Optimization and Finite Element Analysis of the Temperature Field in a Nitride MOCVD Reactor by Induction Heating

A susceptor structure with a ring channel for a vertical metalorganic chemical vapor deposition reactor by induction heating is proposed. Thus the directions of heat conduction are changed by the channel, and the channel makes the heat in the susceptor redistribute. The pattern of heat transfer in this susceptor is also analyzed. In addition, the location and size of the channel in the susceptor are optimized using the finite element method. A comparison between the optimized and the conventional susceptor shows that the optimized susceptor not only enhances the heating efficiency but also the uniformity of temperature distribution in the wafer, which contributes to improving the quality of the film growth.     

Hot-Carrier Stress Effects on GIDL and SILC in 90nm LDD-MOSFET with Ultra-Thin Gate Oxide

Hot-carrier degradation for 90 nm gate length lightly-doped drain （LDD） NMOSFET with ultra-thin （1.4 nm） gate oxide is investigated under the low gate voltage stress （LGVS） and peak substrate current （Isub max） stress. It is found that the degradation of device parameters exhibits saturating time dependence under the two stresses. We concentrate on the effect of these two stresses on gate-induced-drain leakage （GIDL） current and stress induced leakage current （SILC）. The characteristics of the GIDL current are used to analyse the damage generated in the gate-to-LDD region during the two stresses. However, the damage generated during the LGVS shows different characteristics from that during Isub stress. SILC is also investigated under the two stresses. It is found experimentally that there is a linear correlation between the degradation of SILC and that of threshold voltage during the two stresses. It is concluded that the mechanism of SILC is due to the combined effect of oxide charge trapping and interface traps for the ultra-short gate length and ultra-thin gate oxide LDD NMOSFETs under the two stresses.     

Study on the degradation of NMOSFETs with ultra-thin gate oxide under channel hot electron stress at high temperature

This paper studies the degradation of device parameters and that of stress induced leakage current (SILC) of thin tunnel gate oxide under channel hot electron (CHE) stress at high temperature by using n-channel metal oxide semiconductor field effect transistors (NMOSFETs) with 1.4-nm gate oxides. The degradation of device parameters under CHE stress exhibits saturating time dependence at high temperature. The emphasis of this paper is on SILC of an ultra-thin-gate-oxide under CHE stress at high temperature. Based on the experimental results, it is found that there is a linear correlation between SILC degradation and V_h degradation in NMOSFETs during CHE stress. A model of the combined effect of oxide trapped negative charges and interface traps is developed to explain the origin of SILC during CHE stress.     

立式MOCVD反应室中一种刻槽基座的热分析

在立式感应加热的氮化物MOCVD反应室中, 提出了一种刻槽结构的基座;利用有限元法,给出了使衬底温度分布最均匀的槽的位置和大小.与传统的基座相比,这种刻槽优化后的基座,使衬底温度分布的均匀性显著提高.另外,通过对基座温度随加热时间变化的分析,发现刻槽基座的热传导规律,即刻的槽改变了基座中感应产生热量的热传导方向,衬底中的热量是由槽上下基座部分传递而来的,且随时间的增大,基座的温度趋于恒定,衬底的温度趋于均匀,均匀的衬底温度有利于提高生长薄膜的质量.