铒离子注入碳化硅的射程和退火行为研究

用300—500 keV能量的铒(Er)离子注入碳化硅(6H-SiC)晶体中,利用卢瑟福背散射技术研究了剂量为5×10¹⁵ cm^-2 的Er离子注入6H-SiC晶体的平均投影射程R_p和射程离散ΔR_p,将测出的实验值和TRIM软件得到的理论模拟值进行了比较,发现R_p的实验值与理论值符合较好,ΔR_p的实验值和理论值差别大一些 关键词： 离子注入 投影射程和射程离散 退火行为 卢瑟福背散射技术     

菲涅耳深区散斑强度统计特性及演化

利用直透光波和高斯散斑场的叠加理论和基尔霍夫近似研究了菲涅耳深区散斑的构成,给出了菲涅耳深区散斑场及其强度概率密度和对比度的表达式.利用原子力显微镜测量的随机散射表面高度分布数据模拟菲涅耳深区不同散射距离处散斑,并计算绘出其强度概率密度和对比度曲线.理论与模拟相结合研究这两个统计函数的特征和直透光强所占比例的影响,以及它们随散射距离的演化规律.     

铒离子注入6H-SiC的横向离散研究

利用离子注入掺杂技术设计、制作半导体集成器件时,了解离子注入半导体材料的射程分布、射程离散和横向离散规律等是很重要的.用400 keV能量的铒(Er)离子分别与样品表面法线方向成0°,45°和 60°倾角注入碳化硅(6H-SiC)晶体中,利用卢瑟福背散射技术研究了剂量为5×10¹⁵ cm^-2 的400 keV Er离子注入6H-SiC晶体的横向离散.测出的实验值与TRIM98和SRIM 2006得到的理论模拟值进行了比较,发现实验值跟TRIM98和SRIM 关键词： 离子注入 6H-SiC 卢瑟福背散射技术 横向离散     

铒离子注入绝缘体上Si的射程分布研究

利用离子注入掺杂技术设计、制作半导体集成器件时,了解离子注入半导体材料的射程分布和横向离散规律等是很重要的.用200—500 keV能量的铒(Er)离子注入SOI(silicon-on-insulator,绝缘体上的硅)样品中,利用卢瑟福背散射(RBS)技术研究了剂量为2×1015cm-2的Er离子注入SOI的平均投影射程Rp和射程离散△Rp,把测出的实验值和SRIM软件得到的理论计算值进行了比较,发现平均投影射程Rp的实验值跟理论计算值符合较好,射程离散△Rp的实验值和理论计算值差别大一些.     

Investigation of the inhibiting outdiffusion of erbium atoms to a silicon-on-insulator surface after annealing at high temperature

The annealing behaviour of 400 keV Er ions at a fluence of 2×1015 cm-2 implanted into silicon-on-insulator(SOI) samples is investigated by Rutherford backscattering spectrometry of 2.1 MeV He2+ ions with a multiple scattering model.It is found that the damage close to the SOI surface is almost removed after being annealed in O2 and N2 atmospheres,successively,at ℃,and that only a small number of the Er atoms segregated to the surface of the SOI sample,whereas a large number of Er atoms diffused to a deeper position because of the affinity of Er for oxygen.For the SOI sample co-implanted with Er and O ions,there is no evident outdiffusion of Er atoms to the SOI surface after being annealed in N2 atmosphere at ℃.     

Investigation of the lateral spread of erbium ions implanted in silicon crystal

The erbium ions at energy of 400 keV and dose of 5×10 15 ions/cm 2 were implanted into silicon single crystals at room temperature at the angles of 0,45 and 60.The lateral spread of 400 keV erbium ions implanted in silicon sample was measured by the Rutherford backscattering technique.The results show that the measured values were in good agreement with those obtained from the prediction of TRIM’98 (Transport of Ions in Matter) and SRIM2006 (Stopping and Range of Ions in Matter) codes.     

Study of the lateral distribution of neodymium ions implanted in silicon

Due to the need to reduce electronic device sizes,it is very important to consider the depth and lateral distribution of ions implanted into a crystalline target.This paper reports that Nd ions with energies of 200 keV to 500 keV and dose of 5×10 15 ions/cm 2 are implanted into Si single crystals at room temperature under the angles of 0,30,and 45,respectively.The lateral spreads of 200 keV-500 keV Nd ions implanted in Si sample are measured by Rutherford backscattering technique.The results show that the measured values are in good agreement with those obtained from the prediction of SRIM2010 codes.