曲线变化.     

高密度聚乙烯复合导热材料性能

将氮化硼(BN)与高密度聚乙烯(HDPE)熔融共混制备具较高导热性的HDPE/BN复合材料。通过断面形态观察、热学性能、流变性能、力学性能和导热性能研究,讨论了BN质量分数对复合材料性能的影响。结果表明,随着BN质量分数增加,BN颗粒逐渐聚集形成导热通道。当BN质量分数为30%时,复合材料的导热系数达到1.00 W/(m·K),与纯HDPE相比提高156%。同时复合材料的弹性模量提高75%,冷结晶温度提高1.5℃,熔体黏度和模量提高2倍。证明BN不仅改善了复合材料的流变性和冷结晶,还提高了复合材料的导热性和弹性模量。     

Enhanced thermal conductivity of epoxy–matrix composites with hybrid fillers

The results of thermal conductivity study of epoxy–matrix composites filled with different type of powders are reported. Boron nitride and aluminum nitride micro‐powders with different size distribution and surface modification were used. A representative set of samples has been prepared with different contents of the fillers. The microstructure was investigated by SEM observations. Thermal conductivity measurements have been performed at room temperature and for selected samples it was also measured as a function of temperature from 300 K down to liquid helium temperatures. The most spectacular enhancement of the thermal conductivity was obtained for composites filled with hybrid fillers of boron nitride–silica and aluminum nitride–silica. In the case of sample with 31 vol.% of boron nitride–silica hybrid filler it amounts to 114% and for the sample with 45 vol.% of hybrid filler by 65% as compared with the reference composite with silica filler. However, in the case of small aluminum nitride grains application, large interfacial areas were introduced, promoting creation of thermal resistance barriers and causing phonon scattering more effective. As a result, no thermal conductivity improvement was obtained. Different characters of temperature dependencies are observed for hybrid filler composites which allowed identifying the component filler of the dominant contribution to the thermal conductivity in each case. The data show a good agreement with predictions of Agari‐Uno model, indicating the importance of conductive paths forming effect already at low filler contents. Copyright © 2014 John Wiley & Sons, Ltd.     

Thermal conductivity epoxy resin composites filled with boron nitride

Boron nitride (BN) micro particles modified by silane coupling agent, γ‐aminopropyl triethoxy silane (KH550), are employed to prepare BN/epoxy resin (EP) thermal conductivity composites. The thermal conductivity coefficient of the composites with 60% mass fraction of modified BN is 1.052 W/mK, five times higher than that of native EP (0.202 W/mK). The mechanical properties of the composites are optimal with 10 wt% BN. The thermal decomposition temperature, dielectric constant, and dielectric loss increase with the addition of BN. For a given BN loading, the surface modification of BN by KH550 exhibits a positive effect on the thermal conductivity and mechanical properties of the BN/EP composites. Copyright © 2011 John Wiley & Sons, Ltd.     

The surface modification of boron nitride particles

Journal of Thermal Analysis and Calorimetry - The use of coupling agents to enhance the thermal conductivity of composites of epoxy and boron nitride (BN) has been investigated. Two types of BN...     

Polyaniline/1-tetradecanol composites

Polyaniline (PANI)/1-tetradecanol (TD) composite materials, a kind of novel composite that can conduct electricity and store thermal energy at the same time, thus possess the ability to endure certain heat shock, were prepared for the first time. FTIR and XRD results showed that there were some interactions existed between PANI and TD. The thermal stability of the composites exhibited both the characteristics of PANI and TD. The DSC experiments showed that the highest phase change enthalpy of the composites could be as 73% as that of TD, indicating it was a good form-stable phase change material. The thermal conductivity of the composites was also improved. The AC (Alternating Current) conductivity of the composites was enhanced to close to that of PANI when the mass fraction of PANI in the composite was increased to 46%. Heat shock experiments showed that the heat shock resistibility of the composite was greatly improved comparing to that of pure PANI.     

Study on insulating thermal conductive BN/HDPE composites

Thermal conductivity of boron nitride (BN) reinforced high density polyethylene (HDPE) composites was investigated under a special dispersion state of BN particles in HDPE, i.e., BN particles surrounding HDPE matrix particles. The results indicated that the special dispersion of BN in matrix gives the composites high thermal conductivity at low filler content; moreover, the smaller BN particles can more easily form conductive chains of filler compared to the larger filler particles. Examining the dependence of electrical insulation and mechanical properties of the composites on BN content demonstrated that the reinforced composites containing 30% by volume of filler has good electrical insulation and mechanical properties.     

Synthesis of the polyethylene glycol solid-solid phase change materials with a functionalized graphene oxide for thermal energy storage

Polyethylene glycol (PEG) as a phase change material possesses three obstacles, such as leakage, low thermal conductivity and low thermal stability. A novel solid-solid phase change material (PCM) based on functionalized graphene oxide (GO), Polyethylene glycol (PEG) was prepared, and the three obstacles of PEG as a PCM was solved in one and the same material. Fourier transform infrared spectroscopy (FTIR), X-ray photoelectron spectroscopy (XPS), Raman and Transmission electron microscope (TEM), X-ray diffraction (XRD), differential scanning calorimetry (DSC), thermogravimetric analysis (TG) and thermogravimetric analysis/infrared spectrometry (TG-IR) were used to study the properties of supporting material and composite PCM (CPCM). The results indicated that the PEG was grafted on the surface of the supporting material; Compared with pure PEG, the latent heat of CPCM with 9.6 wt% supporting material decreased only 5.3%, however, the thermal conductivity of CPCM increased 111% and the heat peak release rate of CPCM decreased 33.4%.     

Confinement effect of SiO2 framework on phase change of PEG in shape-stabilized PEG/SiO2 composites

PEG/SiO₂ shape-stabilized phase change materials with various mass fractions and molecular weights of PEG were prepared by the sol–gel method. Polyethylene glycol (PEG) and tetraethyl orthosilicate (TEOS) were chosen as the phase change substance and the silica framework precursor, respectively. The as-prepared samples were characterized by X-ray diffraction (XRD), differential scanning calorimetry (DSC), Fourier transform infrared (FTIR) spectroscopy and scanning electron microscope (SEM) techniques. It is shown that the silica framework strongly confined the crystallization of PEG. The crystallinity and thermodynamic performance of the composites were undesirable for PEG with molecular weight of 1500 even when the PEG content reached 80 wt%. The crystallinity and thermodynamic performances of the PEG/SiO₂ composites first decline then improve with the increase of the PEG molecular weights, owing to the different confinement behaviors of the silica framework. Finally, we investigated the phase change mechanism of the PEG/SiO₂ composites under the different confinement of the silica framework.     

Enhanced thermal conductivity and mechanical properties of polymeric composites through formation of covalent bonds between boron nitride and rubber chains

Hexagonal boron nitride (BN) platelets, also known as white graphite, are often used to improve the thermal conductivities of polymeric matrices. Due to the poor interfacial compatibility between BN platelets and polymeric matrices, in this study, polyrhodanine (PRd) was used to modify BN platelets and prepared functionalized BN-PRd platelets, thereby enhancing the interfacial interaction between the thermal conductive filler and polymeric matrix. Then, BN-PRd platelets were dispersed into the nitrile butadiene rubber (NBR) matrix to yield high thermally conductive composites. The presence of N? C═S groups in PRd allowed the combination of PRd and NBR chains containing stable covalent bonds via vulcanization reaction. The thermal conductivity of the as-prepared 30 vol% BN-PRd/NBR composite reached 0.40 W/mK, representing an increment of 135% over pure NBR (0.17 W/mK). In addition, the largest tensile strength of NBR composite containing 30 vol% BN-PRd platelets was 880% times of pure NBR. The 30 vol% BN-PRd/NBR composite also displayed a relatively high dielectric constant (9.35 at 100 Hz) and a low dielectric loss tangent value (0.07 at 100 Hz), indicating their usefulness as dielectric flexible materials of microelectronics. In sum, the simplicity and good efficiency of formation of covalent bonds between boron nitride and rubber chains look very promising for large-scale industrial production of high thermally conductive composites.     

Thermal properties and moisture absorption of nanofillers‐filled epoxy composite thin film for electronic application

This current study aimed to enhance the thermal conductivity of thin film composites without compromising other polymer qualities. The effect of adding high thermal conductivity nanoparticles on the thermal properties and moisture absorption of thin film epoxy composites was investigated. Three types of fillers in nanosize with high thermal conductivity properties, boron nitride (BN), synthetic diamond (SD), and silicon nitride (Si₃N₄) were studied. SN was later used as an abbreviation for Si₃N₄. The contents of fillers varied between 0 and 2 vol.%. An epoxy nanocomposite solution filled with high thermal conductivity fillers was spun at 1500–2000 rpm to produce thin film 40–60 µm thick. The effects of the fillers on thermal properties and moisture absorption were studied. The addition of 2 vol.% SD produced the largest improvement with 78% increment in thermal conductivity compared with the unfilled epoxy. SD‐filled epoxy thin film also showed good thermal stability with the lowest coefficients of thermal expansion, 19 and 124 ppm, before and after T_g, respectively, which are much lower compared with SN‐filled and BN‐filled epoxy thin film composites. However the SD‐filled epoxy film has its drawback as it absorbs more moisture compared with BN‐filled and SN‐filled epoxy film. Copyright © 2012 John Wiley & Sons, Ltd.