功能梯度夹层多个环形界面裂纹扭转冲击

研究位于功能梯度层和外部均匀材料之间多个环形界面裂纹的扭转冲击问题,功能梯度材料 (FGM)粘结在两种不同的弹性材料之间，功能梯度层和外部材料之间环形界面裂纹的数目是任意的．引进积分变换和位错密度函数将问题化为求解Laplace域里标准的Cauchy奇异积分方程，进而化为求解代数方程；应用Laplace数值反演技术，计算时域里的动应力强度因子(DSIF)．考查了结构几何尺度和材料特性对裂尖动态断裂特性的影响．数值结果表明，DSIF存在一个主峰，到达主峰后，在其相应的静态值附近波动并最终趋于稳定；增加FGM的梯度能减小DSIF的峰值．     

Dynamic stress intensity factor of a crack perpendicular to the weak-discontinuous interface in a nonhomogeneous coating–substrate structure

A mechanical model was established for the antiplane dynamic fracture problem of a functionally graded coating–substrate structure with a coating crack perpendicular to the weak-discontinuous interface. The problem was reduced to a Cauchy singular integral equation by the methods of Laplace and Fourier integral transforms. Erdogan’s collocation method and the Laplace numerical inversion proposed by Miller and Guy were used to calculate the dynamic stress intensity factors. Three conclusions were drawn through parametric studies: (a) unlike the conclusion drawn for an interfacial crack, reducing the weak discontinuity of the interface will not necessarily decrease the dynamic stress intensity factor (DSIF) of the coating crack perpendicular to the interface; (b) increasing the stiffness of the substrate when that of the coating is fixed, or decreasing the stiffness of coating when that of the substrate is fixed, will be beneficial for the reduction of the DSIF of a coating crack perpendicular to the interface; and (c) the free surface has a greater influence on the DSIF than the interface does, and the effect of the interface on the DSIF is greater than that of the material stiffness in the crack-tip region.     

Antiplane mechanical and inplane electric time-dependent load applied to two coplanar cracks in piezoelectric ceramic material

This work is concerned with the dynamic response of two coplanar cracks in a piezoelectric ceramic under antiplane mechanical and inplane electric time-dependent load. The cracks are assumed to act either as an insulator or as a conductor. Laplace and Fourier transforms are used to reduce the mixed boundary value problems to Cauchy-type singular integral equations in Laplace transform domain. A numerical Laplace inversion algorithm is used to determine the dynamic stress and electric displacement factors that depend on time and geometry. A normalized equivalent parameter describing the ratio of the equivalent magnitude of electric load to that of mechanical load is introduced in the numerical computation of the dynamic stress intensity factor (DSIF) which has a similar trend as that for the pure elastic material. The results show that the dynamic electric field will impede or enhance crack propagation in a piezoelectric ceramic material at different stages of the dynamic electromechanical load. Moreover, the electromechanical response is greatly affected by the ratio of the crack length to the ligament between the cracks. The stress and electric displacement intensity factor can be combined by the energy density factor or function to address the fracture of piezoelectric materials under the combined influence of electromechanical loading.     

Moving interfacial crack between piezoelectric ceramic and elastic layers

An analysis is performed for the problem of a finite Griffith crack moving with constant velocity along the interface of a two-layered strip composed of a piezoelectric ceramic and an elastic layers. The combined out-of-plane mechanical and in-plane electrical loads are applied to the strip. Fourier transforms are used to reduce the problem to a pair of dual integral equations, which is then expressed in terms of a Fredholm integral equation of the second kind. The dynamic stress intensity factor(DSIF) is determined, and numerical results show that DSIF depends on the crack length, the ratio of stiffness and thickness, and the magnitude and direction of electrical loads as well as the crack speed. In case that the crack moves along the interface of piezoelectric and elastic half planes, DSIF is independent of the crack speed.     

The Anti-plane Dynamic Fracture Analysis of Functionally Graded Materials with Arbitrary Spatial Variations of Material Properties

Anti-plane dynamic fracture analysis is presented for functionally graded materials (FGM) with arbitrary spatial variations of material properties. The FGM with the material properties varying continuously in an arbitrary manner is modeled as a multi-layered medium with the elastic modulus and mass density varying linearly in each sub-layer and continuous at the interfaces between two adjacent sub-layers. With this linearly inhomogeneous multi-layered model, the problem of a crack in a graded interfacial zone bonded to two homogeneous half-spaces or in a coating bonded to a homogeneous half-space subjected to the anti-plane shear impact load is investigated. Laplace and Fourier transforms and transfer matrix are applied to reduce the associated mixed boundary value problem to a Cauchy singular integral equation which is solved numerically in the Laplace transformed domain. The dynamic stress intensity factors (DSIF) are obtained by using the numerical technique of Laplace inversion.     

Dynamic behavior of two collinear interface cracks between two dissimilar functionally graded piezoelectric/piezomagnetic material strips

The dynamic interaction of two collinear interface cracks between two dissimilar functionally graded piezoelectric/piezomagnetic material strips subjected to the anti-plane shear harmonic stress waves was investigated. By using the Fourier transform, the problem can be solved with the help of a pair of triple integral equations in which the unknown variable is jump of displacement across the crack surfaces. These equations are solved using the Schmidt method. Numerical examples are provided to show the effect of the functionally graded parameter, the circular frequency of the incident waves and the thickness of the strip upon stress, electric displacement and magnetic flux intensity factors of cracks.     

The collinear crack problem for an orthotropic functionally graded coating–substrate structure

A theoretical treatment of antiplane crack problem of two collinear cracks on the two sides of and perpendicular to the interface between a functionally graded orthotropic strip bonded to an orthotropic homogeneous substrate is put forward. Various internal cracks and crack terminating at the interface and crack crossing the interface configurations are investigated, respectively. The problem is formulated in terms of a singular integral equation with the crack face displacement as the unknown variable. The asymptotic stress field near the tip of a crack crossing the interface is examined, and it is shown that, unlike the corresponding stress field in piecewise homogeneous materials, in this case, the “kink” in material property at the interface does not introduce any singularity. Numerical calculations are carried out, and the influences of the orthotropy and nonhomogeneous parameters and crack interactions on the mode III stress intensity factors are investigated.     

Fracture analysis on a piezoelectric sensor with a viscoelastic interface

Fracture analysis is performed on a layered piezoelectric sensor possessing a Kelvin-type viscoelastic interface. An electrically permeable anti-plane crack is situated in the piezoelectric layer and perpendicular to the interface. The crack problem is solved by the methods of integral transform and Cauchy singular integral equation. The variations of the dynamic stress intensity factor (DSIF) vs. physical and geometrical parameters are investigated. At the beginning of creep and relaxation, larger viscosity coefficient always induces smaller DSIF. With time elapsing, the effect of viscosity coefficient becomes weaker and weaker. When time approaches infinity, the viscous effect disappears, and the DSIF converges to a value corresponding to the case of an elastic interface. The effect of the viscoelastic interface on the fracture behavior of the piezoelectric layer also depends on the substrate thickness. To some extent, thicker substrate may intensify the effect of the interface.     

Fracture analysis of a weak-discontinuous interface in a symmetrical functionally gradient composite strip loaded by anti-plane impact

The anti-plane impact fracture analysis was performed for a weak-discontinuous interface in a symmetrical functionally gradient composite strip. A new bi-parameter exponential function was introduced to simulate the continuous variation of material properties. Using Laplace and Fourier integral transforms, we reduced the problem to a dual integral equation and obtained asymptotic analytical solution of crack-tip stress field. Based on the numerical solution of the second kind of Fredholm integral equation transformed from the dual integral equation, the effects of the two non-homogeneity parameters on DSIF were discussed. It was indicated that the relative stiffness of the interface and the general stiffness of the whole structure are two important factors affecting the impact fracture behavior of the weak-discontinuous interface. The greater the relative stiffness of the interface is, the higher the value of the dynamic stress intensity factor will be. The greater the general stiffness of the whole structure is, the shorter the time for DSIF to arrive at the peak value and then to stabilize to the steady one. If the general stiffness of the whole structure is great enough, there will be an oscillation between the peak and steady values of DSIF.     

压电体中孔边Ⅲ型界面裂纹的动应力强度因子

采用Green函数法研究界面上含圆孔边界径向有限长度裂纹的两半无限压电材料对SH波的散射和裂纹尖端动应力强度因子问题.首先构造出具有半圆型凹陷半空间的位移Green函数和电场Green函数,然后采用裂纹"切割"方法构造孔边裂纹,并根据契合思想和界面上的连接条件建立起求解问题的定解积分方程.最后作为算例,给出了孔边界面裂纹尖端动应力强度因子的计算结果图并进行了讨论.     

Dynamic stress intensity factors for two parallel interface cracks between a nonhomogeneous bonding layer and two dissimilar elastic half-planes subject to an impact load

Some composite materials are constructed of two dissimilar half-planes bonded by a nonhomogeneous elastic layer. In the present study, a crack is situated at the interface between the upper half-plane and the bonding layer of such a material, and another crack is located at the interface between the lower half-plane and the bonding layer. The material properties of the bonding layer vary continuously from those of the lower half-plane to those of the upper half-plane. Incoming shock stress waves impinge upon the two interface cracks normal to their surfaces. Fourier transformations were used to reduce the boundary conditions for the cracks to two pairs of dual integral equations in the Laplace domain. To solve these equations, the differences in the crack surface displacements were expanded in a series of functions that are zero-valued outside the cracks. The unknown coefficients in the series were solved using the Schmidt method so as to satisfy the conditions inside the cracks. The stress intensity factors were defined in the Laplace domain and were inverted numerically to physical space. Dynamic stress intensity factors were calculated numerically for selected crack configurations.     

Dynamic stress intensity factors around two rectangular cracks in an infinite elastic plate under impact load

A dynamic problem for two equal rectangular cracks in an infinite elastic plate is considered. The two cracks are placed perpendicular to the plane surfaces of the plate. An incoming shock tensile stress is returned by the cracks. In the Laplace transform domain, the boundary conditions at the two sides of the plate are satisfied using the Fourier transform technique. The mixed boundary conditions are reduced to dual integral equations. Crack displacement is expanded in a series of functions which are zero outside of the cracks. The unknown coefficients in the series are determined by the Schmidt method. The stress intensity factors are defined in the Laplace transform domain and these are inverted using a numerical method.     

The dynamic stress intensity factor analysis of adhesively bonded material interface crack with damage under shear loading

This paper studies the dynamic stress intensity factor (DSIF) at the interface in an adhesive joint under shear loading. Material damage is considered. By introducing the dislocation density function and using the integral transform, the problem is reduced to algebraic equations and can be solved with the collocation dots method in the Laplace domain. Time response of DSIF is calculated with the inverse Laplace integral transform. The results show that the mode Ⅱ DSIF increases with the shear relaxation parameter, shear module and Poisson ratio, while decreases with the swell relaxation parameter. Damage shielding only occurs at the initial stage of crack propagation. The singular index of crack tip is -0.5 and independent on the material parameters, damage conditions of materials, and time. The oscillatory index is controlled by viscoelastic material parameters.     

Mode III fracture problem of two arbitrarily oriented cracks located within two bonded functionally graded material strips

This paper shows the anti-plane crack problem of two bonded functionally graded material (FGM) strips. Each strip contains an arbitrarily oriented crack. The material properties of the strips are assumed in exponential forms varied in the direction normal to the interface. After employing the Fourier transforms, the unknowns are solved from the interface conditions, boundary conditions and the condition on the crack surfaces. The problem can then be reduced to a system of singular integral equations, which are solved numerically by applying the Gauss-Chebyshev integration formula to obtain the stress intensity factors at the crack tips. In the discussions, several degenerated problems are considered to demonstrate the influence of the non-homogeneous parameters, crack orientations, edge effects and the crack interactions on the normalized intensity factors. In general, the factors are larger when crack tips are located in stronger material. Also, the factors increase as the crack is oriented in the direction normal to the interface. The conclusions made in this research can be used to evaluate the safety of two bonded strips once the cracks exist inside the structure.     

The dynamic behavior of two collinear interface cracks in magneto-electro-elastic materials

In this paper, the dynamic behavior of two collinear symmetric interface cracks between two dissimilar magneto-electro-elastic material half planes under the harmonic anti-plane shear waves loading is investigated by Schmidt method. By using the Fourier transform, the problem can be solved with a set of triple integral equations in which the unknown variable is the jump of the displacements across the crack surfaces. To solve the triple integral equations, the jump of the displacements across the crack surface is expanded in a series of Jacobi polynomials. Numerical solutions of the stress intensity factor, the electric displacement intensity factor and the magnetic flux intensity factor are given. The relations among the electric filed, the magnetic flux field and the stress field are obtained.     

黏弹性体界面裂纹的冲击响应

研究两半无限大黏弹性体界面Griffith裂纹在反平面剪切突出载荷下,裂纹尖端动应力强度因子的时间响应,首先,运用积分变换方法将黏弹性混合黑社会问题化成变换域上的对偶积分方程,通过引入裂纹位错密度函数进一步化成Cauchy型奇异积分方程,运用分片连续函数法数值求解奇异积分方程,得到变换域内的动应力强度因子,再用Laplace积分变换数值反演方法,将变换域的解反演到时间域内,最终求得动应力强度因子的时间响应,并对黏弹性参数的影响进行分析。     

Closed-form solution for two collinear mode-III cracks in an orthotropic elastic strip of finite width

The problem of an orthotropic strip containing two collinear cracks normal to the strip boundaries is considered. The Fourier series method is used to reduce the associated boundary value problem to triple series equations, then to a singular integral equation, which can be solved analytically. Under remote uniform antiplane shear loading, the stress field and the crack sliding displacement are determined analytically and stress intensity factors are also given in a closed form.     

DYNAMIC STRESS INTENSITY FACTORS AROUND TWO CRACKS NEAR AN INTERFACE OF TWO DISSIMILAR ELASTIC HALF－PLANES UNDER IN－PLANE SHEAR IMPACT LOAD

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Interaction between collinear periodic cracks in an infinite piezoelectric body

The problem of collinear periodic cracks in an infinite piezoelectric body is studied. Effect of saturation strips at the crack-tips is taken into account. By means of the Stroh formalism and the conformal mapping technique, the general periodic solutions for collinear cracks are obtained. The stress intensity factors and the size of saturation strips are derived analytically, and their dependencies on the ratio of the periodicity on the half-length of the crack are analyzed in detail. Numerical results show the following two facts. (1) When h/l>4.0, the stress intensity factors become almost identical to those of a single crack in an infinite piezoelectric body. This indicates that the interaction between cracks can be ignored in establishing the criterion for the crack initiation in this case. (2) The speed of the saturation strip size of periodic cracks approaching that of a single crack depends on the electric load applied at infinity. In general, a large electric load at infinity is associated with a slow approaching speed.     

3D dynamic stress intensity factors around two parallel square cracks in an infinite elastic medium under impact load

Summary  Transient stresses around two parallel cracks in an infinite elastic medium are investigated in the present paper. The shape of the cracks is assumed to be square. Incoming shock stress waves impinge upon the two cracks normal to tzheir surfaces. The mixed boundary value equations with respect to stresses and displacements are reduced to two sets of dual integral equations in the Laplace transform domain using the Fourier transform technique. These equations are solved by expanding the differences in the crack surface displacements in a double series of a function that is equal to zero outside the cracks. Unknown coefficients in the series are calculated using the Schmidt method. Stress intensity factors defined in the Laplace transform domain are inverted numerically to the physical space. Numerical calculations are carried out for transient dynamic stress intensity factors under the assumption that the shape of the upper crack is identical to that of the lower crack. Received 2 February 2000; accepted for publication 10 May 2000