0.18 μm部分耗尽绝缘体上硅互补金属氧化物半导体电路单粒子瞬态特性研究

利用脉冲激光入射技术研究100级0.18 μm部分耗尽绝缘体上硅互补金属氧化物半导体反相器链的单粒子瞬态效应, 分析了激光入射器件类型及入射位置对单粒子瞬态脉冲传输特性的影响. 实验结果表明, 单粒子瞬态脉冲在反相器链中的传输与激光入射位置有关, 当激光入射第100级到第2级的n型金属-氧化物-半导体器件, 得到的脉冲宽度从287.4 ps增加到427.5 ps; 当激光入射第99级到第1级的p型金属-氧化物-半导体器件, 得到的脉冲宽度从150.5 ps增加到295.9 ps. 激光入射点靠近输出则得到的瞬态波形窄; 靠近输入则得到的瞬态波形较宽, 单粒子瞬态脉冲随着反相器链的传输而展宽. 入射器件的类型对单粒子瞬态脉冲展宽无影响. 通过理论分析得到, 部分耗尽绝缘体上硅器件浮体效应导致的阈值电压迟滞是反相器链单粒子瞬态脉冲展宽的主要原因. 而示波器观察到的与预期结果幅值相反的正输出脉冲, 是输出节点电容充放电的结果.     

Estimation of pulsed laser-induced single event transient in a partially depleted silicon-on-insulator 0.18-μm MOSFET

In this paper, we investigate the single event transient(SET) occurring in partially depleted silicon-on-insulator(PDSOI) metal–oxide–semiconductor(MOS) devices irradiated by pulsed laser beams. Transient signal characteristics of a 0.18-μm single MOS device, such as SET pulse width, pulse maximum, and collected charge, are measured and analyzed at wafer level. We analyze in detail the influences of supply voltage and pulse energy on the SET characteristics of the device under test(DUT). The dependences of SET characteristics on drain-induced barrier lowering(DIBL) and the parasitic bipolar junction transistor(PBJT) are also discussed. These results provide a guide for radiation-hardened deep sub-micrometer PDSOI technology for space electronics applications.     

高温对MOSFET ESD防护器件维持特性的影响

静电放电(electro-static discharge, ESD)防护结构的维持电压是决定器件抗闩锁性能的关键参数,但ESD器件参数的热致变化使得防护器件在高温环境中有闩锁风险.本文研究了ESD防护结构N沟道金属-氧化物-半导体(N-channel metal oxide semiconductor, NMOS)在30—195℃的工作温度下的维持特性.研究基于0.18μm部分耗尽绝缘体上硅工艺下制备的NMOS器件展开.在不同的工作温度下,使用传输线脉冲测试系统测试器件的ESD特性.实验结果表明,随着温度的升高,器件的维持电压降低.通过半导体工艺及器件模拟工具进行二维建模及仿真,提取并分析不同温度下器件的电势、电流密度、静电场、载流子注入浓度等物理参数的分布差异.通过研究以上影响维持电压的关键参数随温度的变化规律,对维持电压温度特性的内在作用机制进行了详细讨论,并提出了改善维持电压温度特性的方法.     

Experimental and simulation studies of single-event transient in partially depleted SOI MOSFET

In this study, we investigate the single-event transient(SET) characteristics of a partially depleted silicon-on-insulator(PDSOI) metal-oxide-semiconductor(MOS) device induced by a pulsed laser.We measure and analyze the drain transient current at the wafer level. The results indicate that the body-drain junction and its vicinity are more SET sensitive than the other regions in PD-SOI devices.We use ISE 3D simulation tools to analyze the SET response when different regions of the device are hit. Then, we discuss in detail the characteristics of transient currents and the electrostatic potential distribution change in devices after irradiation. Finally, we analyze the parasitic bipolar junction transistor(p-BJT) effect by performing both a laser test and simulations.