静态溶液中KDP籽晶长大的浮力对流模拟研究

采用有限容积法,对KDP籽晶在静态溶液中的生长过程进行了数值模拟,研究了籽晶长大过程中的形状变化,考察了体过饱和度和籽晶特征尺寸对籽晶表面过饱和度及剪切力的影响,重点分析了籽晶长大过程中的尺寸效应.结果表明,当籽晶的特征长度小于临界尺寸时,籽晶的生长速率随着晶体尺寸的增大而加快;而当籽晶的特征长度大于临界尺寸时,籽晶的生长速率随着晶体尺寸的增大而减慢.     

旋转半径对KDP晶体生长过程影响的数值模拟研究

相比传统KDP晶体同心旋转的生长方式,本文利用数值模拟的方法,针对不同旋转半径和不同籽晶摆放方式对KDP晶体生长过程中溶液流动和物质输运的影响进行研究,以寻找提高晶体表面过饱和度及其均匀性的方法.计算结果表明:随着旋转半径从0 cm增大到3 cm,晶面时均过饱和度整体也逐渐增大,柱面平均均方差逐渐减小,锥面平均均方差先增大后减小;当晶体摆放方式采用棱边迎流时,晶体表面时均过饱和度相比柱面迎流略有下降,但其平均均方差最小,有利于减少包裹体的产生.     

点状籽晶法生长DKDP晶体的研究

本文研究了影响溶液稳定性的因素,主要包括溶液的纯度、饱和点和过饱和度等,并对DKDP的点状籽晶法生长进行了初步研究.同时比较了不同生长速度生长的晶体质量.结果表明:经超细过滤的高纯度溶液稳定性有很大提高,而此时生长速度对晶体质量的影响不大.最后,获得了X、Y向生长速度达3.8mm/d的点状籽晶,生长出尺寸为44mm×44mm×48mm的高质量DKDP晶体,并对晶体生长的表面进行了微观观察,分析了DKDP晶体生长的微观机制.     

单晶硅外延生长晶化硅薄膜的研究

采用P型单晶硅片为衬底,并经混合酸溶液腐蚀抛光、清洗后,利用射频磁控溅射镀膜系统在其表面制备非晶硅薄膜;再结合快速光热退火工艺,于N2气氛下480℃退火30 min,得到晶化硅薄膜;利用光学金相显微镜、XRD衍射仪和拉曼散射光谱(Raman)仪对单晶硅衬底和晶化硅薄膜进行结构和性能表征.研究了混合酸溶液对单晶硅表面腐蚀效果、籽晶诱导外延生长晶化硅薄膜的物相结构和薄膜带隙.结果表明:采用混合酸溶液腐蚀后得到表面平整、光滑的单晶硅衬底;非晶硅薄膜经过快速退火后受籽晶诱导生成晶化硅薄膜,其晶相沿单晶硅衬底取向择优生长;随着非晶硅薄膜厚度从80 nm增加到280 nm,晶化后硅薄膜的表面粗糙度逐渐减小,晶化率从90.0;逐渐降低到37.0;;晶粒尺寸从6.65 nm逐渐减小到1.71 nm;带隙从1.18 eV逐渐升高到1.52 eV.     

籽晶台形状对PVT法同质外延生长氮化铝单晶初始生长的影响

借助专业晶体生长模拟软件FEMAG和自主开发的对流、传质、过饱和度及生长速率预测等有限元模块研究了物理气相传输法(PVT)同质外延生长氮化铝(AlN)单晶工艺时的初始传热及传质过程,并分析了不同形状籽晶台对生长室内的温度场、流场、过饱和度及生长速率的影响。温度场模拟结果表明籽晶台侧部角度改变可影响籽晶表面轴向及径向温度梯度,流场及传质模拟表明籽晶台侧部角度变化对籽晶台周边的传质有巨大影响。传质及过饱和度模拟结果表明,当籽晶台侧部角度为130°时,籽晶表面温度梯度较小且可以完全抑制籽晶台侧部多晶沉积,有利于通过同质外延工艺生长出无寄生、无裂纹的高质量氮化铝单晶锭。     

往复式电镀金刚石线锯切割单晶硅片特性研究

通过往复式电镀金刚石线锯切割单晶硅片实验,分析了切片表面的微观形貌特点,研究了锯丝速度与进给速度对硅片的表面粗糙度、总厚度偏差(TTV)、翘曲度与亚表面损伤层厚度(SSD)的影响规律.结果表明:线锯锯切时材料以脆性模式去除,锯切表面的微观形貌呈现部分沟槽与断续划痕,并存在大量凹坑;锯丝速度增大,进给速度减小,表面粗糙度与SSD减小;锯丝速度增大,进给速度增大,硅片的翘曲度也随之增大;硅片TTV值与锯丝速度和进给速度的匹配关系相关.     

K_(1-x)(NH_4)_xHV_2PO_4混晶的籽晶法生长与结构表征

在KDP为主的不同配比混合溶液中,以KDP为籽晶利用溶液降温法生长出了KADP混合晶体。研究了ADP晶体的浓度对所生长的KADP晶体的影响,并采用XRD和FT-IR对KADP晶体进行了表征。实验发现,随着生长溶液中ADP浓度的增加,KDP籽晶的成锥区越来越长,KADP晶体的Z向生长速度明显减小,KADP晶体晶胞参数c增加,而a基本没有变化。用KDP籽晶生长出KADP透明单晶时,混合溶液中ADP晶体的最大浓度约为8mol%。     

有机添加剂对KDP晶体生长及其光学性质影响的研究

本文研究了乙二胺四乙酸(EDTA)和氨三乙酸(ATA)对KDP晶体生长及其光学性质的影响,其中,后者是首次报导,两者表现相似的影响.随着添加剂含量的增大,晶体生长速度先增大后减小;添加添加剂溶液所生长的KDP晶体在紫外波段的透过率提高;研究还发现,270 nm处晶体透过率的主要影响因素包括过饱和度以及Fe3+和Cr3+含量;有机添加剂的添加和退火对电导率影响微弱.     

过饱和度对KDP晶体生长与光学性能的影响研究

在不同过饱和度的溶液中生长了KDP晶体,对生长晶体的透过率,光散射和激光损伤阈值进行了表征.研究了不同过饱和度对KDP晶体生长及光学性能的影响.实验表明:KDP晶体可以在高过饱和度(σ＞3;)溶液中实现快速生长,生长速度可大于10 mm/d;但随着溶液过饱和度的增加,KDP晶体生长溶液的稳定性降低,晶体容易出现包藏、开裂和添晶等缺陷,晶体的光学性能也随之降低.     

晶体生长机制和生长动力学的蒙特卡罗模拟研究

采用动力学蒙特卡罗方法,对在完整光滑界面上低过饱和度溶液中的晶体生长机制和动态过程进行计算机模拟,得到了晶体生长速率与溶液过饱和度之间的关系以及晶体生长的表面形态.对以二维成核为主要生长机制的动力学生长规律进行分析,发现了二维成核生长的生长死区以及单核生长转变为多核生长时的过饱和度临界值,讨论了热粗糙度、表面扩散、台阶平均高度以及表面尺寸对晶体平均生长速率的影响.     

钛合金基体上TiN涂层的残余热应力分析

采用有限元方法分析TiN涂层的残余热应力,研究钛合金基体和涂层厚度对TiN涂层热应力分布的影响.结果表明:基体内以拉应力为主,涂层内以压应力为主,在明锐界面靠近自由边界处出现了剪切应力奇异场;当涂层厚度增加时,涂层的径向应力逐渐减少,而剪应力先增加随后又趋于平稳;涂层的径向应力随基体厚度增加而增加,当基体厚度超过1 mm时增加变得平缓.     

Role of marangoni tension effects on the melt convection in directional solidification process for multi-crystalline silicon ingots

We carried out global simulations to investigate the marangoni tension effect on the thermal and flow fields in the silicon melt of the directional solidification process for multi-crystalline silicon ingots. The argon flow rate was varied to provide different solidification conditions and to change the relative values between the argon shear stress and the marangoni tension at the melt free surface. We found that the marangoni tension together with the shear stress mainly influences the upper layer melt convection while the thermal buoyancy force dominates the bulk flow of the melt. At low argon flow rates, the argon shear stress can be neglected and the marangoni tension alone enhances the melt convection intensity near the gas–melt–crucible triple junction point. The marangoni tension is so weak that it cannot modify the melt flow pattern in this case. For medium flow rate, the marangoni tension can significantly weaken the shear stress effect at the outer part of the melt free surface, leading to a distinctive flow pattern in the silicon melt. With further increase in argon flow rate, the shear stress sharply increases and dominates the upper layer melt flow, limiting the marangoni tension effect to the triple point. The numerical results are helpful for better understanding and controlling of the directional solidification process for high quality multi-crystalline silicon ingots.     

Nematic and Cholesteric PDLC Elaborated under Shear Stress

Abstract

The properties of nematic and cholesteric Polymer Dispersed Liquid Crystal (PDLC) with ellipsoidal droplets are reported. The shape of the droplets are modified by a shear stress during the preparation. Different values of the shear stress were used which permit an ellipticity ratio modification by a factor 10. The electro-optical properties are measured for different types of samples and compared with theoretical previsions: transmission or reflection under voltage, threshold voltage, response times. We also describe the preparation of the sample, the experimental apparatus used for the shear stress, and the expected theoretical quantities like response times. When the liquid crystals are nematics, we obtain an increase of the threshold voltages, as predicted. The relaxation time decreases with increasing deformation but the diminution is not as great as predicted. When the liquid crystals are cholesterics, the high deformations induce polygonal fields, which strongly modify the electro-optical properties of the micro-composite. The threshold voltages and response time at applied voltage decrease whereas the relaxation time is increasing.     

Work‐hardening characteristics of Zn‐Ti alloy single crystals

Shear stress – shear strain curves of 0.14 at.%Ti alloyed Zn single crystals were measured in compression at different temperatures and shear strain rates. The work‐hardening coefficient for basal slip increases with decreasing temperature and increasing shear strain rate. The work‐hardening characteristics are compared with those reported for Zn single crystals with different constituents and purities. It is discussed with respect to the interaction of dislocations with dislocations, vacancies, vacancy agglomerates and solute atoms. (© 2010 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Mechanical properties and adhesion of hydrated glass surface layers

This paper reviews results for interfacial adhesion and fracture of silicate glasses that demonstrate the effect of hydrated glass surface layers on the mechanical properties of glass. First, it is shown how the generation of hydrated surface layers formed on alkali borosilicate glasses can control crack propagation rates. Crack growth data, solution analysis and surface stress measurements are used to support a fracture model that involves the generation of surface stress on the crack walls behind the crack tip. A fracture mechanics based model is used to show that stressed layers can contribute to the crack tip stress intensity in a way that either increases or decreases the rate of crack propagation. In the case of alkali containing silicate glasses, tensile stresses formed on the crack walls increase the crack tip stress and contribute to the formation of a low velocity plateau in the stress intensity vs. crack velocity curve. Second, fracture mechanics test techniques are used to examine the adhesive bond formed between hydrated surface layers and bulk silicate glass. The adhesive bonds formed by sol-gel precursors composed of colloidal silica, hydrolyzed organosilanes and alkali silicate solutions are compared to determine the mechanism of interfacial bonding to dense silica substrates. The formation of siloxane bonds across the interface depends upon the nature of the silicate polyanions in solution. For the case of soluble alkali silicate derived films, heat treatments at temperatures as low as 200°C can result interferfacial adhesion energies as large as the fracture energy of silica glass. These results have important implications to the aging and repair of surface damage in glass as well as the adhesion of sol-gel derived thin films.     

The Influence of Substances Reducing the Surface Energy of Naphthalene Single Crystals on Plastic Flow

The effect of surface active substances on plastic flow of naphthalene single crystals is considered. The role of normal and shear stresses is revealed. Rates of single crystals flow in different glide systems under constant stress are compared. The stress of plastic flow in single crystals can be decreased in active media by as much as 50%.     

TiAl过渡层对电弧离子镀沉积TiAlN膜层的影响

利用电弧离子镀,在不锈钢和SiCP增强2024铝基复合材料基底上沉积TiAlN薄膜.结果表明:TiAlN膜层直接沉积在不锈钢基底上,膜层呈[111]择优取向;然而,TiAlN膜层沉积在不锈钢基底的TiAl过渡层上,膜层呈[220]方向择优取向;并且随着过渡层从零开始增厚,TiAlN膜层的织构系数T(111)逐渐减小,而T(200)逐渐增大,但膜层一直以[220]方向择优取向,内应力的存在可能是膜层产生[220]方向择优取向的原因.在复合材料基底TiAl过渡层上沉积,随着负脉冲偏压的增加,TiAlN膜层的择优取向由[111]向[200]转变.在不锈钢基底上,没有TiAl过渡层时,膜层表面相对光滑,大颗粒较少;有了TiAl过渡层,表面大颗粒较多;TiAl过渡层不同沉积时间对膜层表面影响不大,颗粒尺寸相差无几.没有TiAl过渡层时,膜层结合强度很差,有了TiAl过渡层,结合强度明显增加,但结合强度的大小随过渡层沉积时间(厚度)变化.     

Microstructure and stored energy evolutions during rolling of Cu60Zr20Ti20 bulk metallic glass

The microstructure and stored energy of Cu₆₀Zr₂₀Ti₂₀ bulk metallic glass rolled at cryogenic temperature in a wide strain rate range 1.0 × 10^?4 ? 5.0 × 10^?1 s^?1 have been investigated. As the specimen is rolled to be thinner, the stored energy first increases linearly, and then saturates above a critical thickness reduction at lower strain rates, or decreases at high strain rates. At the initial stage of rolling, no phase transformation except shear bands appears in the glass. Phase transformation occurs only when the specimen is severely deformed at strain rates higher than 1.0 × 10^?4 s^?1. As strain rate increases, the critical strain for the stored energy to saturate increases, but the critical strain for phase separation to occur decreases, and meanwhile the type of the phase transformation changes from phase separation to nanocrystallization. The stored energy does not change with the occurrence of phase separation, but decreases due to nanocrystallization. It is proposed that coalescence of more free volume in shear bands into nano-voids should be principally responsible for the saturation of the stored energy, which balances the results from the increase in shear band number at higher strains.     

基于液滴外延法的Al(In)纳米结构在GaAs(001)的形成机制

采用液滴外延法在GaAs(001)衬底上同时沉积In、Al液滴形成纳米结构,利用原子力显微镜(AFM)对实验样品进行形貌表征,并通过X射线光电子能谱(XPS)与扫描电子显微镜分析In、Al组分比样品表面元素分布。实验结果显示,混合沉积后的表面InAlAs纳米结构密度随着In组分的降低而降低,而单个纳米结构的尺寸变大。SEM与XPS测试结果证明表面的In并没有因为衬底温度过高而全部偏析。根据实验结果推测,In&Al液滴同时沉积到表面形成InAl混合液滴。当液滴完全晶化后纳米结构中心出现孔洞,而产生这一现象的主要原因是液滴向下刻蚀。     

95氧化铝瓷凝胶注模浆料的制备及氧阻聚的抑制

本文研究95氧化铝瓷凝胶注模成型中浆料的流变性.分析了pH值、分散剂用量、球磨时间对浆料粘度的影响.采用L_9(3~4)正交试验,制备出固相含量为58 vol;,粘度为110 mPa · s的95氧化铝瓷浆料.针对表面氧阻聚,本文通过表面改性的方法,既不增加坯体内有机物的含量,也不降低坯体的强度,使坯体表面不起皮、不剥落.结果显示:通过坯体性能参数和显微结构的比较,凝胶注模的95氧化铝瓷坯体性能均优于热压铸成型的坯体性能.