HF酸刻蚀提升熔石英亚表面划痕抗损伤性能的机理

用HF酸刻蚀熔石英元件,研究刻蚀对元件后表面划痕的形貌结构及损伤性能的影响,探索损伤阈值提升的原因.时域有限差分算法理论计算结果表明:对于含有50nm直径氧化锆颗粒的划痕,对入射光调制引发场增强的最大值是入射光强的6.1倍,且最强点位于划痕内部氧化锆颗粒附近,而结构相同但不含杂质的划痕引发的最大场增强为入射光强的3.6倍,最强区位于划痕外围;HF酸刻蚀能够有效去除划痕中的杂质,改变划痕结构,增加其宽深比值,经刻蚀的划痕对入射光调制引发场增强降低到入射光强的2.2倍.实验结果表明,经过深度刻蚀的划痕初始损伤阈值较刻蚀之前提高一倍多;光热弱吸收测试仪测试刻蚀后划痕对1 064nm激光的吸收最大值仅为230ppm.HF酸刻蚀同时可以提升元件整体损伤阈值,由于元件上无缺陷区域损伤阈值随刻蚀的深入先增加后降低,因此HF酸刻蚀应进行到元件损伤阈值提升到最大值为止.     

HF酸刻蚀提升熔石英亚表面划痕抗损伤性能的机理

用HF酸刻蚀熔石英元件,研究刻蚀对元件后表面划痕的形貌结构及损伤性能的影响,探索损伤阈值提升的原因.时域有限差分算法理论计算结果表明:对于含有50 nm直径氧化锆颗粒的划痕,对入射光调制引发场增强的最大值是入射光强的6.1倍,且最强点位于划痕内部氧化锆颗粒附近,而结构相同但不含杂质的划痕引发的最大场增强为入射光强的3.6倍,最强区位于划痕外围;HF酸刻蚀能够有效去除划痕中的杂质,改变划痕结构,增加其宽深比值,经刻蚀的划痕对入射光调制引发场增强降低到入射光强的2.2倍.实验结果表明,经过深度刻蚀的划痕初始损伤阈值较刻蚀之前提高一倍多;光热弱吸收测试仪测试刻蚀后划痕对1 064 nm激光的吸收最大值仅为230 ppm.HF酸刻蚀同时可以提升元件整体损伤阈值,由于元件上无缺陷区域损伤阈值随刻蚀的深入先增加后降低,因此HF酸刻蚀应进行到元件损伤阈值提升到最大值为止.     

熔石英元件HF刻蚀的实验研究

为深入了解熔石英元件化学刻蚀过程,研究了HF刻蚀反应机理、HF刻蚀工艺参数以及刻蚀对表面质量的影响规律。通过控制变量法,获得刻蚀速率随HF浓度、刻蚀温度以及NH4F浓度的变化规律。对刻蚀不同深度后的元件表面粗糙度、形貌、杂质含量以及激光损伤阈值进行了检测,实验结果表明:刻蚀速率受多种因素共同影响,其中HF浓度的促进作用最为显著;刻蚀后的熔石英表面形貌复杂,有横向、纵向、拖尾等形式的划痕,以及坑点、杂质等缺陷,其中横向划痕和纵向划痕占据了缺陷部分的主体,主要杂质铈元素随刻蚀时间的增长不断减少;激光损伤阈值测量实验表明,通过HF刻蚀将元件损伤阈值提高了59.6%。     

超声波辅助酸蚀提高熔石英损伤阈值

为了提高熔石英元件表面抗激光损伤阈值,利用超声波辅助HF酸研究平滑光学元件表面缺陷形貌和去除刻蚀后残留物效果,通过扫描电子显微镜电镜和原子力显微镜记录表面形貌结构,以及单脉冲激光辐照测试抗损伤阈值确定实验参数。研究表明,超声波场的引入能催化HF酸的刻蚀速率、提高钝化效果并且更易剥离嵌入的亚μm级杂质粒子。经过实验测试,获得了熔石英类元件相匹配的超声辅助HF酸刻蚀实验参数,研究结果对应用超声波辅助HF酸研究熔石英表面抗激光损伤有重要意义。     

光纤微缺陷的激光检测方法

针对光纤微缺陷检测问题,提出了一种基于激光的光纤微缺陷检测方法,分析了光纤微缺陷的基本结构以及激光检测法的原理,并以此搭建了实验装置,进行了缺陷检测实验.实验中用准直氦氖激光束横向入射光纤,在光屏上得到光纤前向散射图样的分布图像,然后对图像进行处理.通过与显微镜观察法的实验结果比较,发现激光检测方法可有效地进行缺陷检测,其检测结果与显微镜直接观察法一致,可以作为光纤拉制后、涂覆层前的缺陷复测.     

HF酸腐蚀提高K9基板损伤阈值

针对K9玻璃基板的HF酸化学腐蚀工艺开展研究,标定了40%和2%高低两种体积分数的HF酸的腐蚀速率;分析了基板表面形貌随腐蚀深度的变化规律;研究了腐蚀时间、HF酸体积分数、超声波工艺对激光损伤阈值的影响,提出了能够有效减少损伤敏感的氟硅盐沉淀、提高损伤阈值的优化腐蚀清洗工艺流程。采用优化的腐蚀清洗工艺流程进行了实验验证,结果表明用体积分数为2%的HF酸在高温和超声波条件下腐蚀90s后,测得1064nm波长激光作用下K9基板抗激光损伤阈值提高了75%。     

CO2激光对熔石英表面小尺寸损伤的修复

 利用10.6 μm的CO₂激光对不同直径的点状损伤和不同宽度的划痕进行了修复。经过波长351 nm的紫外激光考核发现,对于直径小于80 μm的点状损伤和对于宽度小于40 μm的划痕,随着损伤点尺寸和划痕宽度的增加,修复后阈值提高程度逐渐降低。划痕的宽度在达到40 μm以后修复效果非常微弱。修复过程中,由于作用时间较短及温度分布不均产生了热应力导致样片损伤以后产生径向裂痕,后续的紫外激光会使裂痕明显扩展。当样品被置于高温退火炉内退火3 h以后,应力导致开裂的现象得到了解决。     

酸蚀与紫外激光预处理结合提高熔石英损伤阈值

采用HF酸刻蚀和紫外激光预处理相结合的方式提升熔石英元件的负载能力,用质量分数为1%的HF缓冲溶液对熔石英刻蚀1~100 min,综合透过率、粗糙度和损伤阈值测试结果,发现刻蚀时间为10min的熔石英抗损伤能力最佳。采用355 nm紫外激光对HF酸刻蚀10 min的熔石英进行预处理,结果表明:紫外预处理能量密度在熔石英零损伤阈值的60%以下时,激光损伤阈值单调递增;能量到达80%时,阈值反而低于原始样片的损伤阈值。适当地控制酸蚀时间和紫外激光预处理参数能有效提高熔石英的抗损伤能力。     

管板式大功率横流CO2激光横模测量及数值模拟

为了提高激光稳定性和激光加工质量,实验测量了大功率横流CO2激光横模,并理论分析了横模形成机理。针对大功率横流CO2激光器管板式电极结构,由麦克斯韦方程给出电场的横向分布,并通过数值计算得到了激光强度的横向分布。实验结果与数值模拟得到的激光能量分布基本一致。结果表明,在给定放电电压条件下,电极结构和气体流动速率决定了激光横模峰值大小,激光峰值的横向位置取决于气体流动的速率。     

熔石英亚表面划痕激光诱导损伤阈值实验研究

 用原子力显微镜和光学显微镜观测酸蚀后熔石英亚表面划痕，并根据形貌特征将其分为Boussinesq-point-force crack(BPFC)、Hertzian-conical scratch(HCS)和Plastic indent(PI)三类，测试了各类划痕的损伤阈值，讨论了激光损伤机制。结果表明锐度较大的BPFC损伤阈值不超过2.0 J/cm<>2；深度小于1 μm的 HCS阈值可达2.6 J/cm²；形变较大的PI阈值至2.8 J/cm2，形变较小的PI的激光损伤阈值与无缺陷材料相当。BPFC 和深度超过1 μm的HCS是导致熔石英损伤阈值低的主要因素。     

高功率脉冲电子束辐照SiO$lt;sub$gt;2$lt;/sub$gt;的光学和激光损伤性能

研究了不同剂量的60 kW高功率脉冲电子束辐照对高纯熔石英玻璃的微观结构、光学性能和激光损伤特性的影响规律. 光学显微图像表明, 辐照后熔石英样品由于热效应导致表面破裂, 裂纹密度和尺寸随辐照剂量增加而增大, 采用原子力显微镜分析表面裂纹的微观形貌, 裂纹宽度约1 um, 同时样品表面分布着大量尺寸约0.1–1μm的碎片颗粒. 吸收光谱测试表明, 所有样品均在394 nm处出现微弱的吸收峰, 吸收强度随着电子束辐照剂量增大呈现先增加后减小的趋势. 荧光光谱测试发现辐照前后样品均有3个荧光带, 分别位于460, 494和520 nm, 荧光强度随辐照剂量的变化趋势与吸收光谱一致. 利用355 nm激光研究了不同剂量电子束辐照对熔石英激光损伤阈值的影响, 结果表明熔石英的损伤阈值随着辐照剂量的增加而降低. 在剂量较低时, 导致熔石英激光损伤阈值下降的原因主要是色心缺陷; 剂量较高时, 导致损伤阈值降低的原因主要是样品表面产生的大量微裂纹和碎片颗粒对激光的调制和吸收. 关键词： 熔石英 电子束辐照 色心 激光损伤阈值     

溶胶-凝胶SiO2酸性膜与碱性膜的激光损伤行为

 采用溶胶-凝胶技术分别在K9基片上镀制了光学厚度相近的单层SiO₂酸性膜和碱性膜。测试了两类薄膜的激光损伤阈值;分别采用透射式光热透镜技术、椭偏仪、原子力显微镜、扫描电镜和光学显微镜研究了两类薄膜的热吸收、孔隙率、微观表面形貌、激光辐照前薄膜的杂质和缺陷状况以及激光辐照后薄膜的损伤形貌。实验结果表明：相对于碱性膜,酸性膜有更大的热吸收和更小的孔隙率,因此其激光损伤阈值较小;两类薄膜不同的损伤形貌与薄膜的热吸收系数与微观结构有关。     

Study on the feasibility of double stack high reflector coating at 355 nm

The feasibility of the idea of double stack HR coating was discussed in this paper both in theory and experiment. The theoretical simulation was made by employing optical coating design software. The analysis results showed that the design of double stack HR coating was feasible, which made the HR coating have ascendancy not only at reflectance but also at laser damage resistance. Then, the LaF₃/MgF₂ HR coating, the HfO₂/SiO₂ HR coating and the double stack HR coating were prepared for comparison, respectively. Transmittance spectra, surface morphologies and damage morphologies of these coatings were measured. Measurement of laser-induced damage threshold (LIDT) of S polarized light of the samples was performed at 355 nm, 45° incidence. The measurement results showed that the LIDT value of the LaF₃/MgF₂ HR coating with 30 layers was very high, but the reflectance was low. When the layer number was increased up to 36, lots of cracks appeared on the surface of the LaF₃/MgF₂ HR coating, with the LIDT badly declining. It was thought that the residual stress resulted in the cracks and the decline of the LIDT. The spectra measurement showed the double stack HR coatings could provide higher reflectance and wider reflection band than LaF₃/MgF₂ HR coating with less layer pairs. Any crack was also not found on the surface of the double stack coatings. Meanwhile, the double stack HR coatings possessed greater laser damage resistances than the HfO₂/SiO₂ HR coating. The damage morphologies showed that the damage of the double stack coating was even milder than that of the HfO₂/SiO₂ coating. Therefore, the double stack design was effective to gain high reflectance and great UV laser radiation resistance simultaneously.     

Formation of embedded patterns in glasses using femtosecond irradiation

Channel formation in glasses is demonstrated and discussed. Photosensitive glass (Foturan) was microstructured using femtosecond irradiation at 800 nm and 400 nm wavelengths, with subsequent thermal annealing, and HF etching of a lithium-silicate phase formed by exposure-annealing. It was found that there is a significant difference in the volume of lithium-silicate when the exposure was made with and without optical breakdown. Channels with a minimum cross section of approximately 10 m were achieved.In silicate glasses, the optically induced dielectric breakdown was used for the recording of channel patterns. The highest wet etching rate in a HF based solution was observed when the irradiance corresponded to the 2.5–3.0 thresholds of dielectric breakdown and the adjacent pulses were overlapping by more than 50% of the diameter of the focussed beam. Under these conditions, the formation of a void inside the glass was confirmed by optical observation of single shot damage under a microscope. The mechanism of selective wet etching in silicate glasses is discussed in terms of the stress corrosion effect, which explains crack propagation in glasses via the reaction of stretched Si–O–Si bonds at the tip of a crack with water, resulting in SiOH formation. It is shown that intra-connection of voxels was the key factor to achieve etching of high aspect ratio patterns in silica glass. PACS 42.70.Ce; 81.05.Kf; 82.50.Pt; 87.80.Mj     

HfO2/SiO2双色膜在1 064 nm和532 nm激光辐照下的损伤特性

 采用电子束蒸发的方式,制备了有氧化硅内保护层和没有氧化硅内保护层的1 064 nm高透过、532 nm高反射的HfO₂/SiO₂双色膜,测量了它们的光学性能以及在基频和倍频激光辐照下的抗损伤性能。结果表明:氧化硅内保护层提高了双色膜在基频光辐照下的损伤阈值,对双色膜在倍频光辐照下的损伤阈值无明显影响。通过观察薄膜的损伤形貌,分析破斑的深度信息结合驻波场分布,对两类双色膜在基频光和倍频光下的损伤机制做了初步探讨。分析表明:氧化硅内保护层提高了膜基界面的抗损伤性能,从而提高了双色膜在基频光下的损伤阈值。