He and H sequential implantation induced surface blistering and the exfoliation of Si covered with an oxide layer

Si wafers with a 220 nm top oxide layer were sequentially implanted at room temperature with 40 keV He and 35 keV H ions at a fluence of 5×10¹⁶ /cm² and 1×10¹⁶ /cm² , respectively. Techniques of scanning electron microscopy, atomic force microscopy and cross-sectional transmission electron microscopy （XTEM） were used to characterize the thermal evolution of surface damage as well as defect microstructures. Surface blisters as well as the localized exfoliation （～0.42 μm in depth） have been observed for samples annealed at temperatures of 500℃ and above. XTEM observations reveal a variety of defect microstructures, including cavities, platelets, nanometer or micrometer sized cracks and dislocations. The platelets and cracks are mainly distributed at a depth of about 0.42 μm parallel to the sample surface, which are responsible for the occurrence of the observed surface features. The relationship between surface damage and defect microstructures is described in detail.     

He and H sequential implantation induced surface blistering and exfoliation of Si covered with oxide layer

Si wafers with a 220 nm top oxide layer were sequentially implanted at room temperature with 40 keV He and 35 keV H ions at fluence of 5× 10¹⁶/cm² and 1× 10¹⁶/cm², respectively. Techniques of scanning electron microscopy, atomic force microscopy and cross-sectional transmission electron microscopy (XTEM) were used to characterize the thermal evolution of surface damage as well as defect microstructures. Surface blisters as well as the localized exfoliation (～ 0.42 μm in depth) have been observed for samples annealed at temperatures of 500 ℃ and above. XTEM observations reveal a variety of defect microstructures, including cavities, platelets, nanometer or micrometer sized cracks and dislocations. The platelets and cracks are mainly distributed at the depth of about 0.42 μm parallel to the sample surface, which are responsible for the occurrence of the observed surface features. The relations between surface damage and defect microstructures are described in detail.     

He 离子注入引起的高纯钨硬化

完成了不同注量或温度下100 keV 的He 离子注入高纯钨的实验,并利用纳米压痕技术测量了材料的微观力学性能。所有注入样品的纳米硬度值都高于未注入样品的纳米硬度值。对于室温注入样品,随着注量的增加,样品抗弹性变形能力下降;当注量不高于5x1017 ions/cm2 时,钨的纳米硬度峰值随着注量的增加而增加;注量为1x1018 ions/cm2 的钨样品的纳米硬度峰值反而降低。高温注入样品的抗弹性变形能力优于室温注入样品的抗弹性变形能力;随着注入温度的增加,样品的平均纳米硬度值和弹性模量略有下降。分析讨论了He 注入钨硬化和抗弹性形变能力降低的可能原因。Tungsten has been selected as divertor materials in fusion reactors because of its high thermal conductivity,high melting point, low expansion coefficient and high threshold energy for sputtering etc. The paper presents the hardening behaviour of high pure tungsten by 100 keV He+ with different fluences from 5x1016 ions/cm2 to 1x1018ions/cm2 at room temperature, and with fluence of 1x1018 ions/cm2 at higher temperatures (400, 600 and 800 °C). The microscopic mechanical properties of these samples were investigated by nano-indentation technology. The results show that all of the implanted samples harden obviously. The reason for hardening may be that defects of interstitial dislocation loops or dense helium bubbles etc induced by helium implantation obstacle the movement of dislocation. The peak nanohardness of the samples increased with the fluences increasing when the fluence is not more than 5x1017 ions/cm2, while the nano-hardness value of the implanted sample with the fluence of 1x1018 ions/cm2 decreases and the nano-hardness changes little in the region of 50 nm to 200 nm from surface. For all the implanted samples with 1x1018 ions/cm2 at higher temperatures, their nano-hardness values are similar, but show a trend of decrease with increasing temperature.The reason may be the decrease of the defects’ density during implantation at higher temperatures. In addition, the capability of resisting deformation for the implanted tungsten reduces with increasing fluence and increases a little at higher temperatures.     

Study of the lateral distribution of neodymium ions implanted in silicon

Due to the need to reduce electronic device sizes,it is very important to consider the depth and lateral distribution of ions implanted into a crystalline target.This paper reports that Nd ions with energies of 200 keV to 500 keV and dose of 5×10 15 ions/cm 2 are implanted into Si single crystals at room temperature under the angles of 0,30,and 45,respectively.The lateral spreads of 200 keV-500 keV Nd ions implanted in Si sample are measured by Rutherford backscattering technique.The results show that the measured values are in good agreement with those obtained from the prediction of SRIM2010 codes.     

Co+离子注入单晶TiO2铁磁性来源与微结构研究

在室温下,将能量为80 keV, 注量分别为1×1016和1×1017ions/cm2的Co+离子注入到10 mm×10 mm×0.5 mm的单晶TiO₂样品。在氮气保护下, Co+离子注量为1×1017 ions/cm2时样品在温度为900 ℃的条件下退火30 min。 利用超导量子干涉仪 （SQUID）测量样品磁性, 并应用X射线衍射（XRD）和扩展边X射线吸收精细结构谱（EXAFS）研究Co+离子注入后样品的微观结构。 样品磁性测量结果表明:Co+离子注入后的样品具有室温铁磁性, 并且其饱和磁化强度的大小与Co+离子注量及样品是否经退火处理有关。 EXAFS研究表明: Co元素在Co+离子注量为1×1017ions/cm2的样品中主要以团簇形式存在;样品经退火处理后, Co团簇消失, 并发现Co部分替代TiO₂单晶中的Ti。Co+离子注入后, 在样品中形成Co团簇与否受离子注量的影响。 阐述了样品微观结构与铁磁性来源之间的关系。 At room temperature, monocrystalline plates of rutile (TiO₂) were implanted with cobalt ions of an energy of 80 keV to fluences of 1×1016 and 1×1017 ions/cm2 respectively . The 1×1017 ions/cm2 Co implanted samples were annealed in nitrogen at 900 ℃ for 30 min. The magnetic properties of Co implanted samples were measured with a superconducting quantum interference device magnetometer (SQUID) at room temperature. Furthermore, the X ray diffraction (XRD) and Extended X ray Absorption Fine Structure (EXAFS) were applied to investigate the structural and compositional properties of Co implanted samples. The magnetic measurements of samples showed that the size of the saturation magnetization of the Co implanted samples were related to the fluence of ions, and the saturation magnetization of the sample after annealed decreased significantly. The EXAFS measurements showed the presence of cobalt metallic clusters in the sample implanted to ion fluence of 1×1017 ions/cm2. The Co metallic clusters disappeared in the sample after annealed, and resulted in the oxidized Co, which is presumed to substitute into the Ti site. The formation of Co clusters or not was determined by the ion fluence. The relation between ferromagnetic behavior and microscopic structure of the Co implanted samples is discussed.     

Helium-Implantation-Induced Damage in NHS Steel Investigated by Slow-Positron Annihilation Spectroscopy

Evolutions of defects and helium contained defects produced by atomic displacement and helium deposition with helium implantation at different temperatures in novel high silicon （NHS） steel are investigated by a slow positron beam. Differences of the defect information among samples implanted by helium to a fluence of 1×1017 ions/cm2 at room temperature, 300°C, 450°C and 750°C are discussed. It is found that the mobility of vacancies and vacancy clusters, a recombination of vacancy-type defects and the formation of the He-V complex lead to the occurrence of these differences. At high temperature irradiations, a change of the diffusion mechanism of He atoms/He bubbles might be one of the reasons for the change of the S-parameter.     

Investigation of the lateral spread of erbium ions implanted in silicon crystal

The erbium ions at energy of 400 keV and dose of 5×10 15 ions/cm 2 were implanted into silicon single crystals at room temperature at the angles of 0,45 and 60.The lateral spread of 400 keV erbium ions implanted in silicon sample was measured by the Rutherford backscattering technique.The results show that the measured values were in good agreement with those obtained from the prediction of TRIM’98 (Transport of Ions in Matter) and SRIM2006 (Stopping and Range of Ions in Matter) codes.     

Effects of Helium and Oxygen Common Implantation in Silicon Wafer

Defect engineering for SiO2 precipitation is investigated using He-ion implantation as the first stage of separation by implanted oxygen （SIMOX）. Cavities axe created in Si by implantation with helium ions. After thermal annealing at different temperatures, the sample is implanted with 120 keV 8.0 ×1016 cm 2 0 ions. The Q ion energy is chosen such that the peak of the concentration distribution is centred at the cavity band. For comparison, another sample is implanted with O ions alone. Cross-sectionM transmission electron microscopy （XTEM）, Fourier transform infrared absorbance spectrometry （FTIR） and atomic force microscopy （AFM） measurements are used to investigate the samples. The results show that a narrow nano-cavity layer is found to be excellent nucleation sites that effectively assisted SiO2 formation and released crystal lattice strain associated with silicon oxidation.     

Incident particle range dependence of radiation damage in a power bipolar junction transistor

The characteristic degradations in silicon NPN bipolar junction transistors(BJTs) of type 3DD155 are examined under the irradiations of 25-MeV carbon(C),40-MeV silicon(Si),and 40-MeV chlorine(Cl) ions respectively.Different electrical parameters are measured in-situ during the exposure of heavy ions.The experimental data shows that the changes in the reciprocal of the gain variation((1/β)) of 3DD155 transistors irradiated respectively by 25-MeV C,40-MeV Si,and 40-MeV Cl ions each present a nonlinear behaviour at a low fluence and a linear response at a high fluence.The(1/β) of 3DD155 BJT irradiated by 25-MeV C ions is greatest at a given fluence,a little smaller when the device is irradiated by 40-MeV Si ions,and smallest in the case of the 40-MeV Cl ions irradiation.The measured and calculated results clearly show that the range of heavy ions in the base region of BJT affects the level of radiation damage.     

Irradiation Effects on the Retention of Hydrogen in Al_2O_3

Substantial defects are produced in Al_2O_3 by 4 MeV Au ion irradiation with a fluence of 4.4 × 10~(15) cm~(-2).Rutherford backscattering spectrometry/channeling and cross-sectional transmission electron microscopy methods are used to investigate the irradiation damage.The 190 keV H ions with a fluence of 1 × 10~(17) cm~(-2) are used for implanting pristine and Au ion irradiated Al_2O_3 to explore the irradiation damage effects on the hydrogen retention in Al_2O_3.The time-of-flight secondary ion mass spectrometry method is used to obtain the single hydrogen depth profile and ions mass spectra(IMS),in which we find that implanted hydrogens interacted with defects produced by Au ion irradiation.In IMS,we also obtain the hydrogen retention at a certain depth.Comparing the hydrogen retention in different Al_2O_3 samples,it is concluded that the irradiation damage improves the tritium permeation resistance property of Al_2O_3 under given conditions.This result means that Al_2O_3 may strengthen its property of reducing tritium permeation under the harsh irradiation environment in fusion reactors.     

铒掺杂富硅热化SiO2／Si发光薄膜的显微结构

利用金属蒸气真空弧(MEVVA)离子源将稀土元素Er离子掺杂到富硅热氧化SiO2/Si薄膜中.卢瑟福背散射(RBS)和X-射线电子能谱仪(XPS)分析表明,Er浓度可达原子百分数(x)～10,即Er的原子体浓度为～1021·     

氢钝化对硅纳米晶发光强度的影响

通过热蒸发方法在单晶硅衬底上沉积了SiO/SiO₂超晶格样品,在氮气保护下对样品进行高温退火,得到硅纳米晶/SiO₂超晶格结构。随后将该结构样品分别注入3.0×1014和3.0×1015 cm-2两种剂量的H+。通过对样品的光致发光光谱的分析发现,H+注入后未经过二次退火的样品发光强度急剧下降;二次退火后的样品,随着退火温度的升高,发光强度逐渐增强;注入足够剂量的H+,其发光强度可以远远超过未注入时的发光强度。研究表明,样品发光强度的变化取决于样品内部缺陷面密度的改变,而缺陷面密度是由氢离子的注入剂量和注入后再退火的温度等因素决定的。     

Room temperature magnetic properties of Fe and C implanted ZnO films

ZnO films prepared by radio frequency magnetron sputtering were singly or sequentially implanted with 120 keV Fe ions at a fluence of 5 × 10¹⁶ ions/cm² and 20 keV C ions at a fluence of 3 × 10¹⁵ ions/cm². Magnetic and optical properties as well as structures of the films have been investigated using various techniques. Magnetic measurements show that the as-deposited ZnO film presents room temperature ferromagnetism. Single Fe or C ion implantation has no contribution to enhancement in the film magnetism, while magnetic moment increases distinctly in the Fe and C ions sequentially implanted film. Results from structural measurements reveal that Fe nanoparticles are formed in the Fe singly implanted ZnO film. The post C implantation induces dissolution of Fe nanoparticles and promotes Fe atoms to substitute Zn atoms in the lattice. Based on the structural results, the effect of magnetic enhancement has been tentatively interpreted.     

离子辐照对单晶Si中预注入B原子扩散的影响

室温下使用MeV能量级Si,F和O离子对5keV B离子预注入后的n-型单晶Si(100)进行了辐照,应用二次离子质谱仪测试分析了掺杂物B原子的分布剖面及其变化.结果表明,高剂量Si,F和O离子的附加辐照可以抑制热激活退火中B原子发生的瞬间增强扩散.在相同的辐照条件下,Si近表面区域中SiO₂层的存在更有助于限制B原子的瞬间增强扩散.结合卢瑟福沟道背散射分析和DICADA程序计算对实验结果进行了讨论.     

Ar离子辐照非晶态合金表面发泡和针孔形成研究

150keV和195keVAr离子室温下辐照非晶态合金(Co₉₄Fe₄Cr₂)₇₈Si₈B₁₄,表表面发泡和溅射腐蚀是两种主要的表面损伤过程.针孔出现较表面发泡要晚,它的密度随剂量增加迅速地增加,并且在一定的辐照剂量时趋向饱和,这时,一种多孔粗糙的表面损伤结构形成.针孔的形成影响了表面发泡,导致了发泡密度随剂量增加急剧地减小.用溅射和气泡破裂解释了针孔形成和在高剂量时趋向饱和的原因.     

He注入单晶Si表面形貌的变化研究

沿Si的（100）面注入He离子, 能量为30 keV、 剂量为5×1016 ions/cm2。 注入后样品切成几块, 在真空炉中分别做退火处理, 退火温度从600 ℃到1 000 ℃, 退火时间均为30 min。 利用原子力显微镜研究了各个样品表面形貌的演化。 发现样品表面形貌与退火温度相关联。 假设在气泡中He原子与空位的比值很高, 导致样品内部存在高压的He泡, 从而使样品表面形貌发生变化。 探讨了在Si中He泡随退火温度的演化和He原子在材料中的释放机制及其对表面的影响。     

月球表面环境对Mo/Si多层膜光学特性的影响

研究了月球表面高温、强辐射的空间环境下Mo/Si多层膜的热稳定性和辐照稳定性。Mo/Si多层膜采用磁控溅射法镀制,将制备好的多层膜在100℃和200℃高温下加热,利用激光等离子体反射率计和X射线衍射仪(XRD)对加热前后的多层膜进行了测量。结果显示在200℃以内,多层膜反射率和中心波长没有显著变化,表现出良好的热稳定性。利用Monte Carlo方法模拟了质子在多层膜内造成的缺陷的分布和浓度分布。模拟显示,能量大的质子沉积在多层膜内部,造成的缺陷也集中在多层膜内部。用能量为60keV,剂量分别为3×1012 cm-2和3×1014 cm-2的质子对Mo/Si多层膜进行辐照实验。发现多层膜内部出现了烧蚀损伤缺陷及节瘤缺陷。结果表明能量相同时,辐照剂量越大对多层膜反射率影响越大。     

The investigation of ion implanted layers by scanning electron microscopy

SEM signals were used to image ion-implanted surfaces and to quantitatively analyze implanted layers. Silicon was used as substrate material for implantation, but some measurements on GaAs are also reported. Various ion species were implanted and the dependence of the signals upon fluence was studied. Electron backscattering and absorbed current were found to be influenced by the radiation damage rather than by the species of implanted ions. The degree of damage could be characterized by absorbed current measurements. The ion fluence necessary to produce amorphous layers was determined for N, P, and As in Si using this technique. This fluence was found to correspond to an energy deposition of 2.8×10²¹ keV/cm³. For the detection of very small amounts of implanted ions by characteristic X-rays, the electron energy must be fitted to the penetration depth of the ions under conditions maintaining reasonable excitation cross sections. The lowest value of the normalized detectability obtained in our measurements was 2.5×10¹³ Ions/cm² for 45 keV phosphorus.