有限尺寸下双材料界面附近裂纹位置对裂纹尖端的影响

随着复合材料的应用和发展,不同材料组成的界面结构越来越受到人们的重视。界面层两侧材料的性能相异会引起材料界面端奇异性,同时界面和界面附近存在裂纹会引起裂尖处的应力奇异性。因此双材料界面附近的力学分析是比较复杂的。本文建立双材料直角界面模型,在材料界面附近预设初始裂纹,计算了有限材料尺寸对界面应力场及其附近裂纹应力强度因子的影响。运用弹性力学中的 Goursat 公式求得直角界面端在有限尺寸下的应力场以及其应力强度系数。通过叠加原理和格林函数法进一步得到在直角界面端附近的裂纹尖端应力强度因子。计算结果表明,在适当范围内改变材料内裂纹与界面之间的距离,界面附近裂纹尖端的应力强度因子随着裂纹与界面距离的增加而减少,并且逐渐趋于稳定。分析结果可以为预测双材料结构复合材料界面失效位置提供参考。     

Analysis of a mode-I crack perpendicular to an imperfect interface

The elastostatic problem of a mode-I crack embedded in a bimaterial with an imperfect interface is investigated. The crack is in proximity to and perpendicular to the imperfect interface, which is governed by linear spring-like relations. The Fourier transform is applied to reduce the associated mixed-boundary value problem to a singular integral equation with Cauchy kernel. By numerically solving the resulting equation, stress intensity factors near both crack tips are evaluated. Obtained results reveal that the stress intensity factors in the presence of the imperfect interface vary between that with a perfect interface and that with a completely debonding interface. Moreover, an increase in the interface parameters decreases the stress intensity factors. In particular, when crack approaches to the weakened interface closer, the stress intensity factors become larger for a sliding interface, and become larger or smaller for a Winkler interface, depending on the crack lying in a stiffer or softer material. The influences of the imperfection of the interface on the stress intensity factors for a bimaterial composed of aluminum and steel are presented graphically.     

The collinear crack problem for an orthotropic functionally graded coating–substrate structure

A theoretical treatment of antiplane crack problem of two collinear cracks on the two sides of and perpendicular to the interface between a functionally graded orthotropic strip bonded to an orthotropic homogeneous substrate is put forward. Various internal cracks and crack terminating at the interface and crack crossing the interface configurations are investigated, respectively. The problem is formulated in terms of a singular integral equation with the crack face displacement as the unknown variable. The asymptotic stress field near the tip of a crack crossing the interface is examined, and it is shown that, unlike the corresponding stress field in piecewise homogeneous materials, in this case, the “kink” in material property at the interface does not introduce any singularity. Numerical calculations are carried out, and the influences of the orthotropy and nonhomogeneous parameters and crack interactions on the mode III stress intensity factors are investigated.     

Angle cracks in two bonded functionally graded piezoelectric material under anti-plane shear

Consider two bonded functionally graded piezoelectric material (FGPM) with finite height. Each material contains an arbitrary oriented crack. The material properties are assumed in exponential forms in the direction normal to the interface. The crack surface condition is assumed to be electrically impermeable or permeable. Using the Fourier transform technique, the problem can be reduced to a system of singular integral equations, which are then solved numerically by applying the Gauss-Chebyshev integration formula to obtain the stress intensity factors at the crack tips. Numerical calculations are carried out to obtain the energy density factor S and the energy release rate G. In impermeable case, the energy release rate has been shown to be negative as the electric loads are applied. The positive definite characteristic of the energy density factor makes it possible for predicting the fracture behavior of the cracked structure. The influences of the non-homogeneous parameters and crack orientation on the energy density factors at the crack tips are discussed in detail. The results show that the energy density factor at the crack tip will be increased when the crack tip is located within the softer material.     

INTERACTION OF A DISLOCATION DIPOLE WITH A MODE Ⅲ INTERFACE CRACK

Interaction between a screw dislocation dipole and a mode Ⅲ interface crack is investigated. By using the complex variable method, the closed form solutions for complex potentials are obtained when a screw dislocation dipole lies inside a medium. The stress fields and the stress intensity factors at the tip of the interface crack produced by the screw dislocation dipole are given. The influence of the orientation, the dipole arm and the location of the screw dislocation dipole as well as the material mismatch on the stress intensity factors is discussed. zThe image force and the image torque acting on the screw dislocation dipole center are also calculated. The mechanical equilibrium position of the screw dislocation dipole is examined for various material property combinations and crack geometries. The results indicate that the shielding or anti-shielding effect on the stress intensity factor increases abruptly when the dislocation dipole approaches the tip of the crack. Additionally, the disturbation of the interface crack on the motion of the dislocation dipole is also significant.     

INTERACTION OF A DISLOCATION DIPOLE WITH A MODE III INTERFACE CRACK

Interaction between a screw dislocation dipole and a mode III interface crack is investigated. By using the complex variable method, the closed form solutions for complex potentials are obtained when a screw dislocation dipole lies inside a medium. The stress fields and the stress intensity factors at the tip of the interface crack produced by the screw dislocation dipole are given. The influence of the orientation, the dipole arm and the location of the screw dislocation dipole as well as the material mismatch on the stress intensity factors is discussed. The image force and the image torque acting on the screw dislocation dipole center are also calculated. The mechanical equilibrium position of the screw dislocation dipole is examined for various material property combinations and crack geometries. The results indicate that the shielding or anti-shielding effect on the stress intensity factor increases abruptly when the dislocation dipole approaches the tip of the crack. Additionally, the disturbation of the interface crack on the motion of the dislocation dipole is also significant.     

冲击载荷下两裂纹间的连通规律

脆性材料内部含有大量裂纹，当某一裂纹扩展时，其他裂纹会对扩展裂纹产生影响。为了研究冲击载荷下，脆性材料内两裂纹的相互影响、连通规律及裂纹尖端应力强度因子的变化规律，利用有机玻璃板制作了含非平行双裂纹的实验试件，利用落板冲击设备进行了中低速冲击实验，结合有限元分析软件ABAQUS计算出裂纹尖端应力强度因子，利用有限差分软件AUTODYN进行了动态数值模拟研究，并将其模拟结果与实验结果进行对比分析。实验及模拟结果表明:裂纹破坏形态与AUTODYN数值模拟破坏形态基本一致；试件的断裂形态随着两裂纹间距不同而不同；裂纹间的相互影响程度随着裂纹间间距增大而减小；裂纹尖端应力强度因子K_I随着裂纹间距的增大而减小，而K_II随着裂纹间距增大而增大。     

Finite boundary effects in problem of a crack perpendicular to and terminating at a bimaterial interface

In this paper, the problem of a crack perpendicular to and terminating at an interface in bimaterial structure with finite boundaries is investigated. The dislocation simulation method and boundary collocation approach are used to derive and solve the basic equations. Two kinds of loading form are considered when the crack lies in a softer or a stiffer material, one is an ideal loading and the other one fits to the practical experiment loading. Complete solutions of the stress field including the T stress are obtained as well as the stress intensity factors. Influences of T stress on the stress field ahead of the crack tip are studied. Finite boundary effects on the stress intensity factors are emphasized. Comparisons with the problem presented by Chen et al. (Int. J. Solids and Structure, 2003, 40, 2731–2755) are discussed also.The project supported by the National Natural Science Foundation of China (10202023 and 10272103), and the Key Project of CAS (KJCX2-SW-L2).     

A crack perpendicular to and terminating at a bimaterial interface

Using dislocation simulation approach, the basic equation for a finite crack perpendicular to and terminating at a bimaterial interface is formulated. A novel expansion method is proposed for solving the problem. The complete solution to the problem, including the explicit formulae for theT stresses ahead of the crack tip and the stress intensity factors are presented. The stress field characteristics are analysed in detail. It is found that normal stresses {ie27-1} and {ie27-2} ahead of the crack tip, are characterised byQ fields if the crack is within a stiff material and the parameters |p _T | and |q _T | are very small, whereQ is a generalised stress intensity factor for a crack normal to and terminating at the interface. If the crack is within a weak material, the normal stresses {ie27-3} and {ie27-4} are dominated by theQ field plusT stress. This work was supported by the Swedish Research Council for Engineering Sciences.     

Finite element analysis of a bimaterial interface crack

In this investigation, the enriched element method developed by Benzley was extended to treat the stress analysis problem involving a bimaterial interface crack. Unlike crack problems in isotropic elasticity, where the stress singularity at the crack tip is of the inverse square root type, the interface crack contains an additional oscillatory singularity. Although the effect of this oscillatory characteristic is confined to a region very close to the crak tip, it nevertheless requires proper treatment in order to obtain accurate predictions on the stress intensity factors. Using appropriate crack tip stress and displacement expressions, the enriched element method can model the stress singularity for an interface crack exactly. The finite element implementation of this method has been made on the code APES. Stress intensity factor results predicted by the modified APES program compare favorably with those available in the literature. This indicates tha the enriched element technique provides an accurate and efficient numerical tool for the analysis of bimaterial interface crack problems.     

SINGLE AND DOUBLE EDGE INTERFACE CRACK SOLUTIONS FOR ARBITRARY FORMS OF MATERIAL COMBINATION

In this paper interfacial edge crack problems are considered by the application of the finite element method. The stress intensity factors are accurately determined from the ratio of crack-tip-stress value between the target given unknown and reference problems. The reference problem is chosen to produce the singular stress fields proportional to those of the given unknown problem. Here the original proportional method is improved through utilizing very refined meshes and post-processing technique of linear extrapolation. The results for a double-edge interface crack in a bonded strip are newly obtained and compared with those of a single-edge interface crack for different forms of combination of material. It is found that the stress intensity factors should be compared in the three different zones of relative crack lengths. Different from the case of a cracked homogeneous strip, the results for the double edge interface cracks are found to possibly be bigger than those for a single edge interface crack under the same relative crack length.     

Anti-plane shear crack normal to and terminating at the interface of two bonded piezoelectric ceramics

The electroelastic analysis of two bonded dissimilar piezoelectric ceramics with a crack perpendicular to and terminating at the interface is made. By using Fourier integral transform, the associated boundary value problem is reduced to a singular integral equation with generalized Cauchy kernel, the solution of which is given in closed form. Results are presented for a permeable crack under anti-plane shear loading and in-plane electric loading. Obtained results indicate that the electroelastic field near the crack tip in the homogeneous piezoelectric ceramic is dominated by a traditional inverse square-root singularity, while the electroelastic field near the crack tip at the interface exhibits the singularity of power law r^−α, r being distance from the interface crack tip and α depending on the material constants of a bi-piezoceramic. In particular, electric field has no singularity at the crack tip in a homogeneous solid, whereas it is singular around the interface crack tip. Numerical results are given graphically to show the effects of the material properties on the singularity order and field intensity factors.     

不同压电介质界面上的反平面运动裂纹

利用积分变换技术,得到不同压电介质界面上的平面运动裂纹问题的分析解。结果表明应力及电位移强度因子均与界面裂纹扩展速度及材料参数相关,这不同于均匀压电介质中运动裂纹的结论,当两种压电介质完全相同时,本文结果将退化为均匀压电介质中反平面运动裂纹问题的解。     

A semi-infinite interface crack interacting with subinterface matrix cracks in dissimilar anisotropic materials. II. Numerical results and discussion

Based on the investigation performed in Part I of this series, numerical results for the interaction between a semi-infinite interface crack and multiple subinterface matrix microcracks in three kinds of material combinations are given in Part II. The major interaction behaviors are discussed in detail. Special attention is focused on the influences of the different material combinations, the T-stress, the orientation angles, and the location angles of the microcracks on the local stress intensity factor at the interface crack tip. In addition, the variable tendencies of the interaction effect induced from change of the distance between the interface crack tip and the centers of the microcracks are studied. It is concluded that the different material combinations introduced in this paper have little influence on the variable tendencies of the effect, but have significant influence on the effect in magnitude. Detailed comparisons of the results with those in a homogeneous orthotropic material show that the dissimilar materials shift the maximum amplification angle, the maximum shielding angle, the neutral shielding angle, and the neutral T-stress angle, respectively.     

垂直于界面V型缺口尖端的应力奇异性及其应用

基于双材料垂直于界面V型缺口理论,给出了单一材料和双材料裂纹问题、V型缺口问题应力强度因子的统一定义,得到了应力外推法计算双材料K_I的公式,数值算例验证了本文方法的有效性.以双材料单向拉伸和三点弯曲模型为对象,深入研究了双材料中弹性模量、泊松比、缺口深度、缺口张角对缺口尖端奇异应力场的影响,获得了一定范围内各种参数变化对缺口尖端奇异应力场的影响规律,为异体材料形成的V型缺口在应力断料中的应用提供了必要的参考依据.     

Evaluation of fracture mechanics parameters for free edges in multi-layered structures with weak singularities

This study focuses on the stress intensity factors for free edges in multi-layered structural components. The effects of elastic constants of various material combinations on the weak singularity at free edges are analyzed. Using the H-integral approach, the effects of elastic mismatch parameters, the bond area and the thickness of the thin metal layer on the stress intensity factor are quantified and the results are compared with detailed finite element solutions. A good agreement between numerical predictions obtained from the H-integral and the detailed FE results is achieved, showing the applicability of this approach. Similar to a crack problem, the singular elastic field dominates in an annular region adjacent to the notch tip. The relationship between the valid range of the K-dominated field and the thin-film thickness is then demonstrated. Furthermore, the competition of crack initiation between the free edge interface (180° opening angle) and a 90° notch interface in a generic specimen is investigated, in order to find out which is the prevailing failure mode. Comparison between isotropic Si and anisotropic Si substrate is also illustrated. Anisotropy of the Si substrate has a significant influence on the stress intensity factor when combined with an Au or Al metal layer but not with a Cu layer. Additionally, standardized numerical formulae of the dimensionless stress intensity factor have been derived to guide the engineering application.     

位错偶极子和Ⅲ型界面裂纹的干涉效应

研究了多晶体材料中螺型位错偶极子和界面裂纹的弹性干涉作用.利用复变函数方法,得到了该问题复势函数的封闭形式解答.求出了由位错偶极子诱导的应力场和裂纹尖端应力强度应子,分析了偶极子的方向,偶臂和位置以及材料失配对应力强度因子的影响.推导了作用在螺型位错偶极子中心的像力和力偶矩,并讨论了界面裂纹几何条件和不同材料特征组合对位错偶极子平衡位置的影响规律.结果表明,裂纹尖端的螺型位错偶极子对应力强度因子会产生强烈的屏蔽或反屏蔽效应.同时,界面裂纹对螺型位错偶极子在材料中运动有很强的扰动作用.     

A general solution method for an anti-plane shear crack dynamically accelerating along a bimaterial interface

We develop a general solution method for a dynamically accelerating crack under anti-plane shear conditions along the interface between two different homogeneous isotropic elastic materials. The crack is initially at rest, and after loading is applied the crack-tip speed which may accelerate up to the shear wave speed of the more compliant material. The analysis includes an exact, closed-form expression for the stress intensity factor for an arbitrary time-dependent crack-face traction, as well as expressions for computing the crack-face displacements and the stress in front of the crack. We also present some numerical examples for fixed loads and for loads moving with the crack tip, using a stress intensity factor fracture criterion, in order to examine the predicted effect of material mismatch on interfacial fracture.     

Thermo-electro-structural coupled analyses of crack arrest by Joule heating

Using the finite element method, thermo-electro-structural coupled analyses of the cracked conducting plate under high electric current have been solved. The crack contact condition and temperature-dependent material properties are considered in this analysis. The crack tip temperature, electric current density factor, stress intensity factor and strain energy density factor are obtained for discussions. Due to high electric current density and Joule heating at the crack tip, a circular melting area may exist around the tip. After cooling, a circular void or hole may occur at the crack tip and the crack arrest is achieved. The crack tip temperature decreases when the crack contact area increases. The proper tensile load is necessary for making the crack open enough and causing high current density at the crack tip and associated crack arrest. On the other hand, the crack tip temperature increases with time by the increasing external current and Joule heating. The values of mode-I stress intensity factor and strain energy density factor decrease with time due to the thermal deformation around the crack tip. Because of the temperature-dependent resistivity, the variation of the electric current density factor is complicated. In addition, it is not easy to create a crack-arrest condition when the crack length relative to the plate width is too small.     

Dynamic stress intensity factors of two collinear mode-III cracks perpendicular to and on the two sides of a bi-FGM weak-discontinuous interface

The mechanical model was established for the anti-plane dynamic fracture problem for two collinear cracks on the two sides of and perpendicular to a weak-discontinuous interface between two materials with smoothly graded elastic properties, as opposed to a sharp interface with discontinuously changing elastic properties. The problem was reduced as a system of Cauchy singular integral equations of the first kind by Laplace and Fourier integral transforms. The integral equations were solved by Erdogan's collocation method and the dynamic stress intensity factors in the time domain were obtained through Laplace numerical inversion proposed by Miller and Guy. The influences of geometrical and physical parameters on the dynamic stress intensity factors were illustrated and discussed, based on which some conclusions were drawn: (a) to increase the thickness of the FGM strip on either side of the interface will be beneficial to reducing the DSIF of a crack perpendicular to a bi-FGM interface and embedded at the center of one of the FGM strips; (b) To increase the rigidity of the FGM strip where the crack is located will increase the DSIF. However, when the material in one side of the interface is more rigid, the DSIF of the interface-perpendicular embedded crack in the other side will be reduced; (c) To decrease the weak-discontinuity of a bi-FGM interface will not necessarily reduce the stress intensity factor of a crack perpendicular to it, which is different from the case of interfacial crack; (d) For two collinear cracks with equal half-length, when the distance between the two inner tips is less than about three times of the half-length, the interaction of them is intensified, however, when the distance is greater than this the interaction becomes weak.