含强约束界面片状夹杂复合陶瓷热膨胀系数预报

以含强约束界面相片状夹杂复合陶瓷的细观结构为基础,建立含片状夹杂、强约束界面相、基体氛围和有效介质组成的四相模型,将片状夹杂、强约束界面相和基体氛围构成的三相胞元看作复合夹杂,根据Eshelby理论,确定了含同向片状夹杂复合陶瓷的有效热膨胀系数的解析表达式,复合陶瓷为横观各向同性,有2个独立的热膨胀系数.定量分析表明含同向片状夹杂的强约束界面复合陶瓷的有效热膨胀系数具有明显的尺度效应.     

爆炸焊接复合界面波与温度场物质点法分析

爆炸焊接是一门双金属复合工程技术,在炸药爆轰载荷驱动下,飞板高速冲击基板时,两金属板复合界面处在高温高压作用下材料发生塑性流动并形成周期性波状界面,波状界面的形成与复合界面处的材料熔化和变形直接相关。本文应用物质点法对爆炸焊接界面波的形成和界面温度场进行数值模拟,同时开展双金属爆炸焊接实验,并结合物质点法的三维数值模拟对爆炸焊接界面波的形态和界面材料高温软化进行分析。     

层状粘接复合结构界面力学参数声导波定征方法

在推导层状粘接复合结构良好粘接及存在弱界面、滑移界面和脱层等几种不同界面条件下声导波的广义频散方程的基础上,分析了界面径向与轴向力学参数对声导波传播特性的影响,进一步提出以频散特性为基础的超声导波定征方法和在最小二乘意义下的反向算法对粘接复合结构层间界面力学参数进行了估计,分析了影响估计准确性的各种因素,研究了超声导波定征方法对粘接复合结构层间力学参数的灵敏度及其在误差传递中的意义。     

爆炸复合1Cr13Mo/45钢连铸辊工艺

鉴于目前连铸辊制造工艺存在的不足,以爆炸复合法制造1Cr13Mo/45钢复合轧辊,并以爆炸复合工艺为研究对象,采用超声波探伤和金相观察等方法,研究药厚和间隙大小对复合界面波形的影响.结果表明:药厚一定的情况下,间隙对复合轧辊界面波形的影响较大;而在间隙一定的情况下,药厚对复合轧辊界面波形的影响不明显.通过实验,获得了该...     

界面强度对玻璃微珠填充聚丙烯力学性能的影响

本文针对玻璃微珠填充聚丙烯这一刚性粒子填充聚合物复合体系进行了实验研究。通过偶联剂改性对比,研究了该聚合物复合材料在不同界面粘结状态下的宏观拉伸、冲击力学性能。此外,根据冲击破坏断面的电镜观测结果,发现复合体系的断裂和增韧机制随界面粘结强度不同而发生改变,界面改性使得材料抗冲击破坏能力得到增强。本文还采用在位拉伸过程中的细观观测方法,观测到材料在一维应力作用下,刚性粒子和基体界面的脱粘、开裂过程,分析了该复合体系细观结构和宏观力学性能之间的关系,发现界面改性对于材料细观结构的界面脱粘和宏观屈服现象的重要影响,为发展新型复合材料提供了实验依据。     

碰撞角对爆炸复合材料界面状态的影响

复合材料界面状态是衡量复合质量优劣的主要评定因素之一,焊接参数和界面状态之间存在着紧密的联系。为了获得理想的复合质量,必须正确选择爆炸焊接参数。本文在实验的基础上,通过理论研究和数值计算,探讨了爆炸复合的力学模型及物理机制,验证了碰撞角对再入射流的质量(或再入射流的厚度)和爆炸复合材料界面状态存在的影响,得出了波形的变化趋势与碰撞角的变化趋势相一致的结论,同时确立了波形参数和碰撞角的半定量表达式,拓展和深化了爆炸复合的研究领域,丰富和发展了爆炸复合的成波机理,从而能够更好地指导工程应用,减少工程损耗,提高复合质量和工作效率。     

多层爆炸复合中的成波研究

用爆炸复合法制成了15层每层1mm厚的紫铜板组成的长1.2m,宽90mm的软电览。进行了2层至14层的对称爆炸复合实验,在多层对称爆炸复合中,总存在一个较大波纹的复合界面。对奇数层复合来说,存在一个稳定的复合模式。在对称多层复合中,最后二个碰撞界面的碰撞角较大,所以在该界面产生大的波纹.但比波长/H不遵循在单层复合时的公式。数值计算指出多层复合时碰撞压力的峰值与廓图均异于对应的单层复合中的情况。     

基于微结构损伤的珠光体材料本构行为研究

珠光体材料由许多随机取向的珠光体团组成，每一珠光体团又由铁素体片和渗碳体片交替 叠合而成. 实验表明具有较小片层间距的珠光体材料具有较高的强度和寿命. 通过分析构成 珠光体团的各相及界面的损伤特征，利用损伤耗散功的概念，得到了铁素体、渗碳体与界面 损伤的具有统一形式的演化规律，将其嵌入基于细片层微结构和非经典塑性理论的珠光体团 的弹塑性本构方程，利用Hill自洽方法，得到了珠光体材料的损伤本构描述. 所得到的损 伤本构描述显含表征微结构特征的片层间距，容易证明具有较小片层间距的珠光体材料具有 较好的综合力学性能. 对珠光体材料的拉伸和循环拉压特性进行了分析，得到了与实验一 致的结果.     

三维界面裂纹的奇性应力场和应力强度因子分析

使用有限部积分概念和极限方法得到了三维平片界面裂纹的超奇异积分－微分方程组后,进一步利用二维超奇异积分主部分析方法,对裂纹前沿的应力场作了理论分析,并获得了其奇性应力场和裂纹面位移间断表示复位应力强度因子的精确表达式,为三维平片界面裂纹的超奇异积分－微分方程组的求解建立了数值方法,并分析了界面椭圆平片裂纹问题,和现有解比较,所得数值结果令人满意。     

2205双相不锈钢/16MnR 爆炸复合板界面的微观组织

为了研究2205双相不锈钢/16MnR 爆炸复合板界面的微观结构,用金相显微镜和扫描电镜 (SEM)观察了复合界面的形貌;用显微硬度计测定了爆炸复合界面的显微硬度;分析了热处理对显微硬度的 影响。研究表明:基材和复材的显微硬度随着退火加热温度的提高和保温时间的延长而降低;2205双相不锈 钢在850℃加热保温8h后炉冷到400℃出炉空冷会析出相。     

Analysis of the stress singularity field at a vertex in 3D-bonded structures having a slanted side surface

The stress singularity that occurs at a vertex in a joint with a slanted side surface is investigated. The orders of stress singularity at a vertex and at a point on stress singularity lines for various material properties are determined using eigenanalysis. The stress distribution on an interface and the intensity of stress singularity at the vertex are investigated using BEM. It is shown that the order of stress singularity at the vertex in the joints can be reduced by slanting a side surface so as to decrease the angle between the interface and the side surface. The results of BEM analysis reveal that the distribution of stress on the interface is influenced by the slanted side surface. Finally, the 3D intensities of the singularity for stress components which are continuous at the interface are newly defined and determined for various material combinations.     

Analysis of a mode-I crack perpendicular to an imperfect interface

The elastostatic problem of a mode-I crack embedded in a bimaterial with an imperfect interface is investigated. The crack is in proximity to and perpendicular to the imperfect interface, which is governed by linear spring-like relations. The Fourier transform is applied to reduce the associated mixed-boundary value problem to a singular integral equation with Cauchy kernel. By numerically solving the resulting equation, stress intensity factors near both crack tips are evaluated. Obtained results reveal that the stress intensity factors in the presence of the imperfect interface vary between that with a perfect interface and that with a completely debonding interface. Moreover, an increase in the interface parameters decreases the stress intensity factors. In particular, when crack approaches to the weakened interface closer, the stress intensity factors become larger for a sliding interface, and become larger or smaller for a Winkler interface, depending on the crack lying in a stiffer or softer material. The influences of the imperfection of the interface on the stress intensity factors for a bimaterial composed of aluminum and steel are presented graphically.     

瓷修复体界面断裂行为的模拟实验研究

本文利用云纹干涉法和云纹干涉－－有限元混合法，对瓷修复体的模拟双材料模型界面断裂问题进行了实验研究。用云纹干涉和数字错位云纹干涉法测量带边裂纹的双材料四点简支梁在剪切作用下界面表面的剪应变分布及界面两侧局部表面的位移场，实验表明，由于界面两两侧材料力学性质不同，表现出界面剪切断裂问题的非称性和裂尖附近复合型断裂的特点；用云纹干涉法和有限元法相结合的混合法对粘接界面角点应力奇异性进行研究，并对角点附近应力应变场作了分析，得到了应力奇异指数与边界楔角，载荷的关系，证明了用界面应力强度因子Kf来描述界面端部区域应力分布的公式，并得到了双材料界面端部区域的应力应变分布情况。本文的实验结果为进一步研究口腔金瓷修复体界面的优化设计提供了基础，同时也说明云纹干涉法对于双材料界面断裂行为的研究是有效的。     

A theory for stress-driven interfacial damage upon cationic-selective oxidation of alloys

Imagine a void at an interface, separating an outwardly growing oxide and a substitutional solid solution of two metallic elements A and B. Assume the metal interface oxidizes, but the void-free surface does not. Interdiffusion inside the metal, and misfit dislocation activities at the oxidizing interface, both generate a stress-free strain rate field. The compositional and material constraints in the presence of a non-oxidizing void give rise to a multi-axial tensile stress field, while a viscoplastic strain field arises to relax stress. The tensile stress at the interface enforces a concave curvature near the void tip through the continuity condition of the chemical potential. Atoms interflow along the void surface under the combined action of curvature, stress and composition gradients. They enter the metal/oxide interface and flow under the action of local stress, curvature and composition fields. The void grows. The stress at the interface relaxes, and the interface recedes partially and non-uniformly. Interfacial voiding upon cationic-selective oxidation is a long-standing topic in the world of thermal barrier coating and interconnect systems. This paper develops governing equations, within the alloy, for stress generation upon composition evolution and induced plastic strain. Governing equations at the interface and the void surface are next formulated to describe a moving boundary problem that accounts for the simultaneous void extension and interface recession. These governing equations are boundary conditions for the bulk formulation.     

Interface crack problems for mode Ⅱ of double dissimilar orthotropic composite materials

The fracture problems near the interface crack tip for mode Ⅱ of double dissimilar orthotropic composite materials are studied. The mechanical models of interface crack for mode Ⅱ are given. By translating the governing equations into the generalized bi-harmonic equations,the stress functions containing two stress singularity exponents are derived with the help of a complex function method. Based on the boundary conditions,a system of non-homogeneous linear equations is found. Two real stress singularity exponents are determined be solving this system under appropriate conditions about himaterial engineering parameters. According to the uniqueness theorem of limit,both the formulae of stress intensity factors and theoretical solutions of stress field near the interface crack tip are derived. When the two orthotropic materials are the same,the stress singularity exponents,stress intensity factors and stresses for mode Ⅱ crack of the orthotropic single material are obtained.     

Fracture analysis of mode-II crack perpendicular to imperfect bimaterial interface

The problem of a mode-II crack close to and perpendicular to an imperfect interface of two bonded dissimilar materials is investigated.The imperfect interface is modelled by a linear spring with the vanishing thickness.The Fourier transform is used to solve the boundary-value problem and to derive a singular integral equation with the Cauchy kernel.The stress intensity factors near the left and right crack tips are evaluated by numerically solving the resulting equation.Several special cases of the mode-II crack problem with an imperfect interface are studied in detail.The effects of the interfacial imperfection on the stress intensity factors for a bimaterial system of aluminum and steel are shown graphically.The obtained observation reveals that the stress intensity factors are dependent on the interface parameters and vary between those with a fully debonded interface and those with a perfect interface.     

Interface crack problems for mode II of double dissimilar orthotropic composite materials

The fracture problems near the similar orthotropic composite materials are interface crack tip for mode Ⅱ of double disstudied. The mechanical models of interface crack for mode Ⅱ are given. By translating the governing equations into the generalized hi-harmonic equations, the stress functions containing two stress singularity exponents are derived with the help of a complex function method. Based on the boundary conditions, a system of non-homogeneous linear equations is found. Two real stress singularity exponents are determined be solving this system under appropriate conditions about bimaterial engineering parameters. According to the uniqueness theorem of limit, both the formulae of stress intensity factors and theoretical solutions of stress field near the interface crack tip are derived. When the two orthotropic materials are the same, the stress singularity exponents, stress intensity factors and stresses for mode II crack of the orthotropic single material are obtained.     

Stress intensity factors for interface crack in finite size specimen using a generalized variational approach

A generalized variational approach together with eigenfunction expansion is applied to determine the stress intensity factors for interface crack in finite size specimen. Application is also made of the complex potentials such that a complex stress intensity factor with components corresponding to the Mode I and II stress intensity factors can be identified with one of the leading coefficients in the eigenfunction expansion. Obtained are the numerical values of the stress intensity factors for an interface edge crack in a bimaterial rectangular specimen. The outside boundary is subjected to uniform stress normal and parallel to the crack. Solutions are also obtained for the same crack aand specimen geoinetry is subjected to a pair of equal and opposite concentrated forces along the open end away from the edge crack. The third example pertains to the case of three-point bending where the centre concentrated load is directed along the interface dividing the two materials. Numerical results are obtained for four different combinations of the bimaterial specimen with an interface edge crack.     

Singular stress field near the edge of interface of bonded dissimilar materials with an interlayer

For bonded dissimilar materials, the free-edge stress singularity usually prevails near the intersection of the free-surface and the interface. When two materials are bonded by using an adhesive, an interlayer develops between the two bonded materials. When a ceramic and a metal are bonded, the residual stress develops because of difference in the coefficient of thermal expansion. An interlayer may be inserted between the two materials to defuse the residual stress. Stress field near the intersection of the interface and free-surface in the presence of the interlayer is then very important for evaluating the strength of bonded dissimilar materials.In this study, stress distributions on the interface of bonded dissimilar materials with an interlayer were calculated by using the boundary element method to investigate the effect of the interlayer on the stress distribution. The relation between the free-edge singular stress fields of bonded dissimilar materials with and without an interlayer was investigated numerically. It was found that the influence of the interlayer on the stress distributions was confined within a small area of the order of interlayer thickness around the intersection of the interface and the free-surface when the interlayer was very thin. The stress distribution near the intersection of the interface and the free-surface was controlled by the free-edge stress singularity of the bonded dissimilar materials without the interlayer. In this case, the interlayer can be called free-edge singularity-controlled interlayer. If a stress distribution on the interface is known for one thickness of an interlayer h, stress distributions on the interface for other values of h can be estimated.     

界面裂纹问题中的权函数方法

本文将Ｐａｒｉｓ等确定均匀材料中裂纹尖端应力强度因子的权函数方法推广应用到界面裂纹问题，给出了界面裂纹尖端附近或无限大体半无限界面裂纹问题的权函数的显式表达式。利用此权函数表达式可以很简便地求解界面裂纹尖端附近一些外来作用引起的应力强度因子，比如任意分布力、相变应变、位错和热等。作为一个算例，本文计算了界面一侧一个刃型位错引起的应力强度因子。