感应耦合等离子体刻蚀p-GaN的表面特性

研究了p-GaN材料经感应耦合等离子体(ICP)刻蚀后的表面特性,并用不同的方法对刻蚀表面进行处理.利用原子力显微镜(AFM)和X射线光电子能谱(XPS)对刻蚀样品进行分析,并在样品表面制作Ni/Au电极,进行欧姆接触特性的测试.实验结果表明了NaOH溶液处理表面对改善材料表面和欧姆接触特性是比较有效的. 关键词： GaN 感应耦合等离子刻蚀 表面处理 欧姆接触     

光致电化学法提高垂直结构发光二极管出光效率的研究

研究了在垂直结构发光二极管(VLED)器件中, 光致电化学法(PEC)刻蚀N极性n-GaN的速率受不同刻蚀条件(刻蚀浓度、刻蚀时间和光照强度)的影响. 并选择N极性n-GaN表面含有较理想六角金字塔结构(侧壁角为31°)的样品制成器件, 研究PEC刻蚀对VLED的欧姆接触和光电性能的影响. 结果表明, 与未粗化样品相比, PEC刻蚀后的样品接触电阻率明显降低, 形成更好的欧姆接触; 其电学特性有较好的改善, 光输出功率有明显提高, 在20 mA电流下光输出功率增强了86.1%. 对不同金字塔侧壁角度的光提取效率用时域有限差分法(FDTD)模拟, 结果显示光提取效率在侧壁角度为20°– 40°有显著提高, 在23.6° (GaN-空气界面的全反射角)时达到最大.     

等离子体表面处理对硅衬底GaN基蓝光发光二极管内置n型欧姆接触的影响

硅衬底GaN基发光二极管(LED)的内置n型欧姆接触在晶圆键合时的高温过程中常常退化,严重影响LED的工作电压等器件性能.本文深入研究了内置n电极蒸镀前对n-GaN表面的等离子体处理工艺对硅衬底GaN基发光二极管n型欧姆接触特性的影响.实验结果表明,1.1 mm×1.1 mm的LED芯片在350 m A电流下,n-GaN表面未做等离子体处理时,n电极为高反射率Cr/Al的芯片正向电压为3.43 V,比n电极为Cr的芯片正向电压高0.28 V.n-GaN表面经O2等离子体表面处理后,Cr/Al和Cr电极芯片的正向电压均有所降低,但Cr/Al电极芯片的正向电压仍比Cr电极芯片高0.14 V.n-GaN表面经Ar等离子体处理后,Cr/Al电极芯片正向电压降至Cr电极芯片的正向电压,均为2.92 V.利用X射线光电子能谱对Ar等离子体处理前后的n-GaN表面进行分析发现,Ar等离子体处理增加了n-GaN表面的N空位(施主)浓度,更多的N空位可以提高n型欧姆接触的热稳定性,缓解晶圆键合的高温过程对n型欧姆接触特性的破坏.同时还发现,经过Ar等离子体处理并用HCl清洗后,n-GaN表面的O原子含量略有增加,但其存在形式由以介电材料GaO_x为主转变为导电材料GaO_xN_(1-x)和介电材料GaO_x含量相当的状态,这会使得接触电阻进一步降低.上述两方面的变化均有利于降低LED芯片的正向电压.     

Si(100)表面Se薄膜生长及其在Ti/Si欧姆接触中的应用

本文采用分子束外延(MBE)系统在Si(100)表面淀积Se薄膜. 通过控制衬底和固态Se束源炉的温度,实现了Se材料在Si(100)表面上的自限制超薄薄膜生长;在Se超薄层钝化的Si(100)表面上制备的Ti金属电极具有低的欧姆接触电阻特性,且热稳定性温度提升至400 ℃. 关键词： 硒 钝化 欧姆接触 热稳定性     

刻蚀与退火对GaN欧姆接触的影响

使用干法刻蚀在GaN LED晶片上刻蚀n区,用电子束蒸发方法在n型GaN表面上淀积Ti/Al双金属层作为接触电极,在N2环境中进行退火.探讨不同的刻蚀方法和刻蚀条件及不同的退火条件对Ti/Al-n型GaN间欧姆接触的影响.     

表面化学处理和退火对p-GaN/ZnO:Ga接触特性的影响

ZnO∶Ga(GZO)透明电极沉积在p-GaN表面,用作透明电流扩展层。直接沉积在p-GaN上的p-GaN/GZO存在较大的势垒,容易形成肖特基接触,而良好的欧姆接触对功率LED器件至关重要。为了降低接触势垒,采用盐酸和氢氧化钠溶液对GaN表面进行去氧化层处理,并对p-GaN/GZO进行退火处理,研究表面处理和退火对p-GaN/GZO接触特性的影响。研究表明:碱性溶液处理有利于降低接触势垒;退火处理后,接触势垒略有增加。     

低能氩离子束对多孔铝阳极氧化膜表面的刻蚀效应研究

用低能氩离子束(Ar⁺)处理了多孔铝阳极氧化膜(AAO)表面.扫描电子显微镜和原 子力显微镜结果表明，Ar⁺束刻蚀不仅可以有效地去除AAO反面阻挡层，还可使A AO表面产生多种特殊的形貌，如采用倾角入射可使其表面产生波纹，倾角入射同时旋转样品 台，可实现表面抛光.并结合Bradley和Harper提出的无定形材料表面波纹的形成和演化理论 解释了AAO表面波纹的特征. 关键词： 多孔铝阳极氧化膜 离子束刻蚀     

同步辐射光激励的二氧化硅薄膜刻蚀研究

利用热氧化法在硅晶片上生长SiO₂薄膜，结合光刻和磁控溅射技术在SiO₂薄膜表面制备接触型钴掩模，通过掩模方法在硅表面开展了同步辐射光激励的表面刻蚀研究，在室温下制备了SiO₂薄膜的刻蚀图样.实验结果表明：在同步辐射光照射下，通入SF₆气体可以有效地对SiO₂薄膜进行各向异性刻蚀，并在一定的气压范围内，刻蚀率随SF₆气体浓度的增加而增加，随样品温度的下降而升高；如果在同步辐射光照射下，用SF₆和O₂的混合气体作为反应气体，刻蚀过程将停止在SiO₂/Si界面，即不对硅刻蚀，实现了同步辐射对硅和二氧化硅两种材料的选择性刻蚀；另外，钴表现出强的抗刻蚀能力，是一种理想的同步辐射光掩模材料. 关键词： 同步辐射刻蚀 接触型钴掩模 二氧化硅薄膜     

MSM结构ZnO/Cu薄膜的接触特性

利用脉冲激光沉积(PLD)法在Si(111)衬底上分别生长了ZnO薄膜和Cu薄膜, 用Cu薄膜作电极,研究了ZnO薄膜与Cu薄膜的接触特性。分别用X射线衍射仪、扫描电子显微镜和I-V测试的方法对样品的晶体质量、结构和电学性质进行了测试。结果表明:样品中ZnO薄膜和Cu薄膜均具有高度的择优取向;当Cu和 ZnO直接接触时,样品的I-V特性是非线性的;当Cu和 ZnO之间通过ZnO:Cu层间接接触时形成良好的欧姆接触,而且退火后欧姆接触性能明显提高,电阻率降低约2/3。本研究为价格低廉的Cu电极成为ZnO基器件的欧姆电极提供了一定的依据。     

刻蚀AlN缓冲层对硅衬底N极性n-GaN表面粗化的影响

研究了等离子体刻蚀AlN缓冲层对硅衬底N极性n-GaN表面粗化行为的影响. 实验结果表明, 表面AlN缓冲层的状态对N极性n-GaN的粗化行为影响很大, 采用等离子体刻蚀去除一部分表面AlN缓冲层即可以有效提高N极性n-GaN在KOH溶液中的粗化效果, AlN缓冲层未经任何刻蚀处理的样品粗化速度过慢, 被刻蚀完全去除AlN缓冲层的样品容易出现粗化过头的现象. 经X射线光电子能谱分析可知, 等离子体刻蚀能够提高样品表面AlN缓冲层Al 2p的电子结合能, 使得样品表面费米能级向导带底靠近, 原子含量测试表明样品表面产生了大量的N空位, N空位提供电子, 使得材料表面费米能级升高, 这降低了KOH溶液和样品表面之间的肖特基势垒, 从而有利于表面粗化的进行. 通过等离子体刻蚀掉表面部分AlN缓冲层, 改善了N极性n-GaN在KOH溶液中的粗化效果, 明显提升了对应发光二级管器件的出光功率.     

In situ monitoring of uniformity by end point signal during plasma etching

A theory describing the etch rate uniformity based on the end point signal during the cleaning phase of etching is formulated for the case where the influence of residence time of the etching products and the loading effect can be neglected. An etch rate distribution function representing the probability density that the layer is etched at a given etch rate is introduced to calculate the relative root mean square of the etch rate across the wafer. The reduction in the size of the etched surface or the reduction of the flux of etching product molecules leaving the surface during the cleaning phase is used to determine the etch rate distribution function. A numerical simulation of the end point signal was used to illustrate possible applications of the theory. It is also shown that the slope of the end point curve itself cannot be used to characterize the etching nonuniformity as it is generally supposed. The theory was formulated with the aim of finding a simplein situ method applicable to statistical process control in semiconductor manufacturing when the nonuniformity of an etch process is characterized by a number (so-called 3σ method). Dedicated to Prof. Jan Janča on the occasion of his 60th birthday. This work was supported by the Slovak Grant Agency (No. 1/2312/95).     

Surface-science aspects of plasma-assisted etching

Plasma-assisted etching methods have been used in the manufacture of integrated circuits for more than 10 years and yet the surface-science aspects of this technology are poorly understood. The chemistry must be such that the reactive species generated in the plasma react with the surface being etched to form a volatile product. The chemistry is usually dominated by atoms, molecular radicals and low-energy (20–500 eV) positive ions. In microstructure fabrication, the positive ions are accelerated from the plasma towards the etched surface arriving essentially at normal incidence. Thus, the bottom surface of a very small feature being etched is subjected to both energetic ions and reactive neutral species, whereas the sidewalls of the feature are exposed to reactive neutral species only. The role of the energetic ions is primarily to accelerate the reaction between the neutral species and the etched surface (i.e., accelerate the etch rate), thereby reducing the steady-state top-monolayer coverage of the etching species on the etched surface. On the sidewalls, however, the reacting-species coverage is a saturation coverage. The present understanding of some of the surface-science aspects of this complex environment will be summarized, often using the Si-F system as an example, and some phenomena which are not well understood will be described.     

Shallow surface etching of organic and inorganic compounds by electrospray droplet impact

The electrospray droplet impact (EDI) was applied to bradykinin, polyethylene terephthalate (PET), SiO₂/Si, and indium phosphide (InP). It was found that bradykinin deposited on the stainless steel substrate was ionized/desorbed without the accumulation of radiation products. The film thickness desorbed by a single collisional event was found to be less than 10 monolayers. In the EDI mass spectra for PET, several fragment ions were observed but the XPS spectra did not change with prolonged cluster irradiation. The etching rate for SiO₂ by EDI was measured to be ∼0.2 nm/min. The surface roughness of InP etched by EDI was found to be one order of magnitude smaller than that etched by 3 keV Ar⁺ for about the same etching depths. EDI is capable of shallow surface etching with little damage left on the etched surface.     

Modifying of etching anisotropy of silicon substrates by surface active agents

The influence of alcohol additives on etch rate anisotropy of Si(hkl) planes has been studied. The etching processes were carried out in 3 and 5 M KOH aqueous solutions saturated and non-saturated with alcohols. Isopropanol, 1-propanol and tert-butanol were examined. It has been showed that the etching process cannot be controlled only by the surface tension of the solution. Saturation of the etching solution with alcohols modifies etch rate anisotropy, lowering the ratio of the etch rate of (110) and vicinal planes to the etch rate of (100) plane. The morphology of Si(hkl) planes etched in 3 M KOH solution saturated with tert-butyl alcohol has been studied in detail. Smooth (331) and (221) planes have been achieved in this solution. The (100) plane turned out to be densely covered by hillocks, opposite to the (100) plane etched in weak-alkaline solution saturated with isopropanol. To explain this phenomenon, the mechanism of hillocks formation on Si(100) surface has been proposed.     

Barrier parameters and superconducting gap structure of the etched surface of Y−Ba−Cu−O by scanning tunnelling spectroscopy

Summary Using a scanning tunnelling microscope, the tunnelling currentvs. voltage is measured between a gold tip and the chemically etched (001) surface of YBa₂Cu₃O _x crystals at room temperature. The tunnelling barrier height and thickness are derived by modelling the system in the normal state as a conventional N-I-N junction. TheI(V) andG(V) curves are computed for the same junction in the superconducting state (N-I-S junction). The predicted gap structure for a single BCS-Dynes-like gap is simple and has low zero-bias conductance. The complexG(V) spectra measured belowT _c on the etched junctions with ∼ 50% zero-bias conductance suggest a possible multilayer contribution in the unit cell. In honour of Prof. Fausto Fumi on the occasion of his retirement from teaching.     

Laser-assisted etching of diamonds in air and in liquid media

2 O, (CH₃)₂SO). Diamond samples are virtually transparent at this wavelength, and the coupling of laser radiation to diamond is via the formation of a thin graphitized layer at the diamond surface. The etching rate in liquid media is slightly higher than in air at otherwise equal conditions and is as high as 50 μm/s for etching with a scanning laser beam. Raman spectra measurements carried out on diamond samples etched in air show the presence of glassy carbon on the surface, whereas for samples etched in a liquid the diamond peak at 1332 cm^-1 dominates with significantly lower intensity of the glassy carbon peak. Electroless copper deposition on the laser-etched features is studied to compare the catalytic activity of the diamond surface etched in air with that etched in liquids. Possible mechanisms responsible for the observed difference both in the structure of the etched area and in the electroless Cu deposition onto the surface etched in various media (air or liquids) are discussed. Received: 2 August 1996/Accepted: 7 January 1997     

Synchrotron radiation photoelectron spectroscopy and near-edge X-ray absorption fine structure study on oxidative etching of diamond-like carbon films by hyperthermal atomic oxygen

Surface structural changes of a hydrogenated diamond-like carbon (DLC) film exposed to a hyperthermal atomic oxygen beam were investigated by Rutherford backscattering spectroscopy (RBS), synchrotron radiation photoelectron spectroscopy (SR-PES), and near-edge X-ray absorption fine structure (NEXAFS). It was confirmed that the DLC surface was oxidized and etched by high-energy collisions of atomic oxygen. RBS and real-time mass-loss data showed a linear relationship between etching and atomic oxygen fluence. SR-PES data suggested that the oxide layer was restricted to the topmost surface of the DLC film. NEXAFS data were interpreted to mean that the sp² structure at the DLC surface was selectively etched by collisions with hyperthermal atomic oxygen, and an sp³-rich region remained at the topmost DLC surface. The formation of an sp³-rich layer at the DLC surface led to surface roughening and a reduced erosion yield relative to the pristine DLC surface.     

氢氟酸刻蚀对Ni/6H-SiC接触性质的作用

采用浓度为10%的氢氟酸（HF）刻蚀6H-SiC单晶片,研究了HF刻蚀时间对Ni/6H-SiC接触性质的影响．经24?h刻蚀的SiC基片在溅射Ni层后,其接触表现良好线性的电流-电压（I-V）曲线．低于这个腐蚀时间的接触具有明显的势垒,但在大于1000℃快速退火后,也得到了良好线性的I-V曲线．X射线衍射（XRD）和俄歇能谱（AES）深度元素分析表明Ni₂Si和C是快速退火后的主要产物．XRD和低能反射电子能量损失谱表明表层的C 关键词： 欧姆接触 SiC 富碳层 互扩散     

Studies of CdTe surfaces with secondary ion mass spectrometry,rutherford backscattering and ellipsometry

The composition and the stability of chemically etched, mechanically polished and oxidized surfaces of single crystals of cadmium-telluride were studied by secondary ion mass spectroscopy (SIMS), Rutherford backscattering (RBS) and ellipsometry. CdTe surfaces etched using a solution of bromine in methanol were found to be enriched in cadmium but a film, identified to be an oxide of tellurium, was observed to grow on it at room temperature and in air. The thickness of this film increased over long periods of timet linearly versus lnt. Mechanically polished samples and also chemically etched surfaces which were oxidized in a solution of hydrogen peroxide in amoniac were found to be stable.