AbstractThe nano-sized SQS based polyimides have been successfully synthesized with different oxide groups such as phosphineoxide, sulfone and siloxane as in the backbone of polymer. The SQS-Polyimide nanocomposites prepared through the condensation process using amine and epoxy functionalized SQS as precursor. The presence of SQS in the resulting polyimide nanocomposites was confirmed by FTIR and XRD analyses. The presence of SQS and greatly enhances the char yield to an extent of 16% when compared to that of neat polyimide. The incorporation of SQS into polyimide lowered the value of dielectric constant from 3.31 to 2.09 at 1?MHz and the value of thermal expansion coefficient from 56.6 to 42.7?ppm/K. The composites sample prepared using 20?wt% SQS possess the lowest value of dielectric constant and CTE value. The hydrophobic nature of SQS contributes to lower the water uptake of composites from a value of 2.76 (neat polyimide) to 2.42 for POS-PI containing 20?wt% SQS. Further, the SQS polyimide composite systems possess the enhanced values of thermal stability and glass transition temperatures according their percentage weight. Data obtained from different studies, it is suggested that these hybrid composites can be used as an effective insulation materials for high performance microelectronics applications. 相似文献
Polyimide nanocomposites having low-k and UV shielding properties have been developed using fluorine functionalized graphene oxide and bis(quinoline amine) based polyimide. The polyimide was synthesized using bis(quinoline amine) and pyromellitic dianhydride at appropriate experimental conditions, and its molecular structure was confirmed through various spectral analysis such as FTIR and NMR. The polyimide (PI) composites were prepared using bis(quinoline amine), pyromellitic dianhydride, and separately filled with 1, 5, 10 wt% of fluorinated graphene oxide (FGO) through in situ polymerization. The polymer composites were characterized using thermo gravimetric analysis (TGA), X-ray powder diffraction (XRD), and scanning electron microscopy (SEM). In addition, the water contact angle, dielectric behavior, and UV–Vis shielding behavior of FGO/PI composites were evaluated. The value of the water contact angle of the polyimide was increased with increment of FGO in the polyimide matrix. The highest water contact angle of polyimide composites observed 108° was obtained for 15 wt% FGO reinforced polyimide composite. The value of the dielectric constant for neat, 1, 5, and 15 wt% FGO reinforced polyimide composites was obtained as 4.5, 3.7, 2.6, and 2.0, respectively. It is also observed from by UV–Vis spectroscopy analysis that the FGO reinforced polyimide composites have good UV shielding behavior. 相似文献
New polyimide (PI) nanocomposites containing two different amounts of MWCNT (PI/MWCNT) were prepared via in situ polymerization technique. Transmission electron microscopy showed that MWCNT was exfoliated in the polymer matrix, resulting in well-dispersed morphologies at 1 and 3 mass% MWCNT contents. The effects of multiwalled carbon nanotubes (MWCNT) on the thermal and flammability properties of new PI derived from 1,3-bis[4,4′-aminophenoxy]propane and biphenyl dianhydride were investigated by thermogravimetric analysis (TG) in nitrogen and air atmosphere, differential scanning calorimetry, and microscale combustion calorimeter (MCC). The PI/MWCNT nanocomposites were electrically conductive with maximum conductivity obtained at 3 mass% MWCNT, which is favorable for many potential applications. TG results showed that the addition of MWCNT resulted in a substantial increase of the thermal stability and char yields of the nanocomposites compared to those of the neat PI. Flame retardancy of the nanocomposites was significantly improved in the presence of MWCNT. 相似文献
Functional polyimides (PIs) having some desired properties, for example, organo-solubility, chemical reactivity, crosslinkable feature, and high transparency in visible region, are attractive for specific applications. This work reports an effort to integrate the above-mentioned properties in one polyimide through introduction of Meldrum's acid (MA) moieties to polyimide chains with using a MA-containing diamine (MADA) as a monomer. The polyimide prepared with MADA and 4,4′-(hexafluoroisopropylidene) diphthalic anhydride (6FDA) (PI[MADA-6FDA]) has a number-averaged molecular weight of 56,800 g mol−1, shows good solubility in tetrahydrofuran and aprotic high polar solvents, and exhibits post-reactivity/crosslinkability through MA-mediated ketene chemistry. Crosslinked PI(MADA-6FDA) film shows a glass transition temperature of 289°C, a dielectric constant of about 2.78, and high flexibility bearing a near-180° bending. The MA-mediated ketene chemistry contributes to in situ building up covalent linkages between PI chains and silica nanoparticles (SNPs) in preparation of PI/SNPs nanocomposite films (NCF). Formation of the PI/SNPs NCFs enhances the thermal and mechanical properties, reduces the dielectric constants, and increases the transparency. The properties of the MA-functionalized PI are attractive for further studies on their applications. 相似文献
Polyimides incorporating the ferrocene unit were prepared by in situ curing of poly (amic acid) macromolecules with ferrocene, for the molecular-level design of low dielectric constant (low-κ) materials. The effects of ferrocene on dielectric properties of polyimide are investigated in detail in this study. Ferrocene containing polyimides exhibit a number of desirable properties including low-water absorption and admirable thermal stability. Systematic studies demonstrate that proper insertion of ferrocene into a polyimide backbone can give rise to a reduction in the material's dielectric constant. All composites were subjected to DSC measurements for the purpose of examining Tg from all composition. Scanning electron microscopy (SEM), X-ray diffraction (XRD) and the other conventional techniques were used for structural characterization. 相似文献
In this work, the influence of atmospheric-pressure CHF(3)/Ar plasma treatment on surface dielectric properties of polyimide films was investigated using X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM), and contact angle measurements. The dielectric characteristics of the films were studied using a dielectric spectrometer. From the results, it was found that the plasma treatment introduced fluorine functional groups onto the polyimide surfaces. F 1s/C 1s ratios of the polyimides were enhanced with the increase of plasma treatment time. Consequently, the fluorine groups led to a decrease of the surface free energy and dielectric constant of the polyimide films, which can largely be attributed to the decrease of the deformation polarizability or London dispersive component of surface free energy of the solid surface studied. 相似文献
A series of plasma-modified carbon nanotubes with maleic anhydride (mCNT) based on polyimide (mCNT/PI) nanocomposites were prepared by a two-step method. The mCNT/PI nanocomposites exhibit excellent thermal properties owing to mCNT and its good dispersion in the polyimide matrix. The TEM patterns were proved to show dispersed behavior of mCNT in the PI matrix. By using thermogravimetric analysis (TGA), thermogravimetric with infrared spectra (TGA-IR), we discuss the kinetic behavior during the degradation of nanocomposites. Then Ozawa and Kissinger's theorems were calculated based on the relationship between activation energy and mCNT content. 相似文献
Thermosetting resin matrix is the key component of advanced wave-transparent composites,where low dielectric constant,excellent processability,high thermal stability,as well as good bonding ability are required for resins.Herein,we prepared a series of phenylethynyl terminated polyimide(PI)resins by grafting amine-functionalized hyperbranched polysiloxane(HBPSi)to PI chains during the in situ polymerization.The effects of HBPSi on the processability of oligomers,molecular packing,thermal stability,dielectric property and bonding ability to reinforce Kevlar fibers of the cured PI/HBPSi composite resins have been examined in detail.The dielectric constants of the cured composite resins were greatly reduced from 3.29 to 2.19 without compromising its processability and thermal stability.Meanwhile,the 10 wt%HBPSi-containing PI resin demonstrated better bonding ability to reinforce fibers with the interfacial shear strength(IFSS)of 37.64 MPa,compared with that of neat PI-6 matrix(27.34 MPa),and better adhesion to metal with the lap shear strength of 10.48 MPa,50%higher than that of neat resin PI-6(6.98 MPa).These resultant PI/HBPSi composite resins exhibit excellent comprehensive properties,indicating their great potential as low-dielectric constant resin matrix in radar radome. 相似文献
Summary: This investigation presents a simultaneous and convenient approach to produce a high‐performance polyimide with a low dielectric constant by introducing the octa‐acrylated polyhedral oligomeric silsesquioxane (methacrylated‐POSS) into a polyimide matrix to form polyimide semi‐interpenetrating polymer network (semi‐IPN) nanocomposites. The differential scanning calorimetry (DSC) and Fourier‐transform infrared (FT‐IR) results indicate that the self‐curing of methacrylated‐POSS and the imidization of polyamic acid (PAA) occurs simultaneously. The morphology of a semi‐IPN structure of polyimide/POSS‐PI/POSS nanocomposites with POSS nanoparticles embedded inside the matrix is elucidated. The POSS particles are uniform and are aggregated to a size of approximately 50–60 nm inside the polyimide matrix. The interconnected POSS particles are observed at high POSS content. The structure is highly cross‐linked, so the PI/POSS nanocomposites have an enhanced glass transition temperature. The high porosity of the PI/POSS nanocomposites markedly reduces the dielectric constant of PI because of the nanometer‐scale porous structure of POSS.
FT‐IR spectra of the various compounds of A) methacrylate‐POSS before curing, B) methacrylate‐POSS after curing, C) PAA containing 15 wt.‐% POSS, and D) PI/POSS containing 15 wt.‐% POSS. 相似文献
A novel method for the preparation of an asymmetric fluorinated aromatic diamine, 3,4′-bis(4-amino-2-trifluoromethylphenoxy)-benzophenone was investigated. This new diamine containing trifluoromethyl side group was synthesized from the nucleophilic substitution reaction of 2-chloro-5-nitrobenzotrifluoride and 3,4′-dihydroxybenzo phenone in the presence of potassium carbonate, followed by catalytic reduction with SnCl2·6H2O and concentrated hydrochloric acid. This novel diamine was used to react with different commercially available aromatic tetracarboxylic dianhydrides to prepare polyimides via thermal or chemical imidization. The polyimide properties such as inherent viscosity, solubility, thermal and surface properties were investigated to illustrate the contribution of the trifluoromethyl group and the asymmetry structure of the polyimide. The polyimides obtained had good thermal stability and the glass transition temperature values ranged from 225 to 267 °C. All of these novel polyimides held 10% weight loss at the temperature above 543 °C in air and left more than 47% residue even at 800 °C in nitrogen. The inherent viscosities of the obtained polyimides were above 0.73 dL/g and were easily dissolved in both polar, aprotic solvents and some low-boiling-point solvents. Moreover, these PI films had dielectric constants of 2.94-3.53 (1 kHz), with moisture absorption in the range of 0.07-0.34 wt%. In comparison of the PIs (5) series with the analogous symmetric PIs (6) series based on 4,4′-bis(4-amino-2-trifluoromethylphenoxy)-benzophenone, the (5) series revealed better solubility, low dielectric constant and moisture absorption. 相似文献
Four different types of cross-linked polyimides based on 4,4-diphenylmethane diisocyanate (MDI) were prepared by the reaction of different types of conventional poly(amic acid) intermediates with MDI as a cross-linking agent. Subsequently, they were thermally imidized in order to obtain corresponding cross-linked polyimide structure. The results of FTIR-ATR showed that MDI can effectively react with carboxylic acid groups of PAA to form cross-linked polyimide films. TGA, FTIR-ATR and SEM analyses were carried out for characterization of cross-linked polyimide (CPI) films. Moreover, the electrical properties such as dielectric breakdown strength, dielectric constant, I-V characteristics and loss factor of MDI based cross-linked polyimides have been checked. In addition, some physical properties such as water uptake, adhesion, hardness and solubility properties of the films were investigated.The results showed that all CPI films have good insulating properties such as high dielectric breakdown voltage, low loss factor (tan δ), leakage density and excellent physical properties. 相似文献
ABSTRACTThree wholly, semi aromatic and aliphatic-aromatic polyimides containing bis(phenoxy) naphthalene, bis[(phenoxy) phenyl] propane and bis(phenoxy-methyl) cyclohexane segments by the two-step procedure from 2, 7-bis(4-aminophenoxy) naphthalene (BAPON), 2, 2-bis[4-(4-aminophenoxy)phenyl]propane (BAPOP), 1, 4-bis (4-aminophenoxy methyl) cyclohexane (BAPMC) as a diamine and 4,4′-carbonyldiphthalic anhydride (CDPA) were prepared. The first step of this procedure including ring-opening polyaddition in a polar solvent to give poly(amic-acid)s, second step containing cyclodehydration reaction to form polyimides. Synthesized monomer and polyimides were characterized by FT-IR, 1H NMR spectroscopy and elemental analyses (CHN) that obtained results gave the most powerful evidence. The polyimide synthesized from BAPON was characterized as semi-crystalline, whereas the other polyimides showed amorphous patterns by the x-ray diffraction studies. The inherent viscosity was ranging between 0.87–1.01 dL/g. Tensile strength, initial moduli, and elongation at break of the polyimide films ranged from 88–117 MPa, 1.98–2.32 GPa, and 5–8%, respectively. Thermogravimetric analysis in nitrogen atmosphere shows that these polymers having good stability, so 10% weight will be lost in the range of 500–630°C. The point of polyimide with BAPMC segment, is “adding of good thermal stability and processability” lower moisture absorption and dielectric constant (0.75% and 2.90). 相似文献